CN211068175U - Ultraviolet L ED lamp - Google Patents
Ultraviolet L ED lamp Download PDFInfo
- Publication number
- CN211068175U CN211068175U CN201920512566.0U CN201920512566U CN211068175U CN 211068175 U CN211068175 U CN 211068175U CN 201920512566 U CN201920512566 U CN 201920512566U CN 211068175 U CN211068175 U CN 211068175U
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- Prior art keywords
- base
- ultraviolet
- lamp
- ceramic substrate
- chip module
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- 241001465382 Physalis alkekengi Species 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims description 38
- 239000000758 substrate Substances 0.000 claims description 37
- 238000007789 sealing Methods 0.000 claims description 35
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 9
- 229910000838 Al alloy Inorganic materials 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 2
- 238000004026 adhesive bonding Methods 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 7
- 238000004659 sterilization and disinfection Methods 0.000 abstract description 5
- 230000032683 aging Effects 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 239000007769 metal material Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000003292 glue Substances 0.000 abstract description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 238000000746 purification Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 description 4
- 229910017083 AlN Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000000844 anti-bacterial effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000249 desinfective effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
Images
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to an ultraviolet L ED lamps and lanterns, it includes base, shell, lamp shade, ultraviolet L ED chip module, ultraviolet L ED chip module pass through solder or heat-conducting glue with the base is fixed, the base adopts the metal material, can cancel radiator and encapsulation mother board like this, shortens heat-conduction route, reduces the encapsulation volume, the shell with it is waterproof to adopt double-deck sealed rubber ring between the base, and sealed rubber ring position is less than ultraviolet L ED chip module prevents that the waterproof performance that the rubber ring is ageing to be leaded to from descending, and the base tail end adopts the helicitic texture, the utility model discloses whole lamps and lanterns structure is small and exquisite, and the heat dissipation is good, is convenient for use with other part cooperations, and the disinfection that disinfects is effectual, can be used to fields such as water purification, air conditioner.
Description
Technical Field
The utility model relates to a disinfection field, concretely relates to ultraviolet L ED lamps and lanterns.
Background
The ultraviolet L ED device is pollution-free, stable in wavelength, small in packaging volume and long in service life.
SUMMERY OF THE UTILITY MODEL
To the above defect of prior art or improve the demand, the utility model provides an ultraviolet L ED lamps and lanterns structure through shortening heat dissipation path, increases the chip life-span, reduces the encapsulation size, improves sealing performance, improves the exterior structure to enlarge ultraviolet L ED lamps and lanterns range of application.
The utility model discloses a solve the technical scheme that above-mentioned technical problem adopted and be:
an ultraviolet L ED lamp, ultraviolet L ED lamp includes base and L ED chip module, L ED chip module includes ultraviolet L ED chip and ceramic substrate, L ED chip module is fixed on the base.
Specifically, the base is a metal base.
Specifically, the metal is an aluminum alloy.
Specifically, the ultraviolet L ED chip is attached to the ceramic substrate, and the ceramic substrate is fixed on the base.
Specifically, the ceramic substrate and the base are fixed by welding with solder or by gluing with a heat-conducting adhesive.
Specifically, the ceramic substrate is an aluminum nitride ceramic substrate.
Specifically, the ultraviolet L ED lamp further comprises a lead, and the lead is connected with the positive electrode and the negative electrode on the ceramic substrate respectively.
Specifically, the base is provided with a through hole, the ceramic substrate is provided with a wiring hole, and the lead sequentially penetrates through the through hole in the base and the wiring hole in the ceramic substrate, and the positive electrode and the negative electrode on the ceramic substrate are respectively connected.
Specifically, ultraviolet L ED lamps and lanterns still include the shell, the shell with the base is connected, the shell with have the sealing washer between the base.
Specifically, the base is provided with an outer boss, one side of the head of the outer boss of the base is provided with an external thread, the shell is provided with a first inner boss and a second inner boss, an internal thread is arranged between the first inner boss and the second inner boss, and the shell is connected with the base through the external thread and the internal thread; the number of the sealing rings is at least two, and the at least two sealing rings are respectively arranged at the head end and the tail end of the external thread of the base; the head end of the external thread is one end close to the outer boss of the base, and the end far away from the outer boss is the tail end.
The first sealing ring is arranged at the head end of the external thread of the base and is in contact with the outer boss of the base and the first inner boss of the shell, the second sealing ring is arranged at the tail end of the external thread of the base and is in contact with the second inner boss of the shell, and the first sealing ring and the second sealing ring are positioned on the same side of the L ED chip module.
Specifically, the shell and the base are made of the same material.
Specifically, the ultraviolet L ED lamp further comprises a lampshade, and the lampshade penetrates through the second inner boss of the shell and is inserted into the annular groove of the base.
Specifically, the lampshade is made of quartz.
Specifically, the tail of the base adopts a threaded structure.
Specifically, the thickness of the copper layer on the surface of the ceramic substrate is not less than 50 um.
Specifically, the length, the width and the height of the lamp are all less than 40 mm.
Specifically, 1-4 ultraviolet L ED chips are mounted on each ultraviolet L ED chip module.
Compared with the prior art, the utility model discloses following beneficial effect has at least:
(1) the ultraviolet L ED chip module is fixed with the base through the solder or the heat conducting glue, the base is made of the aluminum alloy metal material, so that the base has the function of a radiator, the heat of the ultraviolet L ED chip module is quickly conducted to the base, the radiating path is shortened, the packaging volume is reduced, the whole lamp is small and exquisite in design, and the application requirement of a narrow space can be met;
(2) the ultraviolet L ED chip module consists of an ultraviolet L ED chip and an aluminum nitride ceramic substrate, wherein the ultraviolet chip adopts an ultraviolet L ED chip with the wavelength of 260-280 nm and the radiation power of 10-15mw, so that the sterilizing capability of the lamp is ensured, the heat dissipation path is a chip-aluminum nitride ceramic substrate-metal base, the heat dissipation path is short, the heat of the chip can be quickly conducted out, and the service life of the chip is prolonged;
(3) the shell and the base are of a threaded structure, a double sealing ring is additionally arranged in the middle, wherein the position of the rubber ring is lower than that of an ultraviolet L ED chip module, so that the rubber ring is prevented from aging and the waterproof performance is prevented from being reduced, and the problem of cavity sealing is solved;
(4) the tail end of the base is provided with threads, and the threads are designed according to the size of an external structural part, so that the mercury lamp can be replaced without changing the external structure.
Therefore, the ultraviolet L ED lamp of the utility model has the advantages of compact structure, good heat dissipation and excellent sealing performance, and can meet the requirements of sterilization and disinfection in narrow space.
Drawings
FIG. 1 is an exploded view of the structure of the present invention;
FIG. 2 is a schematic structural view of the present invention;
fig. 3-4 are schematic diagrams of L ED chip modules according to the present invention;
fig. 5 is a schematic view of the heat dissipation path of the present invention.
The LED light source comprises a lamp shade 1, a shell 2, a sealing ring 3, a chip module 4-L ED, a base 5, a lead 6 and a chip heat 7.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. Furthermore, the technical features mentioned in the embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
Fig. 1-2 show an ultraviolet L ED lamp, which includes a housing 1, a casing 2, a sealing ring 3, a L ED chip module 4, a base 5, and a lead 6.
The lampshade 1 is a lens and made of quartz, the quartz lampshade 1 penetrates through the shell 2, the shell 2 is in threaded connection with the base 5, the L ED chip module 4 is fixedly welded with the base 5 through welding flux or fixedly glued through heat-conducting glue, the tail part of the base 5 is in a threaded structure and is provided with standard external threads 55, and the standard external threads are conveniently in threaded connection with external structural components.
Two sealing rings 3 are arranged between the shell 2 and the base 5, so that the sealing rings can be prevented from aging, the sealing performance is lost, and the waterproof and dustproof performance is reduced.
L ED chip module 4 is shown in fig. 3-4. L ED chip module 4 includes ultraviolet L ED chip 41 and aluminum nitride ceramic substrate 42, and ultraviolet L ED chip 41 adopts flip-chip bonding technique to fix on aluminum nitride ceramic substrate 42, and ultraviolet L ED chip 41 wavelength is 280nm, and radiant power is 12mw, and aluminum nitride ceramic substrate 42 copper layer 422 thickness is 55um, and the thermal conductivity is 180W/(m.K), has guaranteed the bactericidal ability of lamps and lanterns.
The aluminum nitride ceramic substrate 42 is provided with two wiring holes 421, two wires 6 respectively penetrate through the wiring holes 421 and are respectively welded with the positive and negative electrodes 401 and 402 of the copper layer 422 on the aluminum nitride ceramic substrate 42, and the wires 6 and the aluminum nitride ceramic substrate 42 are welded by adopting a soldering process.
Ultraviolet L ED chip 41 is fixed on base 5 by aluminium nitride ceramic substrate 42 through the solder welding, the welding temperature is lower than the flip-chip bonding temperature of chip, base 5 adopts metal material figure 5, as shown in figure 5, the material of base 5 is aluminium alloy in this embodiment, base 5 has the function of radiator like this, make the chip heat 7 that produces pass through aluminium nitride ceramic substrate 42 from ultraviolet L ED chip 41 and directly transmit to base 5, shell 2 and base 5 adopt the same material, make base 5 some heat dissipate to the environment through shell 2, like air and water etc..
Specifically, the base 5 has two through holes 51, and two wires sequentially pass through the through holes 51 on the base and the wiring holes 421 on the ceramic substrate to be connected to the positive electrode and the negative electrode on the ceramic substrate, respectively.
The base 5 is provided with an outer boss 52, an external thread 54 is arranged on one side of the head of the outer boss of the base, the shell 2 is provided with a first inner boss 21 and a second inner boss 22, an internal thread corresponding to the external thread 54 of the base is arranged between the first inner boss and the second inner boss, and the shell is connected with the base through the external thread and the internal thread.
The seal ring 3 includes a first seal ring 31 and a second seal ring 32. The first sealing ring 31 is arranged at the head end of the external thread 54 of the base and is contacted with the external boss of the base and the first internal boss of the shell. The second seal ring 32 is disposed at the rear end of the base external thread 54 and contacts the second inner ledge of the housing. The head end of the external thread is one end close to the outer boss of the base, and the end far away from the outer boss is the tail end of the external thread.
The first sealing ring and the second sealing ring are positioned on the same side of the L ED chip module, the sealing ring 3 is positioned at the reserved position of the shell 2, and the height of the reserved position is lower than that of the ultraviolet L ED chip module 4, so that the sealing rubber ring can be effectively prevented from aging, the sealing performance is prevented from losing, and the waterproof and dustproof performance is prevented from being reduced.
The base 5 has an annular groove 53 therein, and the lamp housing 1 passes through the second inner boss 22 of the housing 2 and is inserted into the annular groove 53 of the base. The lamp housing 1 is in contact with the second sealing ring 32 to form a seal.
Because the base 5 is made of metal materials such as aluminum alloy and the like, a radiator and an encapsulation mother board are omitted, so that the whole lamp is small in structure, and in the embodiment, the length, the width and the height of the lamp are smaller than 40 mm.
The utility model discloses lamps and lanterns are small and exquisite, and the heat dissipation is good, and sealing performance is good, can satisfy the disinfection demand of disinfecting in narrow and small space, can replace the disinfection lamps and lanterns of submergence in aqueous.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention to the particular forms disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the appended claims.
Claims (19)
1. An ultraviolet L ED lamp is characterized in that the ultraviolet L ED lamp comprises a base and a L ED chip module, the L ED chip module comprises an ultraviolet L ED chip and a ceramic substrate, and the L ED chip module is fixed on the base;
the ultraviolet L ED lamp further comprises a shell, the shell is connected with the base, and a sealing ring is arranged between the shell and the base;
the ultraviolet L ED lamps and lanterns still include the lamp shade, the lamp shade contacts with the sealing washer, forms sealedly.
2. The ultraviolet L ED lamp set forth in claim 1, wherein the base is a metal base.
3. The ultraviolet L ED lamp set forth in claim 2, wherein the metal is an aluminum alloy.
4. The UV L ED lamp of any one of claims 1-3, wherein the UV L ED chip is mounted on the ceramic substrate, and the ceramic substrate is fixed on the base.
5. The ultraviolet L ED lamp set forth in claim 4, wherein the ceramic substrate and the base are fixed by soldering or gluing with a thermally conductive adhesive.
6. The ultraviolet L ED lamp set forth in claim 4, wherein the ceramic substrate is an aluminum nitride ceramic substrate.
7. The UV L ED lamp of claim 1, wherein the UV L ED lamp further comprises conducting wires connected to the positive and negative electrodes of the ceramic substrate, respectively.
8. The ultraviolet L ED lamp set forth in claim 7, wherein the base has through holes, the ceramic substrate has wiring holes, and the leads are sequentially connected to the positive and negative electrodes of the ceramic substrate through the through holes of the base and the wiring holes of the ceramic substrate.
9. The ultraviolet L ED lamp as set forth in claim 1, wherein the base has an outer boss, an outer thread is provided on one side of a head portion of the outer boss, the housing has a first inner boss and a second inner boss, an inner thread is provided between the first inner boss and the second inner boss, the housing is connected to the base through the outer thread and the inner thread, the number of the sealing rings is at least two, the at least two sealing rings are respectively disposed at a head end and a tail end of the outer thread of the base, the head end of the outer thread is an end close to the outer boss of the base, and the end far from the outer boss is a tail end.
10. The ultraviolet L ED lamp of claim 9, wherein the sealing rings comprise a first sealing ring and a second sealing ring, the first sealing ring is disposed at a head end of the base external thread and contacts with an outer boss of the base and a first inner boss of the housing, the second sealing ring is disposed at a tail end of the base external thread and contacts with a second inner boss of the housing, and the first sealing ring and the second sealing ring are on a same side of the L ED chip module.
11. The ultraviolet L ED lamp of any one of claims 9-10, wherein the housing and the base are made of the same material.
12. The ultraviolet L ED lamp of any one of claims 9-10, wherein the bezel passes through the second inner ledge of the housing and is inserted into the annular recess of the base.
13. The ultraviolet L ED lamp set forth in claim 12, wherein the lampshade is in contact with a gasket disposed at the end of the external threads of the base.
14. The ultraviolet L ED lamp of claim 13, wherein the lampshade is made of quartz.
15. The ultraviolet L ED lamp set forth in claim 1, wherein the base has a threaded rear portion.
16. The UV L ED lamp set forth in claim 1, wherein the ceramic substrate surface copper layer thickness is not less than 50 μm.
17. The ultraviolet L ED lamp set forth in claim 1, wherein the lamps have a length, width and height of less than 40 mm.
18. The UV L ED lamp of claim 4, wherein each UV L ED chip module mounts 1-4 UV L ED chips.
19. An ultraviolet L ED lamp is characterized in that the ultraviolet L ED lamp comprises a base and a L ED chip module, the L ED chip module comprises an ultraviolet L ED chip and a ceramic substrate, and the L ED chip module is fixed on the base;
the ultraviolet L ED lamps and lanterns still include the wire, the through-hole has on the base, the wiring hole has on the ceramic substrate, the wire passes in proper order through-hole on the base with wiring hole on the ceramic substrate with positive negative pole on the ceramic substrate is connected respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920512566.0U CN211068175U (en) | 2019-04-16 | 2019-04-16 | Ultraviolet L ED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920512566.0U CN211068175U (en) | 2019-04-16 | 2019-04-16 | Ultraviolet L ED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211068175U true CN211068175U (en) | 2020-07-24 |
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ID=71620617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920512566.0U Active CN211068175U (en) | 2019-04-16 | 2019-04-16 | Ultraviolet L ED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211068175U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864033A (en) * | 2020-08-17 | 2020-10-30 | 深圳市华而美电子有限公司 | Deep ultraviolet LED encapsulation module |
-
2019
- 2019-04-16 CN CN201920512566.0U patent/CN211068175U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111864033A (en) * | 2020-08-17 | 2020-10-30 | 深圳市华而美电子有限公司 | Deep ultraviolet LED encapsulation module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Ultraviolet LED lamp Effective date of registration: 20220317 Granted publication date: 20200724 Pledgee: Bank of China Limited Wuhan provincial branch Pledgor: WUHAN LIZHIDA TECHNOLOGY CO.,LTD. Registration number: Y2022420000066 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20200724 Pledgee: Bank of China Limited Wuhan provincial branch Pledgor: WUHAN LIZHIDA TECHNOLOGY CO.,LTD. Registration number: Y2022420000066 |