CN206806294U - A kind of chip bonding device - Google Patents
A kind of chip bonding device Download PDFInfo
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- CN206806294U CN206806294U CN201720188375.4U CN201720188375U CN206806294U CN 206806294 U CN206806294 U CN 206806294U CN 201720188375 U CN201720188375 U CN 201720188375U CN 206806294 U CN206806294 U CN 206806294U
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Abstract
The utility model discloses a kind of chip bonding device,Including chip pick-up separative element,It is bonded fingerprint block,Substrate feeding unit and chip are to Barebone,The chip is located between the chip pick-up separative element and the substrate feeding unit to Barebone,The bonding fingerprint block includes the first sports platform,The multiple bonding hands being arranged on first sports platform and the first driving means for driving the first sports platform motion,The bonding hand travels to and fro between the chip pick-up separative element by first sports platform,Chip is between Barebone and substrate feeding unit,Realize one it is described bonding hand be indexed into chip pick up station from the chip pick-up separative element absorption chip when,Other bonding hands in be at least bonded hand chip be aligned station by the chip to Barebone carry out chip position identification and/or chip bonding station by chip bonding on the substrate of the substrate feeding unit,Improve production efficiency.
Description
Technical field
It the utility model is related to a kind of chip bonding device.
Background technology
Flip-chip bonding technology is a kind of interconnection form for being connected chip with slide glass.Bonding techniques can not reduce
In the case of line width, maximum chip superposition is carried out in limited areal and is integrated, while reduces system level chip (SoC)
Encapsulation volume and circuit conductive lengths, and then lift chip efficiency of transmission.Chip-to-wafer bonding techniques (chip-to-wafer,
C2W) relative to wafer-wafer bond techniques (wafer-to-wafer, W2W) have higher yield and lower product into
This.C2W technologies how while high bonding precision is ensured with higher yield and be the target that industry is made great efforts.
Due to electronic product towards it is light, thin and miniaturization trend development so that the application of die bonding technique increasingly increases
It is more, chip bonding process is combined with wafer-level packaging technique, is advantageous to reduce package dimension, improves the property of encapsulating products
Can, in addition, if chip bonding process is combined with silicon hole (TSV) technique, can produce cost and performance more have it is competing
Strive the chip structure of power.
However, prior art is picked and placeed using the order of one single chip and bonding pattern, being bonded precision and yield can not meet
Volume production demand.
Utility model content
The invention provides a kind of chip bonding device, and precision and production are bonded in chip bonding to solve existing equipment
Rate can not meet the problem of volume production demand.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is：
A kind of chip bonding device, including chip pick-up separative element, bonding fingerprint block, substrate feeding unit and chip pair
Barebone, the chip are located between the chip pick-up separative element and the substrate feeding unit to Barebone, the key
Closing fingerprint block includes the first sports platform, the multiple bonding hands being arranged on first sports platform and for driving first fortune
The first driving means of dynamic platform motion, the bonding hand travel to and fro between the chip pick-up by first sports platform and separate list
Member, chip pick up station from described between Barebone and substrate feeding unit, realizing that a bonding hand is indexed into chip
During chip pick-up separative element absorption chip, hand is at least bonded in other bonding hands and passes through the chip in chip alignment station
To Barebone carry out chip position identification and/or chip bonding station by chip bonding the substrate feeding unit substrate
On, chip pick-up, chip alignment and chip bonding synchronous working are realized, improves production efficiency.
Preferably, the bonding apparatus is also used for including chip bonding to Barebone, the chip bonding to Barebone
Measurement is being bonded positioned at the bonding hand of chip bonding station and the position of substrate with reference to the chip that the chip measures to Barebone
Position on hand, realize that the chip is aligned with substrate.
Preferably, first sports platform uses rotate-stationary mode platform, multiple bonding hands are circumferentially provided on described
On first sports platform.
Preferably, the chip includes mark paster mode chip alignment modules down to Barebone, for measuring
Using the mark chip position that paster mode is bonded down, or/and paster mode chip alignment modules upward are marked, for surveying
Amount is using the mark chip position that paster mode is bonded upward.
Preferably, paster mode chip alignment modules include First look aligned units to the mark down, it is described
First look aligned units are corresponding with the bonding chip on hand run to First look aligned units position, described in identification
Backwards to the position of the mark for being bonded hand on chip.
Preferably, the First look aligned units are located at below first sports platform, what the bonding hand was drawn
Chip is positioned at the subordinate surface of bonding, the First look aligned units and the institute of operation to First look aligned units position
State the chip of bonding on hand and be vertically in same straight line.
Preferably, also include upset hand between the chip pick-up separative element and the bonding fingerprint block, it is described to turn over
Change hands for being overturn after picking up chip from the chip pick-up separative element, make to mark backwards to the bonding hand on the chip.
Preferably, paster mode chip alignment modules include temporary measuring unit and the second vision to the mark upward
Aligned units, the temporary measuring unit include the second sports platform, the second driving for driving the second sports platform motion
Device and the multiple chips measurement sucker being arranged on second sports platform, the chip measurement sucker are used for from the key
Close and pick up chip on hand and chip is transferred to the bonding hand, the second vision aligned units are used to identify that the chip is surveyed
Measure the mark position of the chip on sucker.
Preferably, the chip position that second moveable table position is drawn in first sports platform lower section, the bonding hand
In the subordinate surface of bonding, the chip measurement sucker is located at the second sports platform upper surface, the First look alignment
Unit located at the chip measures sucker and picks up from the bonding station of chip on hand described is bonded hand with chip is transferred to
Station between, and with run to First look aligned units position the chip measurement sucker on chip be vertically in
Same straight line.
Preferably, second sports platform uses rotate-stationary mode platform or linear re-ciprocating motion platform.
Preferably, to Barebone, including mark, paster mode with chip alignment modules and marks upward the chip down
Paster mode chip alignment modules, the mark down with chip alignment modules and mark, use paster mode upward by paster mode
Chip alignment modules are oppositely arranged on the bonding fingerprint block, when being bonded using different paster modes, first fortune
The direction of rotation of dynamic platform is opposite.
Preferably, the chip pick-up separative element includes separating table and is arranged on the separating table to be used for from slide glass
The ejecting mechanism of upper separating chips.
Preferably, the substrate feeding unit includes the plummer for carrying substrates, the chip bonding alignment system
Uniting includes being used to measure for what the bonding hand alignment modules of measurement bonding hand position and relatively described plummer were fixedly installed
The substrate alignment modules of substrate position.
Preferably, the chip bonding device also picks and places area including first material, the first material, which picks and places area, to be included
For placing the first thesaurus of slide glass and the first manipulator for picking and placeing slide glass.
Preferably, the chip bonding device also picks and places area including second material, the second material, which picks and places area, to be included
For placing the second thesaurus of substrate and the second manipulator for picking and placeing substrate.
Compared with prior art, the utility model has advantages below：The chip bonding device uses continous way chip
Transmission, chip pick-up, chip alignment and chip bonding synchronous working are realized, make bonding apparatus while ensureing to be bonded precision
Improve yield；Meanwhile the chip bonding device has formulated two kinds of paster modes of die-up and die-down by chip bonding
To the workflow of single substrate, the scope of application of the chip bonding device is expanded.
Brief description of the drawings
Fig. 1 (a) is that chip when die-up paster modes are used in (chip First) technique is preferentially positioned based on breach
Structural representation；
Fig. 1 (b) is that core when die-down paster modes are used in (chip First) technique is preferentially positioned based on breach
The structural representation of piece；
Fig. 2 is the side view of the chip bonding device of the utility model embodiment one；
Fig. 3 is the top view of the chip bonding device of the utility model embodiment one；
Fig. 4 is the structural representation of the bonding fingerprint block of the utility model embodiment one；
Fig. 5 is the top view of first sports platform of the utility model embodiment one；
Fig. 6 is the structural representation of the temporary measurement module of die-up pasters mode of the utility model embodiment one；
Fig. 7 is the top view of second sports platform of the utility model embodiment one；
Fig. 8 is the workflow diagram of the chip bonding device of the utility model embodiment one；
Fig. 9 is the side view of the chip bonding device of the utility model embodiment two；
Figure 10 is the top view of the chip bonding device of the utility model embodiment two；
Figure 11 is the structural representation of the bonding fingerprint block of the utility model embodiment two；
Figure 12 is the structural representation of first sports platform of the utility model embodiment two；
Figure 13 is the side view of the temporary measurement module of die-up pasters mode of the utility model embodiment two；
Figure 14 is the top view of the temporary measurement module of die-up pasters mode of the utility model embodiment two.
Shown in figure：The manipulators of 010- first, the thesaurus of 020- first, the manipulators of 030- second, the thesaurus of 040- second,
100- chip pick-ups separative element, 110- separating tables, 120- ejecting mechanisms, 130- slide glasses, 140- chips, 150- marks, 160-
Upset hand, 200- bonding fingerprint block, the first sports platforms of 210- support, the sports platforms of 220- first, 230- bondings hand, 240- first are regarded
Feel aligned units, 250- first driving means, 300- substrates feeding unit, 310- plummers, 320- bondings hand alignment modules,
330- substrates, 340- substrates alignment modules, the second sports platforms of 410- support, the sports platforms of 420- second, 430-die-up chips are surveyed
Measure sucker, the second visions of 440- aligned units, the drive devices of 450- second.
Embodiment
To enable above-mentioned purpose of the present utility model, feature and advantage more obvious understandable, below in conjunction with the accompanying drawings to this
The embodiment of utility model is described in detail.It should be noted that the utility model accompanying drawing is using simplified form
And non-accurately ratio is used, only to purpose that is convenient, lucidly aiding in illustrating the utility model embodiment.
Embodiment one
Refer to Fig. 2 and Fig. 3, a kind of chip bonding device, including chip pick-up separative element 100, bonding fingerprint block
200th, substrate feeding unit 300 and chip are located at the chip pick-up separative element to Barebone, the chip to Barebone
Between 100 and the substrate feeding unit 300, the bonding fingerprint block 200 be connected across the chip pick-up separative element 100,
Chip is above Barebone and substrate feeding unit 300.Referring to Fig. 4 and Fig. 5, the bonding fingerprint block 200 includes the first motion
Platform 220, the multiple bonding hands 230 being arranged on first sports platform 220 and for driving first sports platform 220 to move
First driving means 250.In the present embodiment, first sports platform 220 uses rotate-stationary mode platform, the bonding hand 230
It is circumferentially provided on first sports platform 220.First sports platform 220 rotates, and drives multiple bonding hands 230 simultaneously
Indexing, the chip pickup station of the chip pick-up separative element 100, the chip are travelled to and fro between successively to the chip pair of Barebone
The chip bonding station of quasi- station and the substrate feeding unit 300.Specifically, when a bonding hand 230 is indexed into
While chip pickup station absorption chip 140 of the chip pick-up separative element 100, in other bonding hands 230 at least
The bonding absorption chip 140 of hand 230 carries out chip alignment in chip alignment station and/or has bonding hand 230 in the chip
The chip 140 of absorption is bonded on a substrate 330 by bonding station.The chip bonding device also includes chip bonding alignment system
System, the chip bonding are used to measure positioned at the bonding hand 230 of chip bonding station and the position of substrate 330, knot to Barebone
Close the chip 140 that chip measures to Barebone and be bonded the position of hand 230, realize the alignment of chip 140 and substrate 330.This hair
It is bright by realizing that chip pick-up and chip bonding work asynchronously, efficiently solve in the prior art chip pick-up with being bonded serial work
The problem of bonding efficiency is low caused by work, and by realizing that chip pick-up, chip alignment and chip bonding work asynchronously, can
Alignment efficiency during chip bonding is improved, further increasing production efficiency.
With continued reference to Fig. 4 and Fig. 5, the bonding fingerprint block 200 also includes the first sports platform support 210, first fortune
Dynamic platform 220 is arranged on the first sports platform support 210, and the first sports platform support 210 supports first sports platform
220, the first driving means 250 are arranged on the first sports platform support 210, and the first driving means 250 are used for
First sports platform 220 is driven to rotate, the rotation of the first sports platform 220 drives the bonding hand 230 to rotate.Described first
Sports platform support 210 uses column.
Chip First techniques include chip mark, and two kinds of (die-down) is pasted down for (die-up) and chip mark upward
Sheet mode, Fig. 1 (a) represent to use die-down paster modes, and during bonding, die-down paster mode chip marks connect with substrate
Touch, Fig. 1 (b) represents to use die-up paster modes, and during bonding, die-up paster mode chip marks do not contact with substrate.Institute
Die-down pasters mode can be included to Barebone with chip alignment modules and/or die-up paster mode chips by stating chip
Alignment modules.
Fig. 4 is referred to, the die-down pasters mode includes First look aligned units 240 with chip alignment modules,
The First look aligned units 240 are with running to the chip being bonded on hand 230 of the position of First look aligned units 240
140 correspondences, identify the position of mark 150 on the chip 140.In the present embodiment, the chip 140 of the bonding hand 230 is located at
Bonding hand 230 lower surface, the First look aligned units 240 are located at the lower section of bonding hand 230, with operation to first
Chip 140 on the bonding hand 230 of the position of vision aligned units 240 is vertically in same straight line.Used specifically, working as
When die-down pasters mode carries out chip bonding, the bonding hand 230 is inhaled from vacuum at the chip pick-up separative element 100
The chip 140 directed downwardly of mark 150 is taken, is rotated by first sports platform 220, chip 140 is transmitted to the die-down
Paster mode chip alignment modules, the First look aligned units 240 measure the position of mark 150 on the chip 140 of top
Put, the bonding hand 230 continues indexing and transmits chip 140 to the substrate feeding unit 300 and be bonded afterwards.Further
Ground, realize 150 mode directed downwardly of mark of chip 140 specifically, in the chip pick-up separative element 100 in the present embodiment
Upset hand 160, the upset hand 160 is set to be carried out after picking up chip from chip pick-up separative element 100 between bonding hand 230
180 degree is overturn, then is transferred to the bonding hand 230, as shown in Figure 2.
Fig. 6 and Fig. 7 are referred to, the die-up pasters mode chip alignment modules include temporary measuring unit and are used for
Measure the second vision aligned units 440 of the position of mark 150 on chip 140.The temporary measuring unit includes the second motion
Platform 420, for driving the second drive device 450 and be arranged on second sports platform 420 that second sports platform 420 moves
On multiple die-up chips measurement sucker 430.In the present embodiment, second sports platform 420 uses rotate-stationary mode platform, if
Put below first sports platform 220, hand 230 is bonded on first sports platform 220 and is rotated to second sports platform 420
During top, the die-up chips measurement sucker 430 is there are in second motion 420 and is bonded the position pair of hand 230 with described
Should, chip 140 is picked up from the bonding hand 230 and chip 140 is transferred to the bonding hand 230, wherein, described second regards
Feel that aligned units 440 are used for the position for identifying mark 150 on the chip 140 on the die-up chips measurement sucker 430, this
Second vision aligned units 440 described in embodiment measure sucker 430 located at the die-up chips and picked up from described be bonded on hand 230
The station of coring piece 140 is transferred to described be bonded between the station of hand 230 with by chip 140.Specifically, pasted when using die-up
When sheet mode carries out chip bonding, the bonding hand 230 draws the core of mark 150 upward at chip pick-up separative element 100
Piece 140；Then, the indexing of bonding hand 230 transmits chip 140 to the die-up pasters mode chip alignment modules,
Meanwhile second sports platform 420 rotates, sucker 430 is indexable is bonded 230 heavy position of hand with described for die-up chips measurement,
Represented in position now such as Fig. 3 with POS.M, the die-up chips measure sucker 430 and inhaled from vacuum on the bonding hand 230
Coring piece 140；Then, die-up chips measurement sucker 430 is indexed into described second and regarded under the rotation of the second sports platform 420
To feel at aligned units 440, the second vision aligned units 440 measure the position of mark 150 on chip 140, meanwhile, described the
One sports platform 220 rotates, the indexing of bonding hand 230；Then, the die-up chips measurement sucker 430 continues indexing, works as institute
State die-up chips measurement sucker 430 and be indexed into when chip 140 is transferred into the station of the bonding hand 230 and with described be bonded hand
230 heavy positions, represented with POS.N in the location drawing 3 now, the bonding hand 230 is from die-up chips measurement sucker 430
Vacsorb chip 140.Pass through para-linkage fingerprint block, die-up pasters mode chip alignment modules and substrate feeding unit
300 are matched, it is possible to achieve chip pick-up, chip alignment and chip bonding synchronous working, ensure that complete machine yield is optimal.
Further, the die-down pasters mode chip alignment modules and die-up are set simultaneously in the present embodiment
Paster mode chip alignment modules.To optimize topology layout, the present embodiment is by the die-down pasters mode chip pair
Quasi-mode block is oppositely arranged with die-up pasters mode chip alignment modules on the fingerprint block that is bonded, different patch during bonding
Sheet mode, the direction that first sports platform 220 rotates is also different, specifically, when using die-down paster modes, described the
The rotate counterclockwise of one sports platform 220, the bonding hand 230 transmit chip 140 to the die-down pasters mode chip
Alignment modules carry out chip alignment；When using die-up paster modes, first sports platform 220 turns clockwise, described
Bonding hand 230 transmits chip 140 to the die-up pasters mode carries out chip alignment with chip alignment modules.
Emphasis is with reference to figure 6, and in preferred scheme, the temporary measuring unit also includes the second sports platform support 410, and described
Two sports platforms 420 are arranged on the second sports platform support 410, and the second sports platform support 410 supports second fortune
Dynamic platform 420, second drive device 450 are arranged on the second sports platform support 410, second drive device 450
For driving second sports platform 420 to rotate, the rotation of the second sports platform 420 drives the die-up chips measurement sucker
430 rotations.The second sports platform support 410 uses column.
Fig. 5 and Fig. 7 are referred to, when second sports platform 420 is using rotate-stationary mode platform, the die-up chips are surveyed
Amount sucker 430 can set 4, and the die-up chips measurement sucker 430 is circumferential to be uniformly arranged on second sports platform 420
On, the bonding hand 230 can set 6, and the bonding hand 230 is circumferential to be uniformly arranged on first sports platform 220, this
Invention does not measure the die-up chips sucker 430 and the quantity of the bonding hand 230 limits, people in the art
Member can configure quantity and the institute of the suitable die-up chips measurement sucker 430 and the bonding hand 230 according to the actual requirements
State the first sports platform 220, the size of the second sports platform 420.
Fig. 2 and Fig. 3 are referred to, the chip pick-up separative element 100 includes separating table 110 and is arranged on the separating table
The ejecting mechanism 120 being used for from separating chips 140 on slide glass 130 on 110.Chip is carried out when using die-down pasters mode
During bonding, after the chip 140 jacked up by the ejecting mechanism 120 is picked up from the separating table 110 by the upset hand 160
The bonding hand 230 is transferred to, bonding apparatus of the present invention also includes chip pickup and Barebone is used to realize the separation
Chip 140 and upset hand 160, the upset hand 160 and the alignment being bonded between hand 230 on platform 110；Work as use
When die-up pasters mode carries out chip bonding, the bonding hand 230 picks up chip 140, institute directly from the separating table 110
State chip pickup and chip 140 and the alignment for being bonded hand 230 on the separating table are realized to Barebone.
Fig. 2 and Fig. 3 are referred to, the substrate feeding unit 300 includes the plummer 310 for carrying substrates 330, described
Chip bonding includes being used to measure the bonding hand alignment modules 320 for being bonded the position of hand 230 and relatively described carrying to Barebone
The substrate alignment modules 340 for being used to measure the mark position on substrate 330 that platform 310 is fixedly installed, the chip bonding alignment
The chip 140 that system combination chip measures to Barebone is being bonded the position of hand 130, realizes pair of chip 140 and substrate 330
It is accurate.
Fig. 2 and Fig. 3 are referred to, the chip bonding device also picks and places area including first material and second material picks and places area.
The first material, which picks and places area, to be included being used for the first thesaurus 020 for placing slide glass 130 and the first machine for capturing slide glass 130
Tool hand 010, the slide glass 130 are provided with multiple chips 140 with mark 150, are carried when being provided with first thesaurus 020
During piece 130, first manipulator 010 captures slide glass 130 from first thesaurus 020 and transmitted to the chip pick-up point
From unit 100, in addition, after chip 140 all on slide glass 130 separates with the slide glass 130, first manipulator 010
The crawl of slide glass 130 is transmitted to first thesaurus 020.The second material, which picks and places area, to be included being used to place substrate 330
The second thesaurus 040 and the second manipulator 030 for picking and placeing substrate 330, second manipulator 030 is by base to be bonded
Piece 330 is transmitted to the plummer 310 after being taken out from second thesaurus 040, when the bonding for completing full wafer substrate 330
Afterwards, second manipulator 030 is drawn substrate 330 from the plummer 310 and transmitted to second thesaurus 040.
Fig. 8 is referred to, the workflow of the chip bonding device is as follows：
S1, the first manipulator 010 capture slide glass 130 from the first thesaurus 020 and transmitted to separating table 110；
S2, separating table 110 carry slide glass 130 and move to predetermined separation point position, and ejecting mechanism 120 jacks up chip 140, makes it
Separated with slide glass 130；
S3, the paster mode for judging chip bonding：In die-down paster modes, the upset absorption chip of hand 160
140, chip 140 is overturn into 180 degree so that the mark 150 on chip 140 is located at the lower section of chip 140；Bonding hand 230 is from turning over
160 absorption chips 140 are changed hands, and die-down pasters mode chip alignment modules, First look aligned units 240 are arrived in indexing
The position of mark 150 on chip 140 is measured, hand 230 is then bonded and continues to be indexed into the substrate feeding unit 300；In die-
During up paster modes, the bonding hand 230 arrives die-up paster modes from the direct vacsorb chip 140 of separating table 110, indexing
Die-up chips measurement sucker 430, die-up chips 430 turns of sucker of measurement are transferred to chip alignment modules, and by chip 140
To at the second vision aligned units 440, the second vision aligned units 440 measure the mark 150 on chip 140 for position
Position, the sucker 430 of die-up chips measurement afterwards continue indexing, and the bonding hand 230 measures from the die-up chips
Vacsorb chip 140 on sucker 430, the bonding hand 230 continue indexing and arrive substrate feeding unit 300, chip 140 is transmitted
To the substrate feeding unit 300；
S4, substrate alignment modules 340 measure the mark on substrate 330, and bonding hand alignment modules 320 measure bonding hand 230
Position, after alignment it is described bonding hand 230 chip 140 is bonded on substrate 330；
As above process repeats the bonding until completing full wafer substrate 330；
S5, the second manipulator 030 crawl substrate 330, the thesaurus of substrate transport 330 to the second 040.
, can comprehensive analysis separating table 110, ejecting mechanism 120, plummer when carrying out chip bonding using the present embodiment
310th, the movement characteristic and characteristic of the second sports platform 420 and the first sports platform 220, rational configuration is provided to ensure complete machine yield
It is optimal.
The utility model uses continous way chip transmission means, and it is same to realize chip pick-up, chip alignment and chip bonding
Work is walked, saves chip transmission time, the chip bonding equipment is improved yield while ensureing and being bonded precision.
Embodiment two
Fig. 9 to Figure 14 is referred to, the difference of embodiment two and embodiment one is, in the present embodiment, second motion
Platform 420 uses linear re-ciprocating motion platform, and now, the die-up chips measure sucker 430 and drawn from the bonding hand 230
Position during chip 140 is with the hand 230 that is bonded from the position on die-up chips measurement sucker 430 during absorption chip 140
Coincidence is put, it is specific as represented in Figure 10 with POS.A, the position of the second vision aligned units 440 is represented in Figure 10 with POS.B
Put.Continuing with referring to Figure 11-14, the die-up chips measurement sucker 430 can set 2, and the bonding hand 230 can be set
4 are put, the present invention does not measure the die-up chips sucker 430 and the quantity of the bonding hand 230 limits.
It is specific such as with the cooperation flow between chip alignment modules that the present embodiment is bonded fingerprint block and die-up pasters mode
Under：
K1, first sports platform 220, which rotate, arrives a bonding hand 230 with an indexing of chip 140
POS.A, chip 140 is transferred on the die-up chips measurement sucker 430 of the vacancy of POS.A positions one, now another absorption
The die-up chips measurement sucker 430 for having chip carries out chip position knowledge in POS.B positions by the second vision aligned units 440
Not；
K2, then, the second sports platform 420 is in the positive Y-direction motion of the second drive device 450 driving lower edge, by POS.B positions
Die-up chips measurement sucker 430 be indexed into POS.C, while the die-up chips of POS.A positions are measured into the indexing of sucker 430
To POS.B, after to be measured, the second sports platform 420 is moved along negative Y-direction, and the die-up chips of POS.C positions are measured and inhaled
Disk 430 is indexed into POS.A, while the die-up chips measurement sucker 430 of POS.B positions is indexed into POS.D；
K3, bonding hand 230 pick up the chip of POS.A positions, and then, first sports platform 220 rotates, and another is inhaled
Bonding hand 230 with chip is indexed into POS.A, and chip is transferred to the measurement sucker 430 of the die-up chips after vacancy；
K4, the second sports platform 420 move along positive Y-direction, and the chip of POS.A positions is moved into POS.B positions measures,
The chip of POS.D positions is moved into POS.A, the bonding hand 230 picks up the chip of POS.A positions, turns again to step K1.
It is above-mentioned on the definition of POS.A, POS.B, POS.C, POS.D position and the direction of motion of the second sports platform 420
Only to facilitate skilled artisan understands that set by the present invention program, do not limit the invention, Ren Heke
The position relationship for realizing such scheme of the present invention is the technical scope that the present invention protects.
The definition in the directions such as the upper and lower, left and right described in the utility model embodiment is only to facilitate art technology
Personnel are understood set by the present invention program, the utility model are not defined, and any achievable the utility model is above-mentioned
The direction relationses of scheme are the technical scope of the utility model protection.
Those skilled in the art can carry out various changes and modification without departing from of the present utility model to utility model
Spirit and scope.So, if these modifications and variations of the present utility model belong to the utility model claims and its are equal
Within the scope of technology, then the utility model is also intended to including these changes and modification.
Claims (15)
1. a kind of chip bonding device, it is characterised in that single including chip pick-up separative element, bonding fingerprint block, substrate supply
Member, chip to Barebone, the chip to Barebone located at the chip pick-up separative element and the substrate feeding unit it
Between, the bonding fingerprint block includes the first sports platform, the multiple bonding hands being arranged on first sports platform and for driving
The first driving means of the first sports platform motion, the bonding hand are travelled to and fro between the chip by first sports platform and inhaled
Separative element, chip are taken between Barebone and substrate feeding unit, realizing that a bonding hand is indexed into chip pickup work
Position from the chip pick-up separative element absorption chip when, other bonding hands in be at least bonded hand chip alignment station pass through
The chip carries out chip position identification to Barebone and/or supplies chip bonding to list in the substrate in chip bonding station
On the substrate of member.
2. chip bonding device according to claim 1, it is characterised in that the bonding apparatus also includes chip bonding pair
Barebone, the chip bonding are used to measure positioned at the bonding hand of chip bonding station and the position of substrate to Barebone, with reference to
Position of the chip that the chip measures to Barebone in bonding on hand, realizes that the chip is aligned with substrate.
3. chip bonding device according to claim 1, it is characterised in that first sports platform uses rotate-stationary mode
Platform, multiple bonding hands are circumferentially provided on first sports platform.
4. chip bonding device according to claim 1, it is characterised in that the chip includes mark down to Barebone
Paster mode chip alignment modules, for measuring using the mark chip position that paster mode is bonded down, or/and mark court
Upper paster mode chip alignment modules, for measuring using the mark chip position that paster mode is bonded upward.
5. chip bonding device according to claim 4, it is characterised in that described to mark paster mode chip pair down
Quasi-mode block includes First look aligned units, the First look aligned units and operation to First look aligned units position
The chip of the bonding on hand is corresponding, identifies on the chip backwards to the position of the mark for being bonded hand.
6. chip bonding device according to claim 5, it is characterised in that the First look aligned units are positioned at described
Below first sports platform, the chip that the bonding hand is drawn is positioned at the subordinate surface of bonding, the First look aligned units
Same straight line is vertically in the chip being bonded on hand run to First look aligned units position.
7. chip bonding device according to claim 5, it is characterised in that the chip pick-up separative element and the key
Also including upset hand between conjunction fingerprint block, the upset hand is used to after chip pick-up separative element pickup chip overturn,
Make to mark backwards to the bonding hand on the chip.
8. chip bonding device according to claim 5, it is characterised in that described to mark paster mode chip pair upward
Quasi-mode block includes temporary measuring unit and the second vision aligned units, and the temporary measuring unit includes the second sports platform, is used for
The multiple chips measurement for driving the second drive device of the second sports platform motion and being arranged on second sports platform
Sucker, the chip measurement sucker is used to pick up chip on hand from the bonding and chip is transferred into the bonding hand, described
Second vision aligned units are used for the mark position for identifying the chip on the chip measurement sucker.
9. chip bonding device according to claim 8, it is characterised in that second moveable table position is in the described first fortune
Below dynamic platform, chip that the bonding hand is drawn is positioned at the subordinate surface of bonding, and the chip measurement sucker is located at described the
Two sports platform upper surfaces, the First look aligned units measure sucker located at the chip and pick up chip on hand from the bonding
Station with by chip be transferred to it is described be bonded the station of hand between, and with run to described in First look aligned units position
Chip on chip measurement sucker is vertically in same straight line.
10. chip bonding device according to claim 8, it is characterised in that second sports platform is using rotary fortune
Dynamic platform or linear re-ciprocating motion platform.
11. chip bonding device according to claim 4, it is characterised in that the chip includes mark court to Barebone
Lower paster mode is with chip alignment modules and marks paster mode chip alignment modules upward, described to mark paster mode down
With chip alignment modules and mark, paster mode is oppositely arranged with chip alignment modules on the bonding fingerprint block upward, when adopting
When being bonded with different paster modes, the direction of rotation of first sports platform is opposite.
12. chip bonding device according to claim 1, it is characterised in that the chip pick-up separative element includes dividing
Destage is used for the ejecting mechanism of the separating chips from slide glass with being arranged on the separating table.
13. chip bonding device according to claim 2, it is characterised in that the substrate feeding unit includes being used to hold
Carry substrate plummer, the chip bonding to Barebone include be used for measure bonding hand position bonding hand alignment modules and
The substrate alignment modules for being used to measure substrate position of relatively described plummer fixed setting.
14. chip bonding device according to claim 1, it is characterised in that the chip bonding device also includes first
Material picks and places area, and the first material, which picks and places area, to be included being used for the first thesaurus for placing slide glass and first for picking and placeing slide glass
Manipulator.
15. chip bonding device according to claim 1, it is characterised in that the chip bonding device also includes second
Material picks and places area, and the second material, which picks and places area, to be included being used for the second thesaurus for placing substrate and second for picking and placeing substrate
Manipulator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720188375.4U CN206806294U (en) | 2017-02-28 | 2017-02-28 | A kind of chip bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720188375.4U CN206806294U (en) | 2017-02-28 | 2017-02-28 | A kind of chip bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206806294U true CN206806294U (en) | 2017-12-26 |
Family
ID=60728526
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720188375.4U Withdrawn - After Issue CN206806294U (en) | 2017-02-28 | 2017-02-28 | A kind of chip bonding device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206806294U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108470698A (en) * | 2018-03-27 | 2018-08-31 | 唐人制造（宁波）有限公司 | A kind of workpiece alignment mounting device and its method |
| CN108511362A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
| CN110858552A (en) * | 2018-08-24 | 2020-03-03 | 上海微电子装备（集团）股份有限公司 | Bonding equipment and bonding method |
-
2017
- 2017-02-28 CN CN201720188375.4U patent/CN206806294U/en not_active Withdrawn - After Issue
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108511362A (en) * | 2017-02-28 | 2018-09-07 | 上海微电子装备（集团）股份有限公司 | A kind of chip bonding device |
| CN108511362B (en) * | 2017-02-28 | 2020-01-24 | 上海微电子装备（集团）股份有限公司 | Chip bonding device |
| CN108470698A (en) * | 2018-03-27 | 2018-08-31 | 唐人制造（宁波）有限公司 | A kind of workpiece alignment mounting device and its method |
| CN108470698B (en) * | 2018-03-27 | 2021-06-11 | 唐人制造（宁波）有限公司 | Workpiece aligning and mounting device and method thereof |
| CN110858552A (en) * | 2018-08-24 | 2020-03-03 | 上海微电子装备（集团）股份有限公司 | Bonding equipment and bonding method |
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| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20171226 Effective date of abandoning: 20200124 |
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| AV01 | Patent right actively abandoned |