CN210868608U - SMT chip mounter - Google Patents
SMT chip mounter Download PDFInfo
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- CN210868608U CN210868608U CN201921714832.4U CN201921714832U CN210868608U CN 210868608 U CN210868608 U CN 210868608U CN 201921714832 U CN201921714832 U CN 201921714832U CN 210868608 U CN210868608 U CN 210868608U
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Abstract
The utility model relates to the technical field of SMT paster, in particular to an SMT paster machine, which comprises a frame, wherein a transmission mechanism and a paster mechanism are arranged on the frame; the paster mechanism is positioned above the transmission mechanism; the conveying mechanism comprises a conveying motor and two conveying supports, the top ends of the two conveying supports are respectively and rotatably connected with a driven wheel and a driving wheel, a synchronous conveying belt is wound between the driving wheel and the driven wheel, and a plurality of anti-skidding bodies are uniformly distributed on the synchronous conveying belt; the transmission support is detachably connected with the rack, and a buffer mechanism is arranged at the bottom of the rack. The utility model discloses novel structure, design benefit prevents that printed circuit board from squinting in transmission process, improves job stabilization nature, and transport mechanism and frame can independently carry respectively and transfer after the dismouting, and convenient transport reduces the transport degree of difficulty, and buffer gear plays shock attenuation buffering effect.
Description
Technical Field
The utility model belongs to the technical field of the SMT paster technique and specifically relates to indicate a SMT chip mounter.
Background
SMT is a surface mount technology, called surface mount technology or surface mount technology, which is the most popular technology and process in the current electronic assembly industry, and is a circuit assembly technology in which surface mount components without pins or short leads (SMC/SMD, in chinese called chip components) are mounted on the surface of a printed circuit board or other substrates and soldered and assembled by solder reflow or dip soldering. Most of the current SMT chip mounters adopt a synchronous transmission belt to transmit a printed circuit board, but the surface of the synchronous transmission belt is smooth, so that the printed circuit board is easy to deviate; and the current SMT chip mounter is large in size and inconvenient to carry integrally.
Disclosure of Invention
The utility model discloses problem to prior art provides a SMT chip mounter, novel structure, design benefit prevents that printed circuit board from squinting in transmission process, improves job stabilization nature, and transport mechanism and frame can independently carry respectively and transfer after the dismouting, and convenient transport reduces the transport degree of difficulty, and buffer gear plays shock attenuation buffering effect.
In order to solve the technical problem, the utility model discloses a following technical scheme:
the utility model provides a SMT chip mounter, which comprises a rack, wherein a transmission mechanism and a chip mounting mechanism are arranged on the rack, the transmission mechanism is used for transmitting an external printed circuit board, and the chip mounting mechanism is used for mounting a chip on the external printed circuit board; the paster mechanism is positioned above the transmission mechanism; the transmission mechanism comprises a transmission motor and two transmission brackets, the top ends of the two transmission brackets are respectively and rotatably connected with a driven wheel and a driving wheel, a synchronous transmission belt is wound between the driving wheel and the driven wheel, a plurality of anti-skidding bodies are uniformly distributed on the synchronous transmission belt, the output shaft of the transmission motor is in driving connection with the driving wheel, and the transmission motor is fixed on the transmission bracket rotatably connected with the driving wheel; the transmission support is detachably connected with the rack, and a buffer mechanism is arranged at the bottom of the rack.
Wherein, the transmission support includes the base and fixes the supporting seat on the base, the base is provided with a plurality of locking groove, and every locking inslot has all installed the locking piece, the frame is provided with the locking hole, the locking hole with the locking groove corresponds the setting, the locking piece is worn to locate and is fixed base and frame behind locking groove and the locking hole.
Wherein, the locking piece includes pole portion, set up in the locking of pole portion one side colludes the portion and set up in the portion of carrying of pole portion opposite side, the locking groove is including being used for installing the first groove of holding of pole portion, being used for installing the second of locking portion holds the groove and is used for installing the third of carrying the portion holds the groove, carry the portion of carrying and stretch out suddenly the base, the third holds the groove and is provided with the confession and carries the portion of carrying and stretch out suddenly the opening of base.
The locking hook part and the second accommodating groove are arranged in an L shape.
Wherein, the antiskid body is elastic plastic particles.
The device comprises a transmission support, a synchronous transmission belt, a sensor and a chip pasting mechanism, wherein baffles are fixedly connected to two sides of the transmission support, the synchronous transmission belt is located between the two baffles, the sensor is further arranged on the baffles and located below the chip pasting mechanism, and the sensor is in signal connection with the chip pasting mechanism.
Wherein, buffer gear includes from last upper fixed plate, buffer layer and the bottom plate who connects gradually down, upper fixed plate is connected with the frame, the buffer layer is shock attenuation plastic layer.
The chip mounting mechanism comprises a moving assembly and a chip mounting head, the moving assembly comprises an X-axis moving assembly, a Y-axis moving assembly and an electric push rod, the X-axis moving assembly comprises an X-axis driving motor, an X-axis transmission lead screw and a slide block, the Y-axis moving assembly comprises a Y-axis driving motor and a Y-axis transmission lead screw, the X-axis driving motor is fixed on a rack, the output end of the X-axis driving motor is in driving connection with one end of the X-axis transmission lead screw, the other end of the X-axis transmission lead screw is in rotating connection with the rack, the slide block is sleeved on the periphery of the X-axis transmission lead screw and is in driving connection with the X-axis transmission lead screw, the Y-axis driving motor is fixed at the bottom of the slide block, one end of the Y-axis transmission lead screw is in driving connection with the output end of the Y-axis driving motor, the other, the moving block is sleeved on the periphery of the Y-axis transmission screw rod and is in transmission connection with the Y-axis transmission screw rod, and the output end of the electric push rod is in driving connection with the chip mounting head and is used for driving the chip mounting head to move up and down.
The CCD visual detector is arranged in the middle of the chip mounting head, and the bottom of the chip mounting head is provided with a plurality of suction nozzles.
The utility model has the advantages that:
the utility model discloses novel structure, design benefit, antiskid body can form better frictional force with printed circuit board, prevents that printed circuit board from squinting in the transmission course, improves job stabilization nature, and when printed circuit board reachd the station of paster mechanism, paster mechanism carries out paster operation to printed circuit board; in addition, the transmission support can be dismantled with the frame and be connected, is convenient for tear transmission device out alone, and transmission device and frame can be dismantled the back and independently carry respectively and transfer, and convenient transport reduces the transport degree of difficulty, and in addition, the frame is provided with buffer gear and can makes the utility model discloses wholly play shock attenuation buffering effect, improvement job stabilization nature and reliability.
Drawings
Fig. 1 is the utility model discloses a structural schematic diagram of SMT chip mounter.
Fig. 2 is a schematic structural view of the synchronous transmission belt of the present invention.
Fig. 3 is an exploded view of the transmission bracket and the frame of the present invention.
Fig. 4 is a schematic structural diagram of the buffer mechanism of the present invention.
The reference numerals in fig. 1 to 4 include:
1-frame 2-transmission motor 3-transmission support
4-driven wheel 5-driving wheel 6-synchronous transmission belt
7-antiskid body 8-buffer mechanism 9-base
10-support seat 11-locking groove 12-locking piece
13-locking hole 14-rod part 15-locking hook part
16-lifting part 17-first containing groove 18-second containing groove
19-third vessel 20-baffle 21-sensor
22-upper fixing plate 23-buffer layer 24-lower fixing plate
25-damping hole 26-patch head 27-electric push rod
28-X-axis driving motor 29-X-axis transmission screw rod 30-sliding block
31-Y-axis driving motor 32-Y-axis transmission lead screw 33-moving block
34-CCD visual detector 35-suction nozzle.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention will be described in detail with reference to the accompanying drawings.
An SMT chip mounter is disclosed, as shown in FIGS. 1 to 4, and comprises a rack 1, wherein a transmission mechanism and a chip mounting mechanism are arranged on the rack 1, the transmission mechanism is used for transmitting an external printed circuit board, and the chip mounting mechanism is used for carrying out chip mounting on the external printed circuit board; the paster mechanism is positioned above the transmission mechanism; the conveying mechanism comprises a conveying motor 2 and two conveying supports 3, the top ends of the two conveying supports 3 are respectively and rotatably connected with a driven wheel 4 and a driving wheel 5, a synchronous conveying belt 6 is wound between the driving wheel 5 and the driven wheel 4, a plurality of anti-skidding bodies 7 are uniformly distributed on the synchronous conveying belt 6, an output shaft of the conveying motor 2 is in driving connection with the driving wheel 5, and the conveying motor 2 is fixed on the conveying support 3 which is rotatably connected with the driving wheel 5; the transmission support 3 is detachably connected with the rack 1, and a buffer mechanism 8 is arranged at the bottom of the rack 1. The utility model discloses novel structure, design benefit, outside robot arm or workman send printed circuit board to synchronous transmission band 6 on, under action wheel 5, from driving wheel 4, synchronous transmission band 6 and transmission motor 2, realize that synchronous transmission band 6 drives printed circuit board placed on synchronous transmission band 6 and moves forward to the station of iron sheet mechanism on, and antiskid body 7 on the synchronous transmission band 6 can form better frictional force with printed circuit board, prevent that printed circuit board from squinting in the transmission course, improve job stabilization nature, when printed circuit board reachs the station of paster mechanism, paster mechanism carries out paster operation to printed circuit board; in addition, transmission support 3 can be dismantled with frame 1 and be connected, is convenient for tear transmission device out alone, and transmission device and frame 1 can independently carry respectively and transfer after the dismouting, and convenient transport reduces the transport degree of difficulty, and in addition, frame 1 is provided with buffer gear 8 and can makes the utility model discloses wholly play shock attenuation buffering effect, improves job stabilization nature and reliability.
This embodiment an SMT chip mounter, transmission support 3 includes base 9 and fixes supporting seat 10 on base 9, base 9 is provided with a plurality of locking groove 11, has all installed locking piece 12 in every locking groove 11, frame 1 is provided with locking hole 13, locking hole 13 with locking groove 11 corresponds the setting, locking piece 12 is worn to locate and is fixed base 9 and frame 1 behind locking groove 11 and the locking hole 13. Specifically, locking piece 12 is inserted into locking groove 11 and then is inserted into locking hole 13 of frame 1, so that the position of frame 1 and base 9 is locked, and further the position of transmission support 3 and frame 1 is locked, and when transmission support 3 needs to be detached, locking piece 12 only needs to be pulled out from locking hole 13.
In this embodiment, the locking member 12 includes a rod portion 14, a locking hook portion 15 disposed on one side of the rod portion 14 and a lifting portion 16 disposed on the other side of the rod portion 14, the locking groove 11 includes a first accommodating groove 17 for mounting the rod portion 14, a second accommodating groove 18 for mounting the locking hook portion 15 and a third accommodating groove 19 for mounting the lifting portion 16, the lifting portion 16 protrudes from the base 9, and the third accommodating groove 19 is provided with an opening for the lifting portion 16 to protrude from the base 9. Specifically, the first accommodating groove 17 and the locking hole 13 are correspondingly arranged, when the locking piece 12 is inserted into the locking groove 11, the rod part 14 is inserted into the locking hole 13 after being inserted into the first accommodating groove 17, the locking hook part 15 is arranged in the second accommodating groove 18, the lifting part 16 is arranged in the third accommodating groove 19, the accommodating part of the locking piece 12 is arranged in the locking groove 11, so that the transmission support 3 is flat in structure, the upper end of the locking piece 12 is prevented from being exposed to scratch to an operator, in addition, an opening is formed in one side of the third accommodating groove 19, the lifting part 16 conveniently protrudes out of the base 9, namely, the operator can lift the locking piece 12 out of the locking hole 13 and the locking groove 11 through the lifting part 16, and the use is convenient, wherein the lifting part 16 is in a horizontal straight strip shape.
In the SMT chip mounter of this embodiment, the locking hook 15 and the second accommodating groove 18 are both in an "L" shape. Specifically, the locking hook 15 hooks the second accommodating groove 18, so as to hook the base 9 of the transmission bracket 3, and when the rod 14 is inserted into the locking hole 13, the position of the transmission bracket 3 is locked.
In the SMT surface mounting machine of the present embodiment, the anti-slip member 7 is an elastic plastic particle. Specifically, the anti-slip body 7 provided as described above provides both an anti-slip effect and a shock absorbing effect.
The SMT chip mounter is characterized in that baffles 20 are fixedly connected to two sides of the transmission support 3, the synchronous transmission belt 6 is located between the two baffles 20, a sensor 21 is further arranged on each baffle 20, the sensor 21 is located below a chip mounting mechanism, and the sensor 21 is in signal connection with the chip mounting mechanism. Specifically, the two baffles 20 can prevent the printed circuit board driven by the transmission of the synchronous transmission belt 6 from falling, the use is reliable, the sensor 21 is set to be conventional in the prior art and used for judging the position of the printed circuit board in place pasting mechanism, and then the pasting mechanism starts pasting work.
The embodiment a SMT chip mounter, buffer gear 8 includes from last upper fixed plate 22, buffer layer 23 and the bottom plate 24 that connects gradually down, upper fixed plate 22 is connected with frame 1, buffer layer 23 is shock attenuation plastic layer. Specifically, a plurality of shock absorption holes 25 are formed in the shock absorption plastic layer, and the shock absorption holes 25 are distributed in a honeycomb shape; the buffer mechanism 8 arranged above plays roles of buffering and shock absorption, and improves the working stability.
The SMT chip mounter is characterized in that the chip mounting mechanism comprises a moving assembly and a chip mounting head 26, the moving assembly comprises an X-axis moving assembly, a Y-axis moving assembly and an electric push rod 27, the X-axis moving assembly comprises an X-axis driving motor 28, an X-axis transmission lead screw 29 and a slider 30, the Y-axis moving assembly comprises a Y-axis driving motor 31 and a Y-axis transmission lead screw 32, the X-axis driving motor 28 is fixed on the frame 1, the output end of the X-axis driving motor 28 is in driving connection with one end of the X-axis transmission lead screw 29, the other end of the X-axis transmission lead screw 29 is in rotating connection with the frame 1, the slider 30 is sleeved on the periphery of the X-axis transmission lead screw 29 and is in driving connection with the X-axis transmission lead screw 29, the Y-axis driving motor 31 is fixed at the bottom of the slider 30, one end of the Y-axis transmission lead screw 32 is, the other end of the Y-axis transmission lead screw 32 is rotatably connected with the sliding block 30, a moving block 33 is fixedly connected to the electric push rod 27, the moving block 33 is sleeved on the periphery of the Y-axis transmission lead screw 32 and is in transmission connection with the Y-axis transmission lead screw 32, and the output end of the electric push rod 27 is in driving connection with the chip mounting head 26 and is used for driving the chip mounting head 26 to move up and down. Specifically, the chip mounter of the present invention may be any conventional chip mounter in the prior art; the paster mechanism that this embodiment provided, wherein, electric putter 27 can drive paster head 26 reciprocating motion from top to bottom, X axle removes the subassembly and can orders about paster head 26 along X axle reciprocating motion, Y axle removes the subassembly and can orders about paster head 26 along Y axle reciprocating motion, realizes the position control to paster head 26, makes things convenient for paster head 26 to adsorb the paster to external pay-off and then carries out the paster to the printed circuit board of synchronous transmission band 6 again, convenient to use.
In the SMT pick and place machine of this embodiment, CCD visual detector 34 has been installed at the middle part of pick and place head 26, the bottom of pick and place head 26 is provided with a plurality of suction nozzle 35. Specifically, CCD visual detector 34 can discern the position of printed circuit board and the position that needs the paster, and CCD visual detector 34 is prior art, and no longer gives details here, and suction nozzle 35 can realize adsorbing and placing convenient to use to the paster.
The above description is only for the preferred embodiment of the present invention, and the present invention is not limited to the above description, and although the present invention is disclosed in the preferred embodiment, it is not limited to the above description, and any person skilled in the art can make some changes or modifications to equivalent embodiments without departing from the scope of the present invention, but all the technical solutions of the present invention are within the scope of the present invention.
Claims (9)
1. An SMT chip mounter is characterized in that: the automatic chip mounter comprises a rack, wherein a transmission mechanism and a chip mounting mechanism are arranged on the rack, the transmission mechanism is used for transmitting an external printed circuit board, and the chip mounting mechanism is used for mounting a chip on the external printed circuit board; the paster mechanism is positioned above the transmission mechanism; the transmission mechanism comprises a transmission motor and two transmission brackets, the top ends of the two transmission brackets are respectively and rotatably connected with a driven wheel and a driving wheel, a synchronous transmission belt is wound between the driving wheel and the driven wheel, a plurality of anti-skidding bodies are uniformly distributed on the synchronous transmission belt, the output shaft of the transmission motor is in driving connection with the driving wheel, and the transmission motor is fixed on the transmission bracket rotatably connected with the driving wheel; the transmission support is detachably connected with the rack, and a buffer mechanism is arranged at the bottom of the rack.
2. An SMT chip mounter according to claim 1, wherein: the transmission support includes the base and fixes the supporting seat on the base, the base is provided with a plurality of locking groove, and every locking inslot has all installed the locking piece, the frame is provided with the locking hole, the locking hole with the locking groove corresponds the setting, the locking piece is worn to locate and is fixed base and frame behind locking groove and the locking hole.
3. An SMT chip mounter according to claim 2, wherein: the locking piece includes pole portion, set up in the locking of pole portion one side colludes the portion and set up in the portion of carrying of pole portion opposite side, the locking groove is including being used for installing the first groove, the being used for installing of pole portion the second of locking portion is held the groove and is used for installing carry the third of portion and hold the groove, carry the portion and stretch out suddenly the base, the third holds the groove and is provided with the confession and carries the portion and stretch out suddenly the opening of base.
4. An SMT chip mounter according to claim 3, wherein: the locking hook part and the second accommodating groove are arranged in an L shape.
5. An SMT chip mounter according to claim 1, wherein: the anti-slip body is elastic plastic particles.
6. An SMT chip mounter according to claim 1, wherein: the equal fixedly connected with baffle in both sides of transmission support, the synchronous transmission band is located between two baffles, still be provided with the sensor on the baffle, the sensor is located the below of paster mechanism, the sensor with paster mechanism signal connection.
7. An SMT chip mounter according to claim 1, wherein: buffer gear includes from last upper fixed plate, buffer layer and the bottom plate that connects gradually extremely down, upper fixed plate is connected with the frame, the buffer layer is shock attenuation plastic layer.
8. An SMT chip mounter according to claim 1, wherein: the chip mounting mechanism comprises a moving assembly and a chip mounting head, the moving assembly comprises an X-axis moving assembly, a Y-axis moving assembly and an electric push rod, the X-axis moving assembly comprises an X-axis driving motor, an X-axis transmission lead screw and a slide block, the Y-axis moving assembly comprises a Y-axis driving motor and a Y-axis transmission lead screw, the X-axis driving motor is fixed on a rack, the output end of the X-axis driving motor is in driving connection with one end of the X-axis transmission lead screw, the other end of the X-axis transmission lead screw is in rotating connection with the rack, the slide block is sleeved on the periphery of the X-axis transmission lead screw and is in driving connection with the X-axis transmission lead screw, the Y-axis driving motor is fixed at the bottom of the slide block, one end of the Y-axis transmission lead screw is in driving connection with the output end of the Y-axis driving motor, the moving block is sleeved on the periphery of the Y-axis transmission screw rod and is in transmission connection with the Y-axis transmission screw rod, and the output end of the electric push rod is in driving connection with the chip mounting head and is used for driving the chip mounting head to move up and down.
9. An SMT pick & place machine according to claim 8, wherein: the middle part of the chip mounting head is provided with a CCD visual detector, and the bottom of the chip mounting head is provided with a plurality of suction nozzles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921714832.4U CN210868608U (en) | 2019-10-12 | 2019-10-12 | SMT chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921714832.4U CN210868608U (en) | 2019-10-12 | 2019-10-12 | SMT chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210868608U true CN210868608U (en) | 2020-06-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921714832.4U Active CN210868608U (en) | 2019-10-12 | 2019-10-12 | SMT chip mounter |
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| CN (1) | CN210868608U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993297A (en) * | 2021-11-29 | 2022-01-28 | 苏州恒铭达电子科技股份有限公司 | Automatic accurate branch of material loading is pasted device |
-
2019
- 2019-10-12 CN CN201921714832.4U patent/CN210868608U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113993297A (en) * | 2021-11-29 | 2022-01-28 | 苏州恒铭达电子科技股份有限公司 | Automatic accurate branch of material loading is pasted device |
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