CN211504174U

CN211504174U - Adjustable positioning mechanism of chip

Info

Publication number: CN211504174U
Application number: CN201922422418.2U
Authority: CN
Inventors: 张俊堂; 李海峰; 魏菊; 方正; 嵇杰
Original assignee: Taicang Superpix Micro Technology Co Ltd
Current assignee: Howay semiconductor (Taicang) Co.,Ltd.
Priority date: 2019-12-27
Filing date: 2019-12-27
Publication date: 2020-09-15
Anticipated expiration: 2029-12-27

Abstract

The utility model discloses an adjustable positioning mechanism of chip, including bottom plate and at least a set of positioning mechanism of setting on the bottom plate, positioning mechanism includes fixed column, first location group, second location group and third location group, and the fixed column is fixed to be set up on the bottom plate, utilizes the fixed column to fix a position a side of chip, and first location group, second location group and third location group are the other three side location of chip respectively. The utility model discloses a limb knot department screw elasticity changes the use of adjusting the location and pushing away arm scope space size in order to satisfy size difference between different products, pushes away the arm and is convex structure, carries out the contact with the chip with the point, more can reduce static, damage etc. that the friction produced between positioning mechanism and product to stability, durability and flexibility have been promoted, and production efficiency and quality have been promoted.

Description

Adjustable positioning mechanism of chip

Technical Field

The utility model relates to a chip field, in particular to adjustable positioning mechanism of chip.

Background

After the chip was arranged through the location frock, snatched the back through test equipment and detect, and the size diverse of chip, consequently, generally carry out customization positioning mechanism according to the size of chip, when product quantity is more, can cause the waste to increase equipment cost. Moreover, the time consumed for placing the chips by workers is more; in addition, the customized positioning mechanism usually has too high adhesion with the product, and is easy to generate static electricity and cause product damage; affecting production efficiency and quality.

SUMMERY OF THE UTILITY MODEL

To the defect that prior art exists above, the utility model discloses a main aim at overcomes prior art's weak point, discloses an adjustable positioning mechanism of chip, be in including bottom plate and setting at least a set of positioning mechanism on the bottom plate, positioning mechanism includes fixed column, first location group, second location group and third location group, the fixed column is fixed to be set up on the bottom plate, utilize the fixed column is fixed a side to a chip and is fixed a position, first location group the second location group with the third location group does respectively the other three side location of chip.

Furthermore, the first positioning group comprises a first extension arm and a first positioning arm, one end of the first extension arm is rotatably arranged on the bottom plate through a screw, and the other end of the first extension arm is rotatably connected with one end of the first positioning arm through a screw.

Furthermore, the second positioning group comprises a second extension arm and a second positioning arm, one end of the second extension arm is rotatably arranged on the bottom plate through a screw, and the other end of the second extension arm is rotatably connected with one end of the second positioning arm through a screw.

Furthermore, the third positioning set comprises a third extension arm and a third positioning arm, one end of the third extension arm is rotatably arranged on the bottom plate through a screw, and the other end of the third extension arm is rotatably connected with one end of the third positioning arm through a screw.

The positioning mechanism array is arranged on the bottom plate, and the first positioning group and the second positioning group of each positioning mechanism are simultaneously connected by the connecting rod.

The utility model discloses the beneficial effect who gains:

the utility model discloses a limb knot department screw elasticity changes the use of adjusting the location and pushing away arm scope space size in order to satisfy size difference between different products, pushes away the arm and is convex structure, carries out the contact with the chip with the point, more can reduce static, damage etc. that the friction produced between positioning mechanism and product to stability, durability and flexibility have been promoted, and production efficiency and quality have been promoted.

Drawings

Fig. 1 is a schematic structural diagram of an adjustable chip positioning mechanism according to the present invention;

FIG. 2 is a schematic structural view of the chip adjustable positioning mechanism in an open state;

FIG. 3 is a schematic structural view of the chip adjustable positioning mechanism in a closed state;

the reference numbers are as follows:

1. the positioning device comprises a base plate, 2, a positioning mechanism, 3, a chip, 4, a connecting rod, 21, a fixing column, 22, a first positioning group, 23, a second positioning group, 24, a third positioning group, 221, a first extension arm, 222, a first positioning arm, 231, a second extension arm, 232, a second positioning arm, 241, a third extension arm, 242 and a third positioning arm.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.

An adjustable chip positioning mechanism is shown in fig. 1 and comprises a bottom plate 1 and a positioning mechanism 2 arranged on the bottom plate 1, wherein the positioning mechanism 2 comprises a fixing column 21, a first positioning group 22, a second positioning group 23 and a third positioning group 24, the fixing column 21 is fixedly arranged on the bottom plate 1, one side surface of a chip 3 is positioned by the fixing column 21, and the first positioning group 22, the second positioning group 23 and the third positioning group 24 are used for positioning the other three side surfaces of the chip respectively. Specifically, the method comprises the following steps:

the first positioning set 22 includes a first extension arm 221 and a first positioning arm 222, one end of the first extension arm 221 is rotatably disposed on the bottom plate 1 through a screw, the other end of the first extension arm is rotatably connected with one end of the first positioning arm 222 through a screw, and the other end of the first positioning arm 222 is used for positioning one side of the chip 3.

The second positioning set 23 includes a second extension arm 231 and a second positioning arm 232, one end of the second extension arm 231 is rotatably disposed on the bottom plate 1 through a screw, the other end of the second extension arm 231 is rotatably connected with one end of the second positioning arm 232 through a screw, and the other end of the second positioning arm 232 is used for positioning one side of the chip 3.

The third positioning set 24 includes a third extending arm 241 and a third positioning arm 242, one end of the third extending arm 241 is rotatably disposed on the bottom plate 1 through a screw, the other end of the third extending arm is rotatably connected with one end of the third positioning arm 242 through a screw, and the other end of the third positioning arm 242 is used for positioning one side of the chip 3.

The four sides of the chip 3 are positioned by the fixing posts 21, the first positioning group 22, the second positioning group 23 and the third positioning group 24, that is, the positioning regions matched with the chip are formed by the fixing posts 21, the first positioning group 22, the second positioning group 23 and the third positioning group 24. Through the structure, the chip packaging structure can be suitable for chips with different sizes, and further saves cost. The joints of the extension arms and the positioning arms can be fixed by screws, and the extension arms and the base plate 1 can be fixed by screws.

It should be noted that several positioning mechanisms 2 may be disposed on the bottom plate 1, and four sets of positioning mechanisms 2 are exemplified below. Specifically, as shown in fig. 1-3, four positioning mechanisms 2 are arranged on the base plate 1 in an array, and the connecting rod 1 connects the first positioning group 22 and the second positioning group 23 of each positioning mechanism 2 together. In a specific embodiment, the connecting rod 4 connects the first positioning arm 222 and the second positioning arm 232 of each positioning mechanism 2, so as to drive the first positioning group 22 and the second positioning group 23 of the four positioning mechanisms 2 through the connecting rod 4, thereby improving the positioning efficiency. When the chip fixing device is used, according to the size of a product, the chip 3 is firstly placed at a specified position of the bottom plate 1, one side edge of the chip is tightly attached to the fixing column 21, the end part of the chip is tightly attached to the side wall of the chip 3 by adjusting the third positioning arm 242, and the chip is locked and fixed through screws. Then, by moving the connecting rod 4, the first positioning arm 222 and the second positioning arm 232 position the two adjacent sides of the chip 3. After the position is determined, the device can be put into use. The link 4 is moved so that the first positioning arm 222 and the second positioning arm 232 are away from the designated positions where the chip 3 is placed, to the positions shown in fig. 2, the chip 3 is placed on the base plate 1, and one side wall is abutted against the fixing post 21. Then, the connecting rod 4 is horizontally moved to enable the first positioning arm 222 to move to a specified position, and at the moment, the positioning of the three side walls of the chip 3 is already realized; then, the link 4 is moved upward, so that the second positioning arm 232 positions the chip 3 to the position shown in fig. 3; the connecting rod 4 is then driven again to the position shown in fig. 2, at which point the chip 3 is adjusted to the specified position and can be sucked by the test equipment. Realize chip 3 position control and location through above-mentioned equipment, through connecting rod 4 synchronization regulation multiunit positioning mechanism, raise the efficiency, practice thrift the workman greatly and place the time of chip 3. In the above embodiment, the chip placement position is increased by the link 4, and the chip 3 is adjusted and positioned by moving the link 4.

It should be noted that the above embodiments are described as "horizontal", "up", etc. in the relative directions shown in the drawings. In actual use, the bottom plate 1 is horizontally placed.

In one embodiment, a connecting rod 4 is further included,

the above are only preferred embodiments of the present invention, and are not intended to limit the scope of the present invention; the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the spirit and scope of the present invention.

Claims

1. The adjustable positioning mechanism for the chip is characterized by comprising a bottom plate and at least one group of positioning mechanisms arranged on the bottom plate, wherein each positioning mechanism comprises a fixed column, a first positioning group, a second positioning group and a third positioning group, the fixed column is fixedly arranged on the bottom plate, one side face of the chip is positioned by using the fixed column, and the first positioning group, the second positioning group and the third positioning group are used for positioning the other three side faces of the chip respectively.

2. The adjustable chip positioning mechanism of claim 1, wherein the first positioning set comprises a first extension arm and a first positioning arm, one end of the first extension arm is rotatably disposed on the bottom plate through a screw, and the other end of the first extension arm is rotatably connected to one end of the first positioning arm through a screw.

3. The adjustable chip positioning mechanism of claim 1, wherein the second positioning set comprises a second extension arm and a second positioning arm, one end of the second extension arm is rotatably disposed on the bottom plate through a screw, and the other end of the second extension arm is rotatably connected to one end of the second positioning arm through a screw.

4. The adjustable chip positioning mechanism of claim 1, wherein the third positioning set comprises a third extension arm and a third positioning arm, one end of the third extension arm is rotatably disposed on the bottom plate through a screw, and the other end of the third extension arm is rotatably connected to one end of the third positioning arm through a screw.

5. The adjustable positioning mechanism for chips of claim 1, further comprising a connecting rod, wherein said positioning mechanism array is disposed on said base plate, and said connecting rod is used to connect said first positioning group and said second positioning group of each positioning mechanism simultaneously.