CN211479990U - Portable tool for semiconductor packaging - Google Patents
Portable tool for semiconductor packaging Download PDFInfo
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- CN211479990U CN211479990U CN202020102210.2U CN202020102210U CN211479990U CN 211479990 U CN211479990 U CN 211479990U CN 202020102210 U CN202020102210 U CN 202020102210U CN 211479990 U CN211479990 U CN 211479990U
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- elastic rubber
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Abstract
The utility model discloses a portable tool for semiconductor packaging, which belongs to the technical field of electronic component packaging, and comprises a product area, wherein a frame is arranged inside the product area, the product area is connected with a fixed pillar, the edge of the product area is provided with an etching groove, the top of the etching groove is provided with a glue grasping area, the top of the glue grasping area is provided with a glue groove, one side of the glue grasping area and the glue groove is provided with a cutting identification hole, the bottom of the product area is provided with an elastic rubber sheet, one side of the elastic rubber sheet is provided with a groove, the other side of the elastic rubber sheet is provided with a handle, the bottom of the elastic rubber sheet is provided with a plastic claw, the utility model can stably fix the product area during packaging by arranging the fixed pillar, prevent sliding or deviation during packaging and cutting, reduce unnecessary errors and improve the reliability of products, meanwhile, the risk of product deviation cutting is reduced, and the manufacturing simplicity of workers is increased.
Description
Technical Field
The utility model belongs to the technical field of the electronic component encapsulation, concretely relates to semiconductor packaging is with portable frock.
Background
The location where an integrated circuit is packaged in an electronics pyramid is both the apex of the pyramid and the base of the pyramid, and ICs represent the tip of electronics in terms of the density of electronic components (e.g., transistors). However, the IC is a starting point and a basic structural unit, which forms the basis of most electronic systems in our lives, and similarly, the IC is not only a single chip or a basic electronic structure, but also has various types (analog circuits, digital circuits, radio frequency circuits, sensors, etc.), and thus, the requirements and requirements for packaging are different.
When the production and processing are carried out in the prior art, warping is easy to occur, coplanarity is poor, material blocking is easy to occur when a product is conveyed, the problem of deviation cutting is caused due to warping in the cutting process, the larger the overall warping degree of the product is, the higher the deviation cutting risk is, and the separation of a frame is still required to be carried out by using a cutting mode, a blade is required to be used, and when a single packaged product is formed by cutting, the cutting blade still can cut the frame, so that the abrasion of a cutting tool is increased.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a semiconductor packaging is with portable frock has the cutting convenience, characteristics such as product stability height.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a semiconductor package is with portable frock, includes the product district, the inside frame that is provided with in product district, the product district is connected with the fixed post, the product district edge is provided with the etching groove, etching groove top is provided with grabs gluey district, it is provided with gluey groove to grab gluey district top, it is provided with the cutting sign hole with one side of gluing the groove to grab gluey district, product district bottom is provided with the elastic rubber piece, elastic rubber piece one side is provided with the recess, elastic rubber piece opposite side is provided with the handle, elastic rubber piece surface is provided with the round hole groove, the bottom of elastic rubber piece is provided with the plastic claw.
Preferably, the cutting identification hole is a cross-shaped cutting and is embedded in the surface of the elastic rubber sheet.
Preferably, the fixing pillars are fixed to one side and the inside of the product area by welding through fusion welding, and the fixing pillars are embedded in the elastic rubber sheet.
Preferably, the etching groove, the glue grasping area and the glue groove which are arranged between the product area and the elastic rubber sheet are in a circle.
Preferably, the plastic claws are embedded in the whole surface of the bottom of the elastic rubber sheet, and the plastic claws are changed along with the stretching of the elastic rubber sheet.
Preferably, the product area is adhered to the surface of the elastic rubber sheet through an adhesive, and products on the surface of the product area can be fixed on the surface of the product area through an electric melting welding mode.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses a set up the elastic rubber piece, make it after the encapsulation, fix the surface at portable frock through pressing down the plastic claw that the elastic rubber piece made its bottom to set up, make the tensile elastic rubber piece that causes also can be along with stretching wearing the frock, the toughness of its elastic rubber piece accessible material returns original appearance, can not cause the damage to its inside device simultaneously.
2. The utility model discloses a set up the fixed post, can carry out stable fixed to the product district when the encapsulation, prevent to cause slip or skew when the encapsulation cutting, less unnecessary error improves product reliability, reduces the product simultaneously and surely leans on one side the risk, increases staff's preparation simple and easy degree.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic side view of the present invention;
in the figure: 1. a groove; 2. cutting the mark hole; 3. a product area; 4. etching a groove; 5. fixing a strut; 6. a glue grasping area; 7. a frame; 8. a glue groove; 9. a circular hole groove; 10. a handle; 11. an elastic rubber sheet; 12. a plastic claw.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides the following technical solutions: a portable tool for semiconductor packaging comprises a product area 3, a frame 7 is arranged in the product area 3, the product area 3 is connected with a fixed support post 5, in order to prevent the product area 3 from shaking and shifting during packaging, the fixed support post 5 is respectively fixed on one side and the inside of the product area 3 through a welding mode of fusion welding, the fixed support post 5 is embedded in an elastic rubber sheet 11, an etching groove 4 is arranged at the edge of the product area 3, a glue grabbing area 6 is arranged at the top of the etching groove 4, a glue groove 8 is arranged at the top of the glue grabbing area 6, in order to facilitate packaging and cutting, the etching groove 4, the glue grabbing area 6 and the glue groove 8 which are arranged between the product area 3 and the elastic rubber sheet 11 are in a circle, a cutting identification hole 2 is arranged on one side of the glue grabbing area 6 and the glue groove 8, in order to fix and increase stability during cutting, the cutting identification hole 2 is embedded on the surface of the elastic rubber sheet 11, 3 bottoms in product district are provided with elastic rubber piece 11, for the product can not drop and the skew produces the error when encapsulating and cutting, product district 3 passes through the adhesive bonding on elastic rubber piece 11 surface, the mode of the product accessible electric smelting butt fusion on 3 surfaces in product district is fixed on its surface, 11 one sides in elastic rubber piece are provided with recess 1, 11 opposite sides in elastic rubber piece are provided with handle 10, 11 surfaces in elastic rubber piece are provided with round hole groove 9, the bottom in elastic rubber piece 11 is provided with plastic claw 12, in order to make it fix on the frock surface, the whole surface of plastic claw 12 embedding in elastic rubber piece 11 bottoms, plastic claw 12 changes along with the tensile of elastic rubber piece 11.
The utility model discloses a theory of operation and use flow: firstly, a user places an elastic rubber sheet 11 on a workbench, aligns and presses a packaging machine to fix the elastic rubber sheet 11 on the workbench by aligning and pressing a groove 1, a circular hole groove 9 and a cutting identification hole 2, so as to prevent the elastic rubber sheet from sliding during working, wherein the connection between a fixing support column 5 and a product area 3 can prevent the product area 3 from shaking to cause unnecessary loss during working, then the rest part can be directly torn off before cutting by a glue grabbing area 6 and a glue groove 8 without affecting internal devices, meanwhile, the product area 3 can be protected from being eroded by etching liquid, then the etching groove 4 is etched, a full etching ring is formed on the back after etching, the stress of the etched full etching ring is released, so that the overall warping degree of the product is reduced, the subsequent product cannot be blocked during conveying, and after packaging is finished, a plastic claw 12 of the elastic rubber sheet 11 can be fixed on the surface of a tool by pressing the elastic rubber sheet 11, the tensile elastic rubber sheet 11 that causes when wearing the frock also can be along with stretching, and the toughness of its elastic rubber sheet 11 accessible material returns original appearance, can not cause the damage to its inside device simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a semiconductor packaging is with portable frock, includes product area (3), its characterized in that: product district (3) inside is provided with frame (7), product district (3) are connected with fixed support post (5), product district (3) edge is provided with etching groove (4), etching groove (4) top is provided with grabs gluey district (6), it is provided with gluey groove (8) to grab gluey district (6) top, it is provided with cutting sign hole (2) with one side of gluey groove (8) to grab gluey district (6), product district (3) bottom is provided with elastic rubber piece (11), elastic rubber piece (11) one side is provided with recess (1), elastic rubber piece (11) opposite side is provided with handle (10), elastic rubber piece (11) surface is provided with round hole groove (9), the bottom of elastic rubber piece (11) is provided with plastic claw (12).
2. The portable tool for semiconductor packaging according to claim 1, characterized in that: the cutting mark holes (2) are in a cross shape and are embedded in the surface of the elastic rubber sheet (11).
3. The portable tool for semiconductor packaging according to claim 1, characterized in that: the fixing support columns (5) are fixed on one side and the inside of the product area (3) respectively in a fusion welding mode, and the fixing support columns (5) are embedded in the elastic rubber sheets (11).
4. The portable tool for semiconductor packaging according to claim 1, characterized in that: the etching groove (4), the glue grabbing area (6) and the glue groove (8) which are arranged between the product area (3) and the elastic rubber sheet (11) are in a circle.
5. The portable tool for semiconductor packaging according to claim 1, characterized in that: the plastic claw (12) is embedded in the whole surface of the bottom of the elastic rubber sheet (11), and the plastic claw (12) changes along with the stretching of the elastic rubber sheet (11).
6. The portable tool for semiconductor packaging according to claim 1, characterized in that: the product area (3) is adhered to the surface of the elastic rubber sheet (11) through an adhesive, and products on the surface of the product area (3) can be fixed on the surface of the elastic rubber sheet in an electric melting welding mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020102210.2U CN211479990U (en) | 2020-01-16 | 2020-01-16 | Portable tool for semiconductor packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020102210.2U CN211479990U (en) | 2020-01-16 | 2020-01-16 | Portable tool for semiconductor packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211479990U true CN211479990U (en) | 2020-09-11 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020102210.2U Active CN211479990U (en) | 2020-01-16 | 2020-01-16 | Portable tool for semiconductor packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211479990U (en) |
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2020
- 2020-01-16 CN CN202020102210.2U patent/CN211479990U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221123 Address after: 530000 No. T964, Floor 2, Building 16, No. 8, Jinlong Road, Nanning District, Nanning City, Guangxi Zhuang Autonomous Region Patentee after: Guangxi Huaxin Zhenbang Semiconductor Co.,Ltd. Address before: 221000 room 213, Clean Technology Industrial Park Service Center, Xuzhou Economic and Technological Development Zone, Jiangsu Province Patentee before: LIANLI (Xuzhou) Semiconductor Co.,Ltd. |