CN103476546A - Laminated polishing pad - Google Patents
Laminated polishing pad Download PDFInfo
- Publication number
- CN103476546A CN103476546A CN201280018985XA CN201280018985A CN103476546A CN 103476546 A CN103476546 A CN 103476546A CN 201280018985X A CN201280018985X A CN 201280018985XA CN 201280018985 A CN201280018985 A CN 201280018985A CN 103476546 A CN103476546 A CN 103476546A
- Authority
- CN
- China
- Prior art keywords
- layer
- grinding
- stacked
- grinding pad
- melt adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 175
- 239000012790 adhesive layer Substances 0.000 claims abstract description 71
- 239000004831 Hot glue Substances 0.000 claims abstract description 63
- 229920000728 polyester Polymers 0.000 claims abstract description 52
- 239000003822 epoxy resin Substances 0.000 claims abstract description 30
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 30
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 15
- 229920001225 polyester resin Polymers 0.000 claims abstract description 14
- 239000004645 polyester resin Substances 0.000 claims abstract description 14
- 229920005601 base polymer Polymers 0.000 claims abstract description 11
- 238000000227 grinding Methods 0.000 claims description 271
- 239000000463 material Substances 0.000 claims description 77
- 238000000034 method Methods 0.000 claims description 52
- 238000004519 manufacturing process Methods 0.000 claims description 38
- 238000010438 heat treatment Methods 0.000 claims description 37
- 229920005989 resin Polymers 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 32
- 239000012780 transparent material Substances 0.000 claims description 28
- 229920002799 BoPET Polymers 0.000 claims description 20
- 239000004065 semiconductor Substances 0.000 claims description 20
- 238000010030 laminating Methods 0.000 claims description 19
- 239000005041 Mylar™ Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 239000010408 film Substances 0.000 description 55
- 229920005749 polyurethane resin Polymers 0.000 description 30
- 238000005187 foaming Methods 0.000 description 28
- -1 polytetrafluoroethylene Polymers 0.000 description 26
- 239000000203 mixture Substances 0.000 description 23
- 229920005862 polyol Polymers 0.000 description 20
- 150000003077 polyols Chemical class 0.000 description 20
- 238000002360 preparation method Methods 0.000 description 18
- 239000002002 slurry Substances 0.000 description 16
- 238000002844 melting Methods 0.000 description 15
- 230000008018 melting Effects 0.000 description 15
- 239000003795 chemical substances by application Substances 0.000 description 12
- 239000012948 isocyanate Substances 0.000 description 12
- 239000000126 substance Substances 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 9
- 150000002513 isocyanates Chemical class 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 8
- 239000004843 novolac epoxy resin Substances 0.000 description 8
- 239000004753 textile Substances 0.000 description 8
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 229940079593 drug Drugs 0.000 description 6
- 239000003814 drug Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 229920000768 polyamine Polymers 0.000 description 5
- 238000010008 shearing Methods 0.000 description 5
- 150000005846 sugar alcohols Polymers 0.000 description 5
- YXFVVABEGXRONW-UHFFFAOYSA-N toluene Substances CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 5
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 208000034189 Sclerosis Diseases 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 4
- 150000002148 esters Chemical group 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920002635 polyurethane Polymers 0.000 description 4
- 239000004814 polyurethane Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 description 3
- 241001112258 Moca Species 0.000 description 3
- URLKBWYHVLBVBO-UHFFFAOYSA-N Para-Xylene Chemical group CC1=CC=C(C)C=C1 URLKBWYHVLBVBO-UHFFFAOYSA-N 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 239000000155 melt Substances 0.000 description 3
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- GTACSIONMHMRPD-UHFFFAOYSA-N 2-[4-[2-(benzenesulfonamido)ethylsulfanyl]-2,6-difluorophenoxy]acetamide Chemical compound C1=C(F)C(OCC(=O)N)=C(F)C=C1SCCNS(=O)(=O)C1=CC=CC=C1 GTACSIONMHMRPD-UHFFFAOYSA-N 0.000 description 2
- SVTBMSDMJJWYQN-UHFFFAOYSA-N 2-methylpentane-2,4-diol Chemical compound CC(O)CC(C)(C)O SVTBMSDMJJWYQN-UHFFFAOYSA-N 0.000 description 2
- YOJKEVXNAVNUGW-UHFFFAOYSA-N 4-n-chlorobenzene-1,4-diamine Chemical compound NC1=CC=C(NCl)C=C1 YOJKEVXNAVNUGW-UHFFFAOYSA-N 0.000 description 2
- 101710130081 Aspergillopepsin-1 Proteins 0.000 description 2
- 102100031007 Cytosolic non-specific dipeptidase Human genes 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229960004050 aminobenzoic acid Drugs 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 125000000853 cresyl group Chemical class C1(=CC=C(C=C1)C)* 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 229940051250 hexylene glycol Drugs 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920006284 nylon film Polymers 0.000 description 2
- 238000007500 overflow downdraw method Methods 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000004632 polycaprolactone Substances 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- WYYWMBKUPQWNRU-UHFFFAOYSA-N (2-methyl-1-phenylpropyl)benzene Chemical compound C=1C=CC=CC=1C(C(C)C)C1=CC=CC=C1 WYYWMBKUPQWNRU-UHFFFAOYSA-N 0.000 description 1
- FEOHYDSNGHIXOM-WLDMJGECSA-N (3R,4R,5S,6R)-3-amino-6-(hydroxymethyl)-2-methyloxane-2,4,5-triol Chemical compound CC1(O)[C@H](N)[C@@H](O)[C@H](O)[C@H](O1)CO FEOHYDSNGHIXOM-WLDMJGECSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- RTTZISZSHSCFRH-UHFFFAOYSA-N 1,3-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC(CN=C=O)=C1 RTTZISZSHSCFRH-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- ALVZNPYWJMLXKV-UHFFFAOYSA-N 1,9-Nonanediol Chemical compound OCCCCCCCCCO ALVZNPYWJMLXKV-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- FRPZMMHWLSIFAZ-UHFFFAOYSA-N 10-undecenoic acid Chemical compound OC(=O)CCCCCCCCC=C FRPZMMHWLSIFAZ-UHFFFAOYSA-N 0.000 description 1
- QJCFYQIGJFOHNQ-UHFFFAOYSA-N 2,2,3-trimethylpentane-1,1-diol Chemical compound CCC(C)C(C)(C)C(O)O QJCFYQIGJFOHNQ-UHFFFAOYSA-N 0.000 description 1
- ICVIFRMLTBUBGF-UHFFFAOYSA-N 2,2,6,6-tetrakis(hydroxymethyl)cyclohexan-1-ol Chemical compound OCC1(CO)CCCC(CO)(CO)C1O ICVIFRMLTBUBGF-UHFFFAOYSA-N 0.000 description 1
- BRPSAOUFIJSKOT-UHFFFAOYSA-N 2,3-dichloroaniline Chemical compound NC1=CC=CC(Cl)=C1Cl BRPSAOUFIJSKOT-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- UXFQFBNBSPQBJW-UHFFFAOYSA-N 2-amino-2-methylpropane-1,3-diol Chemical compound OCC(N)(C)CO UXFQFBNBSPQBJW-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical compound NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- YHFGMFYKZBWPRW-UHFFFAOYSA-N 3-methylpentane-1,1-diol Chemical compound CCC(C)CC(O)O YHFGMFYKZBWPRW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- HNWJOHZBIJGTJB-UHFFFAOYSA-N C(C)C=1C(=C(C(=C(C1)CC1=CC=CC=C1)CC)CC)CC Chemical compound C(C)C=1C(=C(C(=C(C1)CC1=CC=CC=C1)CC)CC)CC HNWJOHZBIJGTJB-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- KMTRUDSVKNLOMY-UHFFFAOYSA-N Ethylene carbonate Chemical compound O=C1OCCO1 KMTRUDSVKNLOMY-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- CTKINSOISVBQLD-UHFFFAOYSA-N Glycidol Chemical compound OCC1CO1 CTKINSOISVBQLD-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229920000305 Nylon 6,10 Polymers 0.000 description 1
- AYDQIZKZTQHYIY-UHFFFAOYSA-N OC(=O)C1(C)CC(C(O)=O)=CC=C1 Chemical compound OC(=O)C1(C)CC(C(O)=O)=CC=C1 AYDQIZKZTQHYIY-UHFFFAOYSA-N 0.000 description 1
- 239000002033 PVDF binder Substances 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 229920005830 Polyurethane Foam Polymers 0.000 description 1
- WUGQZFFCHPXWKQ-UHFFFAOYSA-N Propanolamine Chemical compound NCCCO WUGQZFFCHPXWKQ-UHFFFAOYSA-N 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000005376 alkyl siloxane group Chemical group 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-N anhydrous cyanic acid Natural products OC#N XLJMAIOERFSOGZ-UHFFFAOYSA-N 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 235000009508 confectionery Nutrition 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- VSSAZBXXNIABDN-UHFFFAOYSA-N cyclohexylmethanol Chemical compound OCC1CCCCC1 VSSAZBXXNIABDN-UHFFFAOYSA-N 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- 150000005690 diesters Chemical class 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 229940043237 diethanolamine Drugs 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- ZZVUWRFHKOJYTH-UHFFFAOYSA-N diphenhydramine Chemical compound C=1C=CC=CC=1C(OCCN(C)C)C1=CC=CC=C1 ZZVUWRFHKOJYTH-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229960005082 etohexadiol Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002220 fluorenes Chemical class 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- FBPFZTCFMRRESA-GUCUJZIJSA-N galactitol Chemical compound OC[C@H](O)[C@@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-GUCUJZIJSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000026030 halogenation Effects 0.000 description 1
- 238000005658 halogenation reaction Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- GFMIDCCZJUXASS-UHFFFAOYSA-N hexane-1,1,6-triol Chemical compound OCCCCCC(O)O GFMIDCCZJUXASS-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Natural products OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 229920003049 isoprene rubber Polymers 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- CRVGTESFCCXCTH-UHFFFAOYSA-N methyl diethanolamine Chemical compound OCCN(C)CCO CRVGTESFCCXCTH-UHFFFAOYSA-N 0.000 description 1
- FSWDLYNGJBGFJH-UHFFFAOYSA-N n,n'-di-2-butyl-1,4-phenylenediamine Chemical compound CCC(C)NC1=CC=C(NC(C)CC)C=C1 FSWDLYNGJBGFJH-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920006389 polyphenyl polymer Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 239000011496 polyurethane foam Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000013517 stratification Methods 0.000 description 1
- 229960005137 succinic acid Drugs 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 150000000000 tetracarboxylic acids Chemical class 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Laminated Bodies (AREA)
Abstract
The purpose of the present invention is to provide a long-lived laminated polishing pad wherein a polishing layer is resistant to detachment from a support layer even when high temperatures are produced by long periods of polishing. This laminated polishing pad is characterized in that: a polishing layer and a support layer are laminated together with an adhesive member interposed therebetween; said adhesive member is either an adhesive layer containing a polyester-based hot-melt adhesive or double-sided tape that has one of such adhesive layers on each side of a substrate; and for each 100 parts by weight of a polyester-resin base polymer, said polyester-based hot-melt adhesive contains 2-10 parts by weight of an epoxy resin that has at least two glycidyl groups per molecule.
Description
Technical field
The present invention relates to a kind of can to the optical material such as lens, speculum or silicon wafer, glass substrate for hard disk, aluminium base, and requirements such as common metal grinding processing highly the material of surfaces stablize and the stacked grinding pad of the planarization process of high grinding efficiency.Stacked grinding pad of the present invention is particularly suitable for following step: by silicon wafer with and on be formed with the device of oxide skin(coating), metal level etc., further stacked, carry out planarization before forming these oxide skin(coating)s or metal level.
Background technology
When preparing semiconductor device, form conductive film in wafer surface, the row of going forward side by side forms the formation step of wiring layer by photocopy, etching etc., and forms the step etc. of interlayer dielectric on wiring layer, and what by these steps, in the wafer surface generation, the conductor such as metal or insulator, consist of is concavo-convex.In recent years, wiring granular and multiple stratification that the densification of semiconductor integrated circuit of take is purpose are routed in development, meanwhile, make the technology of the concavo-convex planarization of wafer surface also become and become more and more important.
As the method for the concavo-convex planarization that makes wafer surface, generally adopt cmp (hereinafter referred to as CMP).CMP is pressed under the state of abradant surface of grinding pad at the face that is polished by wafer, the technology of using the grinding agent (the following slurry that claims again) of the pulp-like that is dispersed with abrasive material to be ground.In CMP, the general lapping device used possesses: for example, as shown in Figure 1, support grinding pad 1 grinding plate 2, support to be polished the support platform (rubbing head) 5 of material (semiconductor wafer) 4 and for the back lining materials that wafer carried out to evenly pressurization, and the feed mechanism of grinding agent.Grinding pad 1 for example is installed in grinding plate 2 by pasting of two-sided tape.Grinding plate 2 is configured to respectively its grinding pad of supporting 1 and is polished material 4 for opposed state with supporting platform 5, and possesses respectively rotating shaft 6,7.In addition, support platform 5 sides to be provided with for being polished material 4 and be pressed in the pressing mechanism on grinding pad 1.
All the time, the grinding pad as grinding for high accuracy, generally used polyurethane resin foaming body sheet.Yet, although polyurethane resin foaming body sheet local planarization ability excellence, due to the damping characteristics deficiency, thus be difficult to the whole surface uniform of wafer exert pressure.Therefore, usually at the back side of polyurethane resin foaming body sheet, soft cushion is set separately, as stacked grinding pad, is used for attrition process.
For example, disclose a kind of grinding pad in patent documentation 1, it is according to abrasive areas, cushion, and the sequential cascade of transparent support film, and is provided with light transmissive region in the peristome that runs through abrasive areas and cushion and on transparent support film.
Yet, stacked grinding pad all the time is generally with two-sided tape, grinding layer to be closed and forms with the buffering laminating, but in exist grinding, slurry is invaded the durability that causes two-sided tape between grinding layer and cushion and is reduced, and grinding layer and the cushion problem that becomes and easily peel off.
As solution to the problems described above, for example, following technology has been proposed.
Use reactive hot-melt binding agent adhered plastics film and grinding pad are disclosed in patent documentation 2.
In patent documentation 3, disclose by the grinding pad of hot-melt adhesive layer bond coating and grinding layer.
Following technology is disclosed in patent documentation 4, a kind of by the grinding pad of two-sided tape bonded abrasive layer and basalis, arranges and formed by hot-melt adhesive between the back side of grinding layer and two-sided tape, and the sealing layer of partition ground slurry.
But the heat resistance of the hot-melt adhesive of putting down in writing in patent documentation 2-5 is low, in the situation that through for a long time grinding and become high temperature, exist caking property to reduce and problem that grinding layer and cushion etc. become and easily peel off.
The prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2009-172727 communique
Patent documentation 2: TOHKEMY 2002-224944 communique
Patent documentation 3: TOHKEMY 2005-167200 communique
Patent documentation 4: TOHKEMY 2009-95945 communique
Patent documentation 5: Japanese Unexamined Patent Application Publication 2010-525956 communique
Summary of the invention
The problem that invention will solve
Even the object of the present invention is to provide a kind of warp to grind in the situation of the high temperature that becomes for a long time, also be difficult to the long-life stacked grinding pad of peeling off between grinding layer and supporting layer.In addition, except described purpose, purpose also is to provide a kind of crooked stacked grinding pad that do not have.In addition, its purpose also is to provide the manufacture method of the semiconductor device that uses this stacked grinding pad.
Solve the method for problem
Present inventors etc. are artificial solves described problem and research repeatedly, found that and can reach described purpose by stacked grinding pad shown below, thereby completed the present invention.
; the present invention relates to following stacked grinding pad; it is characterized in that: at stacked grinding layer and supporting layer and in the stacked grinding pad that forms by binding material; described binding material is the adhesive layer that contains the polyesters hot-melt adhesive or the two-sided tape that has described adhesive layer on the two sides of base material; described polyesters hot-melt adhesive, with respect to the base polymer mylar of 100 weight portions, has the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
The people such as present inventor find, in the formation material polyesters hot-melt adhesive at adhesive layer, base polymer mylar with respect to 100 weight portions, the epoxy resin that there are two above glycidyls in the per molecule of interpolation 2-10 weight portion, and make mylar crosslinked, even in the situation that through grinding for a long time the high temperature that becomes, the durability of " shearing " that binding material produces when grinding also can improve, and obtains between grinding layer and supporting layer the stacked grinding pad that is difficult to peel off.
In the situation of addition less than 2 weight portions of epoxy resin, while through grinding for a long time, becoming high temperature, the durability of " shearing " produced when grinding due to binding material becomes insufficient, so become and easily peel off between grinding layer and supporting layer.On the other hand, surpass in the situation of 10 weight portions, because the hardness of the adhesive layer too high caking property that makes that becomes reduces, so become and easily peel off between grinding layer and supporting layer.
Preferably, the base polymer mylar is crystalline polyester resin.By using crystalline polyester resin, can improve the resistance to chemical reagents to slurry, and the cohesive force of adhesive layer be become be difficult for reducing.
Stacked grinding pad of the present invention can be that grinding layer and supporting layer have peristome, at the peristome of grinding layer, is provided with transparent material, and the stacked grinding pad of transparent material and binding material bonding.
The preferred 10-200 μ of the thickness of adhesive layer m.In the situation of the thickness less than 10 μ m of adhesive layer, while through grinding for a long time, becoming high temperature, the durability of " shearing " produced when grinding due to binding material becomes insufficient, so become and easily peel off between grinding layer and supporting layer.On the other hand, while surpassing 200 μ m, because the transparency reduces, impact is provided with optical end point and detects the accuracy of detection with the grinding pad of transparent material.
In addition, preferably, the base material of described two-sided tape is after 30 minutes, with the size changing rate of comparing before heating, to be the resin film below 1.2% 150 ℃ of heating.In addition, preferably, when described supporting layer is the high resiliency layer, this high resiliency layer is after 30 minutes, with the size changing rate of comparing before heating, to be the resin film below 1.2% 150 ℃ of heating.In addition, preferably, when described supporting layer is cushion, being arranged on 150 ℃ of heating at the single face of this cushion was the resin film below 1.2% with the size changing rate of comparing before heating after 30 minutes.
While using hot-melt adhesive laminating grinding layer and supporting layer, be necessary the heating and melting hot-melt adhesive, but now the base material of supporting layer and two-sided tape etc. is out of shape (thermal contraction) because of heating, so the problem that exists the final products grinding pad easily to bend.When grinding pad bends, degraded appearance not only, but also the tendency that exists the uniformity of grinding rate to reduce.
As mentioned above, as base material, the high resiliency layer of two-sided tape or be arranged on the resin film of the single face of cushion, be resin film 1.2% below with the size changing rate of comparing before heating by using 150 ℃ of heating after 30 minutes, can effectively suppress the generation of the bending of final products grinding pad.
In addition, preferred 1-15 μ m, more preferably 3-12 μ m of the arithmetic average roughness of the face of the stacked binding material of grinding layer (Ra).Be adjusted into by the Ra by this face the cohesive force that 1-15 μ m can improve grinding layer and binding material.In the situation of Ra less than 1 μ m, the cohesive force of grinding layer and binding material is difficult for improving fully, and Ra surpasses in the situation of 15 μ m, has the tendency that adaptation reduces and cohesive force reduces of grinding layer and binding material.
In addition, more than the preferred 200N/25mm of the shear stress in the time of 80 ℃ between grinding layer and supporting layer, more preferably more than 250N/25mm.During grinding, the temperature of stacked grinding pad rises to 80 ℃ of left and right.If the shear stress in the time of 80 ℃ is more than 200N/25mm, can effectively prevent peeling off of grinding layer and supporting layer.
In addition, stacked grinding pad of the present invention also can be according to grinding layer, binding material, supporting layer, and the sequential cascade of two-sided bonding sheet, and running through grinding layer, binding material, and the through hole of supporting layer is interior and be provided with transparent material on described two-sided bonding sheet, described binding material is the adhesive layer that contains the polyesters hot-melt adhesive, or there is the two-sided tape of described adhesive layer on the two sides of base material, described polyesters hot-melt adhesive is with respect to the base polymer mylar of 100 weight portions, there is the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
In addition, the manufacture method of stacked grinding pad of the present invention comprises: by the stacked grinding layer of binding material and supporting layer and prepare the step of stacked abrasive sheet, form the step of through hole on stacked abrasive sheet, the step of laminating two-sided bonding sheet on the supporting layer of the stacked abrasive sheet that has formed through hole, and in described through hole and the step of transparent material is set on described two-sided bonding sheet, described binding material is the adhesive layer that contains the polyesters hot-melt adhesive, or there is the two-sided tape of described adhesive layer on the two sides of base material, described polyesters hot-melt adhesive is with respect to the base polymer mylar of 100 weight portions, there is the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
In addition, the present invention relates to a kind of manufacture method of semiconductor device, the step that it comprises the surface of using described stacked grinding pad grinding semiconductor chip.
The invention effect
Stacked grinding pad of the present invention forms by the binding material that contains specific polyesters hot-melt adhesive is stacked due to grinding layer and supporting layer, even therefore in the situation that, through grinding and become high temperature for a long time, also be difficult between grinding layer and supporting layer peel off.
The accompanying drawing explanation
Fig. 1 means the summary construction diagram of an example of the lapping device used in CMP grinds.
Fig. 2 means the summary section of an example of stacked grinding pad of the present invention.
Fig. 3 means another routine summary section of stacked grinding pad of the present invention.
The specific embodiment
Grinding layer in the present invention is so long as have the foaming body of micro air bubble and just be not particularly limited.For example, can enumerate a kind or mixture of more than two kinds in polyurethane resin, mylar, polyamide, acrylic resin, polycarbonate resin, halogenation resinoid (polyvinyl chloride, polytetrafluoroethylene (PTFE), polyvinylidene fluoride etc.), polystyrene, olefine kind resin (polyethylene, polypropylene etc.), epoxy resin, photoresist etc.The polyurethane resin excellent in abrasion resistance, and, by the raw material composition is carried out various changes and can easily obtain the polymer with desired characteristic, be therefore to form the particularly preferably material of material as grinding layer.Below, the representative using polyurethane resin as described foaming body is described.
Described polyurethane resin by isocyanate prepolymer composition, polyol component (high molecular weight polyols, low molecular weight polyols), and the chain elongation agent form.
As isocyanate prepolymer composition, can use without particular limitation known compound in polyurethane field.As isocyanate prepolymer composition, for example can enumerate: 2, the 4-toluene di-isocyanate(TDI), 2, the 6-toluene di-isocyanate(TDI), 2, 2 '-methyl diphenylene diisocyanate, 2, 4 '-methyl diphenylene diisocyanate, 4, 4 '-methyl diphenylene diisocyanate, 1, the 5-naphthalene diisocyanate, PPDI, m-benzene diisocyanate, the paraxylene vulcabond, the aromatic diisocyanates such as m xylene diisocyanate, two isocyanic acid ethyls, 2, 2, the 4-trimethyl hexamethylene diisocyanate, 1, the aliphatic diisocyanates such as hexamethylene-diisocyanate, 1, the 4-cyclohexane diisocyanate, 4, 4 '-dicyclohexyl methyl hydride diisocyanate, IPDI, the ester ring type vulcabond such as norbornene alkyl diisocyanate.These vulcabond can be used a kind, also can mix two or more and use.
As high molecular weight polyols, can enumerate material commonly used in the polyurethanes technology field.For example, take PPG that polytetramethylene ether diol, polyethylene glycol etc. are representative, take and gather the PEPA that adipic acid fourth diester is representative; The illustrative polyester-polycarbonate polyalcohols such as product with the polyester-diols such as polycaprolactone polyol, polycaprolactone and alkylene carbonates; Make ethylene carbonate and polyol reaction, the reactant mixture that then makes gained with organic dicarboxylic acid, react and the polyester-polycarbonate polyalcohol; And the polycarbonate polyol that obtains of the ester exchange reaction by polyol and aryl carbonates etc.These high molecular weight polyols can be used separately, also can two or more be combined with.
As polyol component except above-mentioned high molecular weight polyols, can also be combined with ethylene glycol, 1, the 2-propane diols, 1, ammediol, 1, the 2-butanediol, 1, the 3-butanediol, 1, the 4-butanediol, 2, the 3-butanediol, 1, the 6-hexylene glycol, neopentyl glycol, 1, the 4-cyclohexanedimethanol, the 3-methyl isophthalic acid, the 5-pentanediol, diethylene glycol (DEG), triethylene glycol, 1, two (2-hydroxyl-oxethyl) benzene of 4-, trimethylolpropane, glycerine, 1, 2, the 6-hexanetriol, pentaerythrite, the tetra methylol cyclohexane, methyl glucosamine, D-sorbite, sweet mellow wine, galactitol, sucrose, 2, 2, 6, 6-tetra-(hydroxymethyl) cyclohexanol, diethanol amine, N methyldiethanol amine, reach the low molecular weight polyols such as triethanolamine.In addition, also can be combined with: ethylenediamine, toluenediamine, diphenylmethanediamiand, and the low-molecular-weight polyamine such as diethylenetriamines.In addition, also can be combined with MEA, 2-(2-aminoethylamino) ethanol, and the hydramine such as single Propanolamine.These low molecular weight polyols or low-molecular-weight polyamine etc. can be used separately a kind, also can two or more be combined with.The combined amount of low molecular weight polyols or low-molecular-weight polyamine etc. is not particularly limited, and can suitably determine according to the desired characteristic of prepared grinding pad (grinding layer).
By prepolymer method, prepare in the situation of polyurethane resin foaming body, the chain elongation agent is used in the sclerosis of prepolymer.The chain elongation agent is the organic compound with at least 2 above reactive hydrogen bases, and the reactive hydrogen base can illustration: hydroxyl, primary amino radical or secondary amino group, mercapto (SH) etc.Specifically can enumerate: 4,4 '-di-2-ethylhexylphosphine oxide (o-chloraniline) is (MOCA), the chloro-p-phenylenediamine (PPD) of 2,6-bis-, 4,4 '-di-2-ethylhexylphosphine oxide (2,3-dichloroaniline), two (methyl mercapto)-2 of 3,5-, the 4-toluenediamine, two (methyl mercapto)-2 of 3,5-, the 6-toluenediamine, 3,5-diethyl Toluene-2,4-diisocyanate, the 4-diamines, 3,5-diethyl Toluene-2,4-diisocyanate, the 6-diamines, trimethylene-bis-p-aminobenzoic acid ester, polytetramethylene oxygen-bis-p-aminobenzoic acid ester, 4,4 '-diaminourea-3,3 ', 5,5 '-the tetraethyl diphenyl methane, 4,4 '-diaminourea-3,3 '-diisopropyl-5,5 '-dimethyl diphenylmethane, 4,4 '-diaminourea-3,3 ', 5,5 '-the tetra isopropyl diphenyl methane, two (2-aminobenzene-thio) ethane of 1,2-, 4,4 '-diaminourea-3,3 '-diethyl-5,5 '-dimethyl diphenylmethane, N, N '-di-sec-butyl-4,4 '-diaminodiphenyl-methane, 3,3 '-diethyl-4,4 '-diaminodiphenyl-methane, m-xylene diamine, N, N '-di-sec-butyl-p-phenylenediamine (PPD), m-phenylene diamine (MPD), reach the illustrated polyamines classes such as paraxylene diamines, or described low molecular weight polyols or low-molecular-weight polyamine.These chain elongation agent can a kind of use, also can mix two or more and use.
Isocyanate prepolymer composition in the present invention, polyol component, and the ratio of chain elongation agent, can carry out various changes according to the desired characteristic of each molecular weight or grinding pad etc.In order to obtain the grinding pad with desired abrasive characteristic, the isocyanates radix of the isocyanate prepolymer composition of counting with respect to reactive hydrogen base (hydroxyl+amino) number altogether of polyol component and chain elongation agent is preferably 0.80-1.20, more preferably 0.99-1.15.The isocyanates radix is outside described scope the time, has the sclerosis of generation bad and can't obtain desired proportion and hardness, thus the tendency that abrasive characteristic reduces.
The polyurethane resin foaming body can be applied the known urethane technology such as fusion method, solwution method and be prepared, but considers cost, operating environment etc., preferably utilizes fusion method to be prepared.
The preparation of polyurethane resin foaming body, can use any one in prepolymer method, one-step method, but preferably use in advance the prepolymer of isocyanate prepolymer composition and polyol component synthesizing isocyanate end-blocking, the prepolymer method that makes again this prepolymer react with the chain elongation agent, the physical characteristic excellence of the polyurethane resin obtained therefrom.
As the preparation method of polyurethane resin foaming body, can enumerate the method for adding cenosphere, mechanical foaming method, chemical blowing process etc.
Particularly preferably use the mechanical foaming method of siloxane type surfactants, this siloxane type surfactants is gather the copolymer of alkylsiloxane and polyethers and do not have the reactive hydrogen base.
In addition, can add as required the stabilizing agent such as antioxidant, lubricant, pigment, filler, antistatic additive, and other additives.
The polyurethane resin foaming body can be the separated foam type, can be also the continuous air bubbles type.
The preparation of polyurethane resin foaming body can be each composition is weighed and is fed in container, the intermittent mode stirred; Can be also each composition and non-reactive gas to be supplied to agitating device continuously stirred, and send the bubble dispersion liquid and prepare the continuous mode of production of formed products.
In addition, can be that the prepolymer as polyurethane resin foaming body raw material is added in reaction vessel, then drop into the chain elongation agent, after stirring, flow in the casting die of pre-sizing and prepare block, use plane shape or band saw shape slicer by the method for described block section; Perhaps at the stage of the described casting die shape of laminating.In addition, can dissolve the resin as raw material, from T die head extrusion molding, directly obtain sheet polyurethane resin foaming body.
The mean air bubble diameter of described polyurethane resin foaming body is preferably 30-80 μ m, more preferably 30-60 μ m.Break away from the situation of this scope, exist grinding rate to reduce, the tendency that the flatness that is polished material (wafer) (flatness) after grinding reduces.
Preferably, the proportion of described polyurethane resin foaming body is 0.5-1.3.In the situation of proportion less than 0.5, exist the surface strength of grinding layer to reduce, be polished the tendency of the flatness reduction of material.In addition, be greater than in 1.3 situation, exist the number of bubbles on grinding layer surface to reduce, although flatness is good, the tendency that grinding rate reduces.
The hardness of the described polyurethane resin foaming body that preferably, utilizes the ASKER-D hardometer to record is the 40-75 degree.In the situation of ASKER-D hardness less than 40 degree, the flatness that is polished material reduces, in addition, be greater than in 75 situations while spending, although flatness is good, and the tendency that exists the uniformity (homogeneity) that is polished material to reduce.
With the lapped face that material contacts of being polished of grinding layer, preferably have in order to keep and the concaveconvex structure of new slurry more.The grinding layer formed by foaming body has a plurality of openings at lapped face, there is the more function of new slurry of the 〃 of maintenance, but by lapped face, forming concaveconvex structure, maintenance and the renewal of slurry can be carried out more efficiently, and the destruction that is polished material caused because of the absorption with being polished material can be prevented.If concaveconvex structure keeps also the more shape of new slurry, be not particularly limited, for example can enumerate: XY grid groove, concentric circles groove, through hole, non-through hole, polygonal column, cylinder, spiral groove, off-centre operation shape groove, radial slot, and the shape that combines of these grooves.In addition, these concaveconvex structures have certain regularity usually, but, due to the maintenance of expectation slurry and the property upgraded, therefore also can in certain scope, change separation, well width, groove depth etc.
The shape of grinding layer is not particularly limited, and can be circular, can be also the long-object shape.The size of grinding layer can suitably be adjusted according to the lapping device used.But be in circular situation, diameter is the 30-150cm left and right; In situation for the long-object shape, length is the 5-15m left and right, and width is the 60-250cm left and right.
The thickness of grinding layer is not particularly limited, and is generally the 0.8-4mm left and right, is preferably 1.2-2.5mm.
Stacked grinding pad of the present invention utilizes binding material laminating grinding layer and supporting layer and prepares.
Described supporting layer is the layer that supplements the grinding layer characteristic.Can use the layer (cushion) lower than the elastic modelling quantity of grinding layer as supporting layer, also can use the layer (high resiliency layer) higher than the elastic modelling quantity of grinding layer.Cushion be flatness in order to make trade-off relation in CMP and uniformity the two have concurrently and the layer that needs.Flatness refers to that uniformity refers to the uniformity that is polished material monolithic to having when pattern forms the flatness of produce small concavo-convex drafting department when being polished material and being ground.Utilize the characteristic of grinding layer to improve flatness, utilize the characteristic of cushion to improve uniformity.The high resiliency layer is in the situation that use soft grinding layer for the generation that suppresses scratch in CMP, for the planarization characteristics that improves grinding pad is used.In addition, by using the high resiliency layer, the edge part that can suppress to be polished material excessively cuts.
Described cushion is such as enumerating: polyester non-woven fabric, nylon nonwoven fabrics, and the fabric nonwoven cloth such as acrylic compounds nonwoven; As flooded the resin-dipping nonwoven of the polyester non-woven fabric etc. of polyurethane; The macromolecule such as polyurethane foam and polyethylene foamed resin, the rubbery resins such as butadiene rubber and isoprene rubber; Photoresist etc.
The thickness of cushion is not particularly limited, and is preferably 300-1800 μ m, more preferably 700-1400 μ m.
Preferably, in the situation that described supporting layer is cushion, being arranged on 150 ℃ of heating at the single face (face of grinding plate side) of cushion was the resin film below 1.2% with the size changing rate of comparing before heating after 30 minutes.More preferably size changing rate is the resin film below 0.8%, and particularly preferably size changing rate is the resin film below 0.4%.As the resin film of this specific character, for example, can enumerate and implement the polyethylene terephthalate thin film that thermal contraction is processed, PEN film, reach Kapton etc.
The thickness of described resin film is not particularly limited, from rigidity, and the preferred 10-200 μ of the viewpoints such as the dimensional stability m in when heating, more preferably 15-55 μ m.
As described high resiliency layer, for example, can enumerate: sheet metal, resin film etc.As resin film, for example, can enumerate: the polyester films such as polyethylene terephthalate thin film and PEN film; The polyolefin film such as polyethylene film and polypropylene film; Nylon film; Kapton etc.
As described high resiliency layer, preferably using 150 ℃ of heating was the resin film below 1.2% with the size changing rate of comparing before heating after 30 minutes.More preferably size changing rate is the resin film below 0.8%, and particularly preferably size changing rate is the resin film below 0.4%.As the resin film of this specific character, for example, can enumerate: implemented the polyethylene terephthalate thin film that thermal contraction is processed, PEN film, reached Kapton etc.
The thickness of described high resiliency layer is not particularly limited, from rigidity, and the preferred 10-200 μ of the viewpoints such as the dimensional stability m in when heating, more preferably 15-55 μ m.
As described binding material, use the adhesive layer that contains the polyesters hot-melt adhesive or the two-sided tape that is provided with described adhesive layer on the two sides of base material.
Described polyesters hot-melt adhesive at least contains the base polymer mylar, and has the epoxy resin of two above glycidyls in the per molecule as crosslinking component.
As described mylar, the known resin that can use polycondensation by sour composition and polyol component etc. to obtain, but particularly preferably use crystalline polyester resin.
As sour composition, can enumerate: aromatic dicarboxylic acid, aliphatic dicarboxylic acid and alicyclic dicarboxylic acid etc.These dicarboxylic acids can only be used a kind, also can two or more be combined with.
As the instantiation of aromatic dicarboxylic acid, can enumerate: the ester of terephthalic acid (TPA), M-phthalic acid, phthalic anhydride, α-naphthalene dicarboxylic acids, β-naphthalene dicarboxylic acids and formation thereof etc.
As the instantiation of aliphatic dicarboxylic acid, can enumerate: the ester of butanedioic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, decanedioic acid, undecenoic acid, dodecanedioic acid and formation thereof etc.
As alicyclic dicarboxylic acid's instantiation, can enumerate: Isosorbide-5-Nitrae-cyclohexane dicarboxylic acid, tetrahydrophthalic anhydride, hexahydro phthalic anhydride etc.
In addition, as sour composition, can also be combined with the polybasic carboxylic acids such as the unsaturated acids such as maleic acid, fumaric acid, dimer acids, trimellitic acid, the equal tetracarboxylic acid of benzene etc.
As polyol component, can enumerate: dihydroxylic alcohols and the polyalcohols such as aliphatic diol, alicyclic diol.These polyalcohols can only be used a kind, also can two or more be combined with.
Instantiation as aliphatic diol, can enumerate: ethylene glycol, 1,2-PD, 1,3-PD, 1,3-butanediol, 1,4-butanediol, 1,5-PD, 1,6-hexylene glycol, 1,8-ethohexadiol, 1,9-nonanediol, neopentyl glycol, 3-methyl pentanediol, 2,2,3-trimethyl-pentanediol, diethylene glycol (DEG), triethylene glycol, DPG etc.
As the instantiation of alicyclic diol, can enumerate: 1,4-CHDM, hydrogenated bisphenol A etc.
As polyalcohol, can enumerate: glycerine, trimethylolethane, trimethylolpropane, pentaerythrite etc.
Crystalline polyester resin can be synthesized by known method.For example, the melt phase polycondensation of charging feedstock and catalyst, the temperature more than the fusing point of product heating, at the solid phase polymerization method of the following polymerization of fusing point of product, use the solution polymerization process of solvent etc., can adopt any method.
Preferably, the fusing point of crystalline polyester resin is 100-200 ℃.In the situation that the fusing point less than is 100 ℃, heating during grinding causes the cohesive force of hot-melt adhesive to reduce; Surpass in the situation of 200 ℃, the temperature owing to making the hot-melt adhesive melting uprises, so exist stacked grinding pad bend and abrasive characteristic is produced to dysgenic tendency.
In addition, preferably, the number-average molecular weight of crystalline polyester resin is 5000-50000.In the situation of number-average molecular weight less than 5000, due to the mechanical property reduction of hot-melt adhesive, so can not obtain sufficient caking property and durability; Surpass in 50000 situation, the unfavorable condition in the preparation such as gelation occurs, so the tendency that exists the performance of hot-melt adhesive to reduce during due to the synthetic crystallization mylar.
As described epoxy resin, for example can enumerate: bisphenol A type epoxy resin, brominated bisphenol a type epoxy resin, bisphenol f type epoxy resin, bisphenol-A D type epoxy resin, 1, 2-Stilbene-based epoxy resin, biphenyl type epoxy resin, bisphenol-A phenolic type epoxy resin, the cresols novolac epoxy resin, diaminodiphenyl-methane type epoxy resin, reach the epoxy resin based on polyphenyl such as four (hydroxyphenyl) ethyl group (エ タ ン ベ ー ス), containing fluorenes epoxy resin, the triglycidyl group isocyanuric acid ester, (for example contain hetero-aromatic ring, the aromatic epoxy resins such as epoxy resin triazine ring etc.), the non-aromatic epoxy resin such as aliphatic glycidyl ether type epoxy resin, aliphatic glycidyl ester type epoxy resin, alicyclic glycidol ether type epoxy, alicyclic glycidyl ester type epoxy resin.These can use separately a kind, also can two or more be combined with.
When grinding with the caking property viewpoint of grinding layer, preferred use cresols novolac epoxy resin in these.
With respect to the base polymer mylar of 100 weight portions, need to add the described epoxy resin of 2-10 weight portion, and preferred 3-7 weight portion.
The polyesters hot-melt adhesive can contain the softening agent such as olefine kind resin, tackifier, filler, stabilizing agent, and the known additive such as coupling agent.In addition, also can contain the known inorganic fillers such as talcum.
The polyesters hot-melt adhesive by any means at least mix described mylar, and described epoxy resin etc. prepare.For example, by single axle extruding machine, engagement type cocurrent and parallel axle biaxial extruder, engagement type anisotropic parallel axle biaxial extruder, the incorgruous inclined shaft biaxial extruder of engagement type, non-meshing-type two-axis extruder, the not exclusively extruder such as meshing-type two-axis extruder, the extruder of kneading type altogether, planetary gear extruder, continuous mixing (transfer mix) machine, plunger-type extruder, roll-type extruder or kneader etc., mix each raw material and prepare.
Preferably, polyesters hot-melt adhesive fusing point is 100-200 ℃.
In addition, preferably, the proportion of polyesters hot-melt adhesive is 1.1-1.3.
In addition, preferably, the melt flow index of polyesters hot-melt adhesive (melt flow index) is (MI) under 150 ℃ and the load condition that is 2.16kg in temperature, is 16-26g/10min.
The solution shape etc. that the polyesters hot-melt adhesive can use graininess, Powdered, sheet, film-form, be dissolved in solvent is form arbitrarily, but preferably uses in the present invention sheet or film-form.
By the method for grinding layer and supporting layer laminating, there is no particular restriction, for example can enumerate, the adhesive layer that will be formed by the polyesters hot-melt adhesive is stacked on supporting layer, with heater heating and melting adhesive layer, afterwards, the method for stacked grinding layer pressurization on the adhesive layer of melting.
The thickness of described adhesive layer is preferably 10-200 μ m, more preferably 25-125 μ m.
Also can use the double faced adhesive tape that there is described adhesive layer on the two sides of base material to bring and replace described adhesive layer.Can prevent that by base material slurry is to the infiltration of supporting layer side, and prevent peeling off between supporting layer and adhesive layer.
Can enumerate resin film etc. as base material, as resin film, for example, can enumerate: the polyester films such as pet film and PEN film; The polyolefin film such as polyethylene film and polypropylene film; Nylon film, Kapton etc.In these, preferably use the polyester film of anti-water permeability excellence.
As described base material, preferably using 150 ℃ of heating was the resin film below 1.2% with the size changing rate of comparing before heating after 30 minutes.More preferably size changing rate is the resin film below 0.8%, and particularly preferably size changing rate is the resin film below 0.4%.As the resin film of this specific character, for example, can enumerate: implemented the polyethylene terephthalate thin film that thermal contraction is processed, PEN film, reached Kapton etc.
Also can implement on the surface of base material the easily binder-treatment such as sided corona treatment, Cement Composite Treated by Plasma.
Thickness to base material is not particularly limited, but the preferred 10-200 μ of the viewpoints such as the dimensional stability m during from the transparency, flexibility, rigidity and heating, more preferably 15-55 μ m.
Use in the situation of two-sided tape the preferred 10-200 μ of the thickness of described adhesive layer m, more preferably 25-125 μ m.
Stacked grinding pad of the present invention can arrange two-sided tape on the face with platen (grinding plate) bonding.
Fig. 2 means the summary section of an example of stacked grinding pad of the present invention.Grinding layer 8 is provided with the transparent material 9 detected for optical end point under grinding state.Transparent material 9 embeds the peristome 10 that is arranged at grinding layer 8, by with grinding layer 8 under binding material 11 bondings fix.In the situation that grinding layer 8 arranges transparent material 9, preferably at supporting layer 12, the peristome 13 that makes light transmission is set in advance.
Binding material 11 of the present invention has the function (water retaining function) that the slurry prevented from invading between grinding layer 8 and transparent material 9 drains to supporting layer 12 sides.Further, binding material 11 of the present invention is owing to not existing the cohesive force caused by the slurry from invading between grinding layer 8 and transparent material 9 to reduce, so can effectively prevent peeling off of grinding layer 8 and supporting layer 12.
Fig. 3 means another routine summary section of stacked grinding pad of the present invention.This stacked grinding pad 1 is according to grinding layer 8, binding material 11, supporting layer 12, and the sequential cascade of two-sided bonding sheet 14, and run through grinding layer 8, binding material 11, and the through hole 15 of supporting layer 12 in and transparent material 9 is set on two-sided bonding sheet 14.
Two-sided bonding sheet 14 has adhesive layer on the two sides of base material, is commonly referred to as two-sided tape.Two-sided bonding sheet 14 is for fitting in grinding plate 2 by stacked grinding pad 1.
For example can prepare by the following method by described stacked grinding pad 1.At first, prepare stacked abrasive sheet by the stacked grinding layer 8 of binding material 11 and supporting layer 12.Form through hole 15 on the stacked abrasive sheet of preparation.Two-sided bonding sheet 14 is fitted in to the supporting layer 12 of the stacked abrasive sheet that has formed through hole 15.Then, transparent material 9 is set in through hole 15 and on two-sided bonding sheet 14.In addition, can also, after the interior insertion transparent material 9 of through hole 15, two-sided bonding sheet 14 be fitted in to supporting layer 12 and transparent material 9.
Preferably, the apparent height of transparent material 9 is identical with the apparent height of grinding layer 8, or lower than the apparent height of grinding layer 8.If the apparent height of transparent material 9 is higher than the apparent height of grinding layer 8, likely because of outstanding part in grinding, cause being polished material damage.In addition, the stress owing to grinding makes transparent material 9 distortion, and optical distortion significantly, so likely cause the optical end point accuracy of detection of grinding to reduce.
Semiconductor device forms through the step manufacture of using described grinding pad grinding semiconductor chip surface.So-called semiconductor wafer is generally to form at silicon wafer upper strata laying up line metal and oxide-film.Ginding process, the lapping device of semiconductor wafer are not particularly limited, for example, as shown in Figure 1, use possess the grinding plate 2 of supporting stacked grinding pad 1, the support platform (rubbing head) 5 of supporting semiconductor wafer 4 and for the back lining materials that wafer carried out to evenly pressurization, and the lapping device of the feed mechanism of grinding agent 3 etc.Stacked grinding pad 1 for example is installed in grinding plate 2 by pasting of two-sided tape.Grinding plate 2 is opposed state with supporting platform 5 to be configured to respectively its stacked grinding pad of supporting 1 with semiconductor wafer 4, and possesses respectively rotating shaft 6,7.In addition, support platform 5 sides to be provided with for semiconductor wafer 4 being pressed in to the pressing mechanism on stacked grinding pad 1.When grinding, when making grinding plate 2 and supporting platform 5 rotation, semiconductor wafer 4 is pressed on stacked grinding pad 1, and is ground when supplying with slurry.The flow of slurry, grind load, grinding plate revolution, and the wafer revolution be not particularly limited, can suitably adjust.
Can remove the ledge on the surface of semiconductor wafer 4 accordingly, grind to form flat condition.Afterwards, manufacture semiconductor device by cutting, joint, encapsulation etc.Semiconductor device is for calculus treatment device or memory etc.
Embodiment
Below, the present invention will be described to enumerate embodiment, but the present invention is not limited to these embodiment.
[mensuration, evaluation method]
(mensuration of number-average molecular weight)
Number-average molecular weight is by the GPC(gel permeation chromatography) measured, utilize polystyrene standard to be converted.
The GPC device: Shimadzu Seisakusho Ltd. manufactures, LC-10A
Post: Polymer Laboratories company manufactures, will (PLgel, 5 μ m,
), (PLgel, 5 μ m,
), and (PLgel, 5 μ m,
) 3 posts link and use
Flow: 1.0ml/min
Concentration: 1.0g/l
Injection rate: 40 μ l
Column temperature: 40 ℃
Eluent: oxolane
The mensuration of fusing point)
The fusing point of polyesters hot-melt adhesive has been used TOLEDO DSC822(METTLER company to manufacture), with the heating rate of 20 ℃/min, measure.
(mensuration of proportion)
According to JIS Z8807-1976, carry out.The adhesive layer that will be formed by the polyesters hot-melt adhesive cuts out the short strip shape (thickness: arbitrarily) of 4cm * 8.5cm and as the gravity test sample, under the environment of 23 ℃ ± 2 ℃ of temperature, humidity 50% ± 5% standing 16 hours.During mensuration, use densimeter (manufacture of Sartorius company) to measure proportion.
(melt flow index (melt flow index) mensuration (MI))
According to ASTM-D-1238, measure the melt flow index (melt flow index) of polyesters hot-melt adhesive under 150 ℃, the condition of 2.16kg.
(measurement of shear stress)
Cut out the sample of 3 25mm * 25mm from the stacked grinding pad of preparation, with grinding layer and the supporting layer of each sample of draw rate tractive of 300mm/min, measure shear stress (N/25mm) now.The mean value of 3 samples means in table 1.Confirmed the state of peeling off of sample now.In addition, use the stacked grinding pad of preparation after following condition is ground 60 hours, use with above-mentioned same method and carry out the measurement of shear stress, and confirmed to peel off state.
(the inhomogeneity evaluation of grinding rate)
As lapping device, use SPP600S(ridge this work mechanism company to manufacture), and use the stacked grinding pad prepared, carry out the inhomogeneity evaluation of grinding rate.The grinding rate is on the silicon wafer of 8 inches, to have made
each wafer of tungsten film grind 60 seconds, and the value of calculating from amount of grinding now.The exchange wafer also grinds 60 hours.Noncontact resistance measuring system (manufacture of NAPSON company, Model-NC-80M) is used in the film thickness measuring of tungsten film.The uniformity (%) of initial grinding rate by the maximum grinding rate of grinding (121 point) in the 5th crystal face started, minimum grinding rate, and average grinding rate according to following formula, calculate.In addition, the uniformity (%) of the grinding rate of the wafer after 60 hours also uses the same method and calculates.
Uniformity (%)={ (maximum grinding rate-minimum grinding rate)/2} * on average grinding rate * 100
Grinding condition for being added on W2000(Cabot company manufactured with the flow of 150ml/min in grinding) add the made slurry of hydrogen peroxide of 2 % by weight in dilution with 2 times of ultra-pure water dilutions, grindings load is that 5psi, grinding plate revolution are 120rpm, to reach the wafer revolution be 120rpm.In addition, before grinding, use trimmer (ASAHI DIAMOND company manufactures, M100 type) to grinding pad surfacing processed for 20 seconds.The finishing condition is set to: finishing load 10g/cm
2, grinding plate revolution 30rpm, and trimmer revolution 15rpm.
(measurement of size changing rate)
Resin film heated after 30 minutes under 150 ℃ to be measured according to JIS C2318 with the size changing rate of comparing before heating.
(measurement of the bending of stacked grinding pad)
The stacked grinding pad of preparation is statically placed on the table top of level, measures the height (arch upward) of the maximum deflection part of pad end apart from table top.
(measurement of shear stress)
Cut out the sample of 3 25mm * 25mm from the stacked grinding pad of preparation, in being adjusted to the thermostat of 80 ℃, with grinding layer and the supporting layer of each sample of draw rate tractive of 300mm/min, and measure shear stress (N/25mm) now.The mean value of 3 samples means in table 3.In addition, confirm the state of peeling off of sample now.
Production Example 1
The preparation of grinding layer
The toluene di-isocyanate(TDI) (2 that adds 1229 weight portions in container, 4-isomers/2, the mixture of 6-isomers=80/20), 4 of 272 weight portions, 4 '-polytetramethylene ether diol of the number-average molecular weight 1018 of dicyclohexyl methyl hydride diisocyanate, 1901 weight portions, the diethylene glycol (DEG) of 198 weight portions, reaction 4 hours under 70 ℃ and obtain isocyanate-terminated prepolymer.
The siloxane type surfactants of this prepolymer and 3 weight portions of 100 weight portions (Dow Corning Toray Silicone company manufacture, SH-192) is added in aggregation container and mixes, temperature is adjusted to 80 ℃ and carried out vacuum deaerator.Afterwards, use impeller with rotating speed 900rpm so that mix the mode vigorous stirring approximately 4 minutes of bubble in reaction system.Add wherein 26 weight portions in advance temperature is adjusted to the MOCA(IHARA CHEMICAL company of 120 ℃ manufactures, キ ュ ア ミ Application MT).This mixed liquor stir about, after 1 minute, is flowed in pan type open die (casting die container).The moment lost flowability at this mixed liquor is added in baking oven, carries out rear the solidifying of 16 hours under 100 ℃, thereby obtains polyurethane resin foaming body piece.
Use slicer (manufacture of Amitec company, VGW-125) will be heated to the approximately described polyurethane resin foaming body piece section of 80 ℃, obtain polyurethane resin foaming body sheet (mean air bubble diameter: 50 μ m, proportion: 0.86, hardness: 52 degree).Then, use polishing machine (manufactures of Amitec company), with No. #120, No. #240, the sand paper that reaches No. #400, carry out in turn machining, this sheet is carried out to the surface finish processing until thickness is 2mm, make the sheet of thickness and precision through adjustment.This stamping-out of sheet through polishing is become to the size of diameter 61cm, use groove processing machine (manufacture of Techno company), carry out the groove of the concentric circles of well width 0.25mm, separation 1.5mm, groove depth 0.6mm on surface and process and the making grinding layer.
On the supporting layer formed by polyurathamc (Japanese clockwork spring company manufactures, Nippalay EXT), the stacked adhesive layer formed by the polyesters hot-melt adhesive (thickness 50 μ m), the crystalline polyester resin that this polyesters hot-melt adhesive contains 100 weight portions (Japan textile company manufacture, VYLON GM420), and the per molecule of 5 weight portions in there is the orthoresol novolac epoxy resin (Japanese chemical drug company manufactures, EOCN4400) of two above glycidyls, use infrared heater adhesive layer to be dissolved adhesive layer surface heating to 150 ℃.Then, use laminating machine be layered in the grinding layer of preparation in Production Example 1 and pressurize on the adhesive layer of melting, cut into the size of grinding layer.Further, the another side that uses laminating machine that pressure sensing type two-sided tape (manufacture of 3M company, 442JA) is fitted in to supporting layer prepares stacked grinding pad.In addition, the fusing point of polyesters hot-melt adhesive is that 142 ℃, proportion are 1.22, melt flow index (melt flow index) is 21g/10min.
Embodiment 2
On the PET film that is 50 μ m through the thickness of sided corona treatment on two sides (Japan's textile company is manufactured, E5200), the adhesive layer (thickness 50 μ m) of record in stacked embodiment 1, used infrared heater that adhesive layer surface heating to 150 ℃ is made to the adhesive layer melting.Then, use laminating machine to be layered in grinding layer the pressurization of preparation in Production Example 1 on the adhesive layer of melting, cut into the size of grinding layer and prepare stacked grinding layer.
Upper at the supporting layer formed by polyurathamc (Japanese clockwork spring company manufactures, Nippalay EXT), the adhesive layer (thickness 50 μ m) of record in stacked embodiment 1, used infrared heater that adhesive layer surface heating to 150 ℃ is made to the adhesive layer melting.Then, use laminating machine stacked described stacked grinding layer pressurization on the adhesive layer of melting, cut into the size of stacked grinding layer.Further, the another side that uses laminating machine that pressure sensing type two-sided tape (manufacture of 3M company, 442JA) is fitted in to supporting layer prepares stacked grinding pad.
Embodiment 3
On the grinding layer of the preparation in Production Example 1, be provided for embedding the peristome (56mm * 20mm) of transparent material.
On the PET film that is all 50 μ m through the thickness of sided corona treatment on two sides (Japan's textile company is manufactured, E5200), the adhesive layer (thickness 50 μ m) of record in stacked embodiment 1, used infrared heater that adhesive layer surface heating to 150 ℃ is made to the adhesive layer melting.Then, use laminating machine stacked described grinding layer pressurization on the adhesive layer of melting, then transparent material (55mm * 19mm, thickness 1.98mm) embedded to the peristome of grinding layer and be pressed on adhesive layer, cutting into further the size of grinding layer and prepare stacked grinding layer.
Upper at the supporting layer formed by polyurathamc (Japanese clockwork spring company manufactures, Nippalay EXT), the adhesive layer (thickness 50 μ m) of record in stacked embodiment 1, used infrared heater that adhesive layer surface heating to 150 ℃ is made to the adhesive layer melting.Then, use laminating machine stacked described stacked grinding layer pressurization on the adhesive layer of melting, cut into the size of stacked grinding layer.Further, use laminating machine pressure sensing type two-sided tape (manufacture of 3M company, 442JA) to be fitted in to the another side of supporting layer, the supporting layer of position that will be corresponding with transparent material and pressure sensing type two-sided tape stamping-out become the size of 50mm * 14mm to prepare stacked grinding pad.
Embodiment 4
In embodiment 1, except use the crystalline polyester resin contain 100 weight portions (Japan's textile company is manufactured, VYLON GM420), and the per molecule of 2 weight portions in have the polyesters hot-melt adhesive of orthoresol novolac epoxy resin (Japanese chemical drug company manufactures, EOCN4400) of two above glycidyls, prepare stacked grinding pad with the method identical with embodiment 1.In addition, the fusing point of polyesters hot-melt adhesive is that 140 ℃, proportion are 1.24, melt flow index is 26g/10min.
Except in embodiment 1, use the crystalline polyester resin contain 100 weight portions (Japan's textile company is manufactured, VYLON GM420), and the per molecule of 10 weight portions in have the polyesters hot-melt adhesive of orthoresol novolac epoxy resin (Japanese chemical drug company manufactures, EOCN4400) of two above glycidyls, prepare stacked grinding pad with the method identical with embodiment 1.In addition, the fusing point of polyesters hot-melt adhesive is that 145 ℃, proportion are 1.19, melt flow index is 16g/10min.
Comparative example 1
Except in embodiment 1, use the crystalline polyester resin contain 100 weight portions (Japan's textile company is manufactured, VYLON GM420), and the per molecule of 1 weight portion in have the polyesters hot-melt adhesive of orthoresol novolac epoxy resin (Japanese chemical drug company manufactures, EOCN4400) of two above glycidyls, prepare stacked grinding pad with the method identical with embodiment 1.In addition, the fusing point of polyesters hot-melt adhesive is that 139 ℃, proportion are 1.25, melt flow index is 29g/10min.
Comparative example 2
Except in embodiment 1, use the crystalline polyester resin contain 100 weight portions (Japan's textile company is manufactured, VYLON GM420), and the per molecule of 18 weight portions in have the polyesters hot-melt adhesive of orthoresol novolac epoxy resin (Japanese chemical drug company manufactures, EOCN4400) of two above glycidyls, prepare stacked grinding pad with the method identical with embodiment 1.In addition, the fusing point of polyesters hot-melt adhesive is that 147 ℃, proportion are 1.18, melt flow index is 15g/10min.
Table 1
Even the stacked grinding pad of embodiment 1-5 pad after grinding 60 hours also produces and arches upward, and shear stress is also up to more than 800N, and at adhesive layer, interface peel do not occur.The uniformity of the grinding rate after 60 hours also maintains below 20%, even and, through grinding for a long time, the grinding rate is also stable.On the other hand, in comparative example 1, grind after 5 hours to pad to have produced and arch upward, initial shearing stress is also low, and shear stress declines to a great extent after grinding 60 hours.In addition, grind the uniformity of the grinding rate after 60 hours also very bad.In comparative example 2, after grinding 1 hour, pad produces and arches upward, and the impact of arching upward due to pad after grinding 3 hours makes wafer breakage, so grind, interrupts.In addition, initial shearing stress is also very low, and after grinding 3 hours, shear stress declines to a great extent.
Embodiment 6
(Teijin DuPont Film company manufactures the PEN that is 50 μ m at thickness (PEN) film, TeonexQ83, size changing rate 0%) upper coating foamed polyurethane composition, thus and make its sclerosis form cushion (proportion 0.5, Asker C hardness 50 degree, thickness 800 μ m).The adhesive layer (thickness 50 μ m) of record in stacked embodiment 1 on this cushion, used infrared heater adhesive layer to be dissolved adhesive layer surface heating to 150 ℃.Then, use laminating machine be layered in the grinding layer of preparation in Production Example 1 and pressurize on the adhesive layer of melting, cut into the size of grinding layer.Then, the another side that uses laminating machine that pressure sensing type two-sided tape (manufacture of 3M company, 442JA) is fitted in to the PEN film prepares stacked grinding pad.
Embodiment 7
The PEN film (Teijin DuPont Film company manufactures, TeonexQ81, size changing rate 0.2%) that is 38 μ m except used thickness in addition, prepares stacked grinding pad with the method identical with embodiment 6.
Embodiment 8
The PET film that the thickness of processing through thermal contraction except use is 50 μ m (Teijin DuPont Film company manufactures, TetoronSL, size changing rate 0.4%) in addition, prepares stacked grinding pad with the method identical with embodiment 6.
The PEN film (Teijin DuPont Film company manufactures, TeonexQ51, size changing rate 0.6%) that is 50 μ m except used thickness in addition, prepares stacked grinding pad with the method identical with embodiment 6.
The PEN film (Teijin DuPont Film company manufactures, TeonexQ51, size changing rate 1.0%) that is 16 μ m except used thickness in addition, prepares stacked grinding pad with the method identical with embodiment 6.
The Kapton (Mitsui Chemicals, Inc. manufacture, オ ー ラ system film PL450C, size changing rate 0%) that is 50 μ m except used thickness in addition, prepares stacked grinding pad with the method identical with embodiment 6.
Comparative example 3
The PET film (Teijin DuPont Film company manufactures, TetoronG2, size changing rate 1.7%) that is 50 μ m except used thickness in addition, prepares stacked grinding pad with the method identical with embodiment 6.
Table 2
Production Example 2
(preparation of transparent material)
The PEPA (number-average molecular weight 2400) that mixes polymerization adipic acid, hexylene glycol and the ethylene glycol of 128 weight portions and obtain, and the BDO of 30 weight portions, be adjusted to 70 ℃ by the temperature of the 1st mixed liquor that obtains.The 1st mixed liquor add 100 weight portions in advance temperature is adjusted to 70 ℃ 4,4 '-methyl diphenylene diisocyanate, stir and within 1 minute, obtain the 2nd mixed liquor.Then, the 2nd mixed liquor is injected to the container be incubated to 100 ℃, 100 ℃ of rear solidifying that carry out 8 hours, obtain polyurethane resins.The polyurethane resin that use obtains, utilize injection mo(u)lding to prepare transparent material (56mm * 20mm, thickness 2.75mm).
Production Example 3
(preparation of polyurethane resin foaming body sheet)
The polyethers prepolymer (manufacture of Uniroyal company, Adiprene L-325, the NCO concentration: 2.22meq/g) and the siloxane type surfactants of 3 weight portions (Dow Corning Toray Silicone company manufacture, SH-192) mixing, temperature is adjusted to 80 ℃ and carried out vacuum deaerator that add 100 weight portions in container.Afterwards, use impeller with rotating speed 900rpm so that mix the mode vigorous stirring approximately 4 minutes of bubble in reaction system.Add wherein 26 weight portions in advance temperature is adjusted to the MOCA(IHARA CHEMICAL company of 120 ℃ manufactures, キ ュ ア ミ Application MT).This mixed liquor stir about, after 1 minute, is flowed in pan type open die (casting die container).The moment lost flowability at this mixed liquor is added in baking oven, carries out rear the solidifying of 16 hours under 100 ℃, thereby obtains polyurethane resin foaming body piece.Use slicer (manufacture of Fecken company) by this polyurethane resin foaming body piece section, make polyurethane resin foaming body sheet (proportion: 0.86, D hardness: 52 degree).
Use polishing machine (manufacture of Amitec company), polishing is carried out in the surface of the polyurethane resin foaming body sheet of preparation in Production Example 3, and adjust thickness and precision.The arithmetic average roughness (Ra) that the thickness of the polyurethane resin foaming body sheet after polishing is 2mm, non-abradant surface is 7 μ m.Use groove processing machine (manufacture of Dong Bang iron company), carry out the groove processing of the concentric circles of well width 0.4mm, separation 3.1mm, groove depth 0.76mm on the surface of abradant surface side.Then, the sheet stamping-out is become to the size of diameter 77cm and prepares grinding layer.In addition, the arithmetic average roughness of non-abradant surface (Ra) is measured according to JIS B0601-1994.
At the supporting layer formed by polyurathamc, (Japanese clockwork spring company manufactures, Nippalay EXT, thickness 0.8mm) on, the stacked adhesive layer formed by the polyesters hot-melt adhesive (thickness 50 μ m), the crystalline polyester resin that this polyesters hot-melt adhesive contains 100 weight portions (manufacture by Japan's textile company, VYLON GM420), and (Japanese chemical drug company manufactures to have the orthoresol novolac epoxy resin of two above glycidyls in the per molecule of 5 weight portions, EOCN4400), use infrared heater adhesive layer to be dissolved adhesive layer surface heating to 150 ℃.Then, use laminating machine to fold standby grinding layer pressurization on the adhesive layer upper strata of melting, make the stacked abrasive sheet of hot-melt adhesive sclerosis preparation.Then, stacked abrasive sheet is cut into to the size of grinding layer.The position of the stacked abrasive sheet of the circle center 12cm obtained in distance forms through hole (56mm * 20mm).Then, use laminating machine pressure sensing type two-sided tape (manufacture of 3M company, 442JA) to be fitted in to the another side of supporting layer.Then, the transparent material that will prepare in Production Example 2 inserts through hole, and sticks in the pressure sensing type two-sided tape and prepare stacked grinding pad.
Except the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to 25 μ m, with the method identical with embodiment 12, prepare stacked grinding pad.
Embodiment 14
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 3 μ m, and the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to beyond 25 μ m, with the method identical with embodiment 12, prepares stacked grinding pad.
Embodiment 15
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 12 μ m, and the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to beyond 25 μ m, with the method identical with embodiment 12, prepares stacked grinding pad.
Embodiment 16
Except the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to 125 μ m, in addition, with the method identical with embodiment 12, prepare stacked grinding pad.
Embodiment 17
Except the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to 200 μ m, with the method identical with embodiment 12, prepare stacked grinding pad.
Embodiment 18
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 3 μ m, and the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to beyond 200 μ m, with the method identical with embodiment 12, prepares stacked grinding pad.
Embodiment 19
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 12 μ m, and the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to beyond 200 μ m, with the method identical with embodiment 12, prepares stacked grinding pad.
Comparative example 4
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 0.5 μ m, with the method identical with embodiment 12, prepare stacked grinding pad.
Comparative example 5
Except the arithmetic average roughness by non-abradant surface (Ra) changes to 16 μ m, with the method identical with embodiment 12, prepare stacked grinding pad.
Comparative example 6
Except the thickness of the adhesive layer that will be formed by the polyesters hot-melt adhesive changes to 225 μ m, with the method identical with embodiment 12, prepare stacked grinding pad.
Comparative example 7
Except the adhesive layer that uses pressure sensing type two-sided tape (manufacture of ponding chemical industrial company, #5782W, thickness 130 μ m) to replace being formed by the polyesters hot-melt adhesive, with the method identical with embodiment 12, prepare stacked grinding pad.
Table 3
Utilize possibility on industry
Stacked grinding pad of the present invention can to the optical material such as lens, speculum or silicon wafer, glass substrate for hard disk, aluminium base, and requirements such as common metal grinding processing highly the material of surfaces stablize and the planarization process of high grinding efficiency.Stacked grinding pad of the present invention is particularly suitable for following step: by silicon wafer with and on be formed with oxide skin(coating), metal level etc. device further stacked, carry out planarization before forming these oxide skin(coating)s or metal level.
Description of reference numerals
1 stacked grinding pad
2 grinding plates
3 grinding agents (slurry)
4 are polished material (semiconductor wafer)
5 support platform (rubbing head)
6,7 rotating shafts
8 grinding layers
9 transparent materials
10,13 peristomes
11 binding materials
12 supporting layers
14 two-sided bonding sheets
15 through holes
Claims (12)
1. a stacked grinding pad, it is characterized in that: in the stacked grinding pad of stacked grinding layer and supporting layer by binding material, described binding material is the adhesive layer that contains the polyesters hot-melt adhesive or the two-sided tape that has described adhesive layer on the two sides of base material, described polyesters hot-melt adhesive, with respect to the base polymer mylar of 100 weight portions, has the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
2. stacked grinding pad according to claim 1, described mylar is crystalline polyester resin.
3. stacked grinding pad according to claim 1 and 2, grinding layer and supporting layer have peristome, at the peristome of grinding layer, are provided with transparent material, and transparent material and described binding material bonding.
4. according to the described stacked grinding pad of claim 1-3 any one, the thickness of described adhesive layer is 10-200 μ m.
5. according to the described stacked grinding pad of claim 1-4 any one, described base material is after 30 minutes, with the size changing rate of comparing before heating, to be the resin film below 1.2% 150 ℃ of heating.
6. according to the described stacked grinding pad of claim 1-5 any one, described supporting layer is the high resiliency layer, and this high resiliency layer is after 30 minutes, with the size changing rate of comparing before heating, to be the resin film below 1.2% 150 ℃ of heating.
7. according to the described stacked grinding pad of claim 1-5 any one, described supporting layer is cushion, and at the single face of this cushion, being provided with 150 ℃ of heating was the resin film below 1.2% with the size changing rate of comparing before heating after 30 minutes.
8. according to the described stacked grinding pad of claim 1-7 any one, the arithmetic average roughness of the face of the stacked binding material of grinding layer (Ra) is 1-15 μ m.
9. according to the described stacked grinding pad of claim 1-8 any one, the shear stress in the time of 80 ℃ between grinding layer and supporting layer is more than 200N/25mm.
10. a stacked grinding pad, according to grinding layer, binding material, supporting layer, and the sequential cascade of two-sided bonding sheet, and running through grinding layer, binding material, and the through hole of supporting layer is interior and be provided with transparent material on described two-sided bonding sheet, described binding material is the adhesive layer that contains the polyesters hot-melt adhesive, or there is the two-sided tape of described adhesive layer on the two sides of base material, described polyesters hot-melt adhesive is with respect to the base polymer mylar of 100 weight portions, there is the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
11. the manufacture method of a stacked grinding pad, comprise: by the stacked grinding layer of binding material and supporting layer and prepare the step of stacked abrasive sheet, form the step of through hole on stacked abrasive sheet, the step of laminating two-sided bonding sheet on the supporting layer of the stacked abrasive sheet that has formed through hole, and in described through hole and the step of transparent material is set on described two-sided bonding sheet
Described binding material is the adhesive layer that contains the polyesters hot-melt adhesive or the two-sided tape that has described adhesive layer on the two sides of base material, described polyesters hot-melt adhesive, with respect to the base polymer mylar of 100 weight portions, has the epoxy resin of two above glycidyls in the per molecule that contains the 2-10 weight portion.
12. the manufacture method of a semiconductor device comprises: right to use requires the step on the surface of the described stacked grinding pad grinding semiconductor chip of 1-10 any one.
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-095270 | 2011-04-21 | ||
| JP2011095270 | 2011-04-21 | ||
| JP2011-197277 | 2011-09-09 | ||
| JP2011197277 | 2011-09-09 | ||
| JP2012-084023 | 2012-04-02 | ||
| JP2012084023A JP5893479B2 (en) | 2011-04-21 | 2012-04-02 | Laminated polishing pad |
| PCT/JP2012/059910 WO2012144388A1 (en) | 2011-04-21 | 2012-04-11 | Laminated polishing pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103476546A true CN103476546A (en) | 2013-12-25 |
Family
ID=47041499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280018985XA Pending CN103476546A (en) | 2011-04-21 | 2012-04-11 | Laminated polishing pad |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140065932A1 (en) |
| JP (1) | JP5893479B2 (en) |
| KR (1) | KR101572464B1 (en) |
| CN (1) | CN103476546A (en) |
| SG (1) | SG194560A1 (en) |
| TW (1) | TWI457201B (en) |
| WO (1) | WO2012144388A1 (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105619237A (en) * | 2014-11-28 | 2016-06-01 | 浙江华正新材料股份有限公司 | Non-wax polishing adsorption pad and manufacturing method thereof |
| CN109890562A (en) * | 2016-08-10 | 2019-06-14 | 金世博股份公司 | Abrasive disk with support layer |
| CN110142687A (en) * | 2014-10-17 | 2019-08-20 | 应用材料公司 | By lamination manufacturing process grinding pad produced |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| CN112238670A (en) * | 2020-10-16 | 2021-01-19 | 上海江丰平芯电子科技有限公司 | Preparation method of grinding pad |
| US10953515B2 (en) | 2014-10-17 | 2021-03-23 | Applied Materials, Inc. | Apparatus and method of forming a polishing pads by use of an additive manufacturing process |
| CN113211337A (en) * | 2021-05-18 | 2021-08-06 | 南通大学 | Preparation method of polishing disk for polishing superhard substrate sheet and precision polishing method |
| CN113382824A (en) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | Polishing apparatus platen, polishing apparatus, and polishing method |
| US11446788B2 (en) | 2014-10-17 | 2022-09-20 | Applied Materials, Inc. | Precursor formulations for polishing pads produced by an additive manufacturing process |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014094424A (en) * | 2012-11-08 | 2014-05-22 | Toyo Tire & Rubber Co Ltd | Laminated polishing pad |
| US9238295B2 (en) * | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| JP6380977B2 (en) * | 2014-08-29 | 2018-08-29 | サトーホールディングス株式会社 | Elastic roller |
| WO2016060168A1 (en) * | 2014-10-14 | 2016-04-21 | Hoya株式会社 | Method for manufacturing substrate for magnetic disc and method for manufacturing magnetic disc |
| US9776361B2 (en) | 2014-10-17 | 2017-10-03 | Applied Materials, Inc. | Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles |
| WO2017074773A1 (en) | 2015-10-30 | 2017-05-04 | Applied Materials, Inc. | An apparatus and method of forming a polishing article that has a desired zeta potential |
| US9868185B2 (en) * | 2015-11-03 | 2018-01-16 | Cabot Microelectronics Corporation | Polishing pad with foundation layer and window attached thereto |
| US10593574B2 (en) | 2015-11-06 | 2020-03-17 | Applied Materials, Inc. | Techniques for combining CMP process tracking data with 3D printed CMP consumables |
| US10213894B2 (en) | 2016-02-26 | 2019-02-26 | Applied Materials, Inc. | Method of placing window in thin polishing pad |
| KR101781938B1 (en) * | 2016-08-04 | 2017-09-26 | 주식회사 휴비스 | Polyester-based Hot Melt Adhesive powder |
| TWI626117B (en) * | 2017-01-19 | 2018-06-11 | 智勝科技股份有限公司 | Polishing pad and polishing method |
| US20180345449A1 (en) * | 2017-06-06 | 2018-12-06 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pads for improved removal rate and planarization |
| US11471999B2 (en) | 2017-07-26 | 2022-10-18 | Applied Materials, Inc. | Integrated abrasive polishing pads and manufacturing methods |
| WO2019032286A1 (en) | 2017-08-07 | 2019-02-14 | Applied Materials, Inc. | Abrasive delivery polishing pads and manufacturing methods thereof |
| CN109202693B (en) | 2017-10-16 | 2021-10-12 | Skc索密思株式会社 | Leak-proof polishing pad and method of manufacturing the same |
| KR101890331B1 (en) * | 2017-10-16 | 2018-08-21 | 에스케이씨 주식회사 | Polishing pad protected leakage and manufecturing method thereof |
| KR20210042171A (en) | 2018-09-04 | 2021-04-16 | 어플라이드 머티어리얼스, 인코포레이티드 | Formulations for advanced polishing pads |
| CN112930584A (en) * | 2018-11-12 | 2021-06-08 | 昭和电工材料株式会社 | Method for manufacturing semiconductor device and adhesive film for processing semiconductor wafer |
| KR102202076B1 (en) * | 2018-12-26 | 2021-01-12 | 에스케이씨 주식회사 | Composition for polishing pad, polishing pad and preparation method thereof |
| US11207757B2 (en) * | 2019-06-17 | 2021-12-28 | Skc Solmics Co., Ltd. | Composition for polishing pad, polishing pad and preparation method of semiconductor device |
| US11806829B2 (en) | 2020-06-19 | 2023-11-07 | Applied Materials, Inc. | Advanced polishing pads and related polishing pad manufacturing methods |
| US11878389B2 (en) | 2021-02-10 | 2024-01-23 | Applied Materials, Inc. | Structures formed using an additive manufacturing process for regenerating surface texture in situ |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002371258A (en) * | 2001-06-13 | 2002-12-26 | Toyobo Co Ltd | Solvent-soluble crystalline polyester adhesive composition, laminate, and flat cable |
| CN1684798A (en) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | Polishing pad with window for planarization |
| JP2006062058A (en) * | 2004-08-30 | 2006-03-09 | Fujibo Holdings Inc | Abrasive cloth for finish polishing and manufacturing method of the abrasive cloth |
| JP2007035917A (en) * | 2005-07-27 | 2007-02-08 | Nitta Haas Inc | Polishing pad, silicon wafer, and polishing machine |
| JP2007118106A (en) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | Polishing pad and its manufacturing method |
| JP2008272922A (en) * | 2007-03-30 | 2008-11-13 | Toray Ind Inc | Manufacturing method for polishing pad |
| WO2009081821A1 (en) * | 2007-12-21 | 2009-07-02 | Toagosei Co., Ltd. | Hot melt adhesive composition |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03157473A (en) * | 1989-11-15 | 1991-07-05 | Unitika Ltd | Polyester-based hot-melt adhesive |
| JP2000505837A (en) | 1996-11-26 | 2000-05-16 | エルフ アトケム ソシエテ アノニム | Hot melt adhesives based on copolymers with epoxy groups |
| WO2001023141A1 (en) * | 1999-09-29 | 2001-04-05 | Rodel Holdings, Inc. | Polishing pad |
| US20020137431A1 (en) * | 2001-03-23 | 2002-09-26 | Labunsky Michael A. | Methods and apparatus for polishing and planarization |
| JP2003188124A (en) * | 2001-12-14 | 2003-07-04 | Rodel Nitta Co | Polishing cloth |
| US8066552B2 (en) * | 2003-10-03 | 2011-11-29 | Applied Materials, Inc. | Multi-layer polishing pad for low-pressure polishing |
| EP1739729B1 (en) * | 2004-04-23 | 2012-03-28 | JSR Corporation | Polishing pad for semiconductor wafer, polishing multilayered body for semiconductor wafer having same, and method for polishing semiconductor wafer |
| US7871309B2 (en) * | 2004-12-10 | 2011-01-18 | Toyo Tire & Rubber Co., Ltd. | Polishing pad |
| JP5363470B2 (en) * | 2007-06-08 | 2013-12-11 | アプライド マテリアルズ インコーポレイテッド | Thin polishing pad with window and molding process |
| US7820005B2 (en) * | 2008-07-18 | 2010-10-26 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad manufacturing process |
| JP5254727B2 (en) * | 2008-09-29 | 2013-08-07 | 富士紡ホールディングス株式会社 | Polishing pad |
| US8393940B2 (en) * | 2010-04-16 | 2013-03-12 | Applied Materials, Inc. | Molding windows in thin pads |
-
2012
- 2012-04-02 JP JP2012084023A patent/JP5893479B2/en not_active Expired - Fee Related
- 2012-04-11 US US14/111,503 patent/US20140065932A1/en not_active Abandoned
- 2012-04-11 CN CN201280018985XA patent/CN103476546A/en active Pending
- 2012-04-11 SG SG2013078175A patent/SG194560A1/en unknown
- 2012-04-11 WO PCT/JP2012/059910 patent/WO2012144388A1/en active Application Filing
- 2012-04-11 KR KR1020137022306A patent/KR101572464B1/en active IP Right Grant
- 2012-04-16 TW TW101113451A patent/TWI457201B/en not_active IP Right Cessation
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002371258A (en) * | 2001-06-13 | 2002-12-26 | Toyobo Co Ltd | Solvent-soluble crystalline polyester adhesive composition, laminate, and flat cable |
| CN1684798A (en) * | 2002-09-25 | 2005-10-19 | Ppg工业俄亥俄公司 | Polishing pad with window for planarization |
| JP2006062058A (en) * | 2004-08-30 | 2006-03-09 | Fujibo Holdings Inc | Abrasive cloth for finish polishing and manufacturing method of the abrasive cloth |
| JP2007035917A (en) * | 2005-07-27 | 2007-02-08 | Nitta Haas Inc | Polishing pad, silicon wafer, and polishing machine |
| JP2007118106A (en) * | 2005-10-26 | 2007-05-17 | Toyo Tire & Rubber Co Ltd | Polishing pad and its manufacturing method |
| JP2008272922A (en) * | 2007-03-30 | 2008-11-13 | Toray Ind Inc | Manufacturing method for polishing pad |
| WO2009081821A1 (en) * | 2007-12-21 | 2009-07-02 | Toagosei Co., Ltd. | Hot melt adhesive composition |
Non-Patent Citations (1)
| Title |
|---|
| 田中勤: "《玻璃钢（FRP）成型工艺技术及应用》", 31 January 1996, 中国环境科学出版社 * |
Cited By (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10953515B2 (en) | 2014-10-17 | 2021-03-23 | Applied Materials, Inc. | Apparatus and method of forming a polishing pads by use of an additive manufacturing process |
| US10821573B2 (en) | 2014-10-17 | 2020-11-03 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11958162B2 (en) | 2014-10-17 | 2024-04-16 | Applied Materials, Inc. | CMP pad construction with composite material properties using additive manufacturing processes |
| CN110142687A (en) * | 2014-10-17 | 2019-08-20 | 应用材料公司 | By lamination manufacturing process grinding pad produced |
| CN110142687B (en) * | 2014-10-17 | 2021-05-25 | 应用材料公司 | Polishing pad produced by lamination manufacturing process |
| US10875145B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US10875153B2 (en) | 2014-10-17 | 2020-12-29 | Applied Materials, Inc. | Advanced polishing pad materials and formulations |
| US11745302B2 (en) | 2014-10-17 | 2023-09-05 | Applied Materials, Inc. | Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process |
| US11724362B2 (en) | 2014-10-17 | 2023-08-15 | Applied Materials, Inc. | Polishing pads produced by an additive manufacturing process |
| US11446788B2 (en) | 2014-10-17 | 2022-09-20 | Applied Materials, Inc. | Precursor formulations for polishing pads produced by an additive manufacturing process |
| CN105619237B (en) * | 2014-11-28 | 2018-07-27 | 浙江华正新材料股份有限公司 | It is a kind of without cured polishing absorption layer and its manufacturing method |
| CN105619237A (en) * | 2014-11-28 | 2016-06-01 | 浙江华正新材料股份有限公司 | Non-wax polishing adsorption pad and manufacturing method thereof |
| US11772229B2 (en) | 2016-01-19 | 2023-10-03 | Applied Materials, Inc. | Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process |
| CN109890562A (en) * | 2016-08-10 | 2019-06-14 | 金世博股份公司 | Abrasive disk with support layer |
| CN113382824A (en) * | 2019-03-20 | 2021-09-10 | 丸石产业株式会社 | Polishing apparatus platen, polishing apparatus, and polishing method |
| CN112238670A (en) * | 2020-10-16 | 2021-01-19 | 上海江丰平芯电子科技有限公司 | Preparation method of grinding pad |
| CN113211337A (en) * | 2021-05-18 | 2021-08-06 | 南通大学 | Preparation method of polishing disk for polishing superhard substrate sheet and precision polishing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101572464B1 (en) | 2015-11-27 |
| JP5893479B2 (en) | 2016-03-23 |
| WO2012144388A1 (en) | 2012-10-26 |
| JP2013066993A (en) | 2013-04-18 |
| SG194560A1 (en) | 2013-12-30 |
| TW201302380A (en) | 2013-01-16 |
| TWI457201B (en) | 2014-10-21 |
| KR20130119487A (en) | 2013-10-31 |
| US20140065932A1 (en) | 2014-03-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103476546A (en) | Laminated polishing pad | |
| CN103492124B (en) | Stacked grinding pad hot-melt adhesive sheet and the supporting layer with stacked grinding pad bond layer | |
| KR100909605B1 (en) | Polishing pads and manufacturing method thereof | |
| CN103945984B (en) | The manufacture method of stacked grinding pad and manufacture method thereof and semiconductor device | |
| KR101633766B1 (en) | Laminated polishing pad and method for producing same | |
| KR20140035375A (en) | Polishing pad and manufacturing method therefor | |
| CN103987494A (en) | Method for producing laminated polishing pad | |
| KR20140035374A (en) | Polishing pad and manufacturing method therefor | |
| CN104755227A (en) | Multilayer polishing pad | |
| CN103958125A (en) | Polishing pad | |
| JP2013082035A (en) | Laminated polishing pad and method of manufacturing the same | |
| CN104379304A (en) | Laminated polishing pad and method for manufacturing same | |
| CN104736297A (en) | Method for producing layered polishing pads | |
| JP2014113644A (en) | Polishing pad | |
| JP5797981B2 (en) | Polishing pad | |
| JP4986274B2 (en) | Polishing pad and manufacturing method thereof | |
| CN103180100A (en) | Polishing pad and method for producing same | |
| CN103153539B (en) | Grinding pad and manufacture method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160629 Address after: Delaware Applicant after: Roman Haas electronic materials CMP Holding Ltd Address before: Osaka City, Osaka of Japan Applicant before: Toyo Tire Rubber |
|
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20131225 |