CN211182705U

CN211182705U - High-efficient heat dissipation type PCI-E connector

Info

Publication number: CN211182705U
Application number: CN201821877367.1U
Authority: CN
Inventors: 杨海刚; 梁三华
Original assignee: Shenzhen Zhiyuxin Technology Co ltd
Current assignee: Shenzhen Zhiyuxin Technology Co ltd
Priority date: 2018-11-14
Filing date: 2018-11-14
Publication date: 2020-08-04
Anticipated expiration: 2028-11-14

Abstract

The utility model provides a high-efficient heat dissipation type PCI-E connector, including PCI-E connector and radiator, be equipped with a plurality of chips on the PCI-E connector, the radiator is located the upside of chip, the radiator includes bottom plate, a plurality of fin, fan and upper cover, a plurality of fin and fan setting are on the bottom plate, are equipped with graphite alkene layer on the lower surface of bottom plate, graphite alkene layer offsets with the upper surface of chip; the fan comprises a hub, a plurality of inner blades are arranged on the outer circumference of the hub, a circular ring is arranged on the outer circumference of the inner blades, and a plurality of outer blades are arranged on the outer circumference of the circular ring. The utility model provides a be equipped with graphite alkene layer on the radiator bottom plate, the heat conductivility of graphite alkene is excellent, consequently can replace current heat conduction silica gel with it, simultaneously the utility model discloses fan on the radiator is double-deck fan, and the amount of wind is big, the operation is more stable, life is longer.

Description

High-efficient heat dissipation type PCI-E connector

Technical Field

The utility model relates to a PCI-E connector technical field especially relates to a high-efficient heat dissipation type PCI-E connector.

Background

The PCI-E connector is a new generation bus interface, and is widely used in cooperation with devices such as a computer motherboard, a solid state disk, a wireless network card, a video card, and the like, and when the existing PCI-E connector is used, in order to dissipate heat, a layer of heat-conducting silica gel is generally coated on a chip of the PCI-E connector, and then a radiator is covered on the chip.

SUMMERY OF THE UTILITY MODEL

The utility model provides a high-efficient heat dissipation type PCI-E connector, radiator on this PCI-E connector need not to coat heat conduction silica gel on the PCI-E connector again when using, can not influence follow-up detection and the maintenance to each component on the PCI-E connector, convenient to use.

The utility model adopts the technical proposal that: a high-efficiency heat dissipation type PCI-E connector comprises a PCI-E connector and a heat sink, wherein a plurality of chips are arranged on the PCI-E connector, the heat sink is positioned on the upper side of the chips, the heat sink comprises a bottom plate, a plurality of heat dissipation sheets, a fan and an upper cover, the plurality of heat dissipation sheets and the fan are arranged on the bottom plate, a graphene layer is arranged on the lower surface of the bottom plate, and the graphene layer is abutted to the upper surface of the chips; the fan comprises a hub, a plurality of inner blades are arranged on the outer circumference of the hub, a circular ring is arranged on the outer circumference of the inner blades, and a plurality of outer blades are arranged on the outer circumference of the circular ring.

After the technical scheme more than adopting, compared with the prior art, the utility model has the following advantage:

the utility model provides a be equipped with graphite alkene layer on the radiator bottom plate, the heat conductivility of graphite alkene is excellent, consequently can replace current heat conduction silica gel with it, simultaneously the utility model discloses fan on the radiator is double-deck fan, is equipped with the ring on the outer circumference of inner blade for a plurality of inner blade interconnect get up, strengthen inner blade's intensity, at last, be equipped with a plurality of outer blades on the outer circumference of ring, reduced outer blade's length, increased the amount of wind, make fan operation stability better, life is longer.

As an improvement, the lower surface of the bottom plate of the radiator is provided with the graphene heat conduction layer, the graphene heat conduction layer is connected with the bottom plate through the bonding layer, the structure can be used for directly improving the structure of the existing radiator, the operation is simple, and the cost is low.

As the improvement, the bottom plate of the radiator is a graphene plate, and under the structure, the graphene plate can be used for replacing the traditional bottom plate made of metal materials when the radiator is directly produced and manufactured, so that the structure is simpler.

As an improvement, the inner blades and the outer blades are uniformly distributed and used for ensuring that the air outlet of the fan is uniform.

As an improvement, the inner blade and the outer blade are respectively obliquely arranged on the outer circumference of the hub and the outer circumference of the circular ring, the oblique directions of the inner blade and the outer blade are consistent, and the flow direction of air is further ensured to be consistent.

As an improvement, the number of the outer blades is larger than that of the inner blades, so that the strength of the inner blades is ensured to be higher.

Drawings

FIG. 1 is the overall structure of the present invention

FIG. 2 is a schematic view of a fan

FIG. 3 is a schematic view of a heat sink

FIG. 4 is a connection structure of a bottom plate and a graphene heat conduction layer

As shown in the figure, 1, PCI-E connector, 2, heat sink, 21, base plate, 211, graphene heat conducting layer, 212, adhesive layer, 22, heat sink, 23, fan, 231, hub, 232, inner blade, 233, ring, 234, outer blade, 24, and upper cover.

Detailed Description

As shown in fig. 1 to 4, a high-efficiency heat dissipation type PCI-E connector includes a PCI-E connector 1 and a heat sink 2, a plurality of chips are disposed on the PCI-E connector 1, the heat sink 2 is disposed on an upper side of the chips, the heat sink 2 includes a bottom plate 21, a plurality of heat dissipation fins 22, a fan 23 and an upper cover 24, the plurality of heat dissipation fins 22 and the fan 23 are disposed on the bottom plate 21, a graphene layer is disposed on a lower surface of the bottom plate 21, and the graphene layer abuts against an upper surface of the chips.

The fan 23 comprises a hub 231, a plurality of inner blades 232 are arranged on the outer circumference of the hub 231, a circular ring 233 is arranged on the outer circumference of the inner blades 232, and a plurality of outer blades 234 are arranged on the outer circumference of the circular ring 233; the inner blade 232 and the outer blade 234 are uniformly distributed; the inner blade 232 and the outer blade 234 are respectively and obliquely arranged on the outer circumference of the hub 231 and the outer circumference of the ring 233, and the oblique directions of the inner blade 232 and the outer blade 234 are consistent; the number of outer blades 234 is greater than the number of inner blades 232. The fan 23 of this kind of structure is double-deck fan, is equipped with ring 233 on the outer circumference of inner blade 232 for a plurality of inner blade 232 interconnect for the holistic intensity of reinforcing inner blade 232, simultaneously, be equipped with a plurality of outer blades 234 on the outer circumference of ring 233, under the same condition of external diameter, the utility model discloses the length of well outer blade 234 only has the half of traditional fan blade length, consequently the utility model discloses the length of outer blade 234 has been reduced, makes the stability when fan 23 moves better, and life is longer.

As shown in fig. 4, the first structure of the heat sink 2 is: the lower surface of the bottom plate 21 of the heat sink is provided with a graphene heat conduction layer 211, and the graphene heat conduction layer 211 is connected with the bottom plate 21 through an adhesive layer 212.

The second structure of the heat sink 2 is: the graphene board is directly used as the bottom plate 21 of the heat sink.

Preferably, a through hole may be further disposed on the bottom plate 21 of the heat sink, and the through hole is located right below the fan 23, so as to increase air convection and improve heat dissipation effect.

When the heat radiator is used, the graphene layer on the bottom plate 21 of the heat radiator is directly contacted with the upper surface of the chip on the PCI-E connector, heat on the chip is transferred to the radiating fins on the heat radiator 2 through the graphene layer, the heat transfer efficiency is high, and the heat radiator is convenient to use.

The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that various changes and modifications can be made in the embodiments described in the foregoing embodiments, or equivalent changes and modifications can be made in the technical features of each part without departing from the scope of the embodiments of the present invention.

Claims

1. The high-efficiency heat dissipation type PCI-E connector is characterized by comprising a PCI-E connector (1) and a heat sink (2), wherein a plurality of chips are arranged on the PCI-E connector (1), the heat sink (2) is positioned on the upper side of the chips, the heat sink (2) comprises a bottom plate (21), a plurality of heat dissipation fins (22), a fan (23) and an upper cover (24), the heat dissipation fins (22) and the fan (23) are arranged on the bottom plate (21), a graphene layer is arranged on the lower surface of the bottom plate (21), and the graphene layer is abutted to the upper surface of the chips; the fan (23) comprises a hub (231), a plurality of inner blades (232) are arranged on the outer circumference of the hub (231), a circular ring (233) is arranged on the outer circumference of the inner blades (232), a plurality of outer blades (234) are arranged on the outer circumference of the circular ring (233), the inner blades (232) and the outer blades (234) are obliquely arranged on the outer circumference of the hub (231) and the outer circumference of the circular ring (233) respectively, and the oblique directions of the inner blades (232) and the outer blades (234) are consistent.

2. A PCI-E connector as recited in claim 1, wherein a graphene thermal conductive layer (211) is disposed on a lower surface of the base plate (21) of the heat sink (2), and the graphene thermal conductive layer (211) is connected to the base plate (21) through an adhesive layer (212).

3. The PCI-E connector as claimed in claim 1, wherein the bottom plate (21) of the heat sink is a graphene plate.

4. A PCI-E connector of a high efficiency heat dissipation type as recited in claim 1, wherein the inner blade (232) and the outer blade (234) are uniformly distributed.

5. A high efficiency heat dissipating PCI-E connector according to claim 1, wherein the number of outer blades (234) is greater than the number of inner blades (232).