CN216868219U - Blue light-to-white light laser - Google Patents

Abstract

The utility model relates to a technical field of light source and illumination especially relates to a blue light changes white light laser instrument, including the heat dissipation shell, heat dissipation shell internally mounted has laser diode, and the mounting hole that is used for the light-emitting is offered to the exit end of heat dissipation shell, installs in the mounting hole to be used for turning into the fluorescence piece of compound light with laser, and is fixed through the heat conduction adhesive between the inner wall of fluorescence piece and mounting hole. The heat that the fluorescence membrane produced at laser conversion composite light in-process, it is outside to conduct the blue light through better and printing opacity base plate of heat conduction effect, heat conduction adhesive and heat dissipation shell and change white light laser instrument, forms the heat transfer passageway of a low thermal resistance, and then has realized the heat dissipation of fluorescence piece. Compared with the related technology, the thermal resistance of the heat conduction channel is lower, and the problem of thermal bottleneck of the heat conduction channel is better solved. Under equal drive power, the temperature of the fluorescent sheet is lower, the probability of saturation and quenching of fluorescent powder can be effectively reduced, and the working power of the blue-to-white laser is improved.

Description

Blue light-to-white light laser

Technical Field

The application relates to the technical field of light sources and illumination, in particular to a blue light-to-white light laser.

Background

Visible light laser illumination including blue light excitation fluorescent powder realizes white light illumination, and the laser illumination is widely applied to the fields of automobile illumination, flashlight illumination, stage illumination, industrial illumination and the like.

In some related technologies, the laser lighting device includes a heat dissipation housing, a laser diode and a support with an optical component are sequentially installed in the heat dissipation housing along a light exit direction, a laser chip is installed in the laser diode, and the laser chip emits laser light which is converted into white light for lighting after passing through the optical component. Since the holder with the optical component and the heat dissipating case are not integrally provided, heat generated from the optical component is not easily transferred to the heat dissipating case, thereby causing a thermal bottleneck at the contact surface between the holder and the heat dissipating case. The structure enables heat generated when the fluorescent sheet performs light color conversion to be not effectively transmitted to the outside of the heat dissipation shell, so that the fluorescent sheet is overheated, saturated and quenched and is ineffective. The heat generated by the laser diode during operation cannot be effectively transmitted to the outside of the heat dissipation shell, so that the temperature inside the heat dissipation shell is too high, and the luminous efficiency is reduced.

In view of the above-mentioned related art, in high-power laser lighting, especially a laser light source device for converting blue light into white light has a problem of low thermal state light efficiency.

SUMMERY OF THE UTILITY MODEL

In order to promote the hot light efficiency of laser instrument, this application provides a blue light changes white light laser instrument.

In a first aspect, the present application provides a blue-to-white laser that adopts the following technical solution:

the utility model provides a blue light changes white light laser instrument, includes the heat dissipation shell, heat dissipation shell internally mounted has the laser diode who is used for the outgoing laser, the mounting hole that is used for the light-emitting is offered to the outgoing end of heat dissipation shell, install in the mounting hole and be used for turning into the fluorescence piece of compound light with laser, the fluorescence piece bonds fixedly with the inner wall of mounting hole.

Through adopting above-mentioned technical scheme, the heat dissipation shell has the heat conduction effect, laser jets out from laser diode, when the fluorescence piece, phosphor powder in the fluorescence piece absorbs laser and arouses compound light, the heat that this process produced will transmit to the mounting hole inner wall, because the mounting hole inner wall is the partly of heat dissipation shell, consequently the heat can transmit to the heat dissipation shell smoothly, the problem of heat bottleneck between support and the heat dissipation shell among the correlation technique has been improved, the inside heat of heat dissipation shell has been reduced effectively, and then the hot light efficiency of laser light source device has been promoted.

Optionally, the fluorescent sheet and the inner wall of the mounting hole are fixed by sintered silver bonding.

Through adopting above-mentioned technical scheme, the coefficient of heat conductivity of sintering silver is about 130w/m.k, and coefficient of heat conductivity is higher, therefore sintering silver is filled and can be reduced the clearance thermal resistance between fluorescence piece and the mounting hole inner wall, promotes the heat conductivility between fluorescence piece and the mounting hole inner wall, and then has promoted the heat transfer effect of heat dissipation shell and fluorescence piece.

Optionally, the fluorescent sheet includes a transparent substrate for heat conduction and a fluorescent film for converting laser light into composite light, and the fluorescent film is attached to one side of the transparent substrate.

By adopting the technical scheme, the light-transmitting substrate has the light-transmitting function on one hand, and light can smoothly pass through the light-transmitting substrate; on the other hand, the heat conducting device has the function of heat conduction, and can conduct away part of heat generated by the fluorescent film, so that the heat of the fluorescent film is reduced, and the service life of the fluorescent powder in the fluorescent film is prolonged.

Optionally, heat dissipation textures are arranged on the outer periphery of the heat dissipation shell;

and/or, the mounting hole includes fluorescence hole, diaphragm hole and white light lens hole along the light-emitting direction in proper order, fluorescence piece installs in fluorescence downthehole, the downthehole diaphragm piece that installs of diaphragm, the downthehole compound light focusing lens that installs of white light lens.

By adopting the technical scheme, the surface area of the periphery of the radiating shell is increased by the radiating texture, and the radiating effect of the radiating shell is improved;

the diaphragm can shield the unwanted yellow light at the peripheral part of the light beam of the composite light converted by the fluorescent sheet, so that the emergent composite light is white light; the composite light focusing lens can firstly focus the composite light in the lambertian wave shape into light with a certain beam angle, and provides convenience for further polymerizing the white light into parallel light.

In a second aspect, the present application provides a blue-to-white laser, which adopts the following technical scheme:

optionally, the laser diode includes a tube body, one end of the tube body is provided with a laser emission window for emitting laser, the other end of the tube body is provided with a heat dissipation base, and one side of the heat dissipation base facing the inside of the tube body is provided with a laser chip for generating laser;

the radiating base plate is installed at the transmitting end of the radiating shell, and the radiating base plate are fixedly welded.

Through adopting above-mentioned technical scheme, can produce more heat when laser chip produces the laser, the heat can transmit to the heat dissipation bottom plate through the heat dissipation base, and the heat conduction solder flux between heat dissipation base and the heat dissipation bottom plate can further promote the efficiency of heat transfer again, has promoted the radiating effect of laser chip.

Optionally, the heat dissipation base and the heat dissipation bottom plate are welded and fixed through heat conduction soldering tin.

By adopting the technical scheme, the heat conductivity coefficient of the heat-conducting soldering tin is more than 50w/m.k, so that the heat-conducting soldering tin has a better heat transfer effect.

Optionally, a threaded opening is formed in the transmitting end of the heat dissipation shell, a threaded ring is arranged on the peripheral edge of the heat dissipation bottom plate, and the threaded opening is in threaded fit with the threaded ring.

Through adopting above-mentioned technical scheme, threaded connection between screw thread mouth and the fillet of screw can increase the area of contact between heat dissipation shell and the heat dissipation bottom plate, and then has strengthened thermal transmission effect for the heat that laser chip produced can transmit to the heat dissipation shell comparatively smoothly, has promoted laser chip's hot light efficiency.

Optionally, a gap between the thread opening and the thread ring is filled with a heat-conducting glue.

By adopting the technical scheme, the heat conductivity coefficient of the heat conducting glue is more than 4w/m.k, so that a heat transfer channel with low thermal resistance is formed between the heat dissipation shell and the heat dissipation bottom plate, and the heat of the laser chip can be effectively transferred to the heat dissipation shell through the heat dissipation base.

Optionally, the heat dissipation housing is any one of copper, aluminum, brass or graphite.

Through adopting above-mentioned technical scheme, the better material of heat conduction is selected for use to the heat dissipation shell, and the inside heat transfer of the shell that dispels the heat of being convenient for helps reducing the inside heat of heat dissipation shell.

Optionally, a collimating lens is installed at a laser exit window of the laser diode;

and/or a diffusion sheet support is further installed in the heat dissipation shell, the diffusion sheet support is located between the laser diode and the installation hole, a laser lens hole and a light diffusion hole are sequentially formed in the diffusion sheet support along the light emergent direction, a laser focusing lens used for focusing laser is installed in the laser lens hole, and a light diffusion sheet is installed in the light diffusion hole.

By adopting the technical scheme, the collimating lens can collimate the elliptic conical laser beam into parallel light parallel to the light emergent direction;

the laser focusing lens can further focus the laser to a focal point; the light diffusion sheet can diffuse and expand light spots of a laser focus to a required size, the light intensity distribution on the cross section of a laser beam is more uniform, and damage caused by overhigh single-point laser light intensity of the fluorescent sheet due to nonuniform laser light spots is avoided as much as possible.

In summary, the present application includes at least one of the following beneficial technical effects:

the heat generated by the fluorescent film in the process of converting laser into white light can be conducted through the light-transmitting substrate; the fluorescent sheet and the inner wall of the mounting hole are fixed through sintered silver, the sintered silver has good heat conductivity, and the problem of thermal bottleneck can be further improved;

the bracket for mounting the fluorescent sheet of the optical component is separated from the heat dissipation shell, and the bracket for mounting the fluorescent sheet is integrated on the heat dissipation shell, so that heat transfer is smoother, and the problem of thermal bottleneck is solved;

the laser diode is provided with a heat dissipation base, and the heat dissipation base and a heat dissipation bottom plate of the heat dissipation device are fixed through heat conduction soldering tin, so that on one hand, the heat dissipation base can increase the contact surface between the laser diode and the heat dissipation bottom plate, and on the other hand, the heat conduction solder paste can reduce the gap between the heat dissipation base and the heat dissipation bottom plate, and the heat conduction effect is improved;

the threaded connection between the radiating shell and the radiating bottom plate can increase the contact area between the radiating shell and the radiating bottom plate, thereby further reducing the thermal state working temperature of the laser chip and improving the light efficiency;

gaps in the threaded connection between the heat dissipation shell and the heat dissipation base plate are filled with the high-thermal-conductivity colloid, and therefore thermal resistance of the heat dissipation shell and the heat dissipation base plate is further reduced.

Drawings

Fig. 1 is a sectional view of a related art laser illumination device.

Fig. 2 is a schematic structural diagram of a heat dissipation housing of a blue-to-white laser according to an embodiment of the present application.

Fig. 3 is a sectional view taken along line a-a of fig. 2 to show the optical path.

Fig. 4 is a sectional view taken along line a-a of fig. 2 for illustrating heat dissipation.

Fig. 5 is a partially enlarged view of B in fig. 4.

FIG. 6 is an exploded view of a heat-dissipating housing with a phosphor plate, a diaphragm plate, and a compound light focusing lens according to one embodiment of the present application.

Fig. 7 is a partial enlarged view of C in fig. 4.

Fig. 8 is an exploded view of a heat sink housing and heat sink base, a diffuser bracket, and a laser diode according to an embodiment of the present application.

Fig. 9 is a partial enlarged view of D in fig. 4.

Description of reference numerals:

01. a fluorescent support; 013. a phosphor; 0211. a laser base;

1. a heat dissipation housing; 101. mounting holes; 1011. a light through hole; 1012. a fluorescent well; 1013. an annular support surface; 1014. a diaphragm aperture; 1015. a white light lens aperture; 102. a threaded opening; 103. heat dissipation textures;

11. a heat dissipation base plate; 111. a thread ring; 112. a circular groove; 113. heat conducting glue; 12. a circuit board;

13. a fluorescent sheet; 131. a light-transmitting substrate; 132. a fluorescent film; 14. a thermally conductive adhesive;

15. a diaphragm; 151. a light filtering hole; 16. a composite light focusing lens;

2. a laser diode; 21. a pipe body; 211. a laser exit window; 22. a laser chip;

23. a heat dissipation base; 231. a positive electrode pin; 232. a negative electrode pin;

24. a collimating lens; 25. a thermally conductive flux;

3. a diffusion sheet support; 301. a laser lens aperture; 302. a light diffusing aperture;

31. a laser focusing lens; 32. a light diffusion sheet.

Detailed Description

The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the accompanying drawings 1 to 7 in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application. It is to be understood that the drawings are provided solely for the purposes of reference and illustration and are not intended as a definition of the limits of the utility model. The connection relationships shown in the drawings are for clarity of description only and do not limit the manner of connection.

Referring to fig. 1, a laser lighting device in the related art includes a heat dissipation housing 1, and a laser diode 2, a diffusion sheet support 3, and a fluorescent support 01 are sequentially installed in the heat dissipation housing 1 along a light exit direction; a light diffusion hole 302 is arranged along the axial direction of the diffusion sheet support 3, and a light diffusion sheet 32 is arranged in the light diffusion hole 302; a fluorescent hole 1012 is formed in the axial direction of the fluorescent bracket 01, a fluorescent body 013 is installed in the fluorescent hole 1012, and fluorescent powder which can be excited by laser to generate composite light is contained in the fluorescent body 013; the laser light is emitted from the laser diode 2, passes through the light diffusion sheet 32, and reaches the phosphor 013.

Referring to fig. 1, the laser diode 2 includes a cylindrical tube 21, a laser emission window 211 for emitting laser is disposed at one end of the tube 21, a laser base 0211 is disposed at the other end of the tube 21, and a laser chip 22 is mounted on a side surface of the laser base 0211 facing the inside of the tube 21. In the related art, the peripheral side of the laser base 0211 in the laser diode 2 and the inner side wall of the mounting cavity in the heat dissipation case 1 are fixed by an adhesive. The heat generated by the laser chip 22 during operation is transferred to the inner side wall of the heat dissipation housing 1 through the peripheral side of the laser base 0211, but because the contact surface between the laser base 0211 and the heat dissipation housing 1 is limited and the thermal conductivity of the adhesive is low, a thermal bottleneck is generated at the contact surface between the laser base 0211 and the heat dissipation housing 1, and the thermal resistance from the laser chip 22 to the heat dissipation housing 1 is increased; when the driving power is increased, the heat generated by the laser chip 22 cannot be effectively transferred to the outside of the heat dissipation housing 1, so that the temperature of the laser chip 22 is too high, and the problems of low thermal state light efficiency, low light emitting efficiency and the like of the laser chip 22 occur.

Referring to fig. 1, the phosphor 013 is fixed to the inner wall of the fluorescent hole 1012 by an adhesive. The laser light passes through the light diffusion sheet 32 and is then irradiated to the phosphor 013, and at this time, most of the laser light is absorbed by the phosphor 013 and converted into composite light. Since the thermal conductivity of the adhesive is low, a thermal bottleneck is also generated at the contact surface between the phosphor 013 and the phosphor holder 01, so that the thermal resistance from the phosphor 013 to the heat dissipation case 1 increases, and the heat generated from the phosphor is not easily dissipated smoothly, thereby quenching the phosphor and lowering the light emission efficiency.

In view of the above problems, the related art generally has a problem of low lumen value or luminous efficiency.

The embodiment of the application discloses blue light changes white light laser instrument can improve the radiating effect of laser light source device, promotes luminous efficacy, can also play the effect that promotes the lumen value of laser light source device.

Referring to fig. 2 and 3, a blue-to-white laser includes a heat dissipation housing 1, in this embodiment, the heat dissipation housing 1 is a cylinder with a hollow interior. Two ends of the heat dissipation shell 1 opposite to each other along the axial direction are respectively an emitting end and an emergent end, and the direction from the emitting end to the emergent end is the emergent direction. The emitting end of the heat dissipation shell 1 is provided with an opening, the emergent end of the heat dissipation shell 1 is provided with a mounting hole 101, and the opening is communicated with the mounting hole 101. The laser diode 2 is installed in the heat dissipation casing 1, and the fluorescent sheet 13 is installed in the installation hole 101. The laser diode 2 can emit laser light when it is operated, the laser light advances along the axial direction of the heat dissipation housing 1 and then reaches the phosphor 013, and excites phosphors in the phosphor 013 to emit light. Atoms of the fluorescent powder are transited from a ground state to an excited state after absorbing laser, so that photoluminescence is realized, photons are released, and composite light is generated. In this process, since the phosphor converts part of the laser energy into heat, the phosphor sheet 13 needs to be dissipated in time.

Referring to fig. 1 and 3, in the present embodiment, heat generated by the fluorescent sheet 13 can be transmitted to the entire heat dissipation housing 1 through the inner wall of the mounting hole 101. Compared with the separation arrangement of the fluorescent bracket 01 and the heat dissipation shell 1 in the related art, the fluorescent sheet 13 in the embodiment of the application is directly installed on the heat dissipation shell 1, the heat conduction process is smoother, and therefore the heat conduction efficiency of the fluorescent sheet 13 is improved. Under the same driving power, the temperature of the fluorescent sheet 13 is lower, so that the saturation and quenching of the fluorescent powder can be effectively reduced, and the luminous efficiency of the blue-to-white laser is improved.

Referring to fig. 4 and 5, further, the fluorescent sheet 13 includes a transparent substrate 131 and a fluorescent film 132, the fluorescent film 132 is attached to one side of the transparent substrate 131, and the fluorescent film 132 may be attached to one side of the transparent substrate 131 facing the emission end or one side of the transparent substrate 131 facing away from the emission end. The phosphor is located in the phosphor film 132, and the transparent substrate 131 has an effect of supporting the phosphor film 132, and meanwhile, the heat of the phosphor in the phosphor film 132 can be transferred to the transparent substrate 131, thereby reducing the heat accumulation on the phosphor film 132. Further, the thermal conductivity of the transparent substrate 131 is not lower than 23w/m.k, so that the heat conduction efficiency of the phosphor film 132 can be improved, and the heat dissipation performance of the phosphor sheet 13 is better.

Referring to fig. 5 and 6, in the present embodiment, the mounting hole 101 includes a light-passing hole 1011 and a fluorescent hole 1012 coaxially disposed, the light-passing hole 1011 is closer to the emission end, the fluorescent hole 1012 is closer to the emission end, and the aperture of the light-passing hole 1011 is smaller than the diameter of the fluorescent hole 1012, so that the peripheral edge of the connection between the fluorescent hole 1012 and the light-passing hole 1011 forms an annular support surface 1013. In the present embodiment, the transparent substrate 131 faces the emission end and abuts against the annular support surface 1013, and the fluorescent film 132 faces away from the emission end. With this configuration, since the thermal conductivity of the transparent substrate 131 is higher than that of the phosphor film 132, the heat can be transferred to the annular support surface 1013 at the transparent substrate 131 more quickly, thereby improving the heat dissipation efficiency of the phosphor sheet 13.

Referring to fig. 4 and 5, further, the gap between the transparent substrate 131 and the heat dissipation housing 1 may be partially or completely filled with the heat conductive adhesive 14. Specifically, a side surface of the light-transmitting substrate 131 facing the emission end and the annular support surface 1013 are fixed by the heat-conductive adhesive 14, and a peripheral side of the light-transmitting substrate 131 and an inner sidewall of the fluorescent hole 1012 are also fixed by the heat-conductive adhesive 14. So set up, strengthened the firmness of being connected between fluorescence piece 13 and the heat dissipation shell 1 on the one hand, on the other hand has reduced the clearance between fluorescence piece 13 and the fluorescence hole 1012 inner wall, has improved the problem of the junction heat bottleneck of fluorescence piece 13 and fluorescence hole 1012 inner wall. Further, the thermally conductive adhesive 14 is sintered silver. The heat conductivity coefficient of the sintered silver is more than 130w/m.k, even can reach 170w/m.k, so that the heat transfer effect of the heat dissipation shell 1 and the fluorescent sheet 13 is improved, and the heat dissipation efficiency of the fluorescent sheet 13 is further improved.

Referring to fig. 6, the heat dissipating texture 103 is disposed on the outer periphery of the heat dissipating housing 1, and the heat dissipating texture 103 may be linear, or may be a three-dimensional wave shape, or a radial heat dissipating fin. In this embodiment, the heat dissipation texture 103 is a heat dissipation thread, and the heat dissipation thread is arranged along the circumferential direction of the heat dissipation housing 1, so that the contact surface between the heat dissipation housing 1 and the outside is increased. The heat generated from the fluorescent sheet 13 can be transferred to the heat-dissipating housing 1, and the heat transfer and diffusion of the heat-dissipating housing 1 can be solved by an external heat-dissipating structure connected to the heat-dissipating housing 1.

Referring to fig. 7 and 8, in order to improve the heat dissipation efficiency of the laser diode 2, a heat dissipation base plate 11 is installed at the opening of the heat dissipation housing 1. The heat dissipation bottom plate 11 and the opening of the heat dissipation housing 1 can be fixed by means of snap connection, abutting connection or threaded connection. In this embodiment, the circumference of the heat dissipation base plate 11 is provided with a threaded ring 111, the emitting end of the heat dissipation housing 1 is provided with a threaded opening 102 at the opening, and the threaded ring 111 is in threaded fit with the threaded opening 102, so that the heat dissipation base plate 11 and the heat dissipation housing 1 are connected relatively tightly, the contact area between the heat dissipation housing 1 and the heat dissipation base plate 11 is increased, and heat exchange between the heat dissipation housing 1 and the heat dissipation base plate 11 is facilitated.

Referring to fig. 8, in one embodiment, the screw port 102 of the heat-radiating case 1 may be an internal screw provided on an inner wall of the opening, and correspondingly, the screw ring 111 is an external screw provided on an outer circumferential side of the heat-radiating base plate 11. In another embodiment, the threaded opening 102 of the heat dissipation housing 1 may also be an external thread (not shown in the drawings), and the periphery of the heat dissipation base plate 11 is provided with a circle of internal threaded edges, so that the heat dissipation housing 1 and the heat dissipation base plate 11 are in threaded fit.

Further, the heat dissipation housing 1 is made of a material with a high thermal conductivity, including but not limited to copper, aluminum, brass, or graphite. In the present embodiment, the heat dissipation housing 1 is made of copper. Likewise, the heat sink base plate 11 may be made of copper. The copper has a thermal conductivity of 400w/m.k or more, and has excellent heat dissipation performance.

Referring to fig. 7, a gap between the joint or the abutment between the heat-dissipating base plate 11 and the heat-dissipating housing 1 is filled with a thermally conductive adhesive 113. In the present application, a thermal conductive paste 113 is filled between the screw mouth 102 and the screw ring 111. The heat conductive adhesive 113 is a silica gel formed by mixing polymer materials such as filler, heat conductive flux 25 and the like, and has good heat conductive and electrical insulation properties. The thermal conductivity of the thermal conductive adhesive 113 is about 4w/m.k, and the thermal conductive adhesive 113 has a better thermal conductive effect compared with an air medium.

Referring to fig. 3 and 8, the laser diode 2 includes a tube 21, one end of the tube 21 is provided with a laser exit window 211, and a collimating lens 24 is installed at the laser exit window 211 of the laser diode 2; the other end of the tube body 21 is provided with a heat dissipation base 23, the heat dissipation base 23 is integrally connected with the tube body 21, one side of the heat dissipation base 23 facing the inside of the tube body 21 is provided with a laser chip 22, and the heat dissipation base 23 and the heat dissipation bottom plate 11 are welded and fixed through a heat conduction welding flux 25. A positive pin 231 and a negative pin 232 are arranged on one side surface of the heat dissipation base 23, which is far away from the laser chip 22; correspondingly, set up the perforation that supplies anodal pin 231 and negative pole pin 232 to wear out on the radiating bottom plate 11, radiating bottom plate 11 deviates from one side of radiating base 23 and has seted up circular slot 112, installs circuit board 12 in the circular slot 112, and anodal pin 231 and negative pole pin 232 wear out the perforation to weld with circuit board 12. The laser generated by the laser chip 22 is in an elliptical cone shape and advances along the light exit direction, and after passing through the collimating lens 24 at the laser exit window 211, the laser can be collimated into a laser with a transmission direction substantially parallel to the light exit direction.

Referring to fig. 7, the heat dissipation area of the laser chip 22 is increased by the arrangement of the heat dissipation base 23, and because the laser chip 22 is installed on the heat dissipation base 23, a large amount of heat generated by the laser chip 22 in the work can be timely transmitted to the heat dissipation base 23 and then transmitted to the heat dissipation bottom plate 11, and the heat of the heat dissipation bottom plate 11 is transmitted to the heat dissipation shell 1, so that the heat dissipation effect of the laser chip 22 is greatly improved.

Furthermore, the heat-conducting flux 25 can be heat-conducting solder, and the heat-conducting solder has a heat conductivity coefficient of more than 50w/m.k and has better heat-conducting property. The heat conducting soldering tin can connect the heat dissipation base 23 with the heat dissipation bottom plate 11, so that the air gap between the heat dissipation base 23 and the heat dissipation bottom plate 11 is reduced, the heat conduction effect of the laser chip 22 is improved, and the heat dissipation efficiency of the laser diode 2 is further improved.

Referring to fig. 3 and 4, when the driving power of the blue-to-white laser is increased, the working power of the laser chip 22 is increased, and the generated laser power is increased, compared with the related art, the working temperature of the laser chip 22 according to the embodiment of the present disclosure is lower, so that the thermal state light efficiency of the laser chip 22 is higher, and the light emitting efficiency is also higher.

Referring to fig. 8 and 9, diffuser holder 3 is further mounted between laser diode 2 and mounting hole 101 in heat dissipation case 1. The diffusion sheet holder 3 is cylindrical, and the outer peripheral side of the diffusion sheet holder 3 is fixed to the inner wall of the heat dissipation case 1 with an adhesive. The diffusion sheet holder 3 is provided with a laser lens hole 301 and a light diffusion hole 302 in the light outgoing direction in sequence, the laser lens hole 301 is provided with a laser focusing lens 31, and the light diffusion sheet 32 is provided in the light diffusion hole 302. The laser light from the laser exit window 211 advances in the light exit direction, passes through the laser focusing lens 31 and the light diffusion sheet 32 in sequence, passes through the light passing hole 1011, and is irradiated to the fluorescent sheet 13. The laser focusing lens 31 can focus the laser light, and the light diffusion sheet 32 can make the light intensity distribution of the laser light more uniform.

Referring to fig. 5 and 6, the mounting hole 101 further includes a diaphragm hole 1014 and a white light lens hole 1015, and the fluorescence hole 1012 is located on a side of the diaphragm hole 1014 near the emission end; the aperture of the diaphragm hole 1014 is larger than that of the fluorescent hole 1012, the diaphragm sheet 15 is arranged in the diaphragm hole 1014, the central position of the diaphragm sheet 15 is provided with the light filtering hole 151, and the composite light focusing lens 16 is arranged in the white light lens hole 1015. The fluorescent sheet 13 converts the laser into a composite light, the composite light exits from the fluorescent sheet 13, then passes through the filtering hole 151 of the diaphragm 15, and exits to the outside of the blue-to-white laser along the exit direction of the light path under the focusing of the composite light focusing lens 16. Specifically, the aperture of the filter hole 151 is smaller than that of the fluorescent hole 1012, so that the diaphragm 15 can shield the periphery of the beam of the composite light converted by the fluorescent plate 13, and unnecessary yellow light around the fluorescent plate 13 is reduced, so that the emitted composite light is white light; the composite light focusing lens 16 can focus the lambertian-shaped composite light passing through the diaphragm 15 into light with a certain beam angle in one step, so that the white light of the blue-to-white laser can be more easily focused into a near-parallel beam by an external lens.

The implementation principle of the blue-to-white laser in the embodiment of the application is as follows:

referring to fig. 3, in an operating state, the laser chip 22 may emit laser light, and the laser light advances along the light emitting direction, passes through the collimating lens 24 at the laser emitting window 211, and then is emitted from the laser emitting window 211. The laser light continues to advance along the light emitting direction, passes through the laser focusing lens 31 and the light diffusion sheet 32 in sequence, then passes through the light transmitting hole 1011, and irradiates on the fluorescent sheet 13. The fluorescent sheet 13 converts the laser light into composite light, the composite light exits from the fluorescent sheet 13, then passes through the filtering hole 151 of the diaphragm 15, and exits to the outside of the blue-to-white laser along the exit direction of the light path under the focusing of the composite light focusing lens 16.

Referring to fig. 4, heat generated by the laser chip 22 in the operating state is transferred from the heat dissipation base 23 to the heat dissipation base plate 11 through the heat conductive flux 25, and then transferred to the heat dissipation housing 1 through the heat conductive adhesive 113 and the thread engagement, and then heat exchange is performed between the outer surface of the heat dissipation housing 1 and other media to form a high heat conduction channel, thereby achieving heat dissipation of the laser chip 22.

Referring to fig. 4, heat generated by the fluorescent film 132 during the process of converting laser light into composite light is conducted to the outside of the blue-to-white laser through the transparent substrate 131, the heat conductive adhesive 14 and the heat dissipation housing 1, so as to form a heat transfer channel with low thermal resistance, thereby achieving heat dissipation of the fluorescent sheet 13. Compared with the related technology, the thermal resistance of the heat conduction channel is lower, and the problem of thermal bottleneck of the heat conduction channel is well solved. Under equal drive power, the temperature of the fluorescent sheet 13 is lower, the probability of saturation and quenching of fluorescent powder can be effectively reduced, and the working power of the blue-to-white laser is improved.

Some features of the present application are, for clarity, described in the context of separate embodiments, but may also be provided in combination in a single embodiment. Conversely, some features of the present application, which are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable combination in different embodiments.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims (10)

1. The utility model provides a blue light changes white light laser instrument, includes heat dissipation shell (1), heat dissipation shell (1) internally mounted has laser diode (2) that are used for the outgoing laser, a serial communication port, mounting hole (101) that are used for the light-emitting are offered to the outgoing end of heat dissipation shell (1), install in mounting hole (101) and be used for becoming the fluorescence piece (13) of compound light with laser, fluorescence piece (13) bond fixedly with the inner wall of mounting hole (101).

2. The blue-to-white laser device as claimed in claim 1, wherein the fluorescent sheet (13) is fixed to the inner wall of the mounting hole (101) by silver sintering.

3. The blue-to-white laser according to claim 1, wherein the phosphor sheet (13) comprises a transparent substrate (131) for conducting heat, and a phosphor film (132) for converting the laser light into composite light, the phosphor film (132) being attached to one side of the transparent substrate (131).

4. A blue-to-white light laser according to any one of claims 1-3, wherein the heat-dissipating outer shell (1) is provided with heat-dissipating textures (103) on the outer periphery;

and/or the mounting hole (101) sequentially comprises a fluorescence hole (1012), a diaphragm hole (1014) and a white light lens hole (1015) along the light outgoing direction, the fluorescence sheet (13) is mounted in the fluorescence hole (1012), the diaphragm sheet (15) is mounted in the diaphragm hole (1014), and the composite light focusing lens (16) is mounted in the white light lens hole (1015).

5. The blue light-to-white light laser comprises a heat dissipation shell (1), wherein a laser diode (2) for emitting laser is installed inside the heat dissipation shell (1), and the blue light-to-white light laser is characterized in that the laser diode (2) comprises a tube body (21), a laser emitting window (211) for emitting laser is arranged at one end of the tube body (21), a heat dissipation base (23) is arranged at the other end of the tube body (21), and a laser chip (22) for generating laser is arranged on one side, facing the inside of the tube body (21), of the heat dissipation base (23);

the radiating base plate (11) is installed to the transmitting end of radiating shell (1), welded fastening between radiating base (23) and radiating base plate (11).

6. The blue-to-white laser device as claimed in claim 5, wherein the heat sink base (23) and the heat sink base plate (11) are fixed by soldering with a heat conducting solder.

7. The blue-to-white light laser device according to claim 5, wherein the emission end of the heat-dissipating housing (1) is provided with a threaded opening (102), the periphery of the heat-dissipating base plate (11) is provided with a threaded ring (111), and the threaded opening (102) is in threaded fit with the threaded ring (111).

8. The blue-to-white laser according to claim 7, wherein a gap between the threaded opening (102) and the threaded ring (111) is filled with a thermally conductive glue (113).

9. A blue-to-white light laser as claimed in claim 5, wherein the heat-dissipating housing (1) is any one of copper, aluminum, brass or graphite.

10. A blue-to-white light laser according to any one of claims 5 to 8, characterized in that a collimating lens (24) is mounted at the laser exit window (211) of the laser diode (2);

and/or, still install diffusion piece support (3) in heat dissipation shell (1), diffusion piece support (3) are located between laser diode (2) and mounting hole (101), diffusion piece support (3) have seted up laser lens hole (301) and light diffusion hole (302) along the light-emitting direction in proper order, install laser focusing lens (31) that are used for focusing laser in laser lens hole (301), install light diffusion piece (32) in light diffusion hole (302).

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