CN211277971U - 一种大尺寸硅片磨削用夹持装置 - Google Patents
一种大尺寸硅片磨削用夹持装置 Download PDFInfo
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- CN211277971U CN211277971U CN201922001701.8U CN201922001701U CN211277971U CN 211277971 U CN211277971 U CN 211277971U CN 201922001701 U CN201922001701 U CN 201922001701U CN 211277971 U CN211277971 U CN 211277971U
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 128
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 128
- 239000010703 silicon Substances 0.000 title claims abstract description 128
- 238000000227 grinding Methods 0.000 title claims abstract description 44
- 235000012431 wafers Nutrition 0.000 claims abstract 12
- 238000003754 machining Methods 0.000 abstract description 5
- 229910001651 emery Inorganic materials 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000007603 infrared drying Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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CN201922001701.8U CN211277971U (zh) | 2019-11-19 | 2019-11-19 | 一种大尺寸硅片磨削用夹持装置 |
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CN201922001701.8U CN211277971U (zh) | 2019-11-19 | 2019-11-19 | 一种大尺寸硅片磨削用夹持装置 |
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CN211277971U true CN211277971U (zh) | 2020-08-18 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112720119A (zh) * | 2020-12-19 | 2021-04-30 | 华中科技大学 | 一种晶圆快速定位装置及方法 |
CN113414572A (zh) * | 2021-07-14 | 2021-09-21 | 星河智源(深圳)科技有限公司 | 一种齿轮轴自动插装机 |
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2019
- 2019-11-19 CN CN201922001701.8U patent/CN211277971U/zh active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112720119A (zh) * | 2020-12-19 | 2021-04-30 | 华中科技大学 | 一种晶圆快速定位装置及方法 |
CN113414572A (zh) * | 2021-07-14 | 2021-09-21 | 星河智源(深圳)科技有限公司 | 一种齿轮轴自动插装机 |
CN113414572B (zh) * | 2021-07-14 | 2023-09-29 | 山东国众机械科技有限公司 | 一种齿轮轴自动插装机 |
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CB03 | Change of inventor or designer information |
Inventor after: You Bailing Inventor after: Xie Yan Inventor after: Yang Chunxue Inventor after: Liu Miao Inventor after: Chang Xueyan Inventor after: Lv Ying Inventor after: Xu Rongqing Inventor after: Pei Kunyu Inventor after: Zhu Bin Inventor after: Liu Jiaolong Inventor after: Wu Wei Inventor after: Sun Chenguang Inventor after: Liu Jianwei Inventor after: Wang Juan Inventor after: Liu Yuan Inventor before: You Bailing Inventor before: Xie Yan Inventor before: Yang Chunxue Inventor before: Liu Miao Inventor before: Chang Xueyan Inventor before: Lv Ying Inventor before: Xu Rongqing Inventor before: Pei Kunyu Inventor before: Zhu Bin Inventor before: Liu Jiaolong Inventor before: Wu Wei Inventor before: Sun Chenguang Inventor before: Liu Jianwei Inventor before: Wang Juan Inventor before: Liu Yuan |
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CB03 | Change of inventor or designer information | ||
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Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region after: China Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Address before: No.12 Haitai East Road, Huayuan Industrial Zone, Binhai New Area, Tianjin Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Country or region before: China Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. |
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