CN211321861U - Power amplifier heat radiation structure and power amplifier - Google Patents
Power amplifier heat radiation structure and power amplifier Download PDFInfo
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- CN211321861U CN211321861U CN201922285039.3U CN201922285039U CN211321861U CN 211321861 U CN211321861 U CN 211321861U CN 201922285039 U CN201922285039 U CN 201922285039U CN 211321861 U CN211321861 U CN 211321861U
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Abstract
The utility model relates to a power amplifier heat radiation structure and power amplifier, this heat radiation structure include the power tube, still include: the box body is of a hollow structure, is integrally formed by adopting a temperature-equalizing plate, and is fixed on the inner surface of the box body; and the heat dissipation unit is positioned on one side of the power amplification tube, which is tightly attached to the box body, and when the power amplifier works, the heat dissipation unit is used for correspondingly providing air flows with different sizes to heat sources with different temperatures in the box body. The above-mentioned scheme that this application provided, because the box body adopts the integrated shaping of samming board, power tube direct mount is on the samming board to make the heat that produces on the power tube can expand the internal surface of box body fast, improved the radiating effect of power tube, simultaneously because radiating element can provide the airflow of equidimension not to the heat source correspondence of different temperatures in the box body, thereby make the high heat source of temperature can dispel the heat fast and cool off in the box body, reach good radiating effect.
Description
Technical Field
The utility model relates to a power amplifier technical field especially relates to a power amplifier heat radiation structure and power amplifier.
Background
The power amplifier is used for amplifying the power of radio frequency signals in the radar, is usually arranged in a high-frequency box, and has high power density, compact structure and higher requirement on environmental conditions. The radar generally works outdoors, the temperature of the environment inside the system is high, so that high requirements are provided for the structure and the heat dissipation of the power amplifier, and the reasonable heat dissipation structure is very important for improving the reliability of the power amplifier and the radar.
At present, the expansion of heat flow is mainly realized by paving a heat pipe or a copper block under a power amplifier tube in the conventional power amplifier, and a power amplifier shell carries out heat dissipation through mounting heat dissipation teeth.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a power amplifier heat dissipation structure and a power amplifier with good heat dissipation effect to solve the problem of poor heat dissipation effect of the power amplifier.
A power amplifier heat radiation structure, includes the power amplifier tube, still includes:
the box body is of a hollow structure, the box body is integrally formed by adopting a temperature equalizing plate, and the power amplifier tube is fixed on the inner surface of the box body;
and the heat dissipation unit is positioned at one side of the box body, which is tightly attached to the power amplifier tube, and when the power amplifier works, the heat dissipation unit is used for correspondingly providing air flows with different sizes to heat sources with different temperatures in the box body.
Above-mentioned power amplifier heat radiation structure, because the box body adopts the integrated molding of samming board, power amplifier tube direct mount is on the samming board to make the heat that produces on the power amplifier tube can expand the internal surface of box body fast, improved the radiating effect of power amplifier tube, simultaneously because radiating element can correspond the air current that provides equidimension not to the heat source of different temperatures in the box body, thereby make the high heat source of temperature in the box body can dispel the heat the cooling fast, reach good radiating effect.
In one embodiment, the heat dissipation unit includes an axial flow fan and a heat sink, an air outlet of the axial flow fan is opposite to the heat sink, when the power amplifier is in operation, the axial flow fan is used for conveying cooling air into the heat sink, and the heat sink is used for adjusting the entering cooling air into air flows with different sizes and transmitting the air flows to a heat source with corresponding temperature.
In one embodiment, the heat sink comprises a shell and a first heat dissipation tooth and a second heat dissipation tooth which are arranged in the shell, the shell is arranged on one side of the power amplification tube, which is tightly attached to the box body, and both one side of the shell, which is close to the axial flow fan, and one side of the shell, which is far away from the axial flow fan, are of an open structure;
the first heat dissipation teeth are positioned on one side, close to the axial flow fan, of the shell, and are arranged in the shell in parallel at intervals along the axial direction of a rotating shaft on the axial flow fan;
the second heat dissipation teeth are located on one side, far away from the axial flow fan, of the shell, and included angles between the extending directions of the second heat dissipation teeth and the first heat dissipation teeth form obtuse angles.
In one embodiment, the position of the second heat dissipation tooth corresponds to the position of the power amplifier tube.
In one embodiment, the shell and the box body are integrally formed, or the shell and the box body are fixedly connected through bolts.
In one embodiment, the axial flow fan further comprises a mounting bracket, and the axial flow fan is mounted on the shell through the mounting bracket.
In one embodiment, a clamping block is arranged on one side of the axial flow fan close to the mounting bracket, a clamping groove is arranged on one side of the mounting bracket close to the axial flow fan, and the clamping groove is matched with the clamping block;
the mounting bracket and the shell are integrally molded, or the mounting bracket is fixedly connected with the shell through a bolt.
In one embodiment, the static pressure box is positioned between the axial flow fan and the radiator and is used for adjusting the cooling air sent by the axial flow fan into uniform air pressure and then sending the cooling air into the radiator.
In one embodiment, the power amplifier further comprises a heat conducting pad comprising indium foil disposed between the power tube and the inner surface of the case.
The utility model also provides a power amplifier, include: the power amplifier comprises a power amplifier body and the heat dissipation structure of the power amplifier as described in any one of the embodiments of the present application, wherein the power amplifier body is arranged inside the heat dissipation structure.
Drawings
Fig. 1 is a schematic view of a heat dissipation structure of a power amplifier according to an embodiment of the present invention;
FIG. 2 is a schematic view of another view of FIG. 1;
FIG. 3 is a schematic diagram of the internal structure of the heat sink in FIG. 2;
FIG. 4 is a front view of FIG. 2;
FIG. 5 is a schematic view of the internal structure of the case in FIG. 2;
FIG. 6 is a heat profile of the power amplifier of FIG. 1 during operation;
fig. 7 is a graph of airflow distribution during operation of the power amplifier of fig. 1.
Detailed Description
In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1 and 4, in an embodiment of the present invention, a heat dissipation structure for a power amplifier is provided, including a box body 10, a power amplifier tube 60 and a heat dissipation unit, wherein the inside of the box body 10 is a hollow structure, and the box body 10 is integrally formed by a vapor chamber 50, the power amplifier tube 60 is fixed on the inner surface of the box body 10, the heat dissipation unit is located on one side of the power amplifier tube 60 tightly attached to the box body 10, and when the power amplifier is in operation, the heat dissipation unit is used for providing air flows with different sizes corresponding to heat sources with different temperatures in the box body 10.
Specifically, the temperature-uniforming plate 50 adopted by the box body 10 in this embodiment can be selected as the temperature-uniforming plate in application No. 201720426115.6, and since the temperature-uniforming plate can transfer heat in the two-dimensional direction, heat generated by the power amplifier tube can be rapidly extended to the inner surface of the box body, and the heat dissipation effect of the power amplifier tube is improved.
It should be noted that the above-mentioned structure of the temperature-equalizing plate 50 is only an example, and in other alternative solutions, temperature-equalizing plates with other structures, such as a superconducting aluminum temperature-equalizing plate, may also be used. The specific structure of the vapor chamber is not particularly limited, as long as the structure can achieve the purpose of the present application.
The heat dissipation unit in this embodiment includes an axial flow fan 20 and a heat sink 40, an air outlet of the axial flow fan 20 is tightly attached to the heat sink 40, when the power amplifier is in operation, the axial flow fan 20 is used to supply air to the heat sink 40, and the heat sink 40 is used to adjust the supplied air into air flows of different sizes and transmit the air flows to a heat source with a corresponding temperature.
Further, as shown in fig. 2 and fig. 3, the heat sink 40 includes a housing 401 and a first heat dissipation tooth 402 and a second heat dissipation tooth 403 which are disposed in the housing 401, the housing 401 is disposed on one side of the power tube 60 which is close to the box 10, and both one side of the housing 401 which is close to the axial flow fan 20 and one side of the housing which is far away from the axial flow fan 20 are open structures; the first heat dissipation teeth 402 are located on one side of the casing 401 close to the axial flow fan 20, and the first heat dissipation teeth 402 are arranged in the casing 401 at intervals in parallel along the axial direction of a rotating shaft (not indicated in the figure) on the axial flow fan 20; the second heat dissipation teeth 403 are located on one side of the casing 401 far away from the axial flow fan 20, and an included angle between the second heat dissipation teeth 403 and the first heat dissipation teeth 402 forms an obtuse angle, when the power amplifier is in operation, cold air sent by the axial flow fan 20 into the casing 401 first passes through the first heat dissipation teeth 402 and then flows to the second heat dissipation teeth 403, because the plurality of first heat dissipation teeth 402 are arranged in parallel, the extension direction of the first heat dissipation teeth 402 is parallel to the flow direction of the cold air, and the second heat dissipation teeth 403 and the first heat dissipation teeth 402 form an obtuse angle, after the cold air is conveyed to one end of the first heat dissipation teeth 402 far away from the axial flow fan 20, the wind direction of the cold air changes along with the direction of the second heat dissipation teeth 403, and finally all the cold air is converged to the second heat dissipation teeth 403, so that the air flow at the second heat dissipation teeth 403 is greater than the. As shown in fig. 6, since the power amplifier operates, a higher temperature is generated at the power amplifying tube 60, when the overall structure is assembled, the second heat dissipation teeth 403 can be close to a heat source with a higher temperature in the box body 10, and when the axial flow fan 20 operates, a larger airflow can be provided for the components at the second heat dissipation teeth 403 (as shown in fig. 7), so that rapid heat dissipation and cooling are achieved, and a good heat dissipation effect is achieved.
It should be noted that the positions and the structural relationships of the first heat dissipation teeth 402 and the second heat dissipation teeth 403 are only examples, and in other alternative schemes, other positions and structural relationships may also be adopted, for example, the second heat dissipation teeth are located near a side of the housing close to the axial flow fan, the first heat dissipation teeth are located at a side of the housing away from the axial flow fan, the second heat dissipation teeth are arranged in the housing at intervals in parallel along the axial direction of the rotating shaft on the axial flow fan, and an included angle between the first heat dissipation teeth and the second heat dissipation teeth forms an obtuse angle. The present application does not impose any particular restrictions on the positions and structural relationships of the first heat dissipation teeth and the second heat dissipation teeth, as long as the above-described structure can achieve the objectives of the present application.
In some embodiments, since the temperature near the power amplifier tube mounting position is higher in the power amplifier, the airflow in this area needs to be increased, and therefore, the position of the second heat dissipation tooth 403 in this application corresponds to the position of the power amplifier tube 60, that is, the position of the second heat dissipation tooth 403 is close to the mounting position of the power amplifier tube 60 in the box 10. When the axial flow fan 20 is operated, the airflow at the position of the second heat dissipation tooth 403 is rapidly enhanced, thereby facilitating the heat dissipation at the power amplification tube 60.
In some embodiments, as shown in fig. 1 or fig. 2, the housing 401 of the present embodiment is integrally formed with the box body 10. The shell 401 and the box body 10 are integrally formed, so that not only are the whole installation steps reduced, but also the shell 401 can be in seamless contact with one side of the power amplification tube 60 tightly attached to the box body 10, and further cold air in the shell 401 can be directly transmitted into the box body 10.
In some embodiments, as shown in fig. 1, in order to facilitate the installation of the axial flow fan 20, the present application provides a mounting bracket 30 on the casing 401, the axial flow fan 20 can be installed on the casing 401 through the mounting bracket 30, the mounting bracket 30 is integrally formed with the casing 401, or the mounting bracket 30 is fastened and connected to the casing 401 through a bolt.
Specifically, the mounting bracket 30 may be mounted at an opening on one side of the housing 401 through a structure of a thread or a buckle, a threaded hole is provided on one side of the mounting bracket 30 away from the housing 401, a threaded hole is also provided on the axial flow fan 20, and the mounting bracket 30 is fixed on the bolt by a nut after the bolt sequentially passes through the threaded hole on the axial flow fan 20 and the threaded hole on the mounting bracket 30; or a clamping block is arranged on one side of the axial flow fan 20 close to the mounting bracket 30, and a clamping groove is arranged on one side of the mounting bracket 30 close to the axial flow fan 20 and matched with the clamping block.
It should be noted that, the connection structure between the axial flow fan and the mounting bracket, and between the mounting bracket and the casing is only an example, in other alternative schemes, other connection structures may also be adopted, for example, the axial flow fan and the mounting bracket are connected by a connection structure of a lock catch, and the mounting bracket and the casing are connected by welding.
In some embodiments, in order to make the air sent by the axial flow fan 20 to the heat sink 40 be all air pressure, so as to achieve uniform distribution of the air flow, a static pressure box (not shown) is disposed between the axial flow fan 20 and the heat sink 40, and the static pressure box is selected from a static pressure box with application number 201820130269.5, when the axial flow fan 20 is operated, the external cold air firstly enters the static pressure box through the axial flow fan 20, the air pressure is uniform inside the static pressure box, and then enters the heat sink 40, so as to achieve uniform distribution of the air flow.
It should be noted that the above described hydrostatic tank is only an example, and in other alternatives, other configurations of hydrostatic tanks may be used, such as the one described in application No. 201721889177.7. The present application does not specifically limit the specific structure of the plenum box, so long as the above-described structure achieves the object of the present application.
In some embodiments, in order to further improve the heat dissipation effect between the power tube 60 and the inner surface of the box 10, a thermal pad, such as an indium foil, is disposed between the power tube 60 and the inner surface of the box 10, and the indium foil has high thermal conductivity and high ductility, which can effectively reduce the thermal contact resistance between the power tube 60 and the inner surface of the box 10.
In some embodiments, as shown in fig. 5, the present application further includes a control circuit board 70 and a power module 80, wherein the control circuit board 70 and the power module 80 are both disposed inside the box 10, and the control circuit board 70 is electrically connected to the power module 80 and the power amplifier tube 60, respectively.
In some embodiments, in order to avoid signal interference when the power amplifier is in use, as shown in fig. 5, an isolator 90 is further disposed inside the box 10, and the isolator 90 may be an isolator of type MIK-402E.
The utility model also provides a power amplifier, include: the power amplifier comprises a power amplifier body and a power amplifier heat dissipation structure as described in any one of the embodiments of the present application, wherein the power amplifier body is arranged inside the heat dissipation structure.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which all fall within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. A power amplifier heat radiation structure, includes power amplifier tube (60), its characterized in that still includes:
the box body (10) is of a hollow structure, the box body (10) is integrally formed by adopting a temperature-uniforming plate (50), and the power amplifier tube (60) is fixed on the inner surface of the box body (10);
the heat dissipation unit is located on one side, close to the box body (10), of the power amplification tube (60), and when the power amplifier works, the heat dissipation unit is used for correspondingly providing air flows with different sizes to heat sources with different temperatures in the box body (10).
2. The power amplifier heat dissipation structure according to claim 1, wherein the heat dissipation unit comprises an axial flow fan (20) and a heat sink (40), an air outlet of the axial flow fan (20) is opposite to the heat sink (40), when the power amplifier is in operation, the axial flow fan (20) is used for delivering cooling air into the heat sink (40), and the heat sink (40) is used for adjusting the entering cooling air into air flows with different sizes and transferring the air flows to heat sources with corresponding temperatures.
3. The power amplifier heat dissipation structure according to claim 2, wherein the heat sink (40) comprises a housing (401) and a first heat dissipation tooth (402) and a second heat dissipation tooth (403) arranged in the housing (401), the housing (401) is arranged on one side of the power tube (60) close to the box body (10), and both the side of the housing (401) close to the axial flow fan (20) and the side far away from the axial flow fan (20) are open structures;
the first heat dissipation teeth (402) are positioned on one side, close to the axial flow fan (20), of the shell (401), and the first heat dissipation teeth (402) are arranged in the shell (401) at intervals in parallel along the axial direction of a rotating shaft on the axial flow fan (20);
the second heat dissipation teeth (403) are located on one side, far away from the axial flow fan (20), of the shell (401), and an included angle between the extending direction of the second heat dissipation teeth (403) and the first heat dissipation teeth (402) forms an obtuse angle.
4. The power amplifier heat dissipation structure according to claim 3, wherein the second heat dissipation teeth (403) are located corresponding to the power amplifier tube (60).
5. The power amplifier heat dissipation structure according to claim 3, wherein the housing (401) is integrally molded with the case body (10), or the housing (401) is fastened to the case body (10) by bolts.
6. The power amplifier heat dissipation structure according to claim 3, further comprising a mounting bracket (30), the axial flow fan (20) being mounted on the housing (401) through the mounting bracket (30).
7. The power amplifier heat dissipation structure according to claim 6, wherein a clamping block is disposed on a side of the axial flow fan (20) close to the mounting bracket (30), and a clamping groove is disposed on a side of the mounting bracket (30) close to the axial flow fan (20), and the clamping groove is matched with the clamping block;
the mounting bracket (30) and the shell (401) are integrally molded, or the mounting bracket (30) is fixedly connected with the shell (401) through a bolt.
8. The power amplifier heat dissipation structure according to claim 2, further comprising a plenum box located between the axial flow fan (20) and the heat sink (40), the plenum box being configured to adjust the cooling air fed by the axial flow fan (20) to a uniform air pressure and then to convey the cooling air into the heat sink (40).
9. The power amplifier heat dissipation structure of claim 1, further comprising a thermal pad comprising indium foil disposed between the power tube (60) and the inner surface of the case (10).
10. A power amplifier, comprising: a power amplifier body and the heat dissipation structure of the power amplifier of any one of claims 1 to 9, the power amplifier body being disposed inside the heat dissipation structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922285039.3U CN211321861U (en) | 2019-12-18 | 2019-12-18 | Power amplifier heat radiation structure and power amplifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922285039.3U CN211321861U (en) | 2019-12-18 | 2019-12-18 | Power amplifier heat radiation structure and power amplifier |
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| Publication Number | Publication Date |
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| CN211321861U true CN211321861U (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922285039.3U Active CN211321861U (en) | 2019-12-18 | 2019-12-18 | Power amplifier heat radiation structure and power amplifier |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597698A (en) * | 2022-02-28 | 2022-06-07 | 中航光电科技股份有限公司 | LRM module capable of being quickly assembled and disassembled and preventing rain and electromagnetic shielding |
| CN114980633A (en) * | 2022-08-02 | 2022-08-30 | 成都汉芯国科集成技术有限公司 | Power amplifier device of front side heat extraction structure |
-
2019
- 2019-12-18 CN CN201922285039.3U patent/CN211321861U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114597698A (en) * | 2022-02-28 | 2022-06-07 | 中航光电科技股份有限公司 | LRM module capable of being quickly assembled and disassembled and preventing rain and electromagnetic shielding |
| CN114597698B (en) * | 2022-02-28 | 2024-04-16 | 中航光电科技股份有限公司 | LRM module capable of being quickly assembled and disassembled and preventing rain and electromagnetic shielding |
| CN114980633A (en) * | 2022-08-02 | 2022-08-30 | 成都汉芯国科集成技术有限公司 | Power amplifier device of front side heat extraction structure |
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