CN211506408U - Computer power supply based on liquid cooling system - Google Patents
Computer power supply based on liquid cooling system Download PDFInfo
- Publication number
- CN211506408U CN211506408U CN202020734950.8U CN202020734950U CN211506408U CN 211506408 U CN211506408 U CN 211506408U CN 202020734950 U CN202020734950 U CN 202020734950U CN 211506408 U CN211506408 U CN 211506408U
- Authority
- CN
- China
- Prior art keywords
- heat
- power supply
- liquid cooling
- cooling system
- heat conducting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000007788 liquid Substances 0.000 title claims abstract description 62
- 238000001816 cooling Methods 0.000 title claims abstract description 46
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000007789 sealing Methods 0.000 claims description 18
- 230000017525 heat dissipation Effects 0.000 abstract description 15
- 230000000694 effects Effects 0.000 abstract description 7
- 238000009434 installation Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 235000016936 Dendrocalamus strictus Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a computer power based on liquid cooling system, including shell, power supply circuit board, heat-conducting plate and the guide plate of setting in the shell, the heat-conducting plate is hugged closely power supply circuit board sets up, and the one side that the heat-conducting plate is close to power supply circuit board is equipped with the heat-conducting piece that matches with the heating element on the power supply circuit board, and the guide plate is equipped with the water conservancy diversion chamber in the one side that is close to the heat-conducting. The utility model is suitable for a take the computer of liquid cooling system, replace power and the guide plate in the current liquid cooling computer with the liquid cooling power that this application describes, can integrate the power and realize the liquid cooling function in the current liquid cooling system, banned the air-cooled structure of computer power, be equivalent to "hide" the power circuit board at the back of liquid cooling system guide plate, vacated all installation spaces of air-cooled power in the computer completely, promoted the extension space of computer DIY, also helped realizing the miniaturization of computer; and the heat dissipation effect is higher than air cooling, and the noise in the heat dissipation process is small.
Description
Technical Field
The utility model relates to a power heat dissipation technical field, in particular to computer power based on liquid cooling system.
Background
High temperatures are a rival of integrated circuits. The high temperature can not only cause unstable system operation and shorten the service life of components, but also possibly burn some components. The power supply radiator has the function of absorbing and transferring heat generated during the operation of the electronic components and diffusing the heat into the open space in a physical heat dissipation mode.
The traditional power supply adopts air cooling heat dissipation, has a very simple structure, and takes away heat absorbed by a radiator by using a fan. The fan has the advantages of relatively low price, simple installation and the like, but has higher dependence on the environment, the heat dissipation performance of the fan is greatly influenced when the temperature rises and the high-power load operates, and the defects of large volume, high noise of the fan during heat dissipation and the like exist.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to overcome prior art's not enough, provide a computer power based on liquid cooling system, the guide plate replacement in with current liquid cooling system is the guide plate of this application, realizes the liquid cooling function in integrated to current liquid cooling system with the power, bans the air-cooled structure of computer power.
The purpose of the utility model is realized through the following technical scheme:
the utility model provides a computer power based on liquid cooling system, includes the shell, sets up power supply circuit board, heat-conducting plate and the guide plate in the shell, the heat-conducting plate is hugged closely power supply circuit board sets up, just the heat-conducting plate is close to power supply circuit board's one side be equipped with the heat-conducting piece that heating element matches on the power supply circuit board, the guide plate sets up the heat-conducting plate is kept away from in the one side of power supply circuit board, the guide plate is close to be equipped with the water conservancy diversion chamber in the one side of heat-conducting plate, the guide plate keep away from be equipped with respectively with the feed liquor hole and the play liquid hole of water conservancy diversion chamber.
Further, the opening part of water conservancy diversion chamber is equipped with the seal groove, the sealing member be the sealing washer, the sealing member sets up in the seal groove.
Furthermore, the number of the water outlet hole flow guide cavities is four, and the four flow guide cavities are communicated with each other through pipelines.
Furthermore, the liquid inlet hole and the liquid outlet hole are threaded holes.
Furthermore, the heating element is of a vertically distributed sheet structure, and the heat conducting piece is of a plate structure closely attached to the heating element.
Furthermore, the heating element is of a vertically distributed cylindrical structure, and the heat conducting piece is of a sleeve-shaped structure sleeved outside the heating element.
Further, the heating element is of a cuboid structure, the heat conducting piece is of a square shell structure with one open end and horizontally distributed, the heating element extends into the heat conducting piece from the opening of the heat conducting piece, the side face of the heat conducting piece is tightly attached to the heating element, and one end of the heat conducting piece, opposite to the opening, is connected with the heat conducting plate.
Furthermore, an elastic heat conducting component is arranged on the heat conducting piece and is tightly attached to the heating element.
Further, the guide plate is connected with the heat-conducting plate through a bolt.
The utility model has the advantages that:
1) the utility model is suitable for a take the computer of liquid cooling system, the current liquid cooling system structure of simple transformation, replace power and guide plate in the current liquid cooling computer with the liquid cooling power that this application describes, can integrate the power to realize the liquid cooling function in the current liquid cooling system, banned the air-cooled structure of computer power, equivalent to "hide" the power circuit board at the back of the current liquid cooling system guide plate, vacated all installation spaces of air-cooled power in the computer completely, promoted the extension space of computer DIY, also helped realizing the miniaturization of computer; the space occupied by the heat dissipation structure is effectively reduced, the heat dissipation effect is higher than that of air cooling, and the noise in the heat dissipation process is small.
2) The water conservancy diversion chamber sets up the direct and heat-conducting plate contact of open-ended aim at messenger's water, and then directly takes away the heat of heat-conducting plate when making hydrologic cycle, has effectively guaranteed radiating effect and radiating efficiency. Meanwhile, the arranged sealing element well prevents water from flowing out from the gap between the heat conducting plate and the guide plate, and the safety during heat dissipation is effectively guaranteed.
Drawings
Fig. 1 is a schematic view of an overall structure of a computer power supply based on a liquid cooling system in embodiment 1 of the present invention;
fig. 2 is a bottom view of a computer power supply based on a liquid cooling system in embodiment 1 of the present invention;
fig. 3 is a schematic structural view of a heating element in embodiment 2 of the present invention;
fig. 4 is a schematic structural view of a heat-conducting member according to embodiment 2 of the present invention;
fig. 5 is a schematic structural view of a heating element in embodiment 3 of the present invention;
fig. 6 is a schematic structural view of a heat-conducting member according to embodiment 3 of the present invention;
in the figure, 1, a housing; 2. a power supply circuit board; 3. a heat conducting plate; 4. a baffle; 5. a heat conductive member; 6. a flow guide cavity; 7. a liquid inlet hole; 8. a liquid outlet hole; 9. a seal member; 10. a sealing groove; 11. a bolt; 12. a heat generating element.
Detailed Description
The technical solution of the present invention will be described clearly and completely with reference to the following embodiments, and it should be understood that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution:
example 1:
as shown in fig. 1 and fig. 2, a computer power supply based on a liquid cooling system comprises a housing 1, a power circuit board 2 disposed in the housing 1, a heat conducting plate 3 and a flow guiding plate 4, wherein the heat conducting plate 3 is disposed closely to the power circuit board 2, and one side of the heat conducting plate 3 close to the power circuit board 2 is provided with a heat conducting piece 5 matched with a heating element 12 on the power circuit board 2, the guide plate 4 is arranged on one surface of the heat conducting plate 3 far away from the power supply circuit board 2, a guide cavity 6 is arranged on one surface of the guide plate 4 close to the heat conducting plate 3, a liquid inlet hole 7 and a liquid outlet hole 8 which are respectively communicated with the flow guide cavity 6 are arranged on one surface of the flow guide plate 4 far away from the heat conducting plate 3, the one side that water conservancy diversion chamber 6 is close to heat-conducting plate 3 be equipped with the opening, the setting of heat-conducting plate 3 is hugged closely to the opening face in water conservancy diversion chamber 6, just be provided with sealing member 9 between the opening part in water conservancy diversion chamber 6 and the heat-conducting plate 3.
Disposed on the power circuit board 2 are required electronic components such as a heat generating element 12: rectifier bridge, switch tube, rectifier tube, high-voltage filter capacitor, transformer, filter capacitor, filter inductance etc. it is specifically no longer described for the conventional technology in this field. The heat conducting member 5 is made of the same material as the heat conducting plate 3, preferably integrally formed, and made of a material having good heat conductivity, such as but not limited to metal materials such as copper, gold, aluminum alloy, brass, and bronze.
The working principle is as follows: when the electronic components on the power circuit board 2 are operated, the heat generated by the heating element 12 is transferred to the heat conducting plate 3 through the heat conducting member 5. The water conservancy diversion chamber sets up the direct and heat-conducting plate 3 contact of open-ended aim at messenger's water, and then directly takes away the heat of heat-conducting plate 3 when making hydrologic cycle, has effectively guaranteed radiating effect and radiating efficiency. The sealing member 9 that sets up simultaneously prevents that water is by the clearance outflow between heat-conducting plate 3 and the guide plate 4 that the security when having effectively guaranteed the heat dissipation is with this circulation, and then reaches the radiating purpose of power.
The utility model is suitable for a take the computer of liquid cooling system, the current liquid cooling system architecture of simple transformation, the guide plate replacement in the current liquid cooling system is the guide plate of this application, can realize the liquid cooling function in integrated to the current liquid cooling system with the power, has banned the air-cooled structure of computer power, its effectual shared space that has reduced heat radiation structure, and the radiating effect is higher than the forced air cooling, and the radiating process small in noise. Certainly, in order to meet the heat dissipation requirement of the power circuit board 2, a fan with a small volume may be installed at a suitable position such as a side surface of the power circuit board 2 to achieve the purpose of auxiliary heat dissipation.
Equivalently, the power circuit board is 'hidden' on the back of the guide plate of the existing liquid cooling system, so that the whole installation space of the air cooling power supply in the computer host is completely vacated, the expansion space of the DIY of the computer host is improved, and the miniaturization of the computer host is facilitated.
The periphery of the opening of the diversion cavity 6 is provided with a sealing groove 10, the sealing element 9 is a sealing ring (specifically a rubber sealing ring), and the sealing element 9 is arranged in the sealing groove 10.
Further, as shown in fig. 2, there are four diversion cavities, and the four diversion cavities are communicated with each other through a pipeline. The four diversion cavities are provided with liquid inlet holes and liquid outlet holes correspondingly communicated with the four diversion cavities, the four diversion cavities are communicated with each other through the liquid inlet holes, the liquid outlet holes and the pipelines, the specific connection mode is common knowledge, and the detailed description is omitted here. One of the liquid inlet holes 7 and one of the liquid outlet holes 8 are respectively connected with a liquid cooler externally through a pipeline, wherein the liquid cooler (not shown in the figure) can be a combination of a water pump and a water source (the water source can also be other fluids commonly used for heat dissipation and cooling), the water source provides cooling water for the guide plate 4, the water pump provides water circulation power, and water of the water source enters the flow guide cavity 6 through the liquid inlet hole 7 and flows back to the water source through the liquid outlet hole 8, so that the water can be recycled.
Furthermore, the liquid inlet hole 7 and the liquid outlet hole 8 are threaded holes. The arrangement is convenient for connecting the pipeline joint.
Further, as shown in fig. 2, in the present embodiment, the heating element 12 is a vertically distributed sheet structure, and the heat conductor 5 is a plate structure disposed in close contact with the heating element 12. The arrangement can ensure the contact area of the heat conducting piece 5 and the heating element 12, thereby improving the heat conducting effect.
Furthermore, an elastic heat conducting member (not shown) is disposed on the heat conducting member 11, and the elastic heat conducting member 11 is disposed in close contact with the heating element 12. The elastic heat conducting component can select heat conducting silica gel, and during assembly, the elastic heat conducting component is clamped between the heat conducting piece and the heating element, so that the elastic heat conducting component can be fully contacted with the heating element and the heat conducting piece, and further, the heat energy transfer is effectively ensured.
Further, the guide plate 4 is connected with the heat conducting plate 3 through bolts 11.
Example 2:
as shown in fig. 3 and 4, the present embodiment is different from embodiment 1 in that the heating element 12 is a vertically distributed columnar structure, and the heat conducting member 5 is a sleeve-shaped structure sleeved outside the heating element 12. The bottom of the heat conducting piece 5 in the sleeve is connected with the heat conducting plate 3 to increase the heat conducting area, wherein the heat conducting piece 5 and the heat conducting plate 3 are made of materials with good heat conductivity, such as but not limited to copper, gold, aluminum and other metal materials.
Example 3:
as shown in fig. 5 and fig. 6, the present embodiment is different from embodiments 1 and 2 in that the heating element 12 is a horizontally distributed rectangular parallelepiped structure, the heat conducting member 5 is a square shell structure with one open end, the heating element 12 extends into the heat conducting member 5 from the opening of the heat conducting member 5, the side surface of the heat conducting member 5 is disposed in close contact with the heating element 12, and the end of the heat conducting member 5 opposite to the opening thereof is connected to the heat conducting plate 3.
The same principle is that: the heating element 12 is a horizontally distributed columnar structure, the heat conducting member 5 is a cylindrical shell structure matched with the heat conducting member, and the bottom of the heat conducting member 5 is provided with an opening for the heating element 12 to enter. The heat conducting piece 5 wraps the heating element 12, and the inner wall of the heat conducting piece 5 is tightly attached to the outer wall of the heating element 12, so that the contact area between the heat conducting piece and the heating element can be well guaranteed, and the heat conducting effect is further guaranteed.
The foregoing is illustrative of the preferred embodiments of the present invention, and it is to be understood that the invention is not limited to the precise forms disclosed herein, and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the invention as defined by the appended claims. But that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention, which is to be limited only by the claims appended hereto.
Claims (9)
1. A computer power supply based on liquid cooling system which characterized in that: including shell, heat-conducting plate, guide plate and the power supply circuit board of setting in the shell, the heat-conducting plate is hugged closely power supply circuit board sets up, just the heat-conducting plate is close to power supply circuit board's one side be equipped with the heat-conducting piece that heating element matches on the power supply circuit board, the guide plate sets up the power supply circuit board is kept away from to the heat-conducting plate in the one side, the guide plate is close to and is equipped with at least one water conservancy diversion chamber in the one side of heat-conducting plate, the guide plate is kept away from in the one side be equipped with respectively with the feed liquor hole and the play liquid hole of water conservancy diversion.
2. The liquid cooling system based computer power supply of claim 1, wherein: the periphery of the opening of the flow guide cavity is provided with a sealing groove, the sealing element is a sealing ring, and the sealing element is arranged in the sealing groove.
3. The liquid cooling system based computer power supply of claim 2, wherein: the flow guide cavities are four in number and are communicated with one another through pipelines.
4. The liquid cooling system based computer power supply of claim 3, wherein: the liquid inlet hole and the liquid outlet hole are threaded holes.
5. The liquid cooling system based computer power supply of claim 1, wherein: the heating element is of a vertically distributed sheet structure, and the heat conducting piece is of a plate structure closely attached to the heating element.
6. The liquid cooling system based computer power supply of claim 1, wherein: the heating element is of a vertical columnar structure, and the heat conducting piece is of a sleeve-shaped structure sleeved outside the heating element.
7. The liquid cooling system based computer power supply of claim 1, wherein: the heating element is of a horizontal cuboid structure, the heat conducting piece is of a square shell structure with one open end, the heating element extends into the heat conducting piece from the opening of the heat conducting piece, the side face of the heat conducting piece is tightly attached to the heating element, and one end of the heat conducting piece, opposite to the opening, is connected with the heat conducting plate.
8. The liquid cooling system based computer power supply of claim 1, wherein: the heat conducting part is provided with an elastic heat conducting component which is arranged to be clung to the heating element.
9. A computer power supply based on a liquid cooling system according to any one of claims 1-8, characterized in that: the guide plate is connected with the heat conducting plate through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734950.8U CN211506408U (en) | 2020-05-07 | 2020-05-07 | Computer power supply based on liquid cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020734950.8U CN211506408U (en) | 2020-05-07 | 2020-05-07 | Computer power supply based on liquid cooling system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211506408U true CN211506408U (en) | 2020-09-15 |
Family
ID=72404759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020734950.8U Expired - Fee Related CN211506408U (en) | 2020-05-07 | 2020-05-07 | Computer power supply based on liquid cooling system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211506408U (en) |
-
2020
- 2020-05-07 CN CN202020734950.8U patent/CN211506408U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200915 |