CN211090118U

CN211090118U - Multi-color flexible circuit splitter

Info

Publication number: CN211090118U
Application number: CN201922086875.9U
Authority: CN
Inventors: 张孝海; 兰介钟; 黄武坤; 李小兰
Original assignee: Huizhou Hongqi Electronic Technology Co ltd
Current assignee: Huizhou Hongqi Electronic Technology Co ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-07-24
Anticipated expiration: 2029-11-26

Abstract

The utility model discloses a polychrome flexible line deconcentrator, include two-sided circuit subassembly and hinder and weld the subassembly that switches on, two-sided circuit subassembly includes positive circuit layer and reverse side circuit layer, positive circuit layer bond in on the reverse side circuit layer, positive circuit layer includes many copper bars, each be provided with the interval between the copper bar respectively, reverse side circuit layer includes a plurality of copper foils of bending and a plurality of connection copper sheet, each be provided with the interval between the copper foil of bending respectively, each be provided with the interval between the connection copper sheet respectively, and each the copper foil of bending respectively one-to-one with each the copper bar electricity is connected, each the connection copper sheet respectively one-to-one with each the copper bar electricity is connected. The utility model discloses a set up the positive circuit layer that contains many copper bars and the reverse side circuit layer that contains a plurality of copper foils of bending at two-sided circuit subassembly, conveniently realize a lot of separated time to through designing flexible line, can realize buckling, still conveniently install and weld.

Description

Multi-color flexible circuit splitter

Technical Field

The utility model relates to a deconcentrator field especially relates to a polychrome flexible line deconcentrator.

Background

The flexible circuit industry is under rapid development with small scale. The polymer thick film method is a production process with high efficiency and low cost. The process selectively screens conductive polymer inks on inexpensive flexible substrates. A representative flexible substrate is PET. The polymer thick film method conductor comprises silk-screen metal filler or carbon powder filler. The polymer thick film process is inherently clean, uses a lead-free SMT adhesive, and does not require etching. Because the addition process is used and the cost of the base material is low, the circuit of the polymer thick film method is 1/10 which is the price of the circuit of the copper polyimide film; the price of the rigid circuit board is 1/2-1/3. The polymer thick film method is particularly suitable for a control panel of equipment. In mobile phones and other portable products, the polymer thick film method is suitable for converting elements, switches and lighting devices on a printed circuit board into a polymer thick film method circuit. Not only saves the cost, but also reduces the energy consumption.

The existing deconcentrators of the flexible circuit board are all provided with two deconcentrators, and with the development of the society and the increase of the requirements of people, the two-out deconcentrators cannot meet people, so that more RGB deconcentrators need to be produced to meet the requirements of people, but the existing deconcentrators cannot be produced due to the process and design, so how to produce the RGB deconcentrators is a technical problem which needs to be considered by technical personnel in the field.

SUMMERY OF THE UTILITY MODEL

The utility model aims at overcoming the weak point among the prior art, providing a polychrome flexible circuit deconcentrator, conveniently realizing one more separated time to through designing the flexible circuit, can realize buckling, still conveniently install and weld.

The purpose of the utility model is realized through the following technical scheme:

a multi-color flexible line splitter, comprising:

the double-sided circuit assembly comprises a front circuit layer and a back circuit layer, the front circuit layer is bonded on the back circuit layer, the front circuit layer comprises a plurality of copper strips, intervals are arranged among the copper strips, the back circuit layer comprises a plurality of bent copper foils and a plurality of connecting copper sheets, intervals are arranged among the bent copper foils, intervals are arranged among the connecting copper sheets, the bent copper foils are electrically connected with the copper strips in a one-to-one correspondence mode, and the connecting copper sheets are electrically connected with the copper strips in a one-to-one correspondence mode; and

hinder and weld the subassembly that switches on, hinder and weld the subassembly and include positive solder mask, middle solder mask and back solder mask, the both sides face of middle solder mask laminate respectively in positive circuit layer with on the reverse side circuit layer, positive solder mask bond in positive circuit layer is kept away from on the side of middle solder mask, back solder mask bond in reverse side circuit layer is kept away from on the side of middle solder mask.

In one embodiment, the multi-color flexible circuit splitter further comprises a protective film assembly, the protective film assembly comprises a character screen printing layer and an outer drilling layer, the character screen printing layer is adhered to one side surface, away from the front surface circuit layer, of the front surface solder resist layer, and the outer drilling layer is adhered to one side surface, away from the back surface circuit layer, of the back surface solder resist layer.

In one embodiment, the outer drilling layer is provided with a plurality of via groups and a plurality of connecting through holes, wherein intervals are respectively arranged between the via groups, and intervals are respectively arranged between the connecting through holes.

In one embodiment, each of the via groups is arranged in a step shape.

In one embodiment, in one of the via groups, the via group includes a plurality of via holes, and a space is respectively disposed between the via holes.

In one embodiment, the front circuit layer includes four copper bars, the back circuit layer includes four bent copper foils and four connecting copper sheets, the four bent copper foils are respectively and correspondingly electrically connected with the four copper bars, and the four connecting copper sheets are respectively and correspondingly electrically connected with the four copper bars.

In one embodiment, a safety distance area is further arranged on the reverse circuit layer, and the safety distance area is used for wrapping the bent copper foil on the outermost side.

In one embodiment, the character silk-screen layer comprises an R copybook, a G copybook, a B copybook and a positive copybook.

In one embodiment, the front solder mask layer is provided with a plurality of front solder through holes, and a space is respectively arranged between the front solder through holes.

In one embodiment, the front side welding through hole is a U-shaped through hole.

The utility model discloses compare in prior art's advantage and beneficial effect as follows:

the utility model relates to a polychrome flexible circuit deconcentrator through the positive circuit layer that contains many copper bars and the reverse side circuit layer that contains a plurality of copper foils of bending in the setting of two-sided circuit subassembly, conveniently realizes a lot of separated time to through designing the flexible circuit, can realize buckling, still conveniently install and weld.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

Fig. 1 is a schematic structural diagram of a multi-color flexible circuit splitter according to an embodiment of the present invention;

fig. 2 is a schematic diagram of another embodiment of a multi-color flexible line splitter as shown in fig. 1.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. The preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, a multi-color flexible circuit splitter includes: the double-sided circuit assembly 100 and the solder resist conduction assembly 200 are used for realizing the electrical connection of a deconcentrator, and providing necessary connection lines for the connection; the solder resist conduction assembly 200 is used to protect the double-sided circuit assembly to improve the structural stability of the splitter.

Referring to fig. 1, the double-sided circuit assembly 100 includes a front-side circuit layer 110 and a back-side circuit layer 120, the front-side circuit layer is bonded to the back-side circuit layer, it should be noted that the front-side circuit layer 110 is used for connecting electronic components on the front side and electrically connecting a multicolor L ED lamp, and the back-side circuit layer 120 is used for electrically connecting a front-side circuit with the outside.

Referring to fig. 1, the front circuit layer 110 includes a plurality of copper bars 111, a space is respectively disposed between the copper bars 111, the back circuit layer 120 includes a plurality of bent copper foils 121 and a plurality of connecting copper sheets 122, a space is respectively disposed between the bent copper foils, a space is respectively disposed between the connecting copper sheets, the bent copper foils are respectively electrically connected to the copper bars in a one-to-one correspondence manner, and the connecting copper sheets are respectively electrically connected to the copper bars in a one-to-one correspondence manner.

Referring to fig. 1, the resistance welding conduction assembly 200 includes a front surface resistance welding layer 210, a middle resistance welding layer 220 and a back surface resistance welding layer 230, two side surfaces of the middle resistance welding layer are respectively attached to the front surface circuit layer and the back surface circuit layer, the front surface resistance welding layer is adhered to a side surface of the front surface circuit layer far away from the middle resistance welding layer, and the back surface resistance welding layer is adhered to a side surface of the back surface circuit layer far away from the middle resistance welding layer. Note that the front side solder mask layer 210 is used to protect front side circuitry; middle solder mask 220 is used for setting up between positive and negative circuit, and then avoids positive and negative circuit layer to switch on each other, realizes insulating effect.

So, through set up the positive circuit layer that contains many copper bars and the reverse side circuit layer that contains a plurality of copper foils of bending at two-sided circuit subassembly, conveniently realize one and go out many separated time to through designing flexible line, can realize buckling, still conveniently install and weld.

Referring to fig. 2, the multi-color flexible circuit splitter further includes a protective film assembly 300, the protective film assembly 300 includes a character screen printing layer 310 and an exterior drilling layer 320, the character screen printing layer is bonded to a side of the front solder mask layer away from the front circuit layer, and the exterior drilling layer is bonded to a side of the back solder mask layer away from the back circuit layer. It should be noted that the character screen printing layer 310 is used for playing a role of identification, so that a user can conveniently recognize the character screen printing layer; the outer type drilling layer 320 is used for drilling, so that the front side circuit and the back side circuit are electrically conducted after copper plating.

Referring to fig. 2, the outer drilling layer 320 is formed with a plurality of via groups 321 and a plurality of connecting through holes 322, wherein a space is formed between each via group 321, and a space is formed between each connecting through hole. The via group 321 is used to electrically connect the front side circuit and the back side circuit; the connecting through hole 322 is used for connecting another splitter, so that the splitter can be extended or expanded conveniently.

Each of the via groups is provided in a step shape. Preferably, in one of the via groups, the via group includes a plurality of via holes, and a space is provided between each of the via holes. Therefore, the front circuit and the back circuit at different positions can be conducted by arranging the plurality of via holes, and multi-point electric connection is realized.

It should be noted that the front circuit layer includes four copper bars, the back circuit layer includes four bent copper foils and four connecting copper sheets, the four bent copper foils are respectively electrically connected with the four copper bars in a one-to-one correspondence, and the four connecting copper sheets are respectively electrically connected with the four copper bars in a one-to-one correspondence. Thus, the electrical connection of the RGB colors and the wiring of the anode can be realized,

further, connecting through hole 322 is the row of one, connecting through hole 322 is provided with four, each connecting through hole 322 is one the one-to-one respectively on the copper bar to can realize that the copper bar of each corresponds the copper bar of connecting another deconcentrator respectively.

Please refer to fig. 1, a safety distance area 123 is further disposed on the back side circuit layer 120, and the safety distance area is used for covering the bent copper foil on the outermost side. Therefore, by arranging the safety distance area 123, the lines can be effectively prevented from being worn or mistakenly contacted with the front lines and the back lines, so that the safety and the reliability of the line layer can be improved, and the structural stability of the deconcentrator is further improved.

It should be noted that the character screen printing layer includes an R copybook, a G copybook, a B copybook, and a positive copybook. So, can correspond different colours through setting up R copybook, G copybook and B copybook, R corresponds red promptly, and G corresponds green, and B corresponds blue, has played better markedness.

It should be noted that a plurality of front solder through holes 211 are formed in the front solder mask layer, and a space is respectively formed between the front solder through holes. So, through setting up front welding through-hole 211, conveniently realize switching on, connect another deconcentrator or electronic components. Preferably, the front welding through hole is a U-shaped through hole. So, through setting up U style of calligraphy through-hole, conveniently carry out the electricity and connect.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A multi-color flexible line splitter, comprising:

2. The multi-color flexible circuit splitter according to claim 1, further comprising a protective film assembly, wherein the protective film assembly comprises a character screen printing layer and an outer drilling layer, the character screen printing layer is bonded to a side of the front solder mask layer away from the front circuit layer, and the outer drilling layer is bonded to a side of the back solder mask layer away from the back circuit layer.

3. The multi-color flexible circuit splitter according to claim 2, wherein the outer drill layer has a plurality of via groups and a plurality of connecting through holes, and the via groups are spaced from each other and the connecting through holes are spaced from each other.

4. The multiple color flexible circuit splitter of claim 3, wherein each of said plurality of through holes is arranged in a step-like manner.

5. The multi-color flexible circuit splitter according to claim 3, wherein in one of said via sets, said via set comprises a plurality of vias, and a space is provided between each of said vias.

6. The multi-color flexible circuit splitter according to claim 1, wherein said front circuit layer comprises four copper strips, and said back circuit layer comprises four bent copper foils and four connecting copper sheets, wherein said four bent copper foils are electrically connected to said four copper strips in a one-to-one correspondence, and said four connecting copper sheets are electrically connected to said four copper strips in a one-to-one correspondence.

7. The multi-color flexible circuit splitter of claim 1, wherein a safety distance zone is further disposed on the reverse circuit layer, and the safety distance zone is used for covering the outermost bent copper foil.

8. The multi-color flexible circuit splitter of claim 2, wherein said silk-screen layer of characters comprises R, G, B, and positive type.

9. The multi-color flexible circuit splitter of claim 1, wherein a plurality of front solder vias are formed in the front solder mask, and a space is provided between each front solder via.

10. The multi-color flexible circuit splitter of claim 9, wherein said front face solder vias are U-shaped vias.