CN211267244U

CN211267244U - FPC single face substrate with PI reinforcement

Info

Publication number: CN211267244U
Application number: CN202020022860.6U
Authority: CN
Inventors: 刘传海
Original assignee: Huizhou Fubang Electronic Technology Co ltd
Current assignee: Huizhou Fubang Electronic Technology Co ltd
Priority date: 2020-01-07
Filing date: 2020-01-07
Publication date: 2020-08-14
Anticipated expiration: 2030-01-07

Abstract

The utility model relates to a FPC single face substrate with PI reinforcement, including copper foil layer and PI strengthening layer, be provided with the adhesive film between copper foil layer and the PI strengthening layer, be provided with the perforating hole on the PI strengthening layer, be provided with the gauze on the perforating hole. The utility model provides a FPC single face substrate with PI reinforcement, only individual layer PI strengthening layer has eliminated the coefficient of expansion inconsistency that two-layer different thickness PI layer caused and the product warpage that forms, and the roughness of perforating hole and gauze is better guaranteed in the design of perforating hole and gauze, guarantees that the adhesive has the adhesive strength of enough height.

Description

FPC single face substrate with PI reinforcement

Technical Field

The utility model relates to a FPC substrate field especially relates to a FPC single face substrate with PI reinforcement.

Background

In actual production, the situation that a PI is attached to the whole back of a single-sided FPC for reinforcement is encountered, for example, the single-sided FPC is manufactured according to a conventional single-sided FPC production process, namely, a single-sided FPC circuit is produced by using a single-sided substrate, then a covering film is attached, a positioning hole is punched, and then the PI reinforcement is attached to the whole back of the FPC substrate after the circuit and the covering film are completed.

Because the thickness PI of the base material is very thin (about 25 micrometers), the thickness of PI reinforcement is much thicker (about 200 micrometers), when the base material and the PI are pressed together at high temperature (180 ℃), the expansion coefficients of the base material and the PI are inconsistent, the plate surface is seriously warped after pressing, the precision of appearance processing is influenced, and the quality qualified rate of products is reduced.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a FPC single face substrate with PI reinforcement, only individual layer PI strengthening layer has eliminated the coefficient of expansion inconsistent and the product warpage that forms that two-layer different thickness PI layer caused, and the design of perforating hole and gauze ensures that the roughness of adhesive is better, guarantees that the adhesive has enough high adhesive strength.

The purpose of the utility model is realized through the following technical scheme:

the FPC single-sided substrate with PI reinforcement comprises a copper foil layer and a PI reinforcement layer, wherein an adhesive film is arranged between the copper foil layer and the PI reinforcement layer, a through hole is formed in the PI reinforcement layer, and a gauze is arranged on the through hole.

Preferably, the gauze is located at an end of the through hole, and one side of the gauze is bonded to the adhesive film and the other side of the gauze is bonded to the PI reinforcing layer.

Preferably, the number of the through holes is plural, and the number of the mesh yarns is equal to the number of the through holes.

Preferably, the size of the gauze is larger than the cross-sectional size of the through hole, and the gauze completely covers the end part of the through hole.

Preferably, the mesh number is 50 to 270 mesh.

Preferably, the end of the through-hole is covered with a plurality of gauzes.

Preferably, the copper foil layer and the PI reinforcing layer are made of sheet materials with the same size in a roll shape.

Preferably, the adhesive film has a thickness of 20 to 30 microns.

Preferably, one side surface of the copper foil layer is attached to the adhesive film, the other side surface of the copper foil layer is processed to form a circuit, and the adhesive film completely covers one side surface of the copper foil layer.

Preferably, a groove for placing the gauze is dug in the PI reinforcing layer and is located at the end part of the through hole.

The utility model discloses compare in prior art's beneficial effect and be:

the utility model discloses a FPC single face substrate improves on the basis of traditional FPC single face substrate, only uses one deck PI strengthening layer to glue through the adhesive. In order to ensure the bonding fit of the PI reinforcing layer and the copper foil layer, a plurality of through holes for exhausting are formed in the PI reinforcing layer, gauze is further arranged on the through holes, the through holes can discharge redundant air on the adhesive, the gauze can prevent the adhesive from being discharged from the through holes accidentally, and the flatness of the adhesive is ensured.

Drawings

Fig. 1 is a structural diagram of an FPC single-sided substrate with PI reinforcement in embodiment 1 of the present invention.

Fig. 2 is a structural diagram of an FPC single-sided substrate with PI reinforcement in embodiment 2 of the present invention.

Detailed Description

To facilitate understanding of those skilled in the art, the present invention will be described in further detail with reference to specific embodiments and drawings.

Referring to fig. 1, an embodiment 1 of the present invention includes:

the FPC single-sided substrate with PI reinforcement comprises a copper foil layer 1 and a PI reinforcement layer 2, an adhesive film 3 is arranged between the copper foil layer 1 and the PI reinforcement layer 2, a through hole 4 is formed in the PI reinforcement layer 2, and a gauze 5 is arranged on the through hole 4. The gauze 5 is positioned at the end of the through hole 4, and one side of the gauze 5 is bonded to the adhesive film 3 and the other side is bonded to the PI reinforcing layer 2.

The number of the through holes 4 is plural, and the number of the gauze 5 is equal to that of the through holes 4. The size of the gauze 5 is larger than the cross section size of the through hole 4, and the gauze 5 completely covers the end part of the through hole 4. 5 meshes of gauze are 50 meshes; the end of the through-hole 4 is covered with a plurality of mesh yarns 5. The copper foil layer 1 and the PI reinforcing layer 2 are made of sheet materials with the same roll size, and the thickness of the adhesive film 3 is 20-30 microns. One side surface of the copper foil layer 1 is attached to the adhesive film 3, the other side surface is processed to form a circuit, and the adhesive film 3 completely covers one side surface of the copper foil layer 1.

Referring to fig. 2, embodiment 2 of the present invention includes:

the FPC single-sided substrate with PI reinforcement comprises a copper foil layer 1 and a PI reinforcement layer 2, an adhesive film 3 is arranged between the copper foil layer 1 and the PI reinforcement layer 2, a through hole 4 is formed in the PI reinforcement layer 2, and a gauze 5 is arranged on the through hole 4. The gauze 5 is positioned at the end of the through hole 4, and one side of the gauze 5 is bonded to the adhesive film 3 and the other side is bonded to the PI reinforcing layer 2. Dig on the PI strengthening layer 2 and be equipped with the recess that is used for placing gauze 5, the recess is located 4 tip of perforating hole, and gauze 5 card is in the recess, and under the limiting displacement of recess, rubberizing in-process, gauze 5 also is difficult to take place the skew.

The FPC single-sided substrate of examples 1 and 2 was modified based on the conventional FPC single-sided substrate, using only one PI reinforcing layer, and bonded by an adhesive. In order to ensure the bonding fit of the PI reinforcing layer and the copper foil layer, a plurality of through holes for exhausting are formed in the PI reinforcing layer, gauze is further arranged on the through holes, the through holes can discharge redundant air on the adhesive, the gauze can prevent the adhesive from being discharged from the through holes accidentally, and the flatness of the adhesive is ensured.

In the description of the present invention, it is to be understood that the terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims

1. The FPC single-sided substrate with PI reinforcement is characterized by comprising a copper foil layer (1) and a PI reinforcement layer (2), an adhesive film (3) is arranged between the copper foil layer (1) and the PI reinforcement layer (2), a through hole (4) is formed in the PI reinforcement layer (2), and a gauze (5) is arranged on the through hole (4).

2. The FPC single-sided substrate with PI reinforcement according to claim 1, wherein the gauze (5) is located at the end of the through hole (4), and one side of the gauze (5) is attached to the adhesive film (3) and the other side is attached to the PI reinforcement layer (2).

3. The PI-reinforced FPC single-sided substrate as claimed in claim 1, wherein the number of the through holes (4) is large, and the number of the mesh yarns (5) is equal to that of the through holes (4).

4. The FPC single-sided substrate with PI reinforcement according to claim 1, wherein the dimension of the gauze (5) is larger than the cross-sectional dimension of the through hole (4), and the gauze (5) completely covers the end of the through hole (4).

5. The FPC single-sided substrate with PI reinforcement of claim 1, wherein the mesh number of the gauze (5) is 50-270 meshes.

6. The FPC single-sided substrate with PI reinforcement according to claim 1, wherein the ends of the through holes (4) are covered with a plurality of gauze (5).

7. The FPC single-sided substrate with PI reinforcement of claim 1, wherein the copper foil layer (1) and the PI reinforcement layer (2) are sheet materials with the same size in a roll shape.

8. The FPC single-sided substrate with PI reinforcement according to claim 1, characterized in that the thickness of the adhesive film (3) is 20-30 μm.

9. The FPC single-sided substrate with PI reinforcement of claim 1, wherein one side of the copper foil layer (1) is attached to an adhesive film (3), the other side is processed to form a circuit, and the adhesive film (3) completely covers one side of the copper foil layer (1).

10. The FPC single-sided substrate with PI reinforcement of claim 1, wherein a groove for placing a gauze is dug on the PI reinforcement layer (2), and the groove is positioned at the end part of the through hole (4).