CN211247164U - Glue dispensing mechanism of full-automatic IC plane die bonder - Google Patents
Glue dispensing mechanism of full-automatic IC plane die bonder Download PDFInfo
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- CN211247164U CN211247164U CN201921926815.7U CN201921926815U CN211247164U CN 211247164 U CN211247164 U CN 211247164U CN 201921926815 U CN201921926815 U CN 201921926815U CN 211247164 U CN211247164 U CN 211247164U
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Abstract
The utility model discloses a glue dispensing mechanism of a full-automatic IC plane die bonder, which comprises a supporting seat and a glue dispensing unit, wherein the glue dispensing unit is arranged on the supporting seat; the dispensing unit comprises a dispensing cylinder assembly and a moving platform assembly capable of driving the dispensing cylinder assembly to move transversely and longitudinally, the moving platform assembly moves to a dispensing station through driving the dispensing cylinder assembly, and the dispensing cylinder assembly extrudes glue in a dispensing cylinder under the control of the system and dispenses the glue on the IC support. For traditional point mode of gluing, the utility model discloses mechanism glues carries out the point through setting up two sets of glue units of gluing and glues, has improved point and has glued efficiency. The utility model discloses point gum machine constructs removes through horizontal vertical drive point gum cylinder subassembly, and the position is glued to the point of accurate removal.
Description
Technical Field
The utility model relates to an automation equipment technical field relates to a point gum machine constructs, and specific saying so relates to a point gum machine of full-automatic IC plane solid brilliant machine constructs.
Background
The conventional die bonding mode is that a die bonding swing arm is driven by a motor or other driving mechanisms to rotate and move up and down to suck a wafer from a wafer ring and then convey the wafer to a die bonding position of a support to complete die bonding. Because the processing and assembly of moving parts have inevitable precision problems, the normal use of conventional medium and low precision die bonding machines can be ensured within an allowable range by controlling the precision, but the quality of products is influenced for the machines needing high precision die bonding.
Aiming at the defects in the prior art, a novel glue dispensing mechanism of a full-automatic IC plane die bonder is urgently needed at present.
SUMMERY OF THE UTILITY MODEL
To the deficiency among the prior art, the to-be-solved technical problem of the utility model lies in providing a point gum machine of solid brilliant machine in full-automatic IC plane constructs. The design aims to improve the die bonding precision and reduce the loss rate.
In order to solve the technical problem, the utility model discloses a following scheme realizes: a glue dispensing mechanism of a full-automatic IC plane die bonder comprises:
a support base;
at least one dispensing unit arranged on the supporting seat;
the dispensing unit includes:
a dispensing cylinder component;
the moving platform assembly can drive the glue dispensing cylinder assembly to move transversely and longitudinally, the moving platform assembly moves to a glue dispensing station through driving the glue dispensing cylinder assembly, and the glue dispensing cylinder assembly extrudes glue in a glue cylinder under the control of the system and dispenses the glue on the IC support.
Furthermore, the dispensing units are provided with two groups which are fixedly arranged at the top end of the supporting seat side by side.
Further, the mobile platform assembly comprises:
a raised line is transversely arranged on the surface of the base;
the transverse sliding rail is fixedly arranged on the raised line;
the longitudinal sliding table is connected to the transverse sliding rail in a sliding mode;
the longitudinal sliding rail is longitudinally arranged on the longitudinal sliding table;
the glue dispensing cylinder assembly is arranged on the moving platform and transversely and longitudinally moves by utilizing the transverse sliding rail and the longitudinal sliding rail.
Further, horizontal slide rail is provided with two and parallel arrangement in the up end of two sand grips on the X axle direction, be provided with first linear electric motor on the bottom plate between the horizontal slide rail, first linear electric motor's drive end is connected on vertical slip table, vertical slip table is in follow under first linear electric motor's the drive horizontal slide rail carries out X axial displacement.
Furthermore, vertical slide rail is provided with two and parallel arrangement in Y axle direction vertical slip table's up end is provided with second linear electric motor on the bottom plate between the vertical slide rail, second linear electric motor's drive end is connected moving platform is last, moving platform is in follow under second linear electric motor's the drive vertical slide rail carries out Y axial displacement, and then, moving platform is in under first linear electric motor and second linear electric motor's the common drive, carry out the epaxial removal of X axle and Y.
Furthermore, the dispensing cylinder assembly comprises a motor fixing seat, a lifting motor, a cross slide rail, a slide block and a rubber cylinder assembly, wherein a downward opening is formed in the lower part of the motor fixing seat, right-angle grooves are formed in two sides of the opening, the cross slide rail is laterally arranged on the right-angle grooves of the motor fixing seat, and the slide block is movably connected to the cross slide rail;
the lifting motor is fixed on the motor fixing seat, the driving end of the lifting motor is connected with the sliding block downwards, the rubber cylinder assembly is installed on one side of the sliding block, and the rubber cylinder assembly is driven by the lifting motor to move up and down along the crossed sliding rails.
Further, the packing element subassembly includes:
the glue cylinder is used for storing glue inside, the lower end of the glue cylinder is provided with a glue nozzle, the upper end of the glue cylinder is connected with an air pipe, the glue cylinder, the air pipe and the glue form a closed space, and the glue dispensing amount of the glue nozzle is controlled by the air pressure of the system;
and the lens component is obliquely fixed on the side part of the rubber tube and is used for assisting the rubber nozzle to dispense glue to the dispensing position of the IC support.
Compared with the prior art, the beneficial effects of the utility model are that:
1. for traditional point mode of gluing, the utility model discloses mechanism glues carries out the point through setting up two sets of glue units of gluing and glues, has improved point and has glued efficiency.
2. The utility model discloses point gum machine constructs removes through horizontal vertical drive point gum cylinder subassembly, and the position is glued to the point of accurate removal.
Drawings
Fig. 1 is an axial view of the glue dispensing mechanism of the present invention.
Fig. 2 is an exploded view of the die bonding unit of the present invention.
Fig. 3 is a schematic diagram of the structure of the mobile platform assembly of the present invention.
Fig. 4 is a schematic structural view of the dispensing tube assembly after the lens assembly is removed.
Fig. 5 is an exploded view of the dispensing cartridge assembly of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making more clear and definite definitions of the protection scope of the present invention. It is obvious that the described embodiments of the invention are only some of the embodiments of the invention, and not all of them. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; the two elements may be directly connected or indirectly connected through an intermediate medium, or may be communicated with each other inside the two elements, or may be wirelessly connected or wired connected. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.
referring to fig. 1-5, the utility model discloses a full-automatic IC plane die bonder's point gum machine constructs, should glue the mechanism and includes:
a support base 1;
at least one dispensing unit 2 arranged on the support base 1;
the dispensing unit 2 includes:
a dispensing cartridge assembly 22;
a moving platform component 21 capable of driving the dispensing cylinder component 22 to move transversely and longitudinally, wherein the moving platform component 21 moves to a dispensing station by driving the dispensing cylinder component 22, and the dispensing cylinder component 22 extrudes glue in a glue cylinder and dispenses the glue on the IC bracket under the control of the system.
A preferred technical solution of this embodiment: the glue dispensing units 2 are arranged in two groups and are fixedly arranged at the top end of the supporting seat 1 side by side.
A preferred technical solution of this embodiment: the mobile platform assembly 21 includes:
a base 211, the surface of which is transversely provided with convex strips;
the transverse slide rail 212 is fixedly arranged on the raised strip;
a longitudinal sliding table 213 slidably connected to the transverse sliding rail 212;
a longitudinal slide rail 214 longitudinally arranged on the longitudinal slide table 213;
a moving platform 215 slidably connected to the longitudinal slide rail 214, wherein the dispensing cylinder assembly 22 is mounted on the moving platform 215 and is moved transversely and longitudinally by the transverse slide rail 212 and the longitudinal slide rail 214.
A preferred technical solution of this embodiment: the transverse slide rail 212 is provided with two and parallel arrangement in the upper end face of two sand grips on the X axle direction, be provided with first linear electric motor 216 on the bottom plate between the transverse slide rail 212, the drive end of first linear electric motor 216 is connected on vertical slip table 213, vertical slip table 213 is in under the drive of first linear electric motor 216 along transverse slide rail 212 carries out X axial displacement.
A preferred technical solution of this embodiment: the two longitudinal sliding rails 214 are arranged in the Y-axis direction and are arranged on the upper end face of the longitudinal sliding table 213 in parallel, a second linear motor 217 is arranged on a bottom plate between the longitudinal sliding rails 214, the driving end of the second linear motor 217 is connected to the moving platform 215, the moving platform 215 is driven by the second linear motor 217 to move along the longitudinal sliding rails 214 in the Y-axis direction, and then the moving platform 215 is driven by the first linear motor 216 and the second linear motor 217 together to move in the X-axis direction and the Y-axis direction.
A preferred technical solution of this embodiment: the dispensing cylinder assembly 22 comprises a motor fixing seat 29, a lifting motor 30, a cross sliding rail 31, a sliding block 32 and a rubber cylinder assembly 33, wherein a downward opening is formed in the lower part of the motor fixing seat 29, right-angle grooves are formed in two sides of the opening, the side of the cross sliding rail 31 is installed on the right-angle groove of the motor fixing seat 29, and the sliding block 32 is movably connected to the side of the cross sliding rail 31;
the lifting motor 30 side is fixed on the motor fixing seat 29, the driving end of the lifting motor is connected with the sliding block 32 downwards, the rubber cylinder assembly 33 is installed on one side of the sliding block 32, and the rubber cylinder assembly 33 is driven by the lifting motor 30 to move up and down along the cross sliding rail 31.
A preferred technical solution of this embodiment: the glue cartridge assembly 33 includes:
the glue cylinder is used for storing glue, the lower end of the glue cylinder is provided with a glue nozzle 34, the upper end of the glue cylinder is connected with an air pipe 35, the glue cylinder, the air pipe 35 and the glue form a closed space, and the glue dispensing amount of the glue nozzle 34 is controlled by the air pressure of the system;
and the lens assembly 36 is obliquely fixed on the side part of the rubber tube, and the lens assembly 36 is used for assisting the rubber nozzle 34 to dispense glue to the dispensing position of the IC bracket.
Example 2:
glue is stored in the glue cylinder, the glue cylinder is connected to a compressor device through an air pipe 35, the compressor continuously discharges air pressure to a pipeline, and an electromagnetic valve is arranged on the air pipe 35;
the LED support is conveyed to the glue dispensing station by an external manipulator, the rubber tube assembly 33 is conveyed to the position above the glue dispensing station through the moving platform assembly 21, the rubber tube is arranged right above the glue dispensing position of the LED support, the electromagnetic valve is opened, and glue in the rubber tube is dripped into the glue dispensing position of the LED support by air pressure.
The lens assembly 36 has an image recognition function, and recognizes whether the dispensing position of the LED mount is correct, and assists the glue nozzle 34 to dispense glue onto the dispensing position of the IC mount.
The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent flow changes made by the contents of the specification and the drawings, or directly or indirectly applied to other related technical fields, are included in the same way in the protection scope of the present invention.
Claims (7)
1. The utility model provides a point gum machine of solid brilliant machine in full-automatic IC plane constructs which characterized in that, this point gum machine constructs and includes:
a supporting base (1);
at least one dispensing unit (2) arranged on the support base (1);
the dispensing unit (2) comprises:
a dispensing cartridge assembly (22);
the moving platform assembly (21) can drive the dispensing cylinder assembly (22) to move transversely and longitudinally, the moving platform assembly (21) moves to a dispensing station by driving the dispensing cylinder assembly (22), and the dispensing cylinder assembly (22) extrudes glue in a glue cylinder and dispenses the glue on the IC bracket under the control of the system.
2. The dispensing mechanism of a full-automatic IC plane die bonder as claimed in claim 1, wherein said dispensing units (2) are arranged in two groups and are fixed on top of said supporting base (1) side by side.
3. The dispensing mechanism of a fully automatic IC plane die bonder as claimed in claim 2, wherein said movable platform assembly (21) comprises:
a base (211), the surface of which is transversely provided with a convex strip;
the transverse sliding rail (212) is fixedly arranged on the raised line;
a longitudinal sliding table (213) which is connected with the transverse sliding rail (212) in a sliding manner;
a longitudinal sliding rail (214) longitudinally arranged on the longitudinal sliding table (213);
the glue dispensing cylinder assembly (22) is arranged on the moving platform (215) and transversely and longitudinally moves by utilizing the transverse sliding rail (212) and the longitudinal sliding rail (214).
4. The dispensing mechanism of the full-automatic IC plane die bonder according to claim 3, wherein two transverse slide rails (212) are arranged in the X-axis direction and are arranged on the upper end surfaces of two convex strips in parallel, a first linear motor (216) is arranged on a bottom plate between the transverse slide rails (212), the driving end of the first linear motor (216) is connected to the longitudinal sliding table (213), and the longitudinal sliding table (213) moves along the X-axis direction along the transverse slide rails (212) under the driving of the first linear motor (216).
5. The dispensing mechanism of the full-automatic IC plane die bonder is characterized in that two longitudinal sliding rails (214) are arranged in the Y-axis direction and are arranged on the upper end face of the longitudinal sliding table (213) in parallel, a second linear motor (217) is arranged on a bottom plate between the longitudinal sliding rails (214), the driving end of the second linear motor (217) is connected to the moving platform (215), the moving platform (215) is driven by the second linear motor (217) to move along the longitudinal sliding rails (214) in the Y-axis direction, and further, the moving platform (215) is driven by the first linear motor (216) and the second linear motor (217) together to move in the X-axis direction and the Y-axis direction.
6. The dispensing mechanism of a full-automatic IC plane die bonder according to claim 1, wherein the dispensing cylinder assembly (22) comprises a motor fixing seat (29), a lifting motor (30), a cross sliding rail (31), a sliding block (32) and a rubber cylinder assembly (33), a downward opening is arranged at the lower part of the motor fixing seat (29), right-angle grooves are arranged at two sides of the opening, the cross sliding rail (31) is laterally installed on the right-angle grooves of the motor fixing seat (29), and the sliding block (32) is movably connected to the cross sliding rail;
the lifting motor (30) is laterally fixed on the motor fixing seat (29), the driving end of the lifting motor is connected with the sliding block (32) downwards, the rubber cylinder component (33) is installed on one side of the sliding block (32), and the rubber cylinder component (33) is driven by the lifting motor (30) to move up and down along the crossed sliding rail (31).
7. The dispensing mechanism of a full-automatic IC plane die bonder as claimed in claim 1, wherein said glue cartridge assembly (33) comprises:
the glue cylinder is used for storing glue, a glue nozzle (34) is arranged at the lower end of the glue cylinder, an air pipe (35) is connected to the upper end of the glue cylinder, the air pipe (35) and the glue form a closed space, and the glue dispensing amount of the glue nozzle (34) is controlled by the air pressure of the system;
and the lens assembly (36) is obliquely fixed on the side part of the rubber cylinder, and the lens assembly (36) is used for assisting the rubber nozzle (34) to dispense glue to the dispensing position of the IC bracket.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921926815.7U CN211247164U (en) | 2019-11-07 | 2019-11-07 | Glue dispensing mechanism of full-automatic IC plane die bonder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921926815.7U CN211247164U (en) | 2019-11-07 | 2019-11-07 | Glue dispensing mechanism of full-automatic IC plane die bonder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211247164U true CN211247164U (en) | 2020-08-14 |
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ID=71964800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921926815.7U Active CN211247164U (en) | 2019-11-07 | 2019-11-07 | Glue dispensing mechanism of full-automatic IC plane die bonder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211247164U (en) |
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2019
- 2019-11-07 CN CN201921926815.7U patent/CN211247164U/en active Active
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