CN208589413U - Support plate tooling - Google Patents
Support plate tooling Download PDFInfo
- Publication number
- CN208589413U CN208589413U CN201721847275.4U CN201721847275U CN208589413U CN 208589413 U CN208589413 U CN 208589413U CN 201721847275 U CN201721847275 U CN 201721847275U CN 208589413 U CN208589413 U CN 208589413U
- Authority
- CN
- China
- Prior art keywords
- support plate
- tooling
- utility
- hollow slots
- pcb
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002390 adhesive tape Substances 0.000 claims abstract description 8
- 229910000639 Spring steel Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 13
- 239000000919 ceramic Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 230000001413 cellular effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a kind of support plate tooling, the support plate including rectangle；Wherein, multiple hollow slots are provided on support plate；In the High temperature-resistanadhesive adhesive tape for being provided with covering hollow slots on one side of support plate.Using the utility model, it is able to solve product and is flushed away or the problems such as bad order.
Description
Technical field
The utility model relates to encapsulation technology fields, more specifically, are related to a kind of carrier plate for packaging semiconductor tooling.
Background technique
Waterproof barometer is typically encapsulated including shell, the substrate fixed with outer shell phase, the chip mutually fixed with substrate, this
When class production, if in keys such as D/B (chip attachment), W/B (gold thread bonding), patch shell, gel coating (encapsulating)
After processing step, when carrying out product cutting-up to full page PCB, there are the following problems for meeting:
When using PCB backcut technique, the upper surface of shell is bonded on UV film first, then carries out cutting-up.It is such
Technique, since product casing upper surface and effective bond area of UV film are too small, when will lead to cutting-up, product is by internal cleaning
Water washes away.
When using PCB positive cutting process, product substrate back is bonded on UV film first, then end face lid on the shell
Upper layer protecting film (place cutting clast and enter interiors of products).Such technique, in cutting, protective film can also be cut,
The clast of generation is adsorbed on side wall of outer shell, leads to bad order.
Therefore, the utility model proposes a kind of carrier plate for packaging semiconductor toolings, are carrying out the critical process such as D/B, W/B
Before, cutting-up in advance is carried out to PCB or ceramic substrate, it is as above to solve the problems, such as.
Utility model content
In view of the above problems, the purpose of the utility model is to provide a kind of support plate tooling, with solve product be flushed away or
The problems such as bad order.
Support plate tooling provided by the utility model, the support plate including rectangle；Wherein, multiple hollow outs are provided on support plate
Slot；In the High temperature-resistanadhesive adhesive tape for being provided with covering hollow slots on one side of support plate.
Furthermore it is preferred that structure be that support plate includes four corners, wherein a corner be provided with direction discernment label.
Furthermore it is preferred that structure be to be respectively arranged with location hole in four corners, location hole is for positioning fixed support plate.
Furthermore it is preferred that structure be that for hollow slots for accommodating PCB unit, PCB unit pastes high-temperature plastic by UV film
It takes.
Furthermore it is preferred that structure be that the thickness of support plate is identical as the thickness of PCB unit.
Furthermore it is preferred that structure be that hollow slots are rectangular shape.
Furthermore it is preferred that structure be, support plate be spring steel support plate.
It can be seen from the above technical scheme that support plate tooling provided by the utility model, by the way that hollow slots are arranged on support plate
And High temperature-resistanadhesive adhesive tape corresponding with hollow slots, PCB unit paste on high-temperature plastic band, PCB unit housing is in hollow slots
It is interior, so that existing product is flushed away or the problems such as bad order when solving semiconductor packages.
Detailed description of the invention
By reference to the following description in conjunction with the accompanying drawings and the contents of the claims, and with to the utility model more
Comprehensive understanding, other purposes and result of the utility model will be more clearly understood and understood.In the accompanying drawings:
Fig. 1 is the support plate tooling positive structure schematic according to the utility model embodiment；
Fig. 2 is the support plate tooling reverse structure schematic according to the utility model embodiment；
Fig. 3 is the PCB jigsaw structural schematic diagram according to the utility model embodiment；
Fig. 4 is according to the PCB cellular construction schematic diagram after the cutting-up of the utility model embodiment；
Fig. 5 is to be pasted onto support plate tool structure schematic diagram according to the PCB unit of the utility model embodiment.
Appended drawing reference therein includes: 1, support plate, 2, hollow slots, 3, first positioning hole, 4, second location hole, 5, third it is fixed
Position hole, the 6, the 4th location hole, 7, direction discernment label, 8, PCB jigsaw, 9, PCB unit.
Identical label indicates similar or corresponding feature or function in all the appended drawings.
Specific embodiment
For the ever-present two kinds of problems of existing semiconductor package structure of aforementioned proposition, the first problem are as follows:
When using PCB backcut technique, product casing upper surface and effective bond area of UV film are too small, when will lead to cutting-up, product
It is washed away by internal ejected wash water；Second of problem are as follows: when cutting process positive using PCB, in cutting, protective film can also be cut
It cuts, the clast generated is adsorbed on side wall of outer shell, leads to bad order.Above two in order to solve the problems, such as, the utility model mentions
A kind of new support plate tooling is supplied.
Specific embodiment of the utility model is described in detail below with reference to attached drawing.
In order to illustrate the structure of support plate tooling provided by the utility model, Fig. 1 to Fig. 5 is respectively from different perspectives to support plate work
The structure of dress has carried out exemplary mark.Specifically, Fig. 1 is shown ties according to the support plate tooling front of the utility model embodiment
Structure；Fig. 2 shows the support plate tooling inverse layer structures according to the utility model embodiment；Fig. 3 is shown according to the utility model reality
Apply the PCB jigsaw structure of example；Fig. 4 shows the PCB cellular construction after the cutting-up according to the utility model embodiment；Fig. 5 is shown
According to the PCB unit of the utility model embodiment it is pasted onto support plate tool structure.
As Fig. 1 to Fig. 5 jointly shown in, support plate tooling provided by the utility model, the support plate 1 including rectangle；Wherein, it is carrying
Multiple hollow slots 2 are provided on plate 1；In the High temperature-resistanadhesive adhesive tape (being not marked in figure) for being provided with covering hollow slots on one side of support plate 1.
Wherein, support plate 1 includes four corners, and a corner is provided with direction discernment label 7 wherein.Also, at four
Corner is respectively arranged with location hole, is respectively as follows: first positioning hole 3, second location hole 4, third location hole 5 and the 4th location hole 6,
Four location holes are for positioning fixed support plate 1, wherein the position for being provided with the corner of first positioning hole 3 is provided with direction discernment
Label 7.Setting direction identification label 7 is in order to easily identify the position of each material being packaged operation, to subtract
Few operating time.
In the embodiments of the present invention, the shape rectangle of hollow slots 2, hollow slots 2 are for accommodating PCB unit 9, PCB
Unit 9 is pasted on high-temperature plastic band by UV film.Wherein, it should be noted that the size of hollow slots 2 is according to PCB unit 9
Size is set, and in practical applications, the size of the hollow slots 2 of support plate 1 is set according to the size of PCB unit.
The detailed process of semiconductor packages is discussed in detail below in conjunction with attached drawing.
Step 1: in embodiment as shown in Figure 3, PCB jigsaw 8 or ceramic substrate are subjected to cutting-up, when cutting-up, PCB
Or the front of ceramic substrate is attached on UV film (that is the back side upward), then carries out cutting-up.PCB jigsaw 8 or ceramics
Substrate is divided into separate unit one by one, then irradiate according to UV to UV film.
Step 2: sticking the preferable High temperature-resistanadhesive adhesive tape of viscosity at the back side of support plate tooling, High temperature-resistanadhesive adhesive tape is covered on hollow out
On slot；Using support plate tooling in the first step the good PCB of cutting-up or ceramic substrate unit from UV film transfer to support plate tooling
High-temperature plastic band on (as shown in Figure 5).Can be seen that from embodiment shown in fig. 5 by transferring film, at this time PCB unit or
Ceramic substrate unit is face-up, and the location hole of this step support plate tooling is for guaranteeing transferring film precision.
Step 3: carrying out conventional D/B (chip attachment), W/B to PCB or ceramic substrate after the completion of second step transferring film
The processing steps such as (gold thread bonding), patch shell, gel coating (encapsulating).
It can solve product existing for semiconductor product cutting-up from the above-mentioned steps of the utility model to be flushed away or outside
See the problems such as bad.
Wherein, it should be noted that the thickness of support plate 1 and PCB unit 9 (or ceramic substrate) thickness is identical, so that
The thickness (or ceramic substrate) of PCB unit 9 saves consistent with the thickness of support plate 1.
In addition, support plate is preferably spring steel support plate, the rigidity of spring steel, resistance in the embodiments of the present invention
Shape ability is strong, is conducive in technique manufacturing process, guarantees the position precision between substrate and PCB unit.
By above embodiment as can be seen that support plate tooling provided by the utility model, is engraved by being arranged on support plate
Empty slot and High temperature-resistanadhesive adhesive tape corresponding with hollow slots, PCB unit paste on high-temperature plastic band, and PCB unit housing is being engraved
In empty slot, so that existing product is flushed away or the problems such as bad order when solving semiconductor packages.
Described in an illustrative manner above with reference to attached drawing according to the utility model proposes support plate tooling.But ability
Field technique personnel should be appreciated that the support plate tooling proposed for above-mentioned the utility model, can also be not depart from this practical new
Various improvement are made on the basis of type content.Therefore, the protection scope of the utility model should be by appended claims
Content determines.
Claims (6)
1. a kind of support plate tooling, which is characterized in that the support plate including rectangle, wherein
Multiple hollow slots are provided on the support plate；
The High temperature-resistanadhesive adhesive tapes of the hollow slots is covered in being provided on one side for the support plate；
For accommodating PCB unit, the PCB unit is pasted on the high-temperature plastic band hollow slots by UV film.
2. support plate tooling as described in claim 1, which is characterized in that
The support plate includes four corners, and a corner is provided with direction discernment label wherein.
3. support plate tooling as claimed in claim 2, which is characterized in that
It is respectively arranged with location hole in the four corners, the location hole is for positioning the fixed support plate.
4. support plate tooling as described in claim 1, which is characterized in that
The thickness of the support plate is identical as the thickness of the PCB unit.
5. support plate tooling as described in claim 1, which is characterized in that
The hollow slots are rectangular shape.
6. support plate tooling as described in claim 1, which is characterized in that
The support plate is spring steel support plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721847275.4U CN208589413U (en) | 2017-12-26 | 2017-12-26 | Support plate tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721847275.4U CN208589413U (en) | 2017-12-26 | 2017-12-26 | Support plate tooling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208589413U true CN208589413U (en) | 2019-03-08 |
Family
ID=65532257
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721847275.4U Active CN208589413U (en) | 2017-12-26 | 2017-12-26 | Support plate tooling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208589413U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238595A (en) * | 2019-07-19 | 2019-09-17 | 珠海格力新元电子有限公司 | A kind of novel welding device and its manufacture craft |
-
2017
- 2017-12-26 CN CN201721847275.4U patent/CN208589413U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110238595A (en) * | 2019-07-19 | 2019-09-17 | 珠海格力新元电子有限公司 | A kind of novel welding device and its manufacture craft |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 266100 Qingdao, Laoshan District, North House Street investment service center room, Room 308, Shandong Patentee before: GOERTEK TECHNOLOGY Co.,Ltd. |