CN105619237B - It is a kind of without cured polishing absorption layer and its manufacturing method - Google Patents
It is a kind of without cured polishing absorption layer and its manufacturing method Download PDFInfo
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- CN105619237B CN105619237B CN201410709017.4A CN201410709017A CN105619237B CN 105619237 B CN105619237 B CN 105619237B CN 201410709017 A CN201410709017 A CN 201410709017A CN 105619237 B CN105619237 B CN 105619237B
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- 238000010521 absorption reaction Methods 0.000 title claims abstract description 235
- 238000005498 polishing Methods 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 239000010410 layer Substances 0.000 claims abstract description 452
- 239000002131 composite material Substances 0.000 claims abstract description 171
- 238000000227 grinding Methods 0.000 claims abstract description 168
- 239000012790 adhesive layer Substances 0.000 claims abstract description 143
- 239000004831 Hot glue Substances 0.000 claims abstract description 125
- 239000011265 semifinished product Substances 0.000 claims abstract description 37
- 239000003292 glue Substances 0.000 claims description 160
- 239000004814 polyurethane Substances 0.000 claims description 92
- 229920002635 polyurethane Polymers 0.000 claims description 64
- 239000004593 Epoxy Substances 0.000 claims description 30
- 239000003822 epoxy resin Substances 0.000 claims description 29
- 229920000647 polyepoxide Polymers 0.000 claims description 29
- 229920001971 elastomer Polymers 0.000 claims description 24
- 239000007788 liquid Substances 0.000 claims description 23
- 239000011521 glass Substances 0.000 claims description 19
- 239000004744 fabric Substances 0.000 claims description 16
- 239000010985 leather Substances 0.000 claims description 12
- 238000013016 damping Methods 0.000 claims description 8
- 229920001410 Microfiber Polymers 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 claims description 5
- 239000003658 microfiber Substances 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 3
- 238000007731 hot pressing Methods 0.000 description 185
- 239000004567 concrete Substances 0.000 description 126
- 239000012528 membrane Substances 0.000 description 53
- 238000010030 laminating Methods 0.000 description 49
- 238000005507 spraying Methods 0.000 description 31
- 238000000034 method Methods 0.000 description 24
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 23
- 239000000463 material Substances 0.000 description 23
- 239000000853 adhesive Substances 0.000 description 22
- 230000001070 adhesive effect Effects 0.000 description 22
- 239000011248 coating agent Substances 0.000 description 22
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- 238000004804 winding Methods 0.000 description 16
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- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 14
- 239000012943 hotmelt Substances 0.000 description 14
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 12
- 229910052594 sapphire Inorganic materials 0.000 description 12
- 239000010980 sapphire Substances 0.000 description 12
- 239000004745 nonwoven fabric Substances 0.000 description 11
- 238000007711 solidification Methods 0.000 description 10
- 230000008023 solidification Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005755 formation reaction Methods 0.000 description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
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- 239000002904 solvent Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000009156 water cure Methods 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
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- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of without cured polishing absorption layer and its manufacturing method.The present invention includes abrasive sheet, adhesive layer one, absorption skin, adhesive layer two, support plate, gum layer without cured polishing absorption layer, and adhesive layer one, adhesive layer two select hot melt adhesive film, production stage as follows：One, abrasive sheet, adhesive layer one, adhesive layer two, absorption skin, support plate, gum layer cut into certain size；Two, abrasive sheet and adhesive layer one are bonded, and obtain grinding layer composite plate；Three, the first face of support plate and adhesive layer two are bonded；The second face of support plate and gum layer are bonded, and be supported a layer composite plate；Four, grinding layer composite plate is processed, and is cut, and grinding layer processing plate is obtained；Five, supporting layer composite plate and absorption skin bonding, obtain absorption skin composite plate；Six, it adsorbs skin composite plate and grinding layer processing plate is bonded, obtain absorption layer semi-finished product；Seven, edge is cut, and redundance removal obtains a kind of without cured polishing absorption layer.
Description
Technical field
The invention belongs to grinding-material manufacturing technology fields more particularly to a kind of without cured polishing absorption layer and its manufacturer
Method.
Background technology
Traditional eyeglass, glass, wafer, sapphire, silicon chip polishing process mainly using applying cured polished bonding sheet method.It need to
Eyeglass, glass, wafer, sapphire, the silicon chip to be ground are bonded in using cured liquid on briquetting, in the grinding for fitting in milling apparatus
Grinding and polishing is carried out on disk.Its apply the quality of cured technique and cured liquid, the flatness of briquetting and can directly influence after polishing at
The quality of finish of product eyeglass, glass, wafer, sapphire, silicon chip, cause its qualification rate it is low (bad, fragment, scratch, tolerance it is exceeded
Deng).
As modern product is to the required precision higher of eyeglass, glass, wafer, sapphire, silicon chip, original applies cured polishing process
Cannot meet the needs of product.
Through retrieval, Chinese patent literature publication number CN87202507U discloses a kind of silicon chip without cured polishing pad, patent production
Though product have its advantage, it is 300 μm~400 μm (0.3mm~0.4mm) that it, which inlays layer thickness, cannot meet current grinding
The demand of eyeglass, glass, wafer, sapphire, silicon chip.The material expensives such as silicon chip, wafer bring a large amount of drops of cost after being thinned
Low, with the raising that contemporary society requires properties of product, the progress of technology is more and more thinner using thickness, now conventional silicon
Piece, wafer thickness can be fabricated into 100 μm, even more thin.The patent make a kind of silicon chip without cured polishing pad without
Method meet the materials such as contemporary society's silicon chip, wafer without cured polishing grinding.And the patent uses the mosaic coating after processing and its
The remaining direct bonding mode of layer, the problems such as being susceptible to dislocation, (its adhesive layer one, need to be cut into the consistent size of mosaic coating and
Intermediate identical hole is cut out, adhesive layer one is easy dislocation in mosaic coating in adhesion process, forms adhesive layer glue and is seeped into third
Layer absorption layer surface blocks adsorption layer hole, leads to product rejection problem.) while adhesive layer one be very thin hot melt adhesive layer,
Machining center hole is difficult, and the making qualification rate of product is relatively low, of high cost.
Invention content
The shortcomings that for existing painting cured polishing technology, the present invention provides a kind of universal without cured polishing absorption layer and its system
Make method.The invention enables being achieved without cured polishing technology, the polishing of the materials such as eyeglass, glass, wafer, sapphire, silicon chip
Quality becomes higher (qualification rate improves, precision improves etc.), eyeglass, glass, wafer, sapphire, the silicon wafer thickness model that can be polished
Enclose bigger.
The present invention can simplify polishing process without cured polishing absorption layer, improve product qualification rate and polishing eyeglass, glass, crystalline substance
The precision of circle, sapphire, silicon chip, alternative original cured polishing process of painting.
In order to achieve the goal above, the present invention takes following technical scheme：
It is a kind of without cured polishing absorption layer, by being successively from top to down：Abrasive sheet, the first adhesive layer, absorption skin, the second gluing
Layer, support plate, gum layer amount to 6 layers, are formed using the kinds of processes such as hot pressing, spraying, heat posted substep bonding.
Preferably, abrasive sheet is one kind in epoxy resin glass-fiber-plate with holes, PC plate, PVC board or other wearable plates.
Thickness is determined according to polished part thickness.
Preferably, the first adhesive layer, the second adhesive layer are TPU hot melt adhesive films, EVA hot-melt adhesive film, PO hot melt adhesive films, PU heat
One kind in the thermoplastic cements membrane material such as melten gel film；Either epoxy structural rubber, polyurethane glue and other weatherabilities bond
One kind in the good bonding glue of property.Hot melt adhesive film has the hot melt that release paper is bonded between fusing point is 60 DEG C~150 DEG C
Glued membrane is preferred.0.03~0.1mm of hot melt adhesive film bondline thickness (is free of release paper thickness).
Preferably, absorption skin is polyurethane material：Such as damp one kind in cloth, PU skins, micro fiber leather, polished leather.Its table
It is 50%~70% that face, which has microcellular structure, porosity, is on one side the microcellular structure face with hole, another side is smooth surface.Absorption
Skin thickness is 0.3~1.0mm, 4 μm~7 μm of aperture diameter, 0.35~0.5g/cm of density of material3。
Preferably, support plate, which is epoxy resin glass-fiber-plate, PC plate, PVC board, PET sheet etc., can be provided entirely without cured polishing
One kind in the plank of absorption layer support strength.Support 0.1~1.0mm of plate thickness.
Preferably, gum layer is pressure sensitive double faced adhesive tape, and concrete structure can be the sandwich two-sided paintings such as PET, non-woven fabrics
It covers the pressure-sensitive glues such as acrylic acid and is bonded one layer of release paper again and be combined.
Production method technical solution one of the present invention：A kind of production method without cured absorption polishing pad, adhesive layer one, adhesive layer
Two be one kind in the room temperature solid glued membranes such as the hot melt adhesive films such as TPU, EVA, PO, PU, is included the following steps：
One, abrasive sheet, adhesive layer one, adhesive layer two, absorption skin, support plate, gum layer cut fixed dimension.Its specific side
Formula is：By above-mentioned material by machine cuts (guillotine), it is (bigger depending on consumer product drawing to be cut into certain size
In drawing full-size, this method can avoid product dislocation, when size is just the same big, product caused by misplacing during fitting
It is very big to scrap ratio).
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：The room temperature such as TPU, EVA, PO, PU hot melt adhesive film
One kind in solid glued membrane, using hot pressing laminating type, the hot pressing temperature of setting>TPU, EVA, PO, PU hot melt adhesive film fusing point 10
DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.It is adjusted according to abrasive sheet and hot melt adhesive film characteristic
It is whole.The back sides release papers such as stage TPU, EVA, PO, PU hot melt adhesive film are reserved state.It is denoted as grinding layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU, EVA, PO, PU hot melt adhesive film etc. is normal
One kind in warm solid glued membrane, using hot pressing laminating type, the hot pressing temperature of setting>TPU, EVA, PO, PU hot melt adhesive film fusing point
10 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.It is carried out according to support plate and hot melt adhesive film characteristic
Adjustment.The back sides release papers such as stage TPU, EVA, PO, PU hot melt adhesive film are reserved state.The faces support plate B and gum layer carry out
Bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B containing facing towards gum layer and gum layer
Glue surface is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers.Or be punched using mold, or drawn and cut out using flexible sheet cutting machine
It cuts.It is denoted as grinding layer processing plate.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the hot melt adhesive film back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in hot melt adhesive film layer surface, using hot pressing laminating type, the hot pressing temperature of setting
>10 DEG C or so of TPU, EVA, PO, PU hot melt adhesive film fusing point, hot pressing time are 20s~1min, hot pressing pressure 5PSI~50PSI.Root
According to support plate, hot melt adhesive film and absorption skin characteristic are adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
Hot pressing laminating type, the hot pressing temperature of setting are used afterwards>10 DEG C or so of TPU, EVA, PO, PU hot melt adhesive film fusing point, hot pressing time
For 20s~1min.According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Redundance around absorption layer semi-finished product is used
Cutting die the modes such as cuts and removes.It is a kind of without cured polishing absorption layer to obtain end article.
Preferably, the fitting of abrasive sheet and adhesive layer one, the fitting of support plate and adhesive layer two, gum layer can ground
Leading and adhesive layer one when nog plate and support plate are big plate, gum layer fitting, then carry out being cut into fixed dimension.This mode is in life
When production quantity is big, the fitting time can be saved, improves efficiency.
Certainly, step 2 and step 3 be without specific sequencing, can 3 steps it is leading, also can 2 steps it is leading, or simultaneously into
Row.
Production method technical solution two of the present invention：A kind of production method without cured absorption polishing pad, adhesive layer one, adhesive layer
Two be one kind of the Normal Atmospheric Temperature Liquids glue such as epoxy structural rubber, polyurethane glue, is included the following steps：
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, certain size is cut into.(depending on consumer product drawing).
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：The room temperature such as epoxy structural rubber, polyurethane glue
One kind in liquid glue, using first brush coating, glue spraying is dried to a certain degree, then is bonded release paper, prevents glue face impurity mixed
Enter.(glue adjusts solid content according to brush coating and glue spraying, and solvent is using acetone etc.) is subsequently bonded requirement according to abrasive sheet, controls glue
Water content, glue thickness control are 0.03~0.07mm.It is denoted as grinding layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Epoxy structural rubber, polyurethane glue etc. are normal
One kind in geothermal liquid glue, using first brush coating, glue spraying is dried to a certain degree, then is bonded release paper, prevents glue face impurity
It is mixed into.(glue adjusts solid content according to brush coating and glue spraying) is subsequently bonded requirement according to abrasive sheet, controls glue content, and glue is thick
Degree control is 0.03~0.07mm.The faces support plate B and gum layer are bonded.Its concrete mode is：The gum layer of winding, passes through
The glue surface that contains of support plate B facing towards gum layer and gum layer is bonded by laminator.The laminator speed of service be 0.5m/min~
2m/min is adjusted.It is denoted as supporting layer composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers.Or be punched using mold, or drawn and cut out using flexible sheet cutting machine
It cuts.It is denoted as grinding layer processing plate.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the epoxy structural rubber of supporting layer composite plate,
The release paper at the polyurethane adhesive back side is thrown off, then is bonded absorption skin smooth surface in epoxy structural rubber or polyurethane adhesive layer surface, using heat
Press laminating type, the hot pressing temperature of setting>Epoxy structural rubber, 10 DEG C or so of polyurethane glue solidification temperature, hot pressing time 20s
~1min, hot pressing pressure 5PSI~50PSI.According to support plate, epoxy structural rubber or polyurethane adhesive, absorption skin characteristic are adjusted
It is whole.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：Grinding layer is processed into plate epoxy
Structure glue or the release paper at the polyurethane glue back side are thrown off, by glue face paste together in absorption skin composite plate on, glue face and suction
Attached skin microcellular structure face contacts.In the hole of the grinding layer processing plate center processing removal on surface, filling and its size thickness
Then consistent steel disc mold uses hot pressing laminating type, the hot pressing temperature of setting>Epoxy structural rubber, polyurethane adhesive water cure
10 DEG C or so of temperature, hot pressing time are 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, epoxy structural rubber or
Polyurethane adhesive, adsorbs skin and abrasive sheet characteristic is adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Redundance around absorption layer semi-finished product is used
Cutting die the modes such as cuts and removes.It is a kind of without cured polishing absorption layer to obtain end article.
Preferably, the fitting of abrasive sheet and adhesive layer one, the fitting of support plate and adhesive layer two, gum layer can ground
Leading and adhesive layer one when nog plate and support plate are big plate, gum layer fitting, then carry out being cut into fixed dimension.This mode is in life
When production quantity is big, the fitting time can be saved, improves efficiency.
Step 2 and step 3 without specific sequencing, can 3 steps it is leading, also can 2 steps it is leading, or be carried out at the same time.
Production method technical solution three of the present invention：It is a kind of without it is cured absorption polishing pad production method, adhesive layer one be TPU,
One kind in the hot melt adhesive films such as EVA, PO, PU, adhesive layer two are one kind in the liquid glues such as epoxy structural rubber, polyurethane glue,
Include the following steps：
One, abrasive sheet, one glued membrane of adhesive layer, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：
By above-mentioned material by machine cuts (guillotine), it is cut into certain size.(depending on consumer product drawing).
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：The room temperature such as TPU, EVA, PO, PU hot melt adhesive film
One kind in solid glued membrane, using hot pressing laminating type, the hot pressing temperature of setting>TPU, EVA, PO, PU hot melt adhesive film fusing point 10
DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.It is adjusted according to abrasive sheet and hot melt adhesive film characteristic
It is whole.The back sides release papers such as stage TPU, EVA, PO, PU hot melt adhesive film are reserved state.It is denoted as grinding layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Epoxy structural rubber, polyurethane glue etc. are normal
One kind in geothermal liquid glue, using first brush coating, glue spraying is dried to a certain degree, then is bonded release paper, prevents glue face impurity
It is mixed into.(glue adjusts solid content according to brush coating and glue spraying) is subsequently bonded requirement according to abrasive sheet, controls glue content, and glue is thick
Degree control is 0.03~0.07mm.The faces support plate B and gum layer are bonded.Its concrete mode is：The gum layer of winding, passes through
The glue surface that contains of support plate B facing towards gum layer and gum layer is bonded by laminator.The laminator speed of service be 0.5m/min~
2m/min is adjusted.It is denoted as supporting layer composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers.Or be punched using mold, or drawn and cut out using flexible sheet cutting machine
It cuts.It is denoted as grinding layer processing plate.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the epoxy structural rubber of supporting layer composite plate,
The release paper at the polyurethane adhesive back side is thrown off, then is bonded absorption skin smooth surface in epoxy structural rubber or polyurethane adhesive layer surface, using heat
Press laminating type, the hot pressing temperature of setting>10 DEG C or so of epoxy structural rubber, polyurethane glue solidification temperature, hot pressing time 20s
~1min, hot pressing pressure 5PSI~50PSI.According to support plate, epoxy structural rubber or polyurethane adhesive, absorption skin characteristic are adjusted
It is whole.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
Hot pressing laminating type, the hot pressing temperature of setting are used afterwards>10 DEG C or so of TPU, EVA, PO, PU hot melt adhesive film fusing point, hot pressing time
For 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is adjusted
It is whole.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Redundance around absorption layer semi-finished product is used
Cutting die the modes such as cuts and removes.It is a kind of without cured polishing absorption layer to obtain end article.
Preferably, the fitting of abrasive sheet and adhesive layer one, the fitting of support plate and adhesive layer two, gum layer can ground
Leading and adhesive layer one when nog plate and support plate are big plate, gum layer fitting, then carry out being cut into fixed dimension.This mode exists
When production quantity is big, the fitting time can be saved, improves efficiency.
Step 2 and step 3 without specific sequencing, can 3 steps it is leading, also can 2 steps it is leading, or be carried out at the same time.
Production method technical solution four of the present invention：A kind of production method without cured absorption polishing pad, adhesive layer one is epoxy
One kind in the liquid glues such as structure glue, polyurethane glue, adhesive layer two are one kind in the hot melt adhesive films such as TPU, EVA, PO, PU,
Include the following steps：
One, abrasive sheet, two glued membrane of adhesive layer, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：
By above-mentioned material by machine cuts (guillotine), it is cut into certain size.(depending on consumer product drawing).
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：The room temperature such as epoxy structural rubber, polyurethane glue
One kind in liquid glue, using first brush coating, glue spraying is dried to a certain degree, then is bonded release paper, prevents glue face impurity mixed
Enter.(glue adjusts solid content according to brush coating and glue spraying, and solvent is using acetone etc.) is subsequently bonded requirement according to abrasive sheet, controls glue
Water content, glue thickness control are 0.03~0.07mm.It is denoted as grinding layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU, EVA, PO, PU hot melt adhesive film etc. is normal
One kind in warm solid glued membrane, using hot pressing laminating type, the hot pressing temperature of setting>TPU, EVA, PO, PU hot melt adhesive film fusing point
10 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.It is carried out according to support plate and hot melt adhesive film characteristic
Adjustment.The back sides release papers such as stage TPU, EVA, PO, PU hot melt adhesive film are reserved state.The faces support plate B and gum layer carry out
Bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B containing facing towards gum layer and gum layer
Glue surface is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers.Or be punched using mold, or drawn and cut out using flexible sheet cutting machine
It cuts.It is denoted as grinding layer processing plate.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the hot melt adhesive film back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in hot melt adhesive film layer surface, using hot pressing laminating type, the hot pressing temperature of setting
>10 DEG C or so of TPU, EVA, PO, PU hot melt adhesive film fusing point, hot pressing time are 20s~1min, hot pressing pressure 5PSI~50PSI.Root
According to support plate, hot melt adhesive film and absorption skin characteristic are adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：Grinding layer is processed into plate epoxy
Structure glue or the release paper at the polyurethane glue back side are thrown off, by glue face paste together in absorption skin composite plate on, glue face and suction
Attached skin microcellular structure face contacts.In the hole of the grinding layer processing plate center processing removal on surface, filling and its size thickness
Then consistent steel disc mold uses hot pressing laminating type, the hot pressing temperature of setting>Epoxy structural rubber, polyurethane adhesive water cure
10 DEG C or so of temperature, hot pressing time are 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, epoxy structural rubber or
Polyurethane adhesive, adsorbs skin and abrasive sheet characteristic is adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Redundance around absorption layer semi-finished product is used
Cutting die the modes such as cuts and removes.It is a kind of without cured polishing absorption layer to obtain end article.
Preferably, the fitting of abrasive sheet and adhesive layer one, the fitting of support plate and adhesive layer two, gum layer can ground
Leading and adhesive layer one when nog plate and support plate are big plate, gum layer fitting, then carry out being cut into fixed dimension.This mode exists
When production quantity is big, the fitting time can be saved, improves efficiency.
Step 2 and step 3 without specific sequencing, can 3 steps it is leading, also can 2 steps it is leading, or be carried out at the same time.
It is produced by the present invention to be had the following advantages that without cured polishing absorption layer：Moulded products grind layer thickness, and shape is adjustable
Section is suitble to the grinding of the eyeglass, glass, wafer, sapphire, silicon chip of various thickness shapes.Liquid may be selected in bonding process diversity
The difference bonding process such as body, solid, equipment interoperability are big.Moulding process is repeatedly that substep bonds the problems such as avoiding dislocation, system
Product qualification rate is high, at low cost.Moulded products are used for without cured polishing, and the precision of polished part is compared with the polished part precision that existing product produces
Height, qualification rate are high.
The present invention is bonded using repeatedly substep, is not in problem of misalignment, and when there are other product problems, only
Part raw material are scrapped, and being not in direct bonding leads to scrapping for whole raw material.The invented technology improves product
Qualification rate can greatly be cost-effective in the case where adsorbing the raw material costlinesses such as skin.The grinding layer thickness of the present invention can root
It is selected according to abrasive product thickness, it can be brilliant to 200 μm of current main-stream, the silicon chip of the low thickness such as 100 μm (0.2mm, 0.1mm)
Circle etc. adsorbed without cured polishing and is ground, while also can be to 1.0mm, the quartz glass of the high thickness such as 2.0mm, sapphire glass etc.
Adsorbed without cured polishing and grinds.
Description of the drawings
Fig. 1-12 is the vertical view of embodiment 1-12 respectively.
Figure 13 is the structure chart without cured polishing absorption layer.
In diagram, 1- grinding layers with holes, 2- adhesive layers one, 3- adsorption layers, 4- adhesive layers two, 5- support plates, 6-
Gum layer.
Specific implementation mode
Below by specific implementation row, the present invention is described in more detail, but is not the limit to the scope of the present invention
System.
Implementation column 1
0.2mm optical mirror slips are with a kind of without cured polishing absorption layer.It is the disk knot of 19 circular holes of band of a diameter of 354mm
Structure, bore dia 50.8mm, surface grinding layer thickness 0.2mm.It is specifically shown in Fig. 1.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 0.2mm.Adhesive layer one, adhesive layer two all use tpu hot melt adhesive
Film, fusing point are 120 DEG C, and thickness is 0.03mm (being free of release paper).Skin, which is adsorbed, using cloth, porosity 60%, thickness is damped is
0.4mm, 5 μm of aperture diameter, density 0.4g/cm3.Supporting layer uses epoxy resin glass-fiber-plate, thickness 0.2mm.Gum layer
Using non-woven fabrics pressure sensitive adhesive, thickness is 0.1mm (being free of release paper).Manufacturing step is as follows:
One, abrasive sheet, adhesive layer one, the glued membrane of adhesive layer two, absorption skin, support plate, gum layer cut fixed dimension.Its
Concrete mode is：By above-mentioned material by machine cuts (guillotine), it is cut into 400*400mm sizes.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 120 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 130 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU hot melt adhesive films, 120 DEG C of fusing point, are adopted
With hot pressing laminating type, 130 DEG C or so of the hot pressing temperature of setting, hot pressing time is 20s~1min, hot pressing pressure 10PSI.It can root
It is micro-adjusted according to support plate and hot melt adhesive film characteristic.Stage TPU hot melt adhesive films back side release paper is reserved state.Support plate
The faces B and gum layer are bonded.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum
The glue surface that contains of layer and gum layer is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer
Composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers, cuts the outer circle of 354mm diameters according to drawing and in the circle
The circular hole of 19 50.8mm diameters of heartcut.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the hot melt adhesive film back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in hot melt adhesive film layer surface, using hot pressing laminating type, the hot pressing temperature of setting
130 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 10PSI.According to support plate, hot melt adhesive film and absorption skin characteristic into
Row adjustment.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole that the grinding layer processing plate on surface processes removal in its center, the steel disc mould of filling and its size consistency of thickness
Tool plays the role of so that surfacing, is pressurized uniform, then uses hot pressing laminating type, 130 DEG C of left sides of hot pressing temperature of setting
The right side, hot pressing time are 20s~1min, hot pressing pressure 10PSI.According to support plate, hot melt adhesive film, absorption skin and abrasive sheet characteristic into
Row micro-adjustment.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 354mm diameter disks, around has side more than part, around absorption layer semi-finished product 354mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 0.2mm optical mirror slips are obtained with a kind of without cured polishing absorption layer,
Its overall thickness is about 1.0mm.
This kind without it is cured polishing absorption layer mainly thickness be a diameter of 50.8mm of 0.2mm optical mirror slip grinding when, play
Suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 2
1.5mm sapphires eyeglass is with a kind of without cured polishing absorption layer.It is the disk knot in 32 holes of band of a diameter of 354mm
The long * wide of structure, hole is 39*33mm, surface grinding layer thickness 1.5mm.It is specifically shown in Fig. 2.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 1.5mm.Adhesive layer one, adhesive layer two use tpu hot melt adhesive
Film, fusing point are 100 DEG C, and thickness is 0.05mm (being free of release paper).Skin, which is adsorbed, using cloth, porosity 60%, thickness is damped is
0.4mm, 5.5 μm of aperture diameter, density 0.38g/cm3.Supporting layer uses PC plate, thickness 0.4mm.Gum layer uses nonwoven
Cloth pressure sensitive adhesive, thickness are 0.18mm (being free of release paper).Manufacturing step is as follows:
One, abrasive sheet, adhesive layer one, adhesive layer two, absorption skin, support plate, gum layer cut fixed dimension.Its specific side
Formula is：By above-mentioned material by machine cuts (guillotine), it is cut into 400*400mm sizes.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, are adopted
With hot pressing laminating type, 110 DEG C or so of the hot pressing temperature of setting, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can root
It is micro-adjusted according to support plate and hot melt adhesive film characteristic.Stage TPU hot melt adhesive films back side release paper is reserved state.Support plate
The faces B and gum layer are bonded.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum
The glue surface that contains of layer and gum layer is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer
Composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers, according to drawing cutting except 32 39*33mm long * wide at center
Hole and 354mm diameters outer circle.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the hot melt adhesive film back side of supporting layer composite plate
Release paper throw off, fitting absorption skin in hot melt adhesive film layer surface, using hot pressing laminating type, the hot pressing temperature 110 of setting
DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It is carried out according to support plate, hot melt adhesive film and absorption skin characteristic
Adjustment.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption surface contact.On surface
The processing removal of grinding layer processing plate center hole in, then the steel disc mold of filling and its size consistency of thickness uses heat
It is 20s~1min, hot pressing pressure 20PSI to press laminating type, 110 DEG C or so of the hot pressing temperature of setting, hot pressing time.According to support
Plate, hot melt adhesive film, absorption skin and abrasive sheet characteristic are micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 350mm diameter disks, around has side more than part, around absorption layer semi-finished product 350mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.5mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 2.65mm.
This kind mainly when thickness is the sapphire lens grinding that 1.5mm sizes are 39*33mm, rises without cured polishing absorption layer
To suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 3
1.5mm sapphires eyeglass is with a kind of without cured polishing absorption layer.It is the disk knot in 16 holes of band of a diameter of 305mm
The long * wide of structure, hole is 43*33mm, surface grinding layer thickness 1.5mm.It is specifically shown in Fig. 3.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 1.5mm.Adhesive layer one, adhesive layer two use tpu hot melt adhesive
Film, fusing point are 100 DEG C, and thickness is 0.05mm (being free of release paper).Skin, which is adsorbed, using cloth, porosity 60%, thickness is damped is
0.4mm, 5.5 μm of aperture diameter, density 0.38g/cm3.Supporting layer uses PC plate, thickness 0.4mm.Gum layer uses nonwoven
Cloth pressure sensitive adhesive, thickness are 0.18mm (being free of release paper).Manufacturing step is as follows:
One, abrasive sheet, adhesive layer one, adhesive layer two, absorption skin, support plate, gum layer cut fixed dimension.Its specific side
Formula is：By above-mentioned material by machine cuts (guillotine), it is cut into 350*350mm sizes.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, are adopted
With hot pressing laminating type, 110 DEG C or so of the hot pressing temperature of setting, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can root
It is micro-adjusted according to support plate and hot melt adhesive film characteristic.Stage TPU hot melt adhesive films back side release paper is reserved state.Support plate
The faces B and gum layer are bonded.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum
The glue surface that contains of layer and gum layer is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer
Composite plate.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing by CNC machining centers, according to drawing cutting except 16 43*33mm long * wide at center
Hole and 305mm diameters outer circle.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the hot melt adhesive film back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in hot melt adhesive film layer surface, using hot pressing laminating type, the hot pressing temperature of setting
110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.According to support plate, hot melt adhesive film and absorption skin characteristic into
Row adjustment.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 110 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 350mm*350mm,
Attrition process board size is 305mm diameter disks, around has side more than part, around absorption layer semi-finished product 305mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.5mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 2.65mm.
This kind mainly when thickness is the sapphire lens grinding that 1.5mm sizes are 43*33mm, rises without cured polishing absorption layer
To suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 4
1.0mm tempered glass eyeglass is with a kind of without cured polishing absorption layer.It is the disk in 2 holes of band of a diameter of 254mm
The long * wide of structure, hole is 136*67mm, surface grinding layer thickness 1.0mm.It is specifically shown in Fig. 4.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 1.0mm.Adhesive layer 1,2 uses polyurethane glue, solidification temperature
It is 90 DEG C.It adsorbs skin and uses polished leather, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density 0.4g/cm3.Branch
It supports layer and uses epoxy resin glass-fiber-plate, thickness 0.4mm.Gum layer use non-woven fabrics pressure sensitive adhesive, thickness be 0.15mm (without from
Type paper).Manufacturing step is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 300*300mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：Polyurethane liquid glue is carried out using first glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying, molten
Agent is using acetone etc.) requirement is subsequently bonded according to abrasive sheet, glue content is controlled, glue thickness control is 0.05mm.It is denoted as and grinds
Grind layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Polyurethane liquid glue, using glue spraying, into
Row dries to a certain degree, then is bonded release paper, and glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying)
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer into
Row bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer and gum layer
It is bonded containing glue surface.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is compound to be denoted as supporting layer.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 254mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 2 holes, and the long * wide in hole is 136*67mm.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 100 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 300mm*300mm,
Attrition process board size is 254mm diameter disks, around has side more than part, around absorption layer semi-finished product 254mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 2.25mm.
This kind is mainly the tempered glass lens grinding that 1.0mm sizes are 136*67mm in thickness without cured polishing absorption layer
When, suction-operated is played, while improving grinding precision and grinding qualification rate.
Implementation column 5
1.0mm tempered glass eyeglass is with a kind of without cured polishing absorption layer.It is the disk in 2 holes of band of a diameter of 254mm
The long * wide of structure, hole is 158*78mm, surface grinding layer thickness 1.0mm.It is specifically shown in Fig. 5.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 1.0mm.Adhesive layer one, adhesive layer two use polyurethane glue,
Solidification temperature is 60 DEG C.It adsorbs skin and uses polished leather, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density is
0.4g/cm3.Supporting layer uses PVC board, thickness 0.4mm.It is that 0.15mm (is free of that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,
Release paper).Manufacturing step is as follows:
One, abrasive sheet, adsorbs skin, support plate, and gum layer cuts fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 300*300mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：Polyurethane liquid glue is carried out using first glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying, molten
Agent is using acetone etc.) requirement is subsequently bonded according to abrasive sheet, glue content is controlled, glue thickness control is 0.05mm.It is denoted as and grinds
Grind layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Polyurethane liquid glue, using glue spraying, into
Row dries to a certain degree, then is bonded release paper, and glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying)
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer into
Row bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer and gum layer
It is bonded containing glue surface.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 254mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 2 holes, and the long * wide in hole is 158*78mm.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 100 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 300mm*300mm,
Attrition process board size is 254mm diameter disks, around has side more than part, around absorption layer semi-finished product 254mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 2.25mm.
This kind is mainly the tempered glass lens grinding that 1.0mm sizes are 158*78mm in thickness without cured polishing absorption layer
When, suction-operated is played, while improving grinding precision and grinding qualification rate.
Implementation column 6
2.0mm quartz glass eyeglass is with a kind of without cured polishing absorption layer.It is the circle of 35 circular holes of band of a diameter of 350mm
Dish structure, a diameter of 38mm in hole, surface grinding layer thickness 2.0mm.It is specifically shown in Fig. 6.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 2.0mm.The use EVA hot-melt adhesive film of adhesive layer one, fusing point are
100 DEG C, thickness is 0.07mm (being free of release paper).It is 60 DEG C that adhesive layer two, which uses polyurethane glue, solidification temperature,.Absorption skin is adopted
With damping cloth, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density 0.4g/cm3.Supporting layer uses epoxy resin
Glass-fiber-plate, thickness 0.4mm.It is 0.15mm (being free of release paper) that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,.Manufacturing step is such as
Under:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 400*400mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：EVA hot-melt adhesive film, 100 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.The stage EVA hot-melt adhesive back of the membrane release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Polyurethane liquid glue, using glue spraying, into
Row dries to a certain degree, then is bonded release paper, and glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying)
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer into
Row bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer and gum layer
It is bonded containing glue surface.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 350mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 35 circular holes, a diameter of 38mm in hole.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 100 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 350mm diameter disks, around has side more than part, around absorption layer semi-finished product 350mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 2.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 3.25mm.
This kind polishes absorption layer mainly when thickness is the quartz glass lens grinding of a diameter of 38mm of 2.0mm without cured,
To suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 7
2.0mm quartz glass eyeglass is with a kind of without cured polishing absorption layer.It is the circle in 35 gardens of band hole of a diameter of 350mm
Dish structure, a diameter of 40mm of circular hole, surface grinding layer thickness 2.0mm.It is specifically shown in Fig. 7.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 2.0mm.Adhesive layer 1 uses TPU hot melt adhesive films, fusing point 100
DEG C, thickness is 0.07mm (being free of release paper).It is 60 DEG C that adhesive layer 2, which uses polyurethane glue, solidification temperature,.Skin is adsorbed using resistance
Ni Bu, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density 0.4g/cm3.Supporting layer uses PC plate, and thickness is
0.4mm.It is 0.15mm (being free of release paper) that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,.Manufacturing step is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 400*400mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Polyurethane liquid glue, using glue spraying, into
Row dries to a certain degree, then is bonded release paper, and glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying)
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer into
Row bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer and gum layer
It is bonded containing glue surface.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 350mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 35 circular holes, a diameter of 40mm in hole.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 100 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
Afterwards use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time be 20s~1min, hot pressing pressure 5PSI~
50PSII.According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 350mm diameter disks, around has side more than part, around absorption layer semi-finished product 350mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 3.25mm.
This kind polishes absorption layer mainly when thickness is the quartz glass lens grinding of a diameter of 40mm of 2.0mm without cured,
To suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 8
2.0mm quartz glass eyeglass is with a kind of without cured polishing absorption layer.It is the circle of 20 circular holes of band of a diameter of 350mm
Dish structure, a diameter of 46mm of circular hole, surface grinding layer thickness 2.0mm.It is specifically shown in Fig. 8.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 2.0mm；Adhesive layer one uses polyurethane glue, solidification temperature
It is 60 DEG C；It is 110 DEG C that adhesive layer two, which uses PO hot melt adhesive films, fusing point, and thickness is 0.07mm (being free of release paper)；Skin is adsorbed to use
Damp cloth, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density 0.4g/cm3.Supporting layer uses epoxy resin glass
Fine plate, thickness 0.4mm；It is 0.15mm (being free of release paper) that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,.
Manufacturing step is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 400*400mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：Polyurethane liquid glue is carried out using first glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying, molten
Agent is using acetone etc.) requirement is subsequently bonded according to abrasive sheet, glue content is controlled, glue thickness control is 0.05mm.It is denoted as and grinds
Grind layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：PO hot melt adhesive films, 110 DEG C of fusing point use
Hot pressing laminating type, 120 DEG C or so of the hot pressing temperature of setting, hot pressing time are 20s~1min, hot pressing pressure 10PSI.It can basis
Support plate and hot melt adhesive film characteristic are micro-adjusted.Stage PO hot melt adhesive films back side release paper is reserved state.The faces support plate B
It is bonded with gum layer.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer,
It is bonded containing glue surface with gum layer.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is compound to be denoted as supporting layer
Plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 350mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 20 circular holes, a diameter of 46mm in hole.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 70 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 5PSI~50PSI.According to support plate, polyurethane adhesive adsorbs skin
Characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 120 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 350mm diameter disks, around has side more than part, around absorption layer semi-finished product 350mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 3.25mm.
This kind polishes absorption layer mainly when thickness is the quartz glass lens grinding of a diameter of 46mm of 2.0mm without cured,
To suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 9
0.2mm silicon chips are with a kind of without cured polishing absorption layer.It is the disc structure in 6 holes of band of a diameter of 305mm, Kong Wei
Diagonal line 100mm eight-sided formations, surface grinding layer thickness 0.2mm.It is specifically shown in Fig. 9.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 0.2mm；Adhesive layer one uses polyurethane glue, solidification temperature
It is 60 DEG C；It is 90 DEG C that adhesive layer two, which uses EVA hot-melt adhesive film, fusing point, and thickness is 0.03mm (being free of release paper)；Skin is adsorbed to use
Damp cloth, porosity 60%, thickness 0.4mm, 5 μm of aperture diameter, density 0.4g/cm3.Preferably, supporting layer uses ring
Oxygen resin glass fiber plate, thickness 0.2mm；It is 0.1mm (being free of release paper) that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,.Manufacture
Steps are as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 350*350mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：Polyurethane liquid glue is carried out using first glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying, molten
Agent is using acetone etc.) requirement is subsequently bonded according to abrasive sheet, glue content is controlled, glue thickness control is 0.03mm.It is denoted as and grinds
Grind layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：EVA hot-melt adhesive film, 90 DEG C of fusing point use
Hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time are 20s~1min, hot pressing pressure 20PSI.It can basis
Support plate and hot melt adhesive film characteristic are micro-adjusted.The stage EVA hot-melt adhesive back of the membrane release paper is reserved state.Support plate B
Face and gum layer are bonded.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum
The glue surface that contains of layer and gum layer is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer
Composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 305mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 6 holes, and hole is diagonal line 100mm eight-sided formations.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 70 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 350mm*350mm,
Attrition process board size is 305mm diameter disks, around has side more than part, around absorption layer semi-finished product 305mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 1.0mm sapphires eyeglass is obtained to be adsorbed without cured polishing with a kind of
Pad, overall thickness about 1.0mm.
This kind is mainly that the silicon chip that the holes 0.2mm are diagonal line 100mm eight-sided formations is ground in thickness without cured polishing absorption layer
When mill, suction-operated is played, while improving grinding precision and grinding qualification rate.
Implementation column 10
0.3mm silicon chips are with a kind of without cured polishing absorption layer.It is the disc structure in 6 holes of band of a diameter of 508mm, Kong Wei
Diagonal line 150mm eight-sided formations, surface grinding layer thickness 0.3mm.It is specifically shown in Figure 10.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 0.3mm；The use TPU hot melt adhesive films of adhesive layer one, fusing point are
100 DEG C, thickness is 0.03mm (being free of release paper)；It is 90 DEG C that adhesive layer two, which uses epoxy construction glue, solidification temperature,；Adsorb skin
Using damping cloth, porosity 60%, thickness 0.4mm, 5 μm of aperture diameter, density 0.4g/cm3.Supporting layer uses asphalt mixtures modified by epoxy resin
Fat glass-fiber-plate, thickness 0.2mm；It is 0.15mm (being free of release paper) that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,.Manufacturing step
It is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 550*550mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 100 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 110 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Epoxy structural rubber is carried out using glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying) root
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer carry out
Bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B containing facing towards gum layer and gum layer
Glue surface is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 508mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 6 holes, and hole is diagonal line 150mm eight-sided formations.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：The epoxy structural rubber of supporting layer composite plate is carried on the back
The release paper in face is thrown off, then is bonded absorption skin smooth surface in epoxy construction film surface, using hot pressing laminating type, the hot pressing of setting
Temperature is 100 DEG C or so, and hot pressing time is 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, epoxy construction
Glue, absorption skin characteristic are adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption skin microcellular structure face connect
It touches.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness, so
It is 20s~1min, hot pressing pressure 20PSI to use hot pressing laminating type, 110 DEG C or so of the hot pressing temperature of setting, hot pressing time afterwards.
According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 550mm*550mm,
Attrition process board size is 508mm diameter disks, around has side more than part, around absorption layer semi-finished product 508mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 0.3mm silicon chips are obtained with a kind of without cured polishing absorption layer, always
Thickness about 1.2mm.
This kind is mainly that the silicon chip that the holes 0.3mm are diagonal line 150mm eight-sided formations is ground in thickness without cured polishing absorption layer
When mill, suction-operated is played, while improving grinding precision and grinding qualification rate.
Implementation column 11
0.4mm silicon chips are with a kind of without cured polishing absorption layer.It is the disc structure in 4 holes of band of a diameter of 550mm, Kong Wei
Diagonal line 200mm eight-sided formations, surface grinding layer thickness 0.4mm.It is specifically shown in Figure 11.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 0.4mm；Adhesive layer one, two uses polyurethane glue, solidification temperature
Degree is 90 DEG C；Skin is adsorbed using damping cloth, porosity 60%, thickness 0.5mm, 5 μm of aperture diameter, density 0.4g/cm3。
Supporting layer uses epoxy resin glass-fiber-plate, thickness 0.4mm；It is that 0.15mm (is free of that gum layer, which uses non-woven fabrics pressure sensitive adhesive, thickness,
Release paper).Manufacturing step is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 600*600mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：Polyurethane liquid glue is carried out using first glue spraying
It dries to a certain degree, then is bonded release paper, glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying, molten
Agent is using acetone etc.) requirement is subsequently bonded according to abrasive sheet, glue content is controlled, glue thickness control is 0.05mm.It is denoted as and grinds
Grind layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：Polyurethane liquid glue, using glue spraying, into
Row dries to a certain degree, then is bonded release paper, and glue face impurity is prevented to be mixed into.(glue adjusts solid content according to brush coating and glue spraying)
It is subsequently bonded requirement according to abrasive sheet, controls glue content, glue thickness control is 0.05mm.The faces support plate B and gum layer into
Row bonding.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum layer and gum layer
It is bonded containing glue surface.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is compound to be denoted as supporting layer.
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 550mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 4 holes, and hole is diagonal line 200mm eight-sided formations.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By the polyurethane adhesive back side of supporting layer composite plate
Release paper throw off, then be bonded absorption skin smooth surface in polyurethane adhesive layer surface, using hot pressing laminating type, the hot pressing temperature of setting
It it is 100 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, polyurethane adhesive, absorption
Skin characteristic is adjusted.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：Grinding layer is processed into the poly- ammonia of plate
The release paper at the ester gum back side is thrown off, by glued membrane face paste together in absorption skin composite plate on, glued membrane face and absorption skin microcellular structure face
Contact.In the hole of the grinding layer processing plate center processing removal on surface, the steel disc mold of filling and its size consistency of thickness,
Then it is 20s~1min, hot pressing pressure to use hot pressing laminating type, 100 DEG C or so of the hot pressing temperature of setting, hot pressing time
20PSI.According to support plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 600mm*600mm,
Attrition process board size is 550mm diameter disks, around has side more than part, around absorption layer semi-finished product 550mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 0.4mm silicon chips are obtained with a kind of without cured polishing absorption layer, always
Thickness about 1.6mm.
This kind of absorption layer mainly when thickness is the silicon chip grinding that the holes 0.4mm are diagonal line 200mm eight-sided formations, plays
Suction-operated, while improving grinding precision and grinding qualification rate.
Implementation column 12
0.2mm wafers are with a kind of without cured polishing absorption layer.It is the disc structure of 6 circular holes of band of a diameter of 350mm, circle
Bore dia is 100mm, surface grinding layer thickness 0.2mm.It is specifically shown in Figure 12.
Abrasive sheet uses epoxy resin glass-fiber-plate, thickness 0.2mm；Adhesive layer one, two uses tpu hot melt adhesive films, fusing point
It it is 80 DEG C, thickness is 0.03mm (being free of release paper)；Skin is adsorbed using damping cloth, porosity 60%, thickness 0.4mm, gap
5 μm of diameter, density 0.4g/cm3.Supporting layer uses epoxy resin glass-fiber-plate, thickness 0.2mm；Gum layer uses non-woven fabrics
Pressure sensitive adhesive, thickness are 0.1mm (being free of release paper).Manufacturing step is as follows:
One, abrasive sheet, absorption skin, support plate, gum layer cut fixed dimension.Its concrete mode is：Above-mentioned material is led to
Machine cuts (guillotine) are crossed, 400*400mm sizes are cut into.
Two, abrasive sheet and adhesive layer one are bonded.Its concrete mode is：TPU hot melt adhesive films, 80 DEG C of fusing point, using heat
Laminating type is pressed, for the hot pressing temperature set as 90 DEG C or so, hot pressing time is 20s~1min, hot pressing pressure 20PSI.It can basis
Abrasive sheet and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.It is denoted as grinding
Layer composite plate.
Three, the faces support plate A and adhesive layer two are bonded.Its concrete mode is：TPU hot melt adhesive films, 80 DEG C of fusing point use
Hot pressing laminating type, 90 DEG C or so of the hot pressing temperature of setting, hot pressing time are 20s~1min, hot pressing pressure 20PSI.It can basis
Support plate and hot melt adhesive film characteristic are micro-adjusted.Stage TPU hot melt adhesive films back side release paper is reserved state.Support plate B
Face and gum layer are bonded.Its concrete mode is：The gum layer of winding, by laminator, by support plate B facing towards gum
The glue surface that contains of layer and gum layer is bonded.The laminator speed of service is 0.5m/min~2m/min, is adjusted.It is denoted as supporting layer
Composite plate
Four, grinding layer composite plate is processed, and is cut into the drawing size of client's needs.Its concrete mode is：It will grinding
Layer composite plate carries out high-precision processing, is cut into the outer circle of 350mm diameters according to drawing and at this by CNC machining centers
Circle center cuts 6 circular holes, a diameter of 100mm of circular hole.
Five, supporting layer composite plate and absorption skin bonding.Its concrete mode is：By supporting layer composite plate hot melt adhesive film surface from
Type paper is thrown off, then is bonded absorption skin smooth surface in hot melt adhesive film surface, and using hot pressing laminating type, the hot pressing temperature set is 90 DEG C of left side
The right side, hot pressing time are 20s~1min, hot pressing pressure 10PSI~50PSI.According to support plate, hot melt adhesive film, absorption skin characteristic into
Row adjustment.It is denoted as absorption skin composite plate.
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded.Its concrete mode is：By grinding layer processing plate hot melt
The release paper in glued membrane face is thrown off, and by glued membrane face paste together in adsorbing on skin composite plate, glued membrane face and absorption surface contact.On surface
The processing removal of grinding layer processing plate center hole in, then the steel disc mold of filling and its size consistency of thickness uses heat
It is 20s~1min, hot pressing pressure 20PSI to press laminating type, 90 DEG C or so of the hot pressing temperature of setting, hot pressing time.According to support
Plate, hot melt adhesive film, adsorbs skin and abrasive sheet characteristic is micro-adjusted.It is denoted as absorption layer semi-finished product.
Seven, edge is cut, redundance removal.Its concrete mode is：Since starting cutter size is 400mm*400mm,
Attrition process board size is 350mm diameter disks, around has side more than part, around absorption layer semi-finished product 350mm diameter disks
Redundance the modes such as cuts using cutting die and removes.End article 0.2mm wafers are obtained with a kind of without cured polishing absorption layer, always
Thickness about 1.0mm.
This kind mainly when thickness is the grinding wafer that the holes 0.2mm are diameter 100mm circle, plays suction without cured polishing absorption layer
Attached effect, while improving grinding precision and grinding qualification rate.
Claims (24)
1. a kind of production method without cured polishing absorption layer, it is characterized in that including abrasive sheet, adhesive layer one, absorption skin, adhesive layer
Two, support plate, gum layer, adhesive layer one, adhesive layer two select hot melt adhesive film, and steps are as follows：
One, abrasive sheet, adhesive layer one, adhesive layer two, absorption skin, support plate, gum layer cut into certain size；
Two, abrasive sheet and adhesive layer one are bonded, and obtain grinding layer composite plate；
Three, the first face of support plate and adhesive layer two are bonded；The second face of support plate and gum layer are bonded, and be supported layer
Composite plate；
Four, grinding layer composite plate is processed, and is cut, and grinding layer processing plate is obtained；
Five, supporting layer composite plate and absorption skin bonding, obtain absorption skin composite plate；
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded, obtain absorption layer semi-finished product；
Seven, edge is cut, and redundance removal obtains a kind of without cured polishing absorption layer.
2. the production method as described in claim 1 without cured polishing absorption layer, it is characterized in that：Abrasive sheet is epoxy resin glass
One kind in plate, PC plate or PVC board.
3. the production method as described in claim 1 without cured polishing absorption layer, it is characterized in that：Adhesive layer one and/or adhesive layer
Two be one kind in TPU hot melt adhesive films, EVA hot-melt adhesive film, PO hot melt adhesive films, PU hot melt adhesive films.
4. the production method as described in claim 1 without cured polishing absorption layer, it is characterized in that：Adsorb skin be damping cloth, PU skins,
One kind in micro fiber leather or polished leather.
5. the production method as described in claim 1 without cured polishing absorption layer, it is characterized in that：Support plate is epoxy resin glass
One kind in plate, PC plate, PVC board or PET sheet.
6. the production method as described in claim 1 without cured polishing absorption layer, it is characterized in that：Gum layer is pressure sensitive double faced adhesive tape
Band.
7. a kind of production method without cured polishing absorption layer, it is characterized in that including abrasive sheet, adhesive layer one, absorption skin, adhesive layer
Two, support plate, gum layer, adhesive layer one, adhesive layer two are liquid glue, and steps are as follows：
One, abrasive sheet, absorption skin, support plate, gum layer cut into certain size；
Two, abrasive sheet and adhesive layer one are bonded, and obtain grinding layer composite plate；
Three, the first face of support plate and adhesive layer two are bonded, and the second face of support plate and gum layer are bonded, and be supported layer
Composite plate；
Four, grinding layer composite plate is processed, and is cut, and grinding layer processing plate is obtained；
Five, supporting layer composite plate and absorption skin bonding, obtain absorption skin composite plate；
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded, obtain absorption layer semi-finished product；
Seven, edge is cut, and redundance removal obtains a kind of without cured polishing absorption layer.
8. the production method as claimed in claim 7 without cured polishing absorption layer, it is characterized in that：Abrasive sheet is epoxy resin glass
One kind in plate, PC plate or PVC board.
9. the production method as claimed in claim 7 without cured polishing absorption layer, it is characterized in that：Adhesive layer one and/or adhesive layer
Two be one kind in epoxy structural rubber or polyurethane glue.
10. the production method as claimed in claim 7 without cured polishing absorption layer, it is characterized in that：It is damping cloth, PU to adsorb skin
One kind in skin, micro fiber leather or polished leather.
11. the production method as claimed in claim 7 without cured polishing absorption layer, it is characterized in that：Support plate is epoxy resin glass
One kind in fine plate, PC plate, PVC board or PET sheet.
12. the production method as claimed in claim 7 without cured polishing absorption layer, it is characterized in that：Gum layer is that pressure sensitive is two-sided
Adhesive tape.
13. a kind of production method without cured polishing absorption layer, it is characterized in that including abrasive sheet, adhesive layer one, absorption skin, adhesive layer
Two, support plate, gum layer, adhesive layer one are hot melt adhesive film, and adhesive layer two is liquid glue, and steps are as follows：
One, abrasive sheet, adhesive layer one, absorption skin, support plate, gum layer cut into certain size；
Two, abrasive sheet and adhesive layer one are bonded, and obtain grinding layer composite plate；
Three, the first face of support plate and adhesive layer two are bonded, and the second face of support plate and gum layer are bonded, and be supported layer
Composite plate；
Four, grinding layer composite plate is processed, and is cut, and grinding layer processing plate is obtained；
Five, supporting layer composite plate and absorption skin bonding, obtain absorption skin composite plate；
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded, obtain absorption layer semi-finished product；
Seven, edge is cut, and redundance removal obtains a kind of without cured polishing absorption layer.
14. the production method as claimed in claim 13 without cured polishing absorption layer, it is characterized in that：Abrasive sheet is epoxy resin glass
One kind in fine plate, PC plate or PVC board.
15. the production method as claimed in claim 13 without cured polishing absorption layer, it is characterized in that：Adhesive layer one and/or gluing
Layer two is in TPU hot melt adhesive films, EVA hot-melt adhesive film, PO hot melt adhesive films, PU hot melt adhesive films, epoxy structural rubber or polyurethane glue
One kind.
16. the production method as claimed in claim 13 without cured polishing absorption layer, it is characterized in that：It is damping cloth, PU to adsorb skin
One kind in skin, micro fiber leather or polished leather.
17. the production method as claimed in claim 13 without cured polishing absorption layer, it is characterized in that：Support plate is epoxy resin glass
One kind in fine plate, PC plate, PVC board or PET sheet.
18. the production method as claimed in claim 13 without cured polishing absorption layer, it is characterized in that：Gum layer is that pressure sensitive is two-sided
Adhesive tape.
19. a kind of production method without cured polishing absorption layer, it is characterized in that including abrasive sheet, adhesive layer one, absorption skin, adhesive layer
Two, support plate, gum layer, adhesive layer one are liquid glue, and adhesive layer two is hot melt adhesive film, and steps are as follows：
One, abrasive sheet, adhesive layer two, absorption skin, support plate, gum layer cut into certain size；
Two, abrasive sheet and adhesive layer one are bonded, and obtain grinding layer composite plate；
Three, the first face of support plate and adhesive layer two are bonded, and the second face of support plate and gum layer are bonded, and be supported layer
Composite plate；
Four, grinding layer composite plate is processed, and is cut, and grinding layer processing plate is obtained；
Five, supporting layer composite plate and absorption skin bonding, obtain absorption skin composite plate；
Six, it adsorbs skin composite plate and grinding layer processing plate is bonded, obtain absorption layer semi-finished product；
Seven, edge is cut, and redundance removal obtains a kind of without cured polishing absorption layer.
20. the production method as claimed in claim 19 without cured polishing absorption layer, it is characterized in that：Abrasive sheet is epoxy resin glass
One kind in fine plate, PC plate or PVC board.
21. the production method as claimed in claim 19 without cured polishing absorption layer, it is characterized in that：Adhesive layer one and/or gluing
Layer two is in TPU hot melt adhesive films, EVA hot-melt adhesive film, PO hot melt adhesive films, PU hot melt adhesive films, epoxy structural rubber or polyurethane glue
One kind.
22. the production method as claimed in claim 19 without cured polishing absorption layer, it is characterized in that：It is damping cloth, PU to adsorb skin
One kind in skin, micro fiber leather or polished leather.
23. the production method as claimed in claim 19 without cured polishing absorption layer, it is characterized in that：Support plate is epoxy resin glass
One kind in fine plate, PC plate, PVC board or PET sheet.
24. the production method as claimed in claim 19 without cured polishing absorption layer, it is characterized in that：Gum layer is that pressure sensitive is two-sided
Adhesive tape.
Priority Applications (1)
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| JP6917058B2 (en) * | 2017-06-06 | 2021-08-11 | 丸石産業株式会社 | Polishing method using a polishing pad provided with an adsorption layer |
| CN108608701A (en) * | 2018-04-24 | 2018-10-02 | 安徽禾臣新材料有限公司 | A kind of automobile polishing damping cloth |
| CN108582905A (en) * | 2018-04-24 | 2018-09-28 | 安徽禾臣新材料有限公司 | A kind of liquid crystal display production polishing preparation method of damping cloth |
| CN113199395B (en) * | 2021-03-31 | 2022-07-01 | 安徽禾臣新材料有限公司 | Dust-free coated replaceable filtering and adsorbing pad and implementation method thereof |
| CN113414706A (en) * | 2021-06-26 | 2021-09-21 | 东莞市中微纳米科技有限公司 | Special pad for ultra-fine grinding of semiconductor |
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| CN87202507U (en) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | Wax-free polishing gasket for silicon pellet |
| CN102581750A (en) * | 2012-03-31 | 2012-07-18 | 天津西美科技有限公司 | Wax-free grinding and polishing template with double inlaying layers |
| CN202507187U (en) * | 2012-03-31 | 2012-10-31 | 天津西美科技有限公司 | Single-inlaying layer wax-free grinding and polishing pattern plate |
| CN103476546A (en) * | 2011-04-21 | 2013-12-25 | 东洋橡胶工业株式会社 | Laminated polishing pad |
| CN103465155A (en) * | 2013-09-06 | 2013-12-25 | 蓝思科技股份有限公司 | Epoxy resin type diamond grinding pad and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3152188B2 (en) * | 1997-11-28 | 2001-04-03 | 日本電気株式会社 | Polishing pad |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN87202507U (en) * | 1987-03-02 | 1988-03-23 | 天津市半导体技术研究所 | Wax-free polishing gasket for silicon pellet |
| CN103476546A (en) * | 2011-04-21 | 2013-12-25 | 东洋橡胶工业株式会社 | Laminated polishing pad |
| CN102581750A (en) * | 2012-03-31 | 2012-07-18 | 天津西美科技有限公司 | Wax-free grinding and polishing template with double inlaying layers |
| CN202507187U (en) * | 2012-03-31 | 2012-10-31 | 天津西美科技有限公司 | Single-inlaying layer wax-free grinding and polishing pattern plate |
| CN103465155A (en) * | 2013-09-06 | 2013-12-25 | 蓝思科技股份有限公司 | Epoxy resin type diamond grinding pad and manufacturing method thereof |
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Effective date of registration: 20180105 Address after: Hangzhou City, Zhejiang province 311100 Yuhang District Yuhang Street Huayi Road No. 2 Applicant after: ZHEJIANG HUAZHENG NEW MATERIAL GROUP Co.,Ltd. Applicant after: HANGZHOU LESON INSULATION Co.,Ltd. Address before: Venus Huayi Industrial Park Road Yuhang town Hangzhou city Zhejiang province 311121 No. 2 Applicant before: ZHEJIANG HUAZHENG NEW MATERIAL GROUP Co.,Ltd. |
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Denomination of invention: A wax free polishing adsorption pad and its manufacturing method Effective date of registration: 20231128 Granted publication date: 20180727 Pledgee: Agricultural Bank of China Limited Hangzhou Yuhang Branch Pledgor: ZHEJIANG HUAZHENG NEW MATERIAL GROUP Co.,Ltd. Registration number: Y2023980067733 |