CN211123386U

CN211123386U - Multi-channel on-chip integrated light receiving subassembly

Info

Publication number: CN211123386U
Application number: CN201922380748.XU
Authority: CN
Inventors: 孙涛; 程进; 刘宇飞; 费涛
Original assignee: Xifeng Photoelectric Technology Nanjing Co ltd
Current assignee: Xifeng Photoelectric Technology Nanjing Co ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-07-28
Anticipated expiration: 2029-12-26

Abstract

The application provides a multi-channel on-chip integrated light receiving subassembly, comprising: the device comprises a wave separator component, a photoelectric chip, a carrier plate and other related parts. The photoelectric chip is arranged between the wave separator component and the carrier plate; the wave separator component and the photoelectric chip are arranged on one surface of the carrier plate, and the other surface of the carrier plate can be attached to a PCB (printed circuit board) on which the light receiving sub-component is to be mounted; the routing is arranged at the edge of the carrier plate so as to be convenient for connecting a signal receiving bonding pad on the PCB and be beneficial to improving the high-frequency performance. In the assembling process, the photoelectric chip and the wave splitter component can be installed on the carrier plate, and after the photoelectric chip and the wave splitter component are fixedly coupled, the carrier plate is assembled on the PCB, so that defects of the light receiving sub-component can be found in time before assembly, adverse effects of the assembling process of the PCB on parts on the light receiving sub-component are reduced, and the assembling is facilitated.

Description

Multi-channel on-chip integrated light receiving subassembly

Technical Field

The application relates to the technical field of optical communication, in particular to a multi-channel on-chip integrated optical receiving subassembly.

Background

A Receiver Optical Subassembly (ROSA) is an Optical communication component that converts an Optical signal into an electrical signal. The optical receiving subassembly includes an optical element and an electrical element, and generally receives an optical signal through the optical element, converts the received optical signal into an electrical signal through a photoelectric conversion chip, and processes, converts or forwards the converted electrical signal through the electrical element to complete receiving of the optical signal in optical communication. With the continuous increase of the transmission rate of optical communication, the requirement of high-speed performance on the optical receiving subassembly is higher and higher.

Currently, in the field of optical communication, a coaxially packaged optical receiving subassembly is mostly used, and coaxial packaging is used to keep a coaxial relationship between a photoelectric conversion chip in the receiving subassembly and an optical transmission line so as to directly receive an optical signal in the optical transmission line. When the optical receiving subassembly of the coaxial package is applied at a long line distance, the optical signal receiving capability of the optical receiving subassembly deviates from the preset capability due to the length of the line and the turning part, and the optical receiving subassembly is increasingly difficult to adapt to the requirement of the rate of more than 25 Gb/s.

In addition, there is a trend of popularizing and adopting a COB (chip On Board) scheme in optical communication, whereas a COB (chip On Board) chip of a conventional optical receiving subassembly is directly placed On a PCB (Printed circuit Board), and expensive parts are often soldered On the PCB in advance, so that the assembly of the COB chip is difficult. If the valuable parts are welded later, the UV glue (Ultraviolet ray curable glue) on the COB chip is difficult to bear the high temperature of reflow soldering, and the fixing effect of the COB chip is damaged; if the valuable parts are welded firstly, the COB chip is difficult to rework once the installation fails, and the valuable parts are scrapped. That is, on the PCB, the conventional COB optical receiver subassembly is hardly suitable for assembly of expensive components requiring reflow soldering.

SUMMERY OF THE UTILITY MODEL

The application provides a multi-channel on-chip integrated light receiving subassembly to solve the problem that the conventional light receiving subassembly is not beneficial to assembly.

The application provides a multi-channel on-chip integrated light receiving subassembly, comprising: the device comprises a wave separator component, a photoelectric chip, a carrier plate and a routing;

the photoelectric chip is arranged between the wave separator component and the routing; the wave splitter component and the photoelectric chip are arranged on one surface of the carrier plate, and the other surface of the carrier plate is attached to a PCB (printed circuit board) on which the light receiving sub-component is to be mounted; the routing is arranged at the edge position of the carrier plate so as to be connected with the signal receiving bonding pad on the PCB.

Optionally, the splitter component comprises: the optical fiber module comprises a substrate, an optical fiber module, a wave separator and a lens array; the optical fiber module, the wave separator and the lens array are sequentially arranged in an area between the substrate and the carrier plate.

Optionally, the substrate is parallel to the carrier plate; one side of the wave separator is connected with the substrate, and the other side of the wave separator is connected with the carrier plate.

Optionally, the wave splitter component further comprises a prism; the prism is arranged on one side of the lens array, which is far away from the wave separator.

Optionally, the optoelectronic chip is disposed between the prism and the carrier.

Optionally, the light receiving subassembly further comprises an amplifier; the amplifier is a trans-impedance amplifier arranged on the lens array carrier plate.

Optionally, one side of the amplifier is connected to the optoelectronic chip, and the other side of the amplifier is connected to the routing.

Optionally, the light receiving subassembly further comprises a filter capacitor; the filter capacitor is a patch capacitor arranged on the carrier plate.

Optionally, one side of the filter capacitor is connected to the optoelectronic chip, and the other side of the filter capacitor is connected to the amplifier.

As can be seen from the above technical solutions, the present application provides a multi-channel on-chip integrated light receiving subassembly, including: the device comprises a wave separator component, a photoelectric chip, a carrier plate and a routing wire. The photoelectric chip is arranged between the wave separator component and the routing; the wave separator component and the photoelectric chip are arranged on one surface of the carrier plate, and the other surface of the carrier plate is attached to a PCB (printed circuit board) on which the light receiving sub-component is to be mounted; the routing is arranged at the edge position of the carrier plate so as to contact the signal receiving bonding pad on the PCB. In the assembling process, the photoelectric chip and the wave separator component can be installed on the carrier plate, and after the photoelectric chip and the wave separator component are fixedly coupled, the carrier plate is assembled on the PCB, so that defects of the light receiving sub-component can be found in time before assembly, the influence of the assembling process on other parts and processes on the PCB is reduced, and the assembling is facilitated.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic diagram of a multi-channel on-chip integrated optical receiver sub-assembly according to the present application;

FIG. 2 is a schematic diagram of an exploded front view of a multi-channel on-chip integrated light receiving subassembly according to the present application;

FIG. 3 is a schematic top view of a multi-channel on-chip integrated light receiving subassembly of the present application;

FIG. 4 is an exploded view of the splitter module of the present application;

fig. 5 is a schematic diagram of the overall structure of the splitter module of the present application;

FIG. 6 is a schematic diagram of a partial structure of a multi-channel on-chip integrated light receiving subassembly according to the present application;

fig. 7 is a schematic diagram of the wire bonding structure of the present application.

Illustration of the drawings:

wherein, 1-a splitter component; 11-a substrate; 12-an optical fiber module; 13-a splitter; 14-a prism; 15-a lens array; 2-a photoelectric chip; 3-a carrier plate; 4-an amplifier; 5-a filter capacitor; 6-internal routing; 7-external bonding.

Detailed Description

In the technical scheme provided by the application, the multi-channel on-chip integrated light receiving subassembly can be applied to light receiving equipment. The optical receiving device is an intermediate device for optical fiber communication, and is used for connecting an optical fiber line and communication equipment. A Printed Circuit Board (PCB) is provided in the light receiving device for mounting the light receiving sub-assembly and other communication related components.

Referring to fig. 1, a schematic diagram of a multi-channel on-chip integrated light receiving subassembly according to the present application is shown. As can be seen from fig. 1, the light receiving subassembly provided in the present application can be connected to an optical fiber line, receive an optical signal in an optical fiber, and convert the optical signal into an electrical signal, thereby implementing a light transmission process. The light receiving sub-assembly includes: the device comprises a wave separator component 1, a photoelectric chip 2, a carrier plate 3 and an internal routing 6.

Among them, the demultiplexer component 1, i.e., DEMUX component (demultiplexer), is a component for combining independent signals from a plurality of separate subchannels and transmitting them in the same direction of a common channel. The optoelectronic chip 2 is used for converting an optical signal into an electrical signal. The internal routing 6 is a pin set composed of a plurality of pin arrangements, and can transmit the electrical signal converted by the photoelectric chip 2 out to be transmitted to the communication related elements on the PCB.

In practical application, as shown in fig. 2, the optoelectronic chip 2 is disposed between the splitter component 1 and the internal bonding wire 6. That is, the optical signal in the optical fiber circuit is transmitted to the photoelectric chip 2 by the wave splitter component 1, and the transmitted optical signal can be converted into an electrical signal by the photoelectric chip 2 and transmitted to the lower component through the internal routing 6.

The wave separator component 1 and the photoelectric chip 2 are arranged on one surface of the carrier plate 3, and the other surface of the carrier plate 3 is attached to a PCB (printed circuit board) to be installed with the light receiving sub-component. That is, in the technical solution provided in the application, the wave splitter component 1 and the optoelectronic chip 2 are not directly disposed on the PCB, but are disposed on the PCB through the carrier plate 3. In the assembling process, the optoelectronic chip 2 and the wave splitter component 1 may be mounted on the carrier plate 3, and after the optoelectronic chip 2 and the wave splitter component 1 are coupled and fixed, the carrier plate 3 is assembled on the PCB.

It can be seen that if the mounting effect of the optoelectronic chip 2 is not ideal, the adjustment can be directly performed on the carrier 3. And because the part quantity on the support plate 3 is less, the adjustment of the photoelectric chip 2 or the repeated welding process is difficult to influence other parts, therefore, even if the photoelectric chip 2 fails to be assembled and needs to be reworked, other parts can not be involved, thereby greatly improving the convenience of assembly.

In addition, because the photoelectric chip 2 and the wave splitter component 1 are coupled and fixed on the carrier plate 3, the bad photoelectric chip can be removed before assembly, so that repeated welding or splicing operation on the PCB is avoided, and the assembly process is convenient to complete.

In order to output the converted electric signals, the internal routing 6 is arranged at the edge position of the carrier plate 3 to contact the signal receiving bonding pad on the PCB. In practical application, can align the limit of light receiving subassembly and the limit of PCB board described in this application to directly be connected through pin and inside routing 6, consequently, the connection distance is extremely short, and does not have other devices except routing between photoelectric chip 2 and PCB board pin, does not have connecting device such as soft board, tube socket promptly, it can see that the light receiving subassembly that this application provided more is fit for the requirement of high-speed transmission.

In the technical scheme that this application provided, be separable connection between light receiving subassembly and the PCB board, consequently, the reflow soldering need not be crossed in the actual assembling process, consequently can not be because of the UV glue on the reflow soldering high temperature destruction PCB board, can improve simultaneously the yields of light receiving subassembly and PCB board.

In some embodiments of the present application, as shown in fig. 4, the splitter assembly 1 includes: a substrate 11, an optical fiber module 12, a wave splitter 13 and a lens array 15. In practical application, the optical fiber module 12 is used as a joint of an optical fiber line and can transmit an optical signal to the splitter component 1; the wave separator 13 can compound the independent signals in the optical fiber line and transmit the signals to the lens array 15; the lens array 15 can refract the combined optical signal so that the optical signal can be transmitted to the optoelectronic chip 2.

The substrate 11 is used for supporting and protecting other components, and in the present embodiment, the optical fiber module 12, the splitter 13 and the lens array 15 are sequentially disposed in the region between the substrate 11 and the carrier 3. The substrate 11 is parallel to the carrier 3; one side of the wave separator 13 is connected with the substrate 11, and the other side is connected with the carrier plate 3.

That is, in practical application, the optical fiber module 12, the wave splitter 13 and the lens array 15 can be installed on the bottom surface of the substrate 11, and the whole wave splitter component 1 adopts an inverted installation mode, so that the whole height of the wave splitter component 1 is reduced; in addition, the inverted installation mode can also shorten the distance between the wave splitter component 1 and the photoelectric chip 2, namely, the propagation distance of optical signals is shortened, and the defects that the optical signals are scattered and the like to influence the signal transmission quality are reduced.

In practical application, as shown in fig. 5, the wave splitter assembly 1 further includes a prism 14; the prism 14 is disposed on a side of the lens array 15 away from the splitter 13. Further, the optoelectronic chip 2 is disposed between the prism 14 and the carrier plate 3. In this embodiment, the cross-section of prism 14 can be isosceles right triangle, and two right-angle sides of isosceles right triangle are on a parallel with lens array 15 and photoelectric chip 2 respectively to the mirror surface that corresponds through the hypotenuse reflects light signal, changes light signal's transmission direction, for example reflects the light signal of horizontal direction for vertical direction, so that light signal can transmit to photoelectric chip 2's position.

As shown in fig. 7, the external wire 7 can be connected to the external PCB, and the distance between the carrier plate 3 and the transimpedance amplifier 4 is less than 0.2 mm because the edges of the two are flush, so that the distance between the external wire 7 is very short, and the high-frequency performance is greatly improved. For example, the edge of the right side of the amplifier 4 with the rectangular structure in fig. 7 is flush with the edge of the right side of the rectangular carrier 3, or the distance is less than 0.2 mm, so as to shorten the length of the external bonding wire 7.

In some embodiments of the present application, as shown in fig. 3 and 6, the light receiving subassembly further includes an amplifier 4; the amplifier 4 is a Transimpedance amplifier (TIA) disposed on the carrier 3 of the lens array 15, and the TIA can convert an input current into a differential voltage, thereby facilitating transmission of an electrical signal. Correspondingly, one side of the amplifier 4 is connected with the photoelectric chip 2, and the other side is connected with the internal routing 6. In practical application, after the optical signal is converted into an electrical signal by the photoelectric chip 2, the converted voltage signal is amplified by the amplifier 4 so as to be output by the internal wire bonding 6.

Further, as shown in fig. 3 and 6, the light receiving subassembly further includes a filter capacitor 5; the filter capacitor 5 is a patch capacitor arranged on the carrier plate 3. The filter capacitor 5 can reduce the AC ripple coefficient and improve the high-efficiency smooth DC output. In practical application, one side of the filter capacitor 5 is connected with the photoelectric chip 2, and the other side is connected with the amplifier 4, that is, the converted electric signal is filtered by the filter capacitor 5 and then amplified by the amplifier 4, so that the transmission quality of the signal is improved. Therefore, in the embodiment, the overall thickness of the light receiving subassembly can be further reduced through the patch capacitor, so that the installation is convenient, the channel distance can be shortened, and the signal transmission quality is improved.

In some embodiments of the present application, the substrate 11 and/or the carrier 3 may be made of a soft board or a combination of soft and hard boards, and is connected to the PCB board, so as to further facilitate assembly.

As can be seen from the above technical solutions, the present application provides a multi-channel on-chip integrated light receiving subassembly, including: the device comprises a wave separator component 1, a photoelectric chip 2, a carrier plate 3 and an internal routing 6. The photoelectric chip 2 is arranged between the wave separator component 1 and the internal routing 6; the wave separator component 1 and the photoelectric chip 2 are arranged on one surface of the carrier plate 3, and the other surface of the carrier plate 3 is attached to a PCB (printed circuit board) on which a light receiving sub-component is to be mounted; the internal routing 6 is arranged at the edge position of the carrier plate 3 so as to connect with the signal receiving bonding pad on the PCB.

In the assembling process, the photoelectric chip 2 and the wave separator component 1 can be installed on the carrier plate 3, and after the photoelectric chip 2 and the wave separator component 1 are fixedly coupled, the carrier plate 3 is assembled on the PCB, so that chip flaws are found in time before assembly, the influence of the chip assembling process on other parts on the PCB is reduced, and the assembling is facilitated.

The embodiments provided in the present application are only a few examples of the general concept of the present application, and do not limit the scope of the present application. Any other embodiments extended according to the scheme of the present application without inventive efforts will be within the scope of protection of the present application for a person skilled in the art.

Claims

1. A multi-channel on-chip integrated light receiving subassembly, comprising: the device comprises a wave separator component (1), a photoelectric chip (2), a carrier plate (3) and an amplifier (4);

the wave splitter component (1) and the photoelectric chip (2) are arranged on the carrier plate (3); the photoelectric chip (2) is arranged between the wave splitter component (1) and the carrier plate (3); the amplifier (4) is attached to the carrier plate (3); the distance between the edge of the amplifier (4) and the edge of the carrier plate (3) is less than 0.2 mm, so that a signal receiving pad on a PCB (printed circuit board) can be connected.

2. The multi-channel on-chip integrated light receiving subassembly according to claim 1, wherein the splitter assembly (1) comprises: a substrate (11), an optical fiber module (12), a wave splitter (13) and a lens array (15); the optical fiber module (12), the wave splitter (13) and the lens array (15) are sequentially arranged in an area between the substrate (11) and the carrier plate (3).

3. A multi-channel on-chip integrated light receiving subassembly according to claim 2, characterized in that the substrate (11) is parallel to the carrier plate (3); one side of the wave separator (13) is connected with the substrate (11), and the other side of the wave separator is connected with the carrier plate (3).

4. The multi-channel on-chip integrated light receiving subassembly of claim 2, wherein the splitter assembly (1) further comprises a prism (14); the prism (14) is arranged on the side of the lens array (15) far away from the wave separator (13).

5. A multi-channel on-chip integrated light receiving subassembly according to claim 4, characterized in that an optoelectronic chip (2) is arranged between the prism (14) and the carrier plate (3).

6. A multi-channel on-chip integrated light receiving sub-assembly according to claim 1, characterized in that the amplifier (4) is a transimpedance amplifier provided on the carrier board (3).

7. The multi-channel on-chip integrated light receiving subassembly of claim 6, characterized in that the amplifier (4) is connected to the optoelectronic chip (2) on one side and to wire bonds (6) on the other side.

8. A multi-channel on-chip integrated light receiving sub-assembly according to claim 1, characterized in that it further comprises a filter capacitor (5); the filter capacitor (5) is a patch capacitor arranged on the carrier plate (3).

9. The multi-channel on-chip integrated light receiving subassembly according to claim 8, characterized in that the filter capacitor (5) is connected on one side to the optoelectronic chip (2) and on the other side to the amplifier (4).