CN106910999B - A kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array - Google Patents
A kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array Download PDFInfo
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- CN106910999B CN106910999B CN201710040762.8A CN201710040762A CN106910999B CN 106910999 B CN106910999 B CN 106910999B CN 201710040762 A CN201710040762 A CN 201710040762A CN 106910999 B CN106910999 B CN 106910999B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
- H01Q1/521—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas
- H01Q1/523—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure reducing the coupling between adjacent antennas between antennas of an array
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
Abstract
The present invention provides a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array, for reducing the coupling between array antenna array element, is mainly realized by increasing by three completely identical in structure four layers of electromagnetic bandgap structures between antenna array array element；Designed multilayer electro-magnetic bandgap decoupling arrangements can effectively reduce the coupling between bay, improve the isolation of antenna array；The antenna array includes the common ground plate positioned at entire dielectric-slab lower surface, the rectangular radiation patch of dielectric-slab upper surface, two coaxial feed ports and four layers of electromagnetic bandgap structure unit and its respective grounding probe；Multilayer electro-magnetic bandgap decoupling arrangements designed by the present invention can not only effectively reduce the coupling between bay, but also can effectively improve the isolation of antenna array, realize high-performance array antenna design.
Description
Technical field
The present invention relates to a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array.
Background technique
In recent years, array antenna technique receives the favor of mobile communication field scholars, and in base station and radar
It is widely used.But the requirement with people to mobile communication equipment is higher and higher, array antenna technique is using
Many limitation limitations are received in process, if volume is big, gain is low etc..In addition, modern mobile communication equipment requires miniaturization
With portability, this requires the occupied gross spaces of array antenna unit to become very little, thus make between antenna array element away from
From becoming very little.And antenna array array element spacing is one of key parameter of array antenna design, when distance is greater than half wave
When long, it is believed that the correlation between each antenna element is low, and isolation is big, can be very good work.But in present mobile communication
In equipment, the distance between each antenna element is relatively small, and then makes to generate strong mutual coupling between each array element of antenna array,
This not only will affect the characteristics such as the bandwidth of antenna array, antenna pattern and radiation efficiency, also result between each antenna element
Correlation increases, and reduces the communication quality of communication system.So the mutual coupling between antenna element is reduced using uncoupling technology,
The isolation improved between antenna array array element is one of hot issue of antenna array design.
Alam M.S., Islam M.T. and Misran N. in 2012 propose a based on SRS-EBG (Splitring
Slotted Electromagnetic Band Gap) decoupling array antenna, be there are two centre frequency in the array antenna
The antenna element of 13GHz, the distance between two antenna elements are 0.8 λ, by loading SRS-EBG knot between antenna element
Structure achieves decoupling effect well so that isolation is promoted to 36.2dB.
Summary of the invention
The purpose of the invention is to provide a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array, using multilayer electricity
Ultra wide, it is intended to reduce and couple between array antenna array element, improve the isolation of antenna array.
The object of the present invention is achieved like this: including common ground plate, the medium being symmetricly set on common ground plate
Substrate, two rectangular radiation patch for being symmetricly set on medium substrate center line two sides, two coaxial feed ends further include setting
Three arranged in column electro-magnetic bandgap unit between two rectangular radiation patch, each electro-magnetic bandgap unit is by four layers of metal
Patch composition, every layer of metal patch are connected to common ground plate by grounding probe.
The invention also includes structure features some in this way:
1. the metal patch of the top layer of each bandgap cell be rectangular metal patch, its excess-three layer metal patch be quarter
The rectangular metal patch of slot is lost, the rectangular metal patch of the etching groove refers to that two groups are provided on rectangular metal patch is rectangular
Open slot, two groups of rectangular open slots small one and large one, big square aperture slot position is in outside small square aperture slot and two groups rectangular are opened
Mouth slot is oppositely arranged.
2. the metal patch of the electro-magnetic bandgap unit is copper product patch, grounding probe is the copper post that diameter is 1mm.
Compared with prior art, the beneficial effects of the present invention are: the present invention is based on four layers of electro-magnetic bandgap decoupling arrangements
Micro-strip array antenna, have it is compact-sized, the distance between antenna be 0.13 center frequency wavelength, far smaller than half of wave
It is long, meet integrated level increasingly higher demands；Designed micro-strip array antenna is by using four layers of electro-magnetic bandgap decoupling knot
Structure effectively reduces the coupling between antenna array array element, greatly improves the isolation between antenna array array element, improves communication matter
Amount.The present invention feeds two antenna elements using coaxial feed mode, is conducive to the Integrated design of antenna array.
Detailed description of the invention
Fig. 1 is the schematic diagram of basic structure overlook direction of the invention；
Fig. 2 is the schematic diagram of basic structure main view direction of the invention；
Fig. 3 is that every layer of metal patch of the invention occupies figure structure schematic representation (not including top layer)；
Fig. 4 is the curve graph of decoupling characteristic of the invention.
Specific embodiment
Present invention is further described in detail with specific embodiment with reference to the accompanying drawing.
As depicted in figs. 1 and 2, the present invention includes the common ground plate 101 positioned at entire medium substrate lower surface, medium base
The rectangular radiation patch 301 and 302 of plate upper surface, two coaxial feed ports 201 and 202 and three electromagnetic bandgap structures
Unit 1003,1004 and 1005 and its respective grounding probe 1002,1001 and 1006.Each electromagnetic bandgap structure unit is by 4
Layer composition, and earth plate is connected to using grounding probe between every layer, two sizes formed between three electro-magnetic bandgap units
Equal-sized gap.
To reduce design cost, the medium substrate that the present invention uses be dielectric constant for 4.4 FR4 medium, medium substrate
Length and width be designed according to Miniaturized Microstrip Antennas principle namely the size of medium substrate is set using miniaturization technology
Meter.Rectangular radiation patch on medium substrate is designed according to microstrip antenna theory, under rectangular radiation patch and medium substrate
Common ground plate be all made of copper product, that is to say, that below medium substrate be antenna array common ground plate 101, Practical Project
Middle common ground plate is to cover steel structure.Each electro-magnetic bandgap unit is four layers of electromagnetic bandgap structure 401,4102,4103,4104,
And be copper product patch, grounding probe 1001,1002,1006 is also the copper post that diameter is 1mm, two neighboring electro-magnetic bandgap list
The distance between member is identical.
As shown in Figure 1, a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array of the invention, medium substrate upper surface
Rectangular radiation patch 301 and 302 is printed on Rectangular Enclosure with Participating Media substrate using copper printing material, and is symmetrically distributed in medium substrate
Center line two sides, two coaxial feed ports 201 and 202 are separately connected SMA connector, and the inner conductor of SMA and rectangle spoke
It penetrates patch 301,302 to be connected, the outer conductor of SMA is connect with common ground plate 101.The position of two coaxial feed ports 201 and 202
Setting can be determined according to microstrip antenna designs theory, to meet the requirement of antenna array working frequency.
As shown in figure 3, each electromagnetic bandgap structure unit is divided into four layers, each electromagnetic bandgap structure unit includes four layers of gold
Belong to patch and a grounding probe, wherein the metal patch of top is rectangular metal patch, below three-layer metal patch be
The rectangular patch of etching groove.Namely, adjacent two layers the distance between also phase just the same with the closer three-decker of medium substrate
Together, and above three layers following there is the slot of a pair of of square aperture resonance ring structure 501 and 502, topmost there is no slot, electromagnetism for one layer
All layers of bandgap cell are connected by a grounding probe 1001 or 1002 or 1006 and common ground plate 101.Specifically
Be: the length and width of every layer of patch 401,4102,4103,4104 of each electromagnetic bandgap structure unit is consistent, and the distance between every layer
And the size of every layer of patch can be designed according to engineering demand and uncoupling frequency, below electromagnetic bandgap structure on three layers
The size of the square aperture resonant ring 501 and 502 of face etching can be adjusted to meet antenna uncoupling demand.And each electricity
Spacing between ultra wide unit is equal.
As shown in figure 4, a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array of the invention, are selecting reasonable ruler
It is very little, isolation between the array element of designed antenna array can be made to improve 30dB.
To sum up, the present invention is theoretical according to electromagnetic bandgap structure theory and antenna array Decoupling Design, designs in working band
Meet the electromagnetic bandgap structure for coupling reduction between antenna array array element, three identical four layers of electromagnetic bandgap structure units are set
It sets among two aerial arrays, and two antenna array array elements are symmetrically distributed in the two sides of electromagnetic bandgap structure.Designed is more
Layer electro-magnetic bandgap decoupling arrangements can effectively reduce the coupling between bay, improve the isolation of antenna array；The antenna array
Common ground plate 101 including being located at entire dielectric-slab lower surface, the rectangular radiation patch 301 and 302 of dielectric-slab upper surface, two
A coaxial feed port 201 and 202 and four layers of electromagnetic bandgap structure unit 1003,1004 and 1005 and its respective short circuit
Probe 1002,1001 and 1006；Multilayer electro-magnetic bandgap decoupling arrangements designed by the present invention, can not only effectively reduce antenna
Coupling between array element, and the isolation of antenna array can be effectively improved, realize high-performance array antenna design.
Claims (3)
1. a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array, including common ground plate, it is symmetricly set on common ground
Medium substrate on plate, two rectangular radiation patch for being symmetricly set on medium substrate center line two sides, two coaxial feed ends,
It is characterized by also including three arranged in column the electro-magnetic bandgap units being arranged between two rectangular radiation patch, each
Electro-magnetic bandgap unit is made of four layers of metal patch, and every layer of metal patch is connected to common ground plate by grounding probe；Each
The metal patch of the top layer of bandgap cell be rectangular metal patch, its excess-three layer metal patch be the rectangular metal of etching groove
Patch.
2. a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array according to claim 1, it is characterised in that: described
The rectangular metal patch of etching groove refers to is provided with two groups of rectangular open slots on rectangular metal patch, two groups of rectangular open slots one
Big one small, big square aperture slot position is in outside small square aperture slot and the opening of two groups of rectangular open slots is oppositely arranged.
3. a kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array according to claim 1 or 2, it is characterised in that:
The metal patch of the electro-magnetic bandgap unit is copper product patch, and grounding probe is the copper post that diameter is 1mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710040762.8A CN106910999B (en) | 2017-01-20 | 2017-01-20 | A kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array |
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| CN201710040762.8A CN106910999B (en) | 2017-01-20 | 2017-01-20 | A kind of multilayer electro-magnetic bandgap decoupling arrangements of microstrip antenna array |
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| CN106910999A CN106910999A (en) | 2017-06-30 |
| CN106910999B true CN106910999B (en) | 2019-11-12 |
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Families Citing this family (15)
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| US10886618B2 (en) * | 2018-03-30 | 2021-01-05 | Samsung Electro-Mechanics Co., Ltd. | Antenna apparatus and antenna module |
| US10854978B2 (en) | 2018-04-23 | 2020-12-01 | Samsung Electro-Mechanics Co., Ltd. | Antenna apparatus and antenna module |
| US10957985B2 (en) | 2018-09-28 | 2021-03-23 | Apple Inc. | Electronic devices having antenna module isolation structures |
| CN109768396B (en) * | 2018-10-09 | 2021-01-05 | 北京航空航天大学 | Microstrip antenna composite structure with coupling inhibiting effect |
| CN109494460B (en) * | 2018-10-31 | 2020-11-06 | 重庆大学 | Dual-polarization/circularly-polarized broadband high-density antenna array with high isolation |
| CN110177160A (en) * | 2019-05-31 | 2019-08-27 | Oppo广东移动通信有限公司 | Foldable housing unit and foldable electronic |
| CN110649376B (en) * | 2019-09-06 | 2023-06-09 | 维沃移动通信有限公司 | Antenna and electronic equipment |
| CN110943287A (en) * | 2019-11-18 | 2020-03-31 | 深圳迈睿智能科技有限公司 | Microwave detection module and manufacturing method thereof |
| CN111600121B (en) * | 2020-05-12 | 2022-03-01 | 中天宽带技术有限公司 | Decoupling patch antenna array |
| CN111987434B (en) * | 2020-07-01 | 2022-02-01 | 北京航空航天大学 | Microstrip antenna composite structure with coupling suppression function |
| CN111755838B (en) * | 2020-07-09 | 2022-01-25 | 摩比天线技术（深圳）有限公司 | Antenna unit and array antenna communication device |
| CN112510367B (en) * | 2020-10-19 | 2023-05-30 | 西安朗普达通信科技有限公司 | Resonant decoupling chip |
| CN112490667A (en) * | 2020-11-20 | 2021-03-12 | 榆林学院 | High-isolation symmetrical folding short-circuit dipole two-unit MIMO antenna |
| CN112803161B (en) * | 2021-03-30 | 2021-08-03 | 网络通信与安全紫金山实验室 | Electromagnetic band gap structure for surface wave suppression and patch antenna |
| CN114498018B (en) * | 2022-03-04 | 2023-07-04 | 南通大学 | Low mutual coupling microstrip antenna |
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| US10122074B2 (en) * | 2014-11-19 | 2018-11-06 | Panasonic Intellectual Property Management Co., Ltd. | Antenna device using EBG structure, wireless communication device, and radar device |
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| CN105633574A (en) * | 2016-01-12 | 2016-06-01 | 张晓燕 | Electromagnetic band gap structure based dual-frequency microstrip array antenna with high isolation |
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