CN211265452U - High heat conduction packaging structure of closing cap of sorting flip chip - Google Patents
High heat conduction packaging structure of closing cap of sorting flip chip Download PDFInfo
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- CN211265452U CN211265452U CN201921840102.9U CN201921840102U CN211265452U CN 211265452 U CN211265452 U CN 211265452U CN 201921840102 U CN201921840102 U CN 201921840102U CN 211265452 U CN211265452 U CN 211265452U
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- flip chip
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- copper sheet
- plated copper
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Abstract
The utility model relates to a high heat conduction packaging structure of a sealing cover of a sorting flip chip, which comprises a substrate, a flip chip, a metal cover and a nickel-plated copper sheet, wherein the metal cover is welded on the substrate, and the flip chip is positioned in the metal cover; filling glue is arranged between the flip chip and the substrate, the nickel-plated copper sheet is adhered to the back of the flip chip through the lower heat-conducting adhesive layer on the lower side of the nickel-plated copper sheet, and the upper side of the nickel-plated copper sheet is adhered to the metal cover through the upper heat-conducting adhesive layer; the scheme adopts a structure that an upper layer of heat-conducting adhesive and a lower layer of heat-conducting adhesive are combined with the nickel-plated copper sheet, and finally the encapsulation of the high-heat-conducting sealing cover product is realized; the nickel-plated copper sheet has low manufacturing cost and high practicability, and the heat conduction coefficient of the nickel-plated copper sheet is about 2.6 times of that of the silicon gasket; the device realizes the rapid transfer of heat from the thin sorting flip chip to the metal cover, meets the individual pursuit of a customer on the packaging type, and is suitable for larger gaps between the chip and the metal cover and higher heat dissipation requirements.
Description
Technical Field
The utility model relates to a high heat conduction packaging structure of closing cap of sorting flip chip belongs to integrated circuit flip chip packaging technology field.
Background
When a chip is flip-chip bonded on a substrate or other carrier plates, underfill (underfill) is generally embedded between chip bumps (bump), and the bottom end of a metal cover (Lid) is strongly connected to the substrate or other carrier plates through an adhesive (adhesive) for supporting; the top end of the cavity of the metal cover is communicated to the back surface (non-electrical property surface) of the chip through interface heat dissipation material (TIM glue) to realize heat conduction, and then the metal cover is subjected to ball planting and cutting forming.
When the thickness of the sorting flip chip is less than 500 micrometers and the depth of the cavity of the conventional metal cover is higher than 800 micrometers, the heat dissipation glue with the normal brush interface can not completely fill up the minimum clearance space of about 300 micrometers or even larger, and high-efficiency heat dissipation is realized; therefore, only plastic package (EMC) FCBGA package can be adopted, and the individual requirements of customers on the package form cannot be met; particularly, the metal covers share the die and are uniform in size so as to ensure the minimum cost.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a high heat conduction packaging structure of closing cap of sorting flip chip in order to overcome prior art not enough.
In order to achieve the above purpose, the utility model adopts the technical scheme that: a high-thermal-conductivity packaging structure of a sealing cover of a sorting flip chip comprises a substrate, a flip chip, a nickel-plated copper sheet and a metal cover, wherein a frame of the metal cover is welded on the substrate through a welding agent, and the flip chip is positioned in the metal cover; the front surface of the flip chip is provided with a plurality of bumps, and filling adhesive is arranged between the flip chip and the substrate; the nickel-plated copper sheet is adhered to the back face of the flip chip through the lower heat-conducting adhesive layer on the lower side of the nickel-plated copper sheet, and the upper side of the nickel-plated copper sheet is adhered to the metal cover through the upper heat-conducting adhesive layer.
Preferably, the filling glue fills gaps between the flip chip and the substrate and gaps between the bumps.
Preferably, the lower heat-conducting adhesive layer and the upper heat-conducting adhesive layer are both composed of spot-coated heat-conducting adhesive and solder paste.
Preferably, a solder ball is soldered to the bottom of the substrate.
Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:
the scheme adopts a structure that an upper layer of heat-conducting adhesive and a lower layer of heat-conducting adhesive are combined with the nickel-plated copper sheet, and finally the encapsulation of the high-heat-conducting sealing cover product is realized; in the packaging unit, the heat conduction coefficient of the heat conduction adhesive is 0.5-1.9W/mK, the heat conduction coefficient of the solder paste is 65W/mK, the heat conduction coefficient of the nickel-plated copper sheet is 390W/mK, and is about 2.6 times of the heat conduction coefficient of the silicon gasket 149W/mK; the nickel-plated copper sheet has low manufacturing cost and high practicability; the device realizes the rapid transfer of heat from the thin sorting flip chip to the metal cover, meets the individual pursuit of a customer on the packaging type, and is suitable for larger gaps between the chip and the metal cover and higher heat dissipation requirements.
Drawings
The technical scheme of the utility model is further explained by combining the attached drawings as follows:
fig. 1 is a schematic view of a package structure with a high thermal conductivity for a cap of a sorting and flip chip according to the present invention;
FIG. 2 is a schematic view of a first step of the process of the present invention;
FIG. 3 is a schematic diagram of a second step of the process of the present invention;
FIG. 4 is a schematic diagram of a third step of the process of the present invention;
FIG. 5 is a fourth schematic view of the process of the present invention;
FIG. 6 is a schematic diagram of a fifth step of the process of the present invention;
FIG. 7 is a sixth schematic view of the process of the present invention;
FIG. 8 is a seventh schematic view of the process of the present invention;
FIG. 9 is an eighth schematic view of the process of the present invention;
fig. 10 is a ninth schematic view of the process of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1, the package structure with high thermal conductivity for a cap of a sorting flip chip according to the present invention comprises a substrate 11, a flip chip 12 and a metal cap 7, wherein a solder ball 9 is welded on the bottom of the substrate 11, a frame of the metal cap 7 is welded on the substrate 11 by a solder 6, and the flip chip 12 is located in the metal cap 7; the front surface of the flip chip 12 is provided with a plurality of bumps, filling adhesive 2 is arranged between the flip chip 12 and the substrate 11, and the filling adhesive 2 fills gaps between the flip chip 12 and the substrate 11 and gaps between the bumps; set up nickel plating copper sheet 4 on flip-chip 12's the opposite side, nickel plating copper sheet 4 pastes the back at flip-chip 12 through lower heat conduction adhesive linkage 3 of its downside, and nickel plating copper sheet 4's upside passes through last heat conduction adhesive linkage 5 and metal covering 7 adhesion, and lower heat conduction adhesive linkage 3 and last heat conduction adhesive linkage 5 are constituteed by the heat conduction adhesive and the tin cream of point-coating.
The sealing cover high-thermal-conductivity packaging structure of the sorting flip chip mainly aims at realizing the rapid transfer of heat from the thin sorting flip chip to the metal cover; wherein, the depth and the height of the metal cover cavity can be larger without limitation.
As shown in fig. 2-10, the process of the package structure is as follows:
the first step is as follows: flip chip bonding;
the thin sorting chip is inversely arranged on the substrate or other carrier plates, and 100% corresponding connection of signals is realized.
The second step is that: filling the bottom of the chip;
the underfill material is applied to all gaps between the thin-type chip sorter and the substrate or other carrier plates by siphoning, and is cured to enhance the connection firmness between the chip bumps and the substrate pads.
The third step: firstly, spot-coating heat-conducting adhesive and solder paste;
and uniformly coating the heat-conducting adhesive and the solder paste on the whole back surface of the thin sorting chip.
The fourth step: pasting and baking a nickel-plated copper sheet;
and adhering the nickel-plated copper sheet to the back of the thin sorting chip through a heat-conducting adhesive and solder paste, flattening and baking in an oven.
The fifth step: secondly, thermally conductive adhesive and solder paste are applied in a spot mode;
and uniformly spot-coating the heat-conducting adhesive and the solder paste on the whole back of the nickel-plated copper sheet.
And a sixth step: spot-coating a welding agent;
and spot-coating the welding agent on the annular cover pasting area of the substrate or other carrier plates to ensure uniform BLT and consistent welding width.
The seventh step: sticking a metal cover;
and aligning the metal cover to an annular cover pasting area, namely a welding agent spot coating area, of the substrate or other carrier plates, and controlling the displacement and the pressing height.
Eighth step: fully curing;
the semi-finished product after the metal cover pressing is put into an oven 81, and a pressing block 82 is filled, and then the whole is baked to be fully cured.
The ninth step: planting balls;
the solder balls are soldered on ball pads (ball pads) of the substrate or other carrier boards, so that the chip signal units are effectively communicated with the solder balls through the substrate.
The tenth step: cutting the sheet;
the entire sheet product is cut into individual units using a cutter.
The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.
Claims (3)
1. The utility model provides a high heat conduction packaging structure of closing cap of letter sorting flip chip which characterized in that: the nickel-plated copper sheet flip chip comprises a substrate (11), a flip chip (12), a nickel-plated copper sheet (4) and a metal cover (7), wherein the frame of the metal cover (7) is welded on the substrate (11) through a welding agent (6), and the flip chip (12) is positioned in the metal cover (7); the front surface of the flip chip (12) is provided with a plurality of bumps, and filling glue (2) is arranged between the flip chip (12) and the substrate (11); the nickel-plated copper sheet (4) is adhered to the back of the flip chip (12) through the lower heat-conducting adhesive layer (3) on the lower side of the nickel-plated copper sheet, and the upper side of the nickel-plated copper sheet (4) is adhered to the metal cover (7) through the upper heat-conducting adhesive layer (5).
2. The package structure for sorting flip chips and capping high thermal conductivity according to claim 1, wherein: the filling glue (2) fills gaps between the flip chip (12) and the substrate (11) and gaps between the bumps.
3. The package structure for sorting flip chips and capping high thermal conductivity according to claim 1, wherein: the bottom of the substrate (11) is welded with a solder ball (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921840102.9U CN211265452U (en) | 2019-10-30 | 2019-10-30 | High heat conduction packaging structure of closing cap of sorting flip chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921840102.9U CN211265452U (en) | 2019-10-30 | 2019-10-30 | High heat conduction packaging structure of closing cap of sorting flip chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211265452U true CN211265452U (en) | 2020-08-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921840102.9U Active CN211265452U (en) | 2019-10-30 | 2019-10-30 | High heat conduction packaging structure of closing cap of sorting flip chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211265452U (en) |
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2019
- 2019-10-30 CN CN201921840102.9U patent/CN211265452U/en active Active
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