CN211017029U

CN211017029U - High-precision wafer gluing head wax pasting mechanism

Info

Publication number: CN211017029U
Application number: CN202020117204.4U
Authority: CN
Inventors: 洪志清; 李健飞
Original assignee: DONGGUAN KIZI PRECISION LAPPING MECHANICAL MANUFACTURE CO LTD
Current assignee: DONGGUAN KIZI PRECISION LAPPING MECHANICAL MANUFACTURE CO LTD
Priority date: 2020-01-18
Filing date: 2020-01-18
Publication date: 2020-07-14
Anticipated expiration: 2030-01-18

Abstract

The utility model relates to a high accuracy wafer rubber head wax pasting mechanism, including frame, rubber head wax pasting subassembly and the fixed subassembly of wafer, the frame includes roof, bottom plate and is used for connecting the stand of roof and bottom plate, the roof is located the bottom plate top, rubber head wax pasting subassembly runs through the setting on the roof, the fixed subassembly of wafer sets up in the up end of bottom plate, the fixed subassembly of wafer is located under the rubber head wax pasting subassembly, through conical rubber head contact wafer, the conical top of rubber head contacts with the central point of wafer earlier, contacts the wafer from inside to outside slowly again, can spread the wax in the middle of the wafer to the periphery to realize the high accuracy wax pasting clamping of wafer; the utility model discloses reduce because the error of wafer wax-pasting clamping provides the quality that the wafer ground the polishing, can make the plane quality of wax-pasting improve to 0.002-0.003 mm.

Description

High-precision wafer gluing head wax pasting mechanism

Technical Field

The utility model relates to a shield processing technology field specifically is a high accuracy wafer glues first wax machine to construct.

Background

The dustproof cover is used for protecting the product, plays a role in isolation, prevents dust from entering the part and prevents hands from contacting the product.

The dustproof cover belongs to batch production during production, and is connected together, but the dustproof cover is single use product, so will separate it, and the protective sheath on the existing market tears the limit technique, tears one through artifical manual, and hard uneven make the dustproof cover remain the surplus limit easily, and the personnel selection is many, and work efficiency is slow, and at the bottom of the finished product yield, for this reason, we developed a high accuracy wafer and glued first wax machine to construct.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high accuracy wafer glues first wax machine to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme, a first wax mechanism that pastes is glued to high accuracy wafer, including frame, glue the first wax subassembly of pasting and the fixed subassembly of wafer, the frame includes roof, bottom plate and is used for connecting the stand of roof and bottom plate, the roof is located the bottom plate top, glue the first wax subassembly of pasting and run through the setting on the roof, the fixed subassembly of wafer sets up in the up end of bottom plate, the fixed subassembly of wafer is located glues first wax subassembly under.

Preferably, the glue head wax pasting assembly comprises an air cylinder, a connecting flange, a glue head, a pneumatic scavenging valve and a pressure reducing filter, the air cylinder penetrates through the top plate, the glue head is connected with the output end of the air cylinder through the connecting flange, the pneumatic scavenging valve is arranged on the top plate, the pressure reducing filter is arranged on one side of the top plate, and the pneumatic scavenging valve and the pressure reducing filter are connected with the air cylinder through air pipes.

Preferably, the rubber head is arranged in a conical shape.

Preferably, the wafer fixing assembly comprises a cooling disc and a wafer clamp plate, the cooling disc is arranged on the bottom plate, a plurality of positioning columns are arranged on the cooling disc in an array mode, and the wafer clamp plate is arranged among the positioning columns.

Preferably, the wafer fixing component is used for placing a wafer, and the wafer is located right below the glue head wax pasting component when being pasted with wax.

Compared with the prior art, the beneficial effects of the utility model are that: the utility model provides a high accuracy wafer glues first wax machine and constructs, use to glue the head and carry out the wax pasting of wafer, glue the head because the design that uses similar circular cone mode lets the vertex of a cone of gluing the head earlier with the central point of wafer put the contact, slowly contact the wafer from inside to outside again, can be with the wax in the middle of the wafer toward peripheral diffusion like this to realize the high accuracy wax clamping of pasting of wafer, reduce because the error of wafer wax clamping provides the quality that the wafer ground polish, the plane quality with wafer wax pasting improves 0.002-0.003 mm.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

wherein, 1, a cylinder; 2. a top plate; 3. a coupling flange; 4. gluing heads; 5. a column; 6. a base plate; 7. A pneumatic scavenging valve; 8. a pressure reducing filter; 9. a wafer; 10. a wafer chuck plate; 11. and (5) cooling the disc.

Detailed Description

The technical solutions in the embodiments of the present invention are described below clearly and completely, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, a high-precision wafer head wax-pasting mechanism is characterized by comprising a rack, a head wax-pasting component and a wafer fixing component, wherein the rack comprises a top plate 2, a bottom plate 6 and a column 5 for connecting the top plate 2 and the bottom plate 6, the top plate 2 is positioned above the bottom plate 6, the head wax-pasting component is arranged on the top plate 2 in a penetrating manner, the wafer fixing component is arranged on the upper end surface of the bottom plate 6, and the wafer fixing component is positioned under the head wax-pasting component.

Specifically, the glue head wax pasting assembly comprises an air cylinder 1, a connecting flange 3, a glue head 4, a pneumatic scavenging valve 7 and a pressure reducing filter 8, wherein the air cylinder 1 penetrates through a top plate 2, the glue head 4 is connected with the output end of the air cylinder 1 through the connecting flange 3, the pneumatic scavenging valve 7 is arranged on the top plate 2, the pressure reducing filter 8 is arranged on one side of the top plate 2, and the pneumatic scavenging valve 7, the pressure reducing filter 8 and the air cylinder 1 are connected through an air pipe. The pneumatic air exchange valve 7 and the decompression filter 8 are used for controlling the lifting and the pressure of the glue head 4, and the wafer 9 is prevented from being damaged by too high descending speed or too high pressure in the descending process of the glue head 4.

Specifically, the rubber head 4 is arranged in a conical shape. The cone top of the glue head can be contacted with the central position of the wafer firstly and then contacted with the wafer from inside to outside slowly, so that the wax in the middle of the wafer can be diffused to the periphery.

Specifically, the wafer fixing assembly comprises a cooling disc 11 and a wafer clamp plate 10, the cooling disc 11 is arranged on the bottom plate 6, a plurality of positioning columns are arranged on the cooling disc 11 in an array mode, and the wafer clamp plate 10 is arranged among the positioning columns. The positioning posts enable the wafer chuck plate 10 to be fixed on the cooling plate 11, heat the wafer chuck plate 10, melt the solid wax strip on the surface of the wafer chuck plate 10, and place the wafer 9 on the wax on the surface of the wafer chuck plate 10.

Specifically, the wafer fixing assembly is used for placing the wafer 9, and the wafer 9 is located right below the adhesive head wax pasting assembly when being pasted with wax.

When the wafer-sticking wax-removing device works, the wafer clamp plate 10 is heated firstly, the solid wax strips are melted on the surface of the wafer clamp plate 10 and are dispersed into a thin layer, the wafer 9 is placed on the wax on the surface of the wafer clamp plate 10, the position of the wafer 9 is adjusted, the wafer 9 is right opposite to the right lower part of the glue head 4, the glue head 4 is descended at a constant speed by using the pneumatic reversing valve 7 and the speed reducing filter 8, the glue head 4 is firstly contacted with the middle of the wafer, the wafer 9 is contacted from inside to outside, and the wax in the middle of the wafer 9 is driven from inside to outside, so that the high-precision wax sticking of the wafer is realized.

Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalent substitutions may be made on some of the technical features of the embodiments.

Claims

1. The utility model provides a high accuracy wafer glues first wax machine to construct, its characterized in that, glues first wax machine to construct with the fixed subassembly of wafer including the frame, glues, the frame includes roof (2), bottom plate (6) and is used for connecting stand (5) of roof (2) and bottom plate (6), roof (2) are located bottom plate (6) top, it runs through the setting on roof (2) to glue first wax machine to construct, the fixed subassembly of wafer sets up in the up end of bottom plate (6), the fixed subassembly of wafer is located and glues first wax machine under the subassembly.

2. The high-precision wafer head wax pasting mechanism according to claim 1, wherein the head wax pasting assembly comprises a cylinder (1), a coupling flange (3), a glue head (4), a pneumatic scavenging valve (7) and a pressure reducing filter (8), the cylinder (1) is arranged through the top plate (2), the glue head (4) is connected with the output end of the cylinder (1) through the coupling flange (3), the pneumatic scavenging valve (7) is arranged on the top plate (2), the pressure reducing filter (8) is arranged on one side of the top plate (2), and the pneumatic scavenging valve (7) and the pressure reducing filter (8) are connected with the cylinder (1) through a gas pipe.

3. The high-precision wafer head wax pasting mechanism according to claim 1, wherein the glue head (4) is arranged in a conical shape.

4. The high-precision wafer head wax pasting mechanism according to claim 1, wherein the wafer fixing assembly comprises a cooling plate (11) and a wafer clamp plate (10), the cooling plate (11) is disposed on the bottom plate (6), a plurality of positioning posts are arranged on the cooling plate (11) in an array manner, and the wafer clamp plate (10) is disposed between the plurality of positioning posts.

5. A high precision wafer head wax pasting mechanism according to claim 1, wherein the wafer fixing component is used for placing the wafer (9), and the wafer (9) is located right below the head wax pasting component when pasting wax.