TWI691991B - Light emitting keyboard and lighting board thereof - Google Patents

Light emitting keyboard and lighting board thereof Download PDF

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TWI691991B
TWI691991B TW108105589A TW108105589A TWI691991B TW I691991 B TWI691991 B TW I691991B TW 108105589 A TW108105589 A TW 108105589A TW 108105589 A TW108105589 A TW 108105589A TW I691991 B TWI691991 B TW I691991B
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layer
light
light source
source lamp
board
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TW108105589A
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TW202011439A (en
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何信政
黃恒儀
陳在宇
鄭鴻川
吳洋政
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達方電子股份有限公司
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Priority to US16/553,145 priority Critical patent/US10720289B1/en
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Abstract

A light emitting keyboard includes a bottom board, keyswitches, and a lighting board. The lighting board is disposed between the bottom board and the keyswitches or under the bottom board and includes a flexible substrate having a first hole, multiple-light emitting diodes corresponding to the keyswitches, first and second silver-paste circuit layers formed on upper and lower surfaces of the flexible substrate respectively, a via pillar formed in the first hole to be coupled to the first and second silver-paste circuit layers, a copper layer plated on the first and second silver-paste layers, and a first protection layer coated on the copper layer and having second holes. The multiple-light emitting diode is disposed on the copper layer plated on the first silver-paste circuit layer through the second hole to be coupled to the first silver-paste circuit layer.

Description

發光鍵盤及其光源燈板 Luminous keyboard and its light source lamp board

本發明關於一種發光鍵盤及其光源燈板,尤指一種具有將銀漿線路層分別形成在撓性電路基板之上下表面之光源燈板的發光鍵盤及其光源燈板。 The invention relates to a light-emitting keyboard and its light source lamp board, in particular to a light-emitting keyboard and a light source lamp board having light source lamp boards with silver paste circuit layers formed on the upper and lower surfaces of the flexible circuit substrate respectively.

一般而言,為了使鍵盤具有按鍵發光功能,目前常見的設計係直接在鍵盤底板上配置具有分別對應每一按鍵之複數個發光二極體的發光二極體電路板,藉此,發光二極體係可射出光線至相對應之鍵帽而產生按鍵發光效果,另外,此設計也可利用發光二極體電路板上之積體電路控制晶片以電訊傳輸方式進行每一發光二極體之發光控制,進而使鍵盤可具有更多變化的按鍵發光視覺效果。 Generally speaking, in order to make the keyboard have the key-emitting function, the current common design is to directly configure a light-emitting diode circuit board with a plurality of light-emitting diodes corresponding to each key on the keyboard bottom plate, thereby, the light-emitting diodes The system can emit light to the corresponding keycap to produce the key glow effect. In addition, this design can also use the integrated circuit control chip on the light-emitting diode circuit board to perform the light-emitting control of each light-emitting diode by means of telecommunication transmission. , So that the keyboard can have more varied visual effects of key luminescence.

然而,由於上述具有積體電路控制晶片之發光二極體電路板所使用的電路基板在製程良率的考量下通常會採用材料成本較高之硬化樹脂材質,因此,上述設計不僅會產生發光二極體電路板之板材厚度不易縮減而不利於鍵盤薄型化設計的問題,同時也會導致發光二極體電路板之製造成本居高不下。 However, since the circuit board used in the above-mentioned LED circuit board with integrated circuit control chip usually adopts a hardened resin material with higher material cost in consideration of the yield of the process, the above design will not only produce light-emitting diodes The thickness of the board of the polar body circuit board is not easy to be reduced, which is not conducive to the thin design of the keyboard, and it also causes the manufacturing cost of the light-emitting diode circuit board to remain high.

因此,本發明的目的之一在於提供一種具有將銀漿線路層分別形成在撓性電路基板之上下表面之光源燈板的發光鍵盤及其光源燈板,以解決上述問題。 Therefore, one of the objects of the present invention is to provide a light-emitting keyboard with a light source lamp board in which silver paste circuit layers are respectively formed on the upper and lower surfaces of a flexible circuit board, and a light source lamp board to solve the above problems.

根據一實施例,本發明之發光鍵盤包含一底板、複數個按鍵,以及一光源燈板。該複數個按鍵設置於該底板上,每一按鍵包含一鍵帽以及一升降 機構。該升降機構設置於該底板以及該鍵帽之間,該鍵帽經由該升降機構相對於該底板上下移動。該光源燈板設置於該底板與該複數個按鍵之間或設置於該底板下,該光源燈板包含一撓性電路基板、複數個多色發光二極體、一第一銀漿線路層、一第二銀漿線路層、一導電柱、一鍍銅層,以及一第一保護層。該撓性電路基板具有至少一第一通孔。該複數個多色發光二極體分別對應該複數個按鍵,用來產生光線入射至該複數個鍵帽。該第一銀漿線路層具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面。該第二銀漿線路層具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面。該導電柱形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一。該鍍銅層鍍附於該第一銀漿線路層以及該第二銀漿線路層上。該第一保護層塗佈於該鍍銅層上且對應該複數個按鍵以及對應鍍附在該第一銀漿線路層上之鍍銅層的位置形成有複數個第二通孔,每一多色發光二極體通過相對應之第二通孔設置於鍍附在該第一銀漿線路層之鍍銅層上以電連接至該些第一線路。 According to an embodiment, the light-emitting keyboard of the present invention includes a bottom plate, a plurality of keys, and a light source light board. The plurality of buttons are arranged on the bottom plate, each button includes a key cap and a lift mechanism. The lifting mechanism is disposed between the bottom plate and the key cap, and the key cap moves up and down relative to the bottom plate via the lifting mechanism. The light source lamp board is disposed between the bottom plate and the plurality of keys or under the bottom board. The light source lamp plate includes a flexible circuit substrate, a plurality of multicolor light-emitting diodes, a first silver paste circuit layer, A second silver paste circuit layer, a conductive pillar, a copper plated layer, and a first protective layer. The flexible circuit substrate has at least one first through hole. The plurality of multi-color light-emitting diodes respectively correspond to a plurality of buttons, and are used to generate light incident on the plurality of keycaps. The first silver paste circuit layer has a plurality of first circuits, and the plurality of first circuits are formed on an upper surface of the flexible circuit substrate. The second silver paste circuit layer has a plurality of second circuits, and the plurality of second circuits are formed on a lower surface of the flexible circuit substrate. The conductive pillar is formed in the at least one first through hole to electrically connect at least one of the first lines and at least one of the second lines. The copper plating layer is attached to the first silver paste circuit layer and the second silver paste circuit layer. The first protective layer is coated on the copper-plated layer, and corresponding to the plurality of keys and the position corresponding to the copper-plated layer plated on the first silver paste circuit layer, a plurality of second through holes are formed The color light-emitting diodes are provided on the copper plating layer plated on the first silver paste circuit layer through corresponding second through holes to be electrically connected to the first circuits.

根據另一實施例,本發明之光源燈板適用於提供光線至一鍵盤上之複數個按鍵,該光源燈板包含一撓性電路基板、複數個多色發光二極體、一第一銀漿線路層、一第二銀漿線路層、一導電柱、一鍍銅層,以及一第一保護層。該撓性電路基板具有至少一第一通孔。該複數個多色發光二極體分別對應該複數個按鍵,用來產生光線入射至該複數個按鍵。該第一銀漿線路層具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面。該第二銀漿線路層具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面。該導電柱形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一。該鍍銅層鍍附於該第一銀漿線路層以及該第二銀漿線路層上。該第一保護層塗佈於該鍍銅層上且對應該複數個按 鍵以及對應鍍附在該第一銀漿線路層上之鍍銅層的位置形成有複數個第二通孔,每一多色發光二極體通過相對應之第二通孔設置於鍍附在該第一銀漿線路層之該鍍銅層上以電連接至該些第一線路。 According to another embodiment, the light source lamp board of the present invention is suitable for providing light to a plurality of keys on a keyboard. The light source lamp board includes a flexible circuit substrate, a plurality of multi-color light-emitting diodes, and a first silver paste The circuit layer, a second silver paste circuit layer, a conductive post, a copper plated layer, and a first protective layer. The flexible circuit substrate has at least one first through hole. The plurality of multi-color light-emitting diodes respectively correspond to the plurality of buttons, and are used to generate light incident on the plurality of buttons. The first silver paste circuit layer has a plurality of first circuits, and the plurality of first circuits are formed on an upper surface of the flexible circuit substrate. The second silver paste circuit layer has a plurality of second circuits, and the plurality of second circuits are formed on a lower surface of the flexible circuit substrate. The conductive pillar is formed in the at least one first through hole to electrically connect at least one of the first lines and at least one of the second lines. The copper plating layer is attached to the first silver paste circuit layer and the second silver paste circuit layer. The first protective layer is coated on the copper plating layer and corresponds to a plurality of A plurality of second through holes are formed at the position of the key and the copper plating layer attached to the first silver paste circuit layer, and each multi-color light-emitting diode is provided on the plated through the corresponding second through hole The copper plating layer of the first silver paste circuit layer is electrically connected to the first circuits.

根據另一實施例,本發明之發光鍵盤包含一底板、複數個按鍵,以及一光源燈板。該複數個按鍵設置於該底板上,每一按鍵包含一鍵帽以及一升降構。該升降機構設置於該底板以及該鍵帽之間,該鍵帽經由該升降機構相對於該底板上下移動。該光源燈板設置於該底板與該複數個按鍵之間或設置於該底板下,該光源燈板包含一撓性電路基板、複數個多色發光二極體、一第一高導電線路層、一第二高導電線路層、一導電柱、一高導電鍍層,以及一第一保護層。該撓性電路基板具有至少一第一通孔。該複數個多色發光二極體分別對應該複數個按鍵,用來產生光線入射至該複數個鍵帽。該第一高導電線路層具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面。該第二高導電線路層具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面。該導電柱形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一。該高導電鍍層鍍附於該第一高導電線路層以及該第二高導電線路層上。該第一保護層塗佈於該高導電鍍層上且對應每一按鍵以及對應鍍附在該第一高導電線路層上之高導電鍍層的位置形成有一第二通孔,每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一高導電線路層之高導電鍍層電連接至該些第一線路。 According to another embodiment, the light-emitting keyboard of the present invention includes a bottom plate, a plurality of keys, and a light source light board. The plurality of keys are arranged on the bottom plate, and each key includes a key cap and a lifting structure. The lifting mechanism is disposed between the bottom plate and the key cap, and the key cap moves up and down relative to the bottom plate via the lifting mechanism. The light source lamp board is disposed between the bottom plate and the plurality of keys or under the bottom board. The light source lamp plate includes a flexible circuit board, a plurality of multi-color light-emitting diodes, a first highly conductive circuit layer, A second highly conductive circuit layer, a conductive pillar, a highly conductive plating layer, and a first protective layer. The flexible circuit substrate has at least one first through hole. The plurality of multi-color light-emitting diodes respectively correspond to a plurality of buttons, and are used to generate light incident on the plurality of keycaps. The first highly conductive circuit layer has a plurality of first circuits, and the plurality of first circuits are formed on an upper surface of the flexible circuit substrate. The second highly conductive circuit layer has a plurality of second circuits, and the plurality of second circuits are formed on a lower surface of the flexible circuit substrate. The conductive pillar is formed in the at least one first through hole to electrically connect at least one of the first lines and at least one of the second lines. The highly conductive plating layer is attached to the first highly conductive circuit layer and the second highly conductive circuit layer. The first protective layer is coated on the highly conductive plating layer and a second through hole is formed corresponding to each button and corresponding to the highly conductive plating layer attached to the first highly conductive circuit layer The polar body is electrically connected to the first circuits through a corresponding second through hole and through a highly conductive plating layer deposited on the first highly conductive circuit layer.

根據另一實施例,本發明之光源燈板適用於提供光線至一鍵盤上之複數個按鍵,該光源燈板包含一撓性電路基板、複數個多色發光二極體、一第一高導電線路層、一第二高導電線路層、一導電柱、一高導電鍍層,以及一第一保護層。該撓性電路基板具有至少一第一通孔。該複數個多色發光二極體分別對應該複數個按鍵,用來產生光線入射至該複數個按鍵。該第一高導電線路 層具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面。該第二高導電線路層具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面。該導電柱形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一。該高導電鍍層鍍附於該第一高導電線路層以及該第二高導電線路層上。該第一保護層塗佈於該高導電鍍層上且對應每一按鍵以及對應鍍附在該第一高導電線路層上之高導電鍍層的位置形成有一第二通孔,每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一高導電線路層之高導電鍍層電連接至該些第一線路。 According to another embodiment, the light source lamp board of the present invention is suitable for providing light to a plurality of keys on a keyboard. The light source lamp board includes a flexible circuit substrate, a plurality of multi-color light-emitting diodes, and a first highly conductive The circuit layer, a second highly conductive circuit layer, a conductive pillar, a highly conductive plating layer, and a first protective layer. The flexible circuit substrate has at least one first through hole. The plurality of multi-color light-emitting diodes respectively correspond to the plurality of buttons, and are used to generate light incident on the plurality of buttons. The first highly conductive line The layer has a plurality of first lines formed on an upper surface of the flexible circuit substrate. The second highly conductive circuit layer has a plurality of second circuits, and the plurality of second circuits are formed on a lower surface of the flexible circuit substrate. The conductive pillar is formed in the at least one first through hole to electrically connect at least one of the first lines and at least one of the second lines. The highly conductive plating layer is attached to the first highly conductive circuit layer and the second highly conductive circuit layer. The first protective layer is coated on the highly conductive plating layer and a second through hole is formed corresponding to each button and corresponding to the highly conductive plating layer attached to the first highly conductive circuit layer The polar body is electrically connected to the first circuits through a corresponding second through hole and through a highly conductive plating layer deposited on the first highly conductive circuit layer.

綜上所述,透過僅將用來進行電訊傳輸之線路(即第一銀漿線路層、第二銀漿線路層,以及鍍銅層)分別形成在撓性電路基板之上下表面之設計,本發明係可利用撓性電路基板之可撓性(可撓性材質在實際製造上所能達到之最小板材厚度係小於硬板材質在實際製造上所能達到之最小板材厚度)以及撓性電路基板之材料成本低於電路硬板之材料成本,藉以有效地解決先前技術中所提到之發光二極體電路板之板材厚度不易縮減而不利於發光鍵盤薄型化設計的問題,並且可進一步地降低發光鍵盤之製造成本。 In summary, through the design that only the lines used for telecommunication transmission (ie, the first silver paste circuit layer, the second silver paste circuit layer, and the copper plating layer) are formed on the upper and lower surfaces of the flexible circuit substrate, respectively The invention can utilize the flexibility of the flexible circuit board (the minimum plate thickness of the flexible material that can be achieved in actual manufacturing is less than the minimum plate thickness that the hard material can achieve in actual manufacturing) and the flexible circuit board The material cost is lower than the material cost of the circuit board, so as to effectively solve the problem that the thickness of the light-emitting diode circuit board mentioned in the prior art is not easy to reduce and is not conducive to the thin design of the light-emitting keyboard, and can be further reduced Manufacturing cost of luminous keyboard.

關於本發明之優點與精神可以藉由以下的發明詳述及所附圖式得到進一步的瞭解。 The advantages and spirit of the present invention can be further understood through the following detailed description of the invention and the accompanying drawings.

10、100、150:發光鍵盤 10, 100, 150: illuminated keyboard

12、102:底板 12, 102: bottom plate

14:按鍵 14: Button

15:按鍵區域 15: Button area

18:鍵帽 18: Keycap

20:升降機構 20: Lifting mechanism

21、104、152:薄膜電路板 21, 104, 152: thin film circuit board

22:撓性電路基板 22: Flexible circuit board

23:第一通孔 23: First through hole

24:多色發光二極體 24: Multicolor LED

25、25’:導電柱 25, 25’: conductive column

30:鍍銅層 30: copper plating

31:第二通孔 31: Second through hole

32:第一保護層 32: The first protective layer

33:第二保護層 33: Second protective layer

40:中空槽孔 40: Hollow slot

103:穿孔 103: Piercing

202:第一高導電線路層 202: the first highly conductive circuit layer

204:第二高導電線路層 204: second highest conductive circuit layer

206:高導電鍍層 206: Highly conductive coating

208:合金接著層 208: Alloy bonding layer

252:導電抗氧化層 252: conductive antioxidant layer

302:第一導電抗氧化層 302: The first conductive anti-oxidation layer

304:第二導電抗氧化層 304: Second conductive anti-oxidation layer

S1:上表面 S 1 : upper surface

S2:下表面 S 2 : lower surface

16、16’、16”、200、250、300:光源燈板 16, 16’, 16”, 200, 250, 300: light source lamp board

26、26’、26”:第一銀漿線路層 26, 26’, 26”: the first silver paste line layer

27、27’、27”、203:第一線路 27, 27’, 27”, 203: the first line

28、28’、28”:第二銀漿線路層 28, 28’, 28”: Second silver paste line layer

29、29’、29”、205:第二線路 29, 29’, 29”, 205: second line

34:排線板部 34: cable board section

36:連接線路層 36: connection line layer

38:控制電路板 38: Control circuit board

第1圖為根據本發明之一實施例所提出之發光鍵盤之立體示意圖。 FIG. 1 is a perspective schematic view of a light-emitting keyboard according to an embodiment of the invention.

第2圖為第1圖之發光鍵盤沿剖面線A-A之剖面示意圖。 FIG. 2 is a schematic cross-sectional view of the light-emitting keyboard of FIG. 1 along section line A-A.

第3圖為第2圖之光源燈板之放大上視圖。 Figure 3 is an enlarged top view of the light source lamp board of Figure 2.

第4圖為第3圖之光源燈板沿剖面線B-B之部分剖面簡示圖。 FIG. 4 is a schematic partial cross-sectional view of the light source lamp board of FIG. 3 along section line B-B.

第5圖為根據本發明另一實施例所提出之光源燈板之部分剖面簡示圖。 FIG. 5 is a schematic partial cross-sectional view of a light source lamp panel according to another embodiment of the present invention.

第6圖為根據本發明另一實施例所提出之光源燈板之成型過程之部分剖面簡示圖。 FIG. 6 is a schematic partial cross-sectional view of a forming process of a light source lamp board according to another embodiment of the present invention.

第7圖為根據本發明另一實施例所提出之發光鍵盤之部分剖面示意圖。 FIG. 7 is a schematic partial cross-sectional view of a light-emitting keyboard according to another embodiment of the present invention.

第8圖為根據本發明另一實施例所提出之發光鍵盤之部分剖面示意圖。 FIG. 8 is a schematic partial cross-sectional view of a light-emitting keyboard according to another embodiment of the present invention.

第9圖為根據本發明另一實施例所提出之光源燈板之部分剖面簡示圖。 FIG. 9 is a schematic partial cross-sectional view of a light source lamp board according to another embodiment of the present invention.

第10圖為根據本發明另一實施例所提出之光源燈板之部分剖面簡示圖。 FIG. 10 is a schematic partial cross-sectional view of a light source lamp panel according to another embodiment of the present invention.

第11圖為根據本發明另一實施例所提出之光源燈板之部分剖面簡示圖。 FIG. 11 is a schematic partial cross-sectional view of a light source lamp board according to another embodiment of the present invention.

請參閱第1圖以及第2圖,第1圖為根據本發明之一實施例所提出之發光鍵盤10之立體示意圖,第2圖為第1圖之發光鍵盤10沿剖面線A-A之剖面示意圖,如第1圖以及第2圖所示,發光鍵盤10包含底板12、複數個按鍵14,以及光源燈板16。複數個按鍵14係設置於底板12上以供使用者按壓而執行使用者所欲輸入之功能,每一按鍵14包含鍵帽18以及升降機構20,升降機構20係設置於底板12以及鍵帽18之間,鍵帽18可經由升降機構20相對於底板12上下移動。在此實施例中,升降機構20係可較佳地為採用如第2圖所示之剪刀腳機構設計(但不受此限,其係可改採用其他常見之鍵帽升降設計,如磁吸設計等)且可活動地連接於鍵帽18以及底板12,藉此,鍵帽18即可透過升降機構20之剪刀腳連接設計相對於底板12上下移動。 Please refer to FIG. 1 and FIG. 2, FIG. 1 is a perspective schematic view of a light-emitting keyboard 10 according to an embodiment of the present invention, and FIG. 2 is a cross-sectional schematic view of the light-emitting keyboard 10 of FIG. 1 along section line AA, As shown in FIGS. 1 and 2, the light-emitting keyboard 10 includes a bottom plate 12, a plurality of keys 14, and a light source lamp board 16. A plurality of keys 14 are provided on the bottom plate 12 for the user to press to perform the function that the user wants to input. Each key 14 includes a keycap 18 and a lifting mechanism 20. The lifting mechanism 20 is provided on the bottom plate 12 and the keycap 18 In between, the keycap 18 can move up and down relative to the bottom plate 12 via the lifting mechanism 20. In this embodiment, the lifting mechanism 20 is preferably a scissor mechanism as shown in Figure 2 (but not limited to this, it can be changed to other common key cap lifting designs, such as magnetic suction Design, etc.) and can be movably connected to the keycap 18 and the bottom plate 12, whereby the keycap 18 can move up and down relative to the bottom plate 12 through the scissor connection design of the lifting mechanism 20.

至於在光源燈板16之發光設計方面,請參閱第2圖、第3圖以及第4圖,第3圖為第2圖之光源燈板16之放大上視圖,第4圖為第3圖之光源燈板16沿剖面線B-B之部分剖面簡示圖,由第2圖、第3圖以及第4圖可知,光源燈板16係設置於底板12上,光源燈板16包含撓性電路基板22、複數個多色發光二極體24、導電柱25、第一銀漿線路層26、第二銀漿線路層28、鍍銅層30,以及第一保護層32。撓性電路基板22係可較佳地由可撓性電路基板材質所組成(例如聚對苯二甲酸 乙二酯(polyethylene terephthalate,PET)或聚醯亞胺(polyimide,PI),但不受此限)且具有至少一第一通孔23(其數量與配置端視光源燈板16之實際電路設計需求而定,不以第3圖為限)。複數個多色發光二極體24係可較佳地為紅綠藍發光二極體(RGB LED)且分別對應複數個按鍵14,藉此,多色發光二極體24係可用來發射光線入射至相對應之鍵帽18,從而達到按鍵發光效果。 As for the luminous design of the light source lamp board 16, please refer to FIG. 2, FIG. 3 and FIG. 4, FIG. 3 is an enlarged top view of the light source lamp board 16 of FIG. 2, and FIG. 4 is FIG. 3 A partial cross-sectional schematic view of the light source lamp board 16 along the section line BB. As can be seen from FIGS. 2, 3, and 4, the light source lamp board 16 is disposed on the bottom plate 12, and the light source lamp board 16 includes the flexible circuit board 22 A plurality of multi-color light-emitting diodes 24, conductive pillars 25, a first silver paste circuit layer 26, a second silver paste circuit layer 28, a copper plating layer 30, and a first protective layer 32. The flexible circuit board 22 can be preferably composed of a flexible circuit board material (for example, polyterephthalic acid Polyethylene terephthalate (PET) or polyimide (PI), but not limited to this, and has at least one first through hole 23 (the number and configuration of the actual circuit design of the end-view light source lamp board 16 Depends on demand, not limited to Figure 3). The plurality of multi-color light-emitting diodes 24 can be preferably red, green, and blue light-emitting diodes (RGB LEDs) and correspond to the plurality of buttons 14, respectively, whereby the multi-color light-emitting diodes 24 can be used to emit light incident To the corresponding keycap 18, so as to achieve the key light effect.

第一銀漿線路層26係可具有複數條第一線路27(其數量與配置端視光源燈板16之實際電路設計需求而定,不以第3圖為限),複數條第一線路27係可較佳地採用銀漿印刷製程形成於撓性電路基板22之上表面S1,相似地,第二銀漿線路層28係可具有形成在撓性電路基板22之下表面S2的複數條第二線路29,上述複數條第一線路27之至少其中之一可經由形成於第一通孔23中之導電柱25電性連接複數條第二線路29之至少其中之一(其線路貫孔連接配置端視光源燈板16之實際電路設計需求而定,不以第3圖為限)以建立撓性電路基板22之第一線路27與第二線路29之電性連接,更進一步地,為了解決銀漿線路因線路長短不同而具有不同阻抗的問題,在此實施例中,鍍銅層30係可鍍附於第一銀漿線路層26以及第二銀漿線路層28上,且第一保護層32係可較佳地由紫外線(UV)熱固絕緣膠材質所組成(但不受此限)且塗佈於鍍銅層30上,進而產生防止鍍銅層30氧化之功效。 The first silver paste circuit layer 26 may have a plurality of first circuits 27 (the number and configuration of which depend on the actual circuit design requirements of the light source lamp board 16 and are not limited to FIG. 3), and the plurality of first circuits 27 The silver paste printing process may be preferably formed on the upper surface S 1 of the flexible circuit substrate 22. Similarly, the second silver paste circuit layer 28 may have a plurality of surfaces S 2 formed on the lower surface of the flexible circuit substrate 22 A second line 29, at least one of the plurality of first lines 27 may be electrically connected to at least one of the plurality of second lines 29 via the conductive pillar 25 formed in the first through hole 23 The configuration of the hole connection depends on the actual circuit design requirements of the light source lamp board 16, not limited to FIG. 3) to establish the electrical connection of the first circuit 27 and the second circuit 29 of the flexible circuit board 22, and further In order to solve the problem of silver paste lines having different impedances due to different line lengths, in this embodiment, the copper plating layer 30 can be plated on the first silver paste circuit layer 26 and the second silver paste circuit layer 28, and The first protective layer 32 may be preferably composed of ultraviolet (UV) thermosetting insulating adhesive material (but not limited thereto) and coated on the copper plating layer 30, thereby generating the effect of preventing the oxidation of the copper plating layer 30.

更詳細地說,由第4圖可知,第一保護層32係可在對應複數個按鍵14以及對應鍍附在第一銀漿線路層26上之鍍銅層30的位置形成有複數個第二通孔31,每一多色發光二極體24係可通過相對應之第二通孔31設置於鍍附在第一銀漿線路層26之鍍銅層30上以電連接至第一線路27,藉以使光源燈板16可經由鍍銅層30(相較於銀漿線路,銅線路不會有因線路長短不同而具有不同阻抗的問題)進行電訊傳輸以控制複數個多色發光二極體24發光與顏色變化。在實際應用中,光源燈板16可另包含第二保護層33,第二保護層33塗佈於第一保護層32以及 每一多色發光二極體24上以產生防靜電放電(Electrostatic Discharge,ESD)、防塵以及防水之保護功效。 In more detail, as can be seen from FIG. 4, the first protective layer 32 can be formed with a plurality of second positions at positions corresponding to the plurality of keys 14 and the copper plating layer 30 plated on the first silver paste circuit layer 26 Through holes 31, each multi-color light emitting diode 24 can be provided on the copper plating layer 30 plated on the first silver paste circuit layer 26 through the corresponding second through holes 31 to be electrically connected to the first circuit 27 , So that the light source lamp board 16 can carry out telecommunication transmission through the copper plating layer 30 (compared to the silver paste circuit, the copper circuit does not have the problem of different impedance due to the different circuit length) to control a plurality of multicolor light-emitting diodes 24 glow and color changes. In practical applications, the light source lamp board 16 may further include a second protective layer 33, the second protective layer 33 is coated on the first protective layer 32 and Each multi-color light-emitting diode 24 is provided with protection effects of anti-electrostatic discharge (ESD), dustproof and waterproof.

於此針對上述第一銀漿線路層26、第二銀漿線路層28、導電柱25、鍍銅層30、第一保護層32,以及第二保護層33形成在撓性電路基板22上之步驟進行說明。由第4圖可知,首先,第一銀漿線路層26以及第二銀漿線路層28係可以銀漿印刷製程分別形成於撓性電路基板22之上表面S1以及下表面S2,並且鍍銅層30係可鍍附(例如以化學電鍍製程等)在第一銀漿線路層26以及第二銀漿線路層28上,在此過程中,銀漿與銅係可沿著第一通孔23形成導電柱25(如第4圖所示,也就是說,在此實施例中,導電柱25係由銀漿與銅層疊材質所組成),藉以建立第一線路27與第二線路29之電性連接;接下來,第一保護層32係可以印刷製程塗佈於鍍銅層30上且形成有第二通孔31,藉此,多色發光二極體24係可通過第二通孔31設置於鍍銅層30上(例如以焊接之方式等)以電連接至第一線路27;最後,第二保護層33係可以印刷製程塗佈於第一保護層32以及多色發光二極體24上,如此即可完成光源燈板16之成型製程。需注意的是,如第4圖所示,在上述依序形成第一保護層32以及第二保護層33的過程中,第一保護層32以及第二保護層33係可較佳地沿著第一通孔23形成有中空槽孔40(但不受此限,在另一實施例中,其亦可採用第一保護層32以及第二保護層33可依序填滿第一通孔23之設計)。 Here, the first silver paste circuit layer 26, the second silver paste circuit layer 28, the conductive pillar 25, the copper plating layer 30, the first protective layer 32, and the second protective layer 33 are formed on the flexible circuit board 22 The steps are explained. As can be seen from FIG. 4, first, the first silver paste circuit layer 26 and the second silver paste circuit layer 28 can be formed on the upper surface S 1 and the lower surface S 2 of the flexible circuit board 22 by a silver paste printing process, and plated The copper layer 30 can be deposited on the first silver paste circuit layer 26 and the second silver paste circuit layer 28 (for example, by a chemical plating process, etc.). During this process, the silver paste and the copper system can be along the first through hole 23 to form a conductive pillar 25 (as shown in FIG. 4, that is to say, in this embodiment, the conductive pillar 25 is composed of silver paste and copper laminated material), so as to establish the first circuit 27 and the second circuit 29 Electrical connection; Next, the first protective layer 32 can be printed on the copper plating layer 30 and has a second through hole 31 formed thereon, whereby the multicolor light-emitting diode 24 can pass through the second through hole 31 is disposed on the copper plating layer 30 (for example, by soldering, etc.) to be electrically connected to the first circuit 27; finally, the second protective layer 33 can be applied to the first protective layer 32 and the multi-color light-emitting diode by a printing process On the body 24, the forming process of the light source lamp board 16 can be completed in this way. It should be noted that, as shown in FIG. 4, in the above process of forming the first protective layer 32 and the second protective layer 33 in sequence, the first protective layer 32 and the second protective layer 33 may preferably be along The first through hole 23 is formed with a hollow slot 40 (but not limited to this, in another embodiment, it can also use the first protective layer 32 and the second protective layer 33 to fill the first through hole 23 in sequence Design).

除此之外,如第3圖所示,撓性電路基板22向外延伸形成至少一排線板部34(於第3圖中顯示三個,但不以此為限),光源燈板16可另包含連接線路層36以及控制電路板38,連接線路層36係形成於排線板部34上且經由鍍銅層30電連接於複數個多色發光二極體24,控制電路板38係連接於排線板部34之一端(例如以排線插接於連接埠之電性連接方式)以電連接於連接線路層36,藉此,控制電路板38係可經由連接線路層36傳輸電性訊號至複數個多色發光二極體24以進行複數個多色發光二極體24之發光控制(例如控制複數個多色發光二極體24分時 發光或依序產生不同色光等,其相關電路控制設計與原理常見於先前技術中,於此不再贅述),從而使發光鍵盤10可具有更多變化的按鍵發光視覺效果。另外,在按鍵觸發設計方面,由第2圖可知,發光鍵盤10可另包含薄膜電路板21,薄膜電路板21係設置於光源燈板16上,藉此,當鍵帽18被外力按壓時,鍵帽18伴隨升降機構20向下移動,使得薄膜電路板21上相對應之薄膜開關被觸發,從而使按鍵14可據以執行使用者所欲輸入之功能,至於針對按鍵14與薄膜電路板21之間的觸發設計(例如利用升降機構20上之突出結構件下壓觸發薄膜電路板21上之薄膜開關等)的相關描述,其係常見於先前技術中,於此不再贅述。 In addition, as shown in FIG. 3, the flexible circuit board 22 extends outward to form at least one row of wire plate portions 34 (three are shown in FIG. 3, but not limited thereto), the light source lamp board 16 The connection circuit layer 36 and the control circuit board 38 may be further included. The connection circuit layer 36 is formed on the wiring board portion 34 and is electrically connected to a plurality of multicolor light-emitting diodes 24 through the copper plating layer 30. The control circuit board 38 system One end connected to the cable board portion 34 (for example, an electrical connection method in which the cable is plugged into the port) is electrically connected to the connection circuit layer 36, whereby the control circuit board 38 can transmit electricity through the connection circuit layer 36 Sexual signals to a plurality of multi-color light-emitting diodes 24 to perform the light-emitting control of the plurality of multi-color light-emitting diodes 24 (for example, to control the time division of the plurality of multi-color light-emitting diodes 24) The related circuit control design and principle of illuminating or generating different colored lights in sequence are common in the prior art, which will not be repeated here), so that the luminous keyboard 10 can have more varied visual effects of luminous keys. In addition, in terms of key trigger design, as can be seen from FIG. 2, the light-emitting keyboard 10 may further include a thin film circuit board 21, which is disposed on the light source lamp board 16, whereby, when the key cap 18 is pressed by an external force, The keycap 18 moves downwards with the lifting mechanism 20, so that the corresponding membrane switch on the membrane circuit board 21 is triggered, so that the button 14 can perform the function that the user wants to input according to the button 14 and the membrane circuit board 21 The related descriptions of the trigger design (for example, using the protruding structural member on the lifting mechanism 20 to press down the membrane switch on the membrane circuit board 21, etc.) are common in the prior art and will not be repeated here.

如此一來,透過僅將用來進行電訊傳輸之線路(即第一銀漿線路層26、第二銀漿線路層28,以及鍍銅層30)分別形成在撓性電路基板22之上下表面S1、S2,且將用來進行多色發光二極體24之發光控制的控制電路板38外接於撓性電路基板22之一側的設計,再加上由第1圖以及第3圖可知,複數個按鍵14係可形成按鍵區域15且撓性電路基板22之面積大致上等於按鍵區域15之面積(由於控制電路板38上僅需配置用來控制多色發光二極體24之發光變化的積體電路控制晶片而無須配置複數個多色發光二極體24以及分別連接至每一多色發光二極體24之電訊傳輸線路,因此,控制電路板38之面積係可小於撓性電路基板22之面積),本發明係可利用撓性電路基板之可撓性(可撓性材質在實際製造上所能達到之最小板材厚度係小於硬板材質在實際製造上所能達到之最小板材厚度)以及撓性電路基板之材料成本低於電路硬板之材料成本,藉以有效地解決先前技術中所提到之發光二極體電路板之板材厚度不易縮減而不利於發光鍵盤薄型化設計的問題,並且可進一步地降低發光鍵盤之製造成本。 In this way, by forming only the circuits for telecommunication transmission (ie, the first silver paste circuit layer 26, the second silver paste circuit layer 28, and the copper plating layer 30) on the upper and lower surfaces S of the flexible circuit substrate 22, respectively 1 , S 2 , and the design of the external connection of the control circuit board 38 used to control the light emission of the multi-color light-emitting diode 24 on one side of the flexible circuit board 22, plus from FIG. 1 and FIG. 3 , A plurality of buttons 14 can form a button area 15 and the area of the flexible circuit board 22 is substantially equal to the area of the button area 15 (since the control circuit board 38 only needs to be configured to control the light emission of the multi-color light-emitting diode 24 The integrated circuit control chip does not need to be equipped with a plurality of multi-color light-emitting diodes 24 and a telecommunication transmission line respectively connected to each multi-color light-emitting diode 24, therefore, the area of the control circuit board 38 can be smaller than the flexible circuit The area of the substrate 22), the present invention can utilize the flexibility of the flexible circuit board (the minimum material thickness that the flexible material can achieve in actual manufacturing is less than the minimum material that the hard board material can achieve in actual manufacturing) Thickness) and the material cost of the flexible circuit board is lower than the material cost of the circuit board, so as to effectively solve the problem that the thickness of the light-emitting diode circuit board mentioned in the prior art is not easy to reduce and is not conducive to the thin design of the light-emitting keyboard Problems, and can further reduce the manufacturing cost of the light-emitting keyboard.

此外,值得一提的是,在光源燈板16無須具有能夠控制多色發光二極體24發光與否之控制功能的實施例中,也就是說,在光源燈板16僅需具備有電訊線路傳輸功能且發光控制功能係由發光鍵盤10所連接之電子裝置(如筆記型 電腦)提供的應用情況下,控制電路板38係為可省略之元件,藉以進一步地簡化發光鍵盤10之電路板設計以及降低發光鍵盤10之製造成本。另外,在實際應用中,控制電路板38係可利用撓性電路基板22之可撓性而疊貼於光源燈板16下,藉以更進一步地縮減光源燈板16所需佔用之配置空間。需注意的是,控制電路板之配置係可不限於上述實施例,其亦可採用省略排線板部及連接線路層之配置而直接將控制電路板疊貼於撓性電路基板下之設計,藉以更進一步地簡化發光鍵盤之電路板設計,簡言之,在省略排線板部及連接線路層之配置的實施例中,控制電路板係可直接疊貼於撓性電路基板下(例如以異方性導電膠(Anisotropic Conductive Film,ACF)黏貼或熱壓熔錫焊接(Hot bar)等方式)以經由鍍銅層電連接於多色發光二極體,藉此,控制電路板係可用來經由鍍銅層傳輸電性訊號至多色發光二極體以進行多色發光二極體之發光控制。 In addition, it is worth mentioning that in the embodiment where the light source lamp board 16 does not need to have a control function capable of controlling the light emission of the multicolor light-emitting diode 24, that is to say, the light source lamp board 16 only needs to have a telecommunication circuit The transmission function and the light-emitting control function are electronic devices (such as notebooks) connected by the light-emitting keyboard 10 In the application provided by the computer), the control circuit board 38 is an omitting element, so as to further simplify the circuit board design of the light-emitting keyboard 10 and reduce the manufacturing cost of the light-emitting keyboard 10. In addition, in practical applications, the control circuit board 38 can be stacked under the light source lamp board 16 by using the flexibility of the flexible circuit board 22, so as to further reduce the configuration space required by the light source lamp board 16. It should be noted that the configuration of the control circuit board may not be limited to the above embodiment, and it may also be a design in which the configuration of the wiring board portion and the connection circuit layer is omitted and the control circuit board is directly laminated under the flexible circuit board, thereby To further simplify the design of the circuit board of the light-emitting keyboard, in short, in the embodiment that omits the configuration of the cable board portion and the connection circuit layer, the control circuit board can be directly laminated under the flexible circuit board (for example, different Anisotropic Conductive Film (ACF) or hot-press soldering (Hot bar, etc.) is used to electrically connect to the multi-color light-emitting diode through the copper plating layer, by which the control circuit board can be used to The copper-plated layer transmits electrical signals to the multi-color light-emitting diodes to control the light emission of the multi-color light-emitting diodes.

除此之外,鍍銅層與第一銀漿線路層以及第二銀漿線路層之配置係可不限於上述實施例,舉例來說,請參閱第5圖,其為根據本發明另一實施例所提出之光源燈板16’之部分剖面簡示圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。由第5圖可知,光源燈板16’包含撓性電路基板22、複數個多色發光二極體24(於第5圖中僅顯示一個)、導電柱25’、第一銀漿線路層26’、第二銀漿線路層28’、鍍銅層30、第一保護層32,以及第二保護層33。第一銀漿線路層26’係可具有複數條第一線路27’,複數條第一線路27’係可較佳地採用銀漿印刷製程形成於撓性電路基板22之上表面S1,相似地,第二銀漿線路層28’係可具有形成在撓性電路基板22之下表面S2的複數條第二線路29’。需注意的是,如第5圖所示,在上述形成第一線路27’與第二線路29’的過程中,銀漿係可較佳地填滿(但不受此限)第一通孔23以形成導電柱25’(也就是說,在此實施例中,導電柱25’係由銀漿材質所組成),藉以建立第一線路27’與第二線路29’之電性連接。 In addition, the configuration of the copper plating layer, the first silver paste circuit layer and the second silver paste circuit layer may not be limited to the above embodiment. For example, please refer to FIG. 5, which is another embodiment according to the present invention. The schematic diagram of a partial cross-section of the proposed light source lamp board 16'. In this embodiment, the elements mentioned in the above embodiments have the same number as the same structure or function, and the related description is not repeated here. Repeat. As can be seen from FIG. 5, the light source lamp board 16 ′ includes the flexible circuit board 22, a plurality of multicolor light-emitting diodes 24 (only one is shown in FIG. 5 ), the conductive pillar 25 ′, and the first silver paste circuit layer 26 ', the second silver paste circuit layer 28', the copper plating layer 30, the first protective layer 32, and the second protective layer 33. The first silver paste circuit layer 26' may have a plurality of first circuits 27'. The plurality of first circuits 27' may be preferably formed on the upper surface S 1 of the flexible circuit substrate 22 by a silver paste printing process, similar Ground, the second silver paste wiring layer 28 ′ may have a plurality of second wirings 29 ′ formed on the lower surface S 2 of the flexible circuit substrate 22. It should be noted that, as shown in FIG. 5, in the above process of forming the first line 27' and the second line 29', the silver paste system can preferably fill (but not limited to) the first through hole 23 to form a conductive pillar 25' (that is, in this embodiment, the conductive pillar 25' is composed of silver paste material) to establish an electrical connection between the first line 27' and the second line 29'.

在另一實施例中,請參閱第6圖,其為根據本發明另一實施例所提出之光源燈板16”之成型過程之部分剖面簡示圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。由第6圖可知,光源燈板16”包含撓性電路基板22、複數個多色發光二極體24(於第6圖中僅顯示一個)、導電柱25’、第一銀漿線路層26”、第二銀漿線路層28”、鍍銅層30,以及保護層32。第一銀漿線路層26”係可具有複數條第一線路27”且第二銀漿線路層28”係可具有複數條第二線路29”,如第6圖(a)所示,第一線路27”與第二線路29”係可較佳地採用銀漿印刷製程分別形成於撓性電路基板22之上表面S1以及下表面S2,並且鍍銅層30係可鍍附於第一銀漿線路層26”以及第二銀漿線路層28”上,接下來,如第6圖(b)所示,其係可再進行一次銀漿印刷製程以使銀漿填滿第一通孔23而使得第一線路27”與第二線路29”經由導電柱25’彼此電性連接以建立撓性電路基板22之電路連接。 In another embodiment, please refer to FIG. 6, which is a schematic partial cross-sectional view of the forming process of the light source lamp board 16" according to another embodiment of the present invention. The mentioned elements have the same number, which means that they have the same structure or function, and the relevant description will not be repeated here. It can be seen from FIG. 6 that the light source lamp board 16" includes the flexible circuit board 22 and a plurality of multi-color lights The diode 24 (only one is shown in FIG. 6), the conductive pillar 25', the first silver paste wiring layer 26", the second silver paste wiring layer 28", the copper plating layer 30, and the protective layer 32. The first silver paste line layer 26" may have a plurality of first lines 27" and the second silver paste line layer 28" may have a plurality of second lines 29", as shown in FIG. 6(a), the first The circuit 27" and the second circuit 29" can be preferably formed on the upper surface S 1 and the lower surface S 2 of the flexible circuit board 22 using a silver paste printing process, and the copper plating layer 30 can be plated on the first On the silver paste circuit layer 26" and the second silver paste circuit layer 28", as shown in FIG. 6(b), the silver paste printing process may be performed again to fill the first through hole with the silver paste 23, so that the first line 27" and the second line 29" are electrically connected to each other via the conductive post 25' to establish the circuit connection of the flexible circuit board 22.

另外,薄膜電路板與光源燈板以及底板之配置亦可不限於上述實施例。舉例來說,請參閱第7圖,其為根據本發明另一實施例所提出之發光鍵盤100之部分剖面示意圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。由第7圖可知,發光鍵盤100包含複數個按鍵14(於第7圖中僅顯示一個)、光源燈板16、底板102,以及薄膜電路板104,薄膜電路板104係設置於底板102上,光源燈板16係貼附於底板102下且多色發光二極體24係可穿設在底板102之穿孔103中,藉以有效地降低發光二極體在發光鍵盤內部所佔用之配置空間,以利發光鍵盤之薄型化設計。 In addition, the configuration of the thin film circuit board, the light source lamp board, and the bottom plate may not be limited to the above embodiments. For example, please refer to FIG. 7, which is a partial cross-sectional schematic view of a light-emitting keyboard 100 according to another embodiment of the present invention. In this embodiment, the elements mentioned in the above embodiments have the same number as the representative. It has the same structure or function, and the related description is not repeated here. As can be seen from FIG. 7, the light-emitting keyboard 100 includes a plurality of keys 14 (only one is shown in FIG. 7), the light source lamp board 16, the bottom plate 102, and the thin film circuit board 104, the thin film circuit board 104 is disposed on the bottom plate 102, The light source lamp board 16 is attached to the bottom plate 102 and the multi-color light-emitting diode 24 can be inserted into the perforation 103 of the bottom plate 102, thereby effectively reducing the configuration space occupied by the light-emitting diode inside the light-emitting keyboard, The thin design of the luminous keyboard.

在另一實施例中,請參閱第8圖,其為根據本發明另一實施例所提出之發光鍵盤150之部分剖面示意圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。由第8圖可知,發光鍵盤150包含複數個按鍵14(於第8圖中僅顯示一個)、光源燈板 16、底板12,以及薄膜電路板152,薄膜電路板152係設置於底板12以及光源燈板16之間,藉此,當鍵帽18被外力按壓時,鍵帽18伴隨升降機構20向下移動,使得薄膜電路板152上相對應之薄膜開關被觸發,從而使按鍵14可據以執行使用者所欲輸入之功能。 In another embodiment, please refer to FIG. 8, which is a partial cross-sectional schematic diagram of a light-emitting keyboard 150 according to another embodiment of the present invention. In this embodiment, the elements mentioned in the above embodiments have the same number In other words, it means that they have the same structure or function, and the related description is not repeated here. As can be seen from FIG. 8, the light-emitting keyboard 150 includes a plurality of keys 14 (only one is shown in FIG. 8), and the light source lamp panel 16. The bottom plate 12 and the thin film circuit board 152, which are disposed between the bottom plate 12 and the light source lamp board 16, whereby when the key cap 18 is pressed by an external force, the key cap 18 moves down with the lifting mechanism 20 , So that the corresponding membrane switch on the membrane circuit board 152 is triggered, so that the button 14 can perform the function that the user wants to input accordingly.

在另一實施例中,本發明係可改採用三層結構設計以完成多色發光二極體在撓性電路基板上的電性連接,舉例來說,請參閱第9圖,其為根據本發明另一實施例所提出之光源燈板200之部分剖面簡示圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。光源燈板200係可應用在發光鍵盤上以產生按鍵發光功效,由第9圖可知,光源燈板200包含撓性電路基板22、複數個多色發光二極體24(於第9圖中僅顯示一個)、導電柱25、第一高導電線路層202、第二高導電線路層204、高導電鍍層206、第一保護層32,以及第二保護層33。第一高導電線路層202以及第二高導電線路層204係可較佳地由銀漿或銅漿材質所組成(但不以此為限),第一高導電線路層202可具有複數條第一線路203且第二高導電線路層204可具有複數條第二線路205,複數條第一線路203以及複數條第二線路205係可較佳地採用印刷製程以分別形成於撓性電路基板22之上表面S1以及下表面S2,複數條第一線路203之至少其中之一可經由形成於第一通孔23中之導電柱25電性連接複數條第二線路205之至少其中之一(其線路貫孔連接配置端視光源燈板200之實際電路設計需求而定)以建立撓性電路基板22之第一線路203與第二線路205之電性連接。高導電鍍層206係可較佳地由銅、銀或鎳材質所組成(但不以此為限)且鍍附(例如以化學電鍍製程等)在第一高導電線路層202以及第二高導電線路層204上。在此實施例中,光源燈板200可另包含合金接著層208,合金接著層208係可較佳地由錫鉍合金或錫銀銅合金材質(但不以此為限)所組成且形成於每一多色發光二極體24與相對應之高導電鍍層206之間,以使每一多色發光二極體24可更穩固 地接合於高導電鍍層206上。至於針對光源燈板200之其他相關描述(如導電柱設計、控制電路板設計等),其係可參照上述實施例類推,於此不再贅述。 In another embodiment, the present invention can be changed to a three-layer structure design to complete the electrical connection of the multi-color light-emitting diode on the flexible circuit board. For example, please refer to FIG. 9, which is based on this A schematic diagram of a partial cross-section of a light source lamp panel 200 according to another embodiment of the invention. In this embodiment, the elements mentioned in the above embodiment have the same number as the same number, which means that they have the same structure or function. I will not repeat them here. The light source lamp board 200 can be applied to a light-emitting keyboard to produce a key-emitting effect. As can be seen from FIG. 9, the light source lamp board 200 includes a flexible circuit board 22 and a plurality of multi-color light-emitting diodes 24 (in FIG. 9 only One is shown), the conductive pillar 25, the first highly conductive circuit layer 202, the second highly conductive circuit layer 204, the highly conductive plating layer 206, the first protective layer 32, and the second protective layer 33. The first highly conductive circuit layer 202 and the second highly conductive circuit layer 204 can be preferably composed of silver paste or copper paste material (but not limited to this), the first highly conductive circuit layer 202 can have a plurality of A circuit 203 and the second highly conductive circuit layer 204 may have a plurality of second circuits 205. The plurality of first circuits 203 and the plurality of second circuits 205 may be preferably formed on the flexible circuit substrate 22 by a printing process On the upper surface S 1 and the lower surface S 2 , at least one of the plurality of first lines 203 can be electrically connected to at least one of the plurality of second lines 205 through conductive pillars 25 formed in the first through holes 23 (The circuit through-hole connection configuration depends on the actual circuit design requirements of the light source lamp board 200) to establish the electrical connection between the first circuit 203 and the second circuit 205 of the flexible circuit board 22. The highly conductive plating layer 206 can be preferably composed of copper, silver or nickel (but not limited to this) and is plated (e.g. by chemical plating process, etc.) on the first highly conductive circuit layer 202 and the second highly conductive layer On the circuit layer 204. In this embodiment, the light source lamp panel 200 may further include an alloy bonding layer 208. The alloy bonding layer 208 may be preferably composed of but not limited to tin-bismuth alloy or tin-silver-copper alloy material and formed in Each multi-color light-emitting diode 24 is corresponding to the corresponding high-conductivity plating layer 206, so that each multi-color light-emitting diode 24 can be more firmly bonded to the high-conductivity plating layer 206. As for other relevant descriptions of the light source lamp board 200 (such as the design of the conductive post, the design of the control circuit board, etc.), it can be referred to the above embodiment by analogy, and will not be repeated here.

在另一實施例中,本發明係可改採用四層結構設計以完成多色發光二極體在撓性電路基板上的電性連接,舉例來說,請參閱第10圖,其為根據本發明另一實施例所提出之光源燈板250之部分剖面簡示圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。光源燈板250係可應用在發光鍵盤上以產生按鍵發光功效,由第10圖可知,光源燈板250包含撓性電路基板22、複數個多色發光二極體24(於第10圖中僅顯示一個)、導電柱25、第一高導電線路層202、第二高導電線路層204、高導電鍍層206、合金接著層208、導電抗氧化層252、第一保護層32,以及第二保護層33。在此實施例中,導電抗氧化層252係可較佳地由鎳或金材質所組成(但不以此為限)且形成於高導電鍍層206與合金接著層208之間,以產生防止高導電鍍層206氧化的功效。至於針對光源燈板250之其他相關描述(如導電柱設計、控制電路板設計等),其係可參照上述實施例類推,於此不再贅述。 In another embodiment, the present invention can be changed to a four-layer structure design to complete the electrical connection of the multi-color light-emitting diode on the flexible circuit substrate. For example, please refer to FIG. 10, which is based on A partial cross-sectional schematic diagram of a light source lamp panel 250 according to another embodiment of the invention. In this embodiment, the elements mentioned in the above embodiment have the same number as the same number, which means they have the same structure or function. I will not repeat them here. The light source lamp board 250 can be applied to a light-emitting keyboard to produce a key luminous effect. As can be seen from FIG. 10, the light source lamp board 250 includes a flexible circuit board 22 and a plurality of multicolor light-emitting diodes 24 (in FIG. 10 only (Showing one), conductive pillar 25, first highly conductive circuit layer 202, second highly conductive circuit layer 204, highly conductive plating layer 206, alloy bonding layer 208, conductive antioxidant layer 252, first protective layer 32, and second protection Layer 33. In this embodiment, the conductive anti-oxidation layer 252 may be preferably composed of nickel or gold (but not limited to this) and formed between the highly conductive plating layer 206 and the alloy bonding layer 208 to prevent high The oxidation effect of the conductive coating 206. As for other related descriptions of the light source lamp board 250 (such as the design of the conductive post, the design of the control circuit board, etc.), it can be referred to the above embodiment by analogy, which will not be repeated here.

在另一實施例中,本發明係可改採用五層結構設計以完成多色發光二極體在撓性電路基板上的電性連接,舉例來說,請參閱第11圖,其為根據本發明另一實施例所提出之光源燈板300之部分剖面簡示圖,在此實施例與上述實施例中所提到之元件具有相同編號者,代表其具有相同之結構或功能,其相關描述於此不再贅述。光源燈板300係可應用在發光鍵盤上以產生按鍵發光功效,由第11圖可知,光源燈板300包含撓性電路基板22、複數個多色發光二極體24(於第11圖中僅顯示一個)、導電柱25、第一高導電線路層202、第二高導電線路層204、高導電鍍層206、合金接著層208、第一導電抗氧化層302、第二導電抗氧化層304、第一保護層32,以及第二保護層33。在此實施例中,第一導電抗氧化層302係可較佳地由鎳材質所組成(但不以此為限)且形成於高導電鍍層206與合金 接著層208之間,第二導電抗氧化層304係可較佳地由金材質所組成(但不以此為限)且形成於第一導電抗氧化層302與合金接著層208之間,如此一來,透過上述雙層抗氧化設計,本發明係可更進一步地提升針對高導電鍍層的抗氧化保護。至於針對光源燈板300之其他相關描述(如導電柱設計、控制電路板設計等),其係可參照上述實施例類推,於此不再贅述。 In another embodiment, the present invention may adopt a five-layer structure design to complete the electrical connection of the multi-color light-emitting diode on the flexible circuit substrate. For example, please refer to FIG. 11, which is based on A schematic partial cross-sectional view of a light source lamp panel 300 according to another embodiment of the invention. In this embodiment, the elements mentioned in the above embodiments have the same number as the same number, which means they have the same structure or function. I will not repeat them here. The light source lamp panel 300 can be applied to a light-emitting keyboard to generate the key-emitting effect. As can be seen from FIG. 11, the light source lamp panel 300 includes a flexible circuit board 22 and a plurality of multi-color light-emitting diodes 24 (in FIG. (Showing one), conductive pillar 25, first highly conductive circuit layer 202, second highly conductive circuit layer 204, highly conductive plating layer 206, alloy bonding layer 208, first conductive antioxidant layer 302, second conductive antioxidant layer 304, The first protective layer 32, and the second protective layer 33. In this embodiment, the first conductive anti-oxidation layer 302 may be preferably composed of nickel material (but not limited to this) and formed on the highly conductive plating layer 206 and alloy Between the next layers 208, the second conductive anti-oxidation layer 304 can be preferably composed of gold material (but not limited to this) and formed between the first conductive anti-oxidation layer 302 and the alloy bonding layer 208, so First, through the above double-layer anti-oxidation design, the present invention can further improve the anti-oxidation protection for highly conductive plating. As for other relevant descriptions of the light source lamp board 300 (such as the design of the conductive post, the design of the control circuit board, etc.), it can be referred to the above embodiment by analogy, which will not be repeated here.

以上所述僅為本發明之較佳實施例,凡依本發明申請專利範圍所做之均等變化與修飾,皆應屬本發明之涵蓋範圍。 The above are only the preferred embodiments of the present invention, and all changes and modifications made in accordance with the scope of the patent application of the present invention shall fall within the scope of the present invention.

16:光源燈板 16: Light source lamp board

22:撓性電路基板 22: Flexible circuit board

26:第一銀漿線路層 26: The first silver paste line layer

27:第一線路 27: First line

30:鍍銅層 30: copper plating

34:排線板部 34: cable board section

36:連接線路層 36: connection line layer

38:控制電路板 38: Control circuit board

Claims (42)

一種發光鍵盤,其包含:一底板;複數個按鍵,其設置於該底板上,每一按鍵包含:一鍵帽;以及一升降機構,其設置於該底板以及該鍵帽之間,該鍵帽經由該升降機構相對於該底板上下移動;以及一光源燈板,其設置於該底板與該複數個按鍵之間或設置於該底板下,該光源燈板包含:一撓性電路基板,其具有至少一第一通孔;複數個多色發光二極體,其分別對應該複數個按鍵,用來產生光線入射至該複數個鍵帽;一第一銀漿線路層,其具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面;一第二銀漿線路層,其具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面;一導電柱,其形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一;一鍍銅層,其鍍附於該第一銀漿線路層以及該第二銀漿線路層上;以及一第一保護層,其塗佈於該鍍銅層上且對應每一按鍵以及對應鍍附在該第一銀漿線路層上之鍍銅層的位置形成有一第二通孔,每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一銀漿線路層之鍍銅層電連接至該些第一線路。 A light-emitting keyboard, comprising: a bottom plate; a plurality of keys arranged on the bottom plate, each key comprising: a key cap; and a lifting mechanism arranged between the bottom plate and the key cap, the key cap Moving up and down relative to the bottom plate via the lifting mechanism; and a light source lamp board disposed between the bottom plate and the plurality of buttons or under the bottom board, the light source lamp board includes: a flexible circuit board having At least one first through hole; a plurality of multi-color light-emitting diodes, which respectively correspond to a plurality of keys, used to generate light incident on the plurality of key caps; a first silver paste circuit layer, which has a plurality of first Circuit, the plurality of first circuits are formed on an upper surface of the flexible circuit substrate; a second silver paste circuit layer having a plurality of second circuits, the plurality of second circuits formed on the flexible circuit substrate A lower surface; a conductive post formed in the at least one first through hole to electrically connect at least one of the first circuits and at least one of the second circuits; a copper plating layer, which Plated on the first silver paste circuit layer and the second silver paste circuit layer; and a first protective layer coated on the copper plated layer and corresponding to each button and correspondingly plated on the first silver A second through hole is formed at the position of the copper plating layer on the paste circuit layer, and each multicolor light-emitting diode passes through the corresponding second through hole and is electrically plated through the copper plating layer attached to the first silver paste circuit layer Connect to these first lines. 如請求項1所述之發光鍵盤,其中該撓性電路基板向外延伸形成至少一排線板部,該光源燈板另包含:一連接線路層,其形成於該至少一排線板部上且經由該鍍銅層電連接於該複數個多色發光二極體;以及一控制電路板,其連接於該排線板部之一端以電連接於該連接線路層,用來經由該連接線路層傳輸電性訊號至該複數個多色發光二極體以進行該複數個多色發光二極體之發光控制。 The light-emitting keyboard according to claim 1, wherein the flexible circuit substrate extends outward to form at least one wiring board portion, and the light source lamp board further includes: a connection circuit layer formed on the at least one wiring board portion And is electrically connected to the plurality of multi-color light-emitting diodes through the copper plating layer; and a control circuit board, which is connected to one end of the wiring board portion to be electrically connected to the connection circuit layer for passing through the connection circuit The layer transmits electrical signals to the plurality of multicolor light-emitting diodes to perform light emission control of the plurality of multicolor light-emitting diodes. 如請求項2所述之發光鍵盤,其中該控制電路板疊貼於該光源燈板下。 The illuminated keyboard according to claim 2, wherein the control circuit board is stacked under the light source lamp board. 如請求項1所述之發光鍵盤,其中該撓性電路基板係由聚對苯二甲酸乙二酯(polyethylene terephthalate,PET)或聚醯亞胺(polyimide,PI)材質所組成。 The light-emitting keyboard according to claim 1, wherein the flexible circuit substrate is made of polyethylene terephthalate (PET) or polyimide (PI) material. 如請求項1所述之發光鍵盤,其中該第一保護層係由紫外線(UV)熱固絕緣膠材質所組成。 The illuminated keyboard according to claim 1, wherein the first protective layer is composed of ultraviolet (UV) thermosetting insulating adhesive material. 如請求項1所述之發光鍵盤,其中該光源燈板另包含:一第二保護層,其塗佈於該第一保護層以及每一多色發光二極體上。 The light-emitting keyboard according to claim 1, wherein the light source lamp board further comprises: a second protective layer coated on the first protective layer and each multi-color light-emitting diode. 如請求項6所述之發光鍵盤,其中該第一保護層以及該第二保護層沿著該至少一第一通孔形成有一中空槽孔。 The light-emitting keyboard according to claim 6, wherein the first protective layer and the second protective layer are formed with a hollow slot along the at least one first through hole. 如請求項1所述之發光鍵盤,其中該複數個按鍵形成一按鍵區域,該撓性電路基板之面積大致上等於該按鍵區域的面積。 The illuminated keyboard according to claim 1, wherein the plurality of keys form a key area, and the area of the flexible circuit substrate is substantially equal to the area of the key area. 如請求項1所述之發光鍵盤,其中該導電柱由銀漿材質或銅與銀漿層疊材質所組成。 The luminous keyboard according to claim 1, wherein the conductive post is composed of silver paste material or a laminated material of copper and silver paste. 如請求項1所述之發光鍵盤,其中該光源燈板另包含一控制電路板,該控制電路板疊貼於該撓性電路基板下以經由該鍍銅層電連接於該複數個多色發光二極體,該控制電路板用來傳輸電性訊號至該複數個多色發光二極體以進行該複數個多色發光二極體之發光控制。 The light-emitting keyboard according to claim 1, wherein the light source lamp board further includes a control circuit board, the control circuit board is laminated under the flexible circuit substrate to be electrically connected to the plurality of multi-color lights through the copper plating layer Diode, the control circuit board is used to transmit electrical signals to the plurality of multi-color light-emitting diodes to perform the light-emitting control of the plurality of multi-color light-emitting diodes. 如請求項1所述之發光鍵盤,其中每一多色發光二極體與該鍍銅層之間形成有一合金接著層。 The light-emitting keyboard according to claim 1, wherein an alloy adhesive layer is formed between each multi-color light-emitting diode and the copper-plated layer. 如請求項11所述之發光鍵盤,其中該合金接著層係由錫鉍合金或錫銀銅合金材質所組成。 The illuminated keyboard according to claim 11, wherein the alloy bonding layer is made of tin-bismuth alloy or tin-silver-copper alloy material. 一種光源燈板,其適用於提供光線至一鍵盤上之複數個按鍵,該光源燈板包含:一撓性電路基板,其具有至少一第一通孔;複數個多色發光二極體,其分別對應該複數個按鍵,用來產生光線入射至該複數個按鍵;一第一銀漿線路層,其具有複數條第一線路,該複數條第一線路形成於該 撓性電路基板之一上表面;一第二銀漿線路層,其具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面;一導電柱,其形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一;一鍍銅層,其鍍附於該第一銀漿線路層以及該第二銀漿線路層上;以及一第一保護層,其塗佈於該鍍銅層上且對應每一按鍵以及對應鍍附在該第一銀漿線路層上之鍍銅層的位置形成有一第二通孔,每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一銀漿線路層之鍍銅層電連接至該些第一線路。 A light source lamp board suitable for providing light to a plurality of keys on a keyboard. The light source lamp board includes: a flexible circuit board having at least one first through hole; a plurality of multi-color light-emitting diodes, which Corresponding to a plurality of buttons, respectively, for generating light incident on the plurality of buttons; a first silver paste circuit layer having a plurality of first circuits, the plurality of first circuits formed in the An upper surface of the flexible circuit substrate; a second silver paste circuit layer having a plurality of second circuits formed on a lower surface of the flexible circuit substrate; a conductive post formed on the flexible circuit substrate At least one of the first through holes is electrically connected to at least one of the first circuits and at least one of the second circuits; a copper plated layer is attached to the first silver paste circuit layer and On the second silver paste circuit layer; and a first protective layer coated on the copper plating layer and corresponding to each button and corresponding to the position of the copper plating layer deposited on the first silver paste circuit layer There is a second through hole, and each multi-color light emitting diode is electrically connected to the first circuits through a corresponding second through hole and through a copper plating layer deposited on the first silver paste circuit layer. 如請求項13所述之光源燈板,其中該撓性電路基板向外延伸形成至少一排線板部,該光源燈板另包含:一連接線路層,其形成於該至少一排線板部上且經由該鍍銅層電連接於該複數個多色發光二極體;以及一控制電路板,其連接於該排線板部之一端以電連接於該連接線路層,用來經由該連接線路層傳輸電性訊號至該複數個多色發光二極體以進行該複數個多色發光二極體之發光控制。 The light source lamp board according to claim 13, wherein the flexible circuit substrate extends outward to form at least one wire board portion, and the light source lamp board further includes: a connection circuit layer formed on the at least one wire board portion And electrically connected to the plurality of multi-color light-emitting diodes through the copper plating layer; and a control circuit board connected to one end of the cable board portion to be electrically connected to the connection circuit layer for passing the connection The circuit layer transmits electrical signals to the plurality of multi-color light-emitting diodes to perform light emission control of the plurality of multi-color light-emitting diodes. 如請求項14所述之光源燈板,其中該控制電路板疊貼於該光源燈板下。 The light source lamp board according to claim 14, wherein the control circuit board is stacked under the light source lamp board. 如請求項13所述之光源燈板,其中該撓性電路基板係由聚對苯二甲酸乙二酯或聚醯亞胺材質所組成。 The light source lamp panel according to claim 13, wherein the flexible circuit board is composed of polyethylene terephthalate or polyimide material. 如請求項13所述之光源燈板,其中該第一保護層係由紫外線熱固絕緣膠材質所組成。 The light source lamp panel according to claim 13, wherein the first protective layer is composed of ultraviolet thermosetting insulating glue material. 如請求項13所述之光源燈板,其另包含:一第二保護層,其塗佈於該第一保護層以及每一多色發光二極體上。 The light source lamp panel according to claim 13, further comprising: a second protective layer coated on the first protective layer and each multi-color light-emitting diode. 如請求項18所述之光源燈板,其中該第一保護層以及該第二保護層沿著該至少一第一通孔形成有一中空槽孔。 The light source lamp panel according to claim 18, wherein the first protective layer and the second protective layer are formed with a hollow slot along the at least one first through hole. 如請求項13所述之光源燈板,其中該複數個按鍵形成一按鍵區域,該撓性電路基板之面積大致上等於該按鍵區域的面積。 The light source lamp panel according to claim 13, wherein the plurality of keys form a key area, and the area of the flexible circuit substrate is substantially equal to the area of the key area. 如請求項13所述之光源燈板,其中該導電柱由銀漿材質或銅與銀漿層疊材質所組成。 The light source lamp panel as described in claim 13, wherein the conductive column is composed of silver paste material or copper and silver paste laminated material. 如請求項13所述之光源燈板,其中該光源燈板另包含一控制電路板,該控制電路板疊貼於該撓性電路基板下以經由該鍍銅層電連接於該複數個多色發光二極體,該控制電路板用來傳輸電性訊號至該複數個多色發光二極體以進行該複數個多色發光二極體之發光控制。 The light source lamp board according to claim 13, wherein the light source lamp board further includes a control circuit board, the control circuit board is laminated under the flexible circuit board to be electrically connected to the plurality of multi-colors through the copper plating layer A light-emitting diode, the control circuit board is used to transmit electrical signals to the plurality of multi-color light-emitting diodes to perform light-emission control of the plurality of multi-color light-emitting diodes. 如請求項13所述之光源燈板,其中每一多色發光二極體與該鍍銅層之間形成有一合金接著層。 The light source lamp panel according to claim 13, wherein an alloy adhesive layer is formed between each multi-color light-emitting diode and the copper plating layer. 如請求項23所述之光源燈板,其中該合金接著層係由錫鉍合金或錫銀銅合金材質所組成。 The light source lamp panel according to claim 23, wherein the alloy bonding layer is composed of tin-bismuth alloy or tin-silver-copper alloy material. 一種發光鍵盤,其包含:一底板;複數個按鍵,其設置於該底板上,每一按鍵包含:一鍵帽;以及一升降機構,其設置於該底板以及該鍵帽之間,該鍵帽經由該升降機構相對於該底板上下移動;以及一光源燈板,其設置於該底板與該複數個按鍵之間或設置於該底板下,該光源燈板包含:一撓性電路基板,其具有至少一第一通孔;複數個多色發光二極體,其分別對應該複數個按鍵,用來產生光線入射至該複數個鍵帽;一第一高導電線路層,其具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面;一第二高導電線路層,其具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面;一導電柱,其形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一;一高導電鍍層,其鍍附於該第一高導電線路層以及該第二高導電線路層上;以及一第一保護層,其塗佈於該高導電鍍層上且對應每一按鍵以及對應鍍附在該第一高導電線路層上之高導電鍍層的位置形成有一第二通孔, 每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一高導電線路層之高導電鍍層電連接至該些第一線路。 A light-emitting keyboard, comprising: a bottom plate; a plurality of keys arranged on the bottom plate, each key comprising: a key cap; and a lifting mechanism arranged between the bottom plate and the key cap, the key cap Moving up and down relative to the bottom plate via the lifting mechanism; and a light source lamp board disposed between the bottom plate and the plurality of buttons or under the bottom board, the light source lamp board includes: a flexible circuit board having At least one first through hole; a plurality of multi-color light-emitting diodes, which respectively correspond to a plurality of keys, for generating light incident on the plurality of key caps; a first highly conductive circuit layer, which has a plurality of first Circuit, the plurality of first circuits are formed on an upper surface of the flexible circuit substrate; a second highly conductive circuit layer having a plurality of second circuits, the plurality of second circuits formed on the flexible circuit substrate A lower surface; a conductive post formed in the at least one first through hole to electrically connect at least one of the first circuits and at least one of the second circuits; a highly conductive plating layer, which Plated on the first highly conductive circuit layer and the second highly conductive circuit layer; and a first protective layer coated on the highly conductive plating layer corresponding to each key and correspondingly plated on the first high A second through hole is formed at the position of the highly conductive plating layer on the conductive circuit layer, Each multi-color light emitting diode is electrically connected to the first circuits through a corresponding second through hole and through a highly conductive plating layer deposited on the first highly conductive circuit layer. 如請求項25所述之發光鍵盤,其中該光源燈板另包含:一第二保護層,其塗佈於該第一保護層以及每一多色發光二極體上。 The light-emitting keyboard according to claim 25, wherein the light source lamp board further comprises: a second protective layer coated on the first protective layer and each multi-color light-emitting diode. 如請求項25所述之發光鍵盤,其中該第一高導電線路層以及該第二高導電線路層係由銀漿或銅漿材質所組成,該高導電鍍層係由銅、銀或鎳材質所組成。 The illuminated keyboard according to claim 25, wherein the first highly conductive circuit layer and the second highly conductive circuit layer are composed of silver paste or copper paste material, and the highly conductive plating layer is composed of copper, silver or nickel material composition. 如請求項25所述之發光鍵盤,其中每一多色發光二極體與該高導電鍍層之間形成有一合金接著層。 The light-emitting keyboard according to claim 25, wherein an alloy bonding layer is formed between each multi-color light-emitting diode and the highly conductive plating layer. 如請求項28所述之發光鍵盤,其中該合金接著層係由錫鉍合金或錫銀銅合金材質所組成。 The luminous keyboard according to claim 28, wherein the alloy bonding layer is made of tin-bismuth alloy or tin-silver-copper alloy material. 如請求項28所述之發光鍵盤,其中每一合金接著層與該高導電鍍層之間形成有一第一導電抗氧化層。 The light-emitting keyboard according to claim 28, wherein a first conductive anti-oxidation layer is formed between each alloy bonding layer and the highly conductive plating layer. 如請求項30述之發光鍵盤,其中該第一導電抗氧化層係由鎳或金材質所組成。 The illuminated keyboard as recited in claim 30, wherein the first conductive anti-oxidation layer is composed of nickel or gold material. 如請求項30所述之發光鍵盤,其中每一合金接著層與該第一導電抗氧化層之間形成有一第二導電抗氧化層。 The light-emitting keyboard according to claim 30, wherein a second conductive anti-oxidation layer is formed between each alloy bonding layer and the first conductive anti-oxidation layer. 如請求項32所述之發光鍵盤,其中該第一導電抗氧化層係由鎳材質所組成,該第二導電抗氧化層係由金材質所組成。 The illuminated keyboard according to claim 32, wherein the first conductive antioxidant layer is composed of nickel material, and the second conductive antioxidant layer is composed of gold material. 一種光源燈板,其適用於提供光線至一鍵盤上之複數個按鍵,該光源燈板包含:一撓性電路基板,其具有至少一第一通孔;複數個多色發光二極體,其分別對應該複數個按鍵,用來產生光線入射至該複數個按鍵;一第一高導電線路層,其具有複數條第一線路,該複數條第一線路形成於該撓性電路基板之一上表面;一第二高導電線路層,其具有複數條第二線路,該複數條第二線路形成於該撓性電路基板之一下表面;一導電柱,其形成於該至少一第一通孔中以電性連接該些第一線路之至少其中之一以及該些第二線路之至少其中之一;一高導電鍍層,其鍍附於該第一高導電線路層以及該第二高導電線路層上;以及一第一保護層,其塗佈於該高導電鍍層上且對應每一按鍵以及對應鍍附在該第一高導電線路層上之高導電鍍層的位置形成有一第二通孔,每一多色發光二極體通過相對應之第二通孔且經由鍍附在該第一高導電線路層之高導電鍍層電連接至該些第一線路。 A light source lamp board suitable for providing light to a plurality of keys on a keyboard. The light source lamp board includes: a flexible circuit board having at least one first through hole; a plurality of multi-color light-emitting diodes, which Corresponding to a plurality of buttons, respectively, for generating light incident on the plurality of buttons; a first highly conductive circuit layer having a plurality of first circuits, the plurality of first circuits formed on one of the flexible circuit substrates A surface; a second highly conductive circuit layer having a plurality of second circuits formed on a lower surface of the flexible circuit substrate; a conductive post formed in the at least one first through hole Electrically connecting at least one of the first circuits and at least one of the second circuits; a highly conductive plating layer, which is attached to the first highly conductive circuit layer and the second highly conductive circuit layer And a first protective layer coated on the highly conductive plating layer and corresponding to each button and corresponding to the position of the highly conductive plating layer attached to the first highly conductive circuit layer is formed a second through hole, each A multi-color light emitting diode is electrically connected to the first circuits through a corresponding second through hole and through a highly conductive plating layer deposited on the first highly conductive circuit layer. 如請求項34所述之光源燈板,其另包含:一第二保護層,其塗佈於該第一保護層以及每一多色發光二極體上。 The light source lamp panel according to claim 34, further comprising: a second protective layer coated on the first protective layer and each multi-color light-emitting diode. 如請求項34所述之光源燈板,其中該第一高導電線路層以及該第二高導電線路層係由銀漿或銅漿材質所組成,該高導電鍍層係由銅、銀或鎳材質所組成。 The light source lamp panel according to claim 34, wherein the first highly conductive circuit layer and the second highly conductive circuit layer are composed of silver paste or copper paste material, and the highly conductive plating layer is composed of copper, silver or nickel material Formed by. 如請求項34所述之光源燈板,其中每一多色發光二極體與該高導電鍍層之間形成有一合金接著層。 The light source lamp panel according to claim 34, wherein an alloy bonding layer is formed between each multi-color light-emitting diode and the highly conductive plating layer. 如請求項37所述之光源燈板,其中該合金接著層係由錫鉍合金或錫銀銅合金材質所組成。 The light source lamp panel according to claim 37, wherein the alloy bonding layer is made of tin-bismuth alloy or tin-silver-copper alloy material. 如請求項37所述之光源燈板,其中每一合金接著層與該高導電鍍層之間形成有一第一導電抗氧化層。 The light source lamp panel according to claim 37, wherein a first conductive anti-oxidation layer is formed between each alloy bonding layer and the highly conductive plating layer. 如請求項39所述之光源燈板,其中該第一導電抗氧化層係由鎳或金材質所組成。 The light source lamp panel according to claim 39, wherein the first conductive anti-oxidation layer is composed of nickel or gold material. 如請求項39所述之光源燈板,其中每一合金接著層與該第一導電抗氧化層之間形成有一第二導電抗氧化層。 The light source lamp panel according to claim 39, wherein a second conductive antioxidant layer is formed between each alloy bonding layer and the first conductive antioxidant layer. 如請求項41所述之光源燈板,其中該第一導電抗氧化層係由鎳材質所組成,該第二導電抗氧化層係由金材質所組成。 The light source lamp panel according to claim 41, wherein the first conductive antioxidant layer is composed of nickel material, and the second conductive antioxidant layer is composed of gold material.
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