CN219107832U

CN219107832U - SMT chip mounter of quick solidification paster

Info

Publication number: CN219107832U
Application number: CN202222852768.4U
Authority: CN
Inventors: 顾成华
Original assignee: Suzhou Aohai Electronics Co ltd
Current assignee: Suzhou Aohai Electronics Co ltd
Priority date: 2022-10-28
Filing date: 2022-10-28
Publication date: 2023-05-30
Anticipated expiration: 2032-10-28

Abstract

The utility model discloses an SMT chip mounter capable of rapidly solidifying chips, wherein a plurality of groups of limiting mechanisms are arranged on the surface of a conveyor belt in a conveyor belt mechanism, a movable telescopic chip mounter is arranged at the top of the inner side of a U-shaped mounting plate, a cooling and solidifying mechanism is arranged at the outer side of the movable telescopic chip mounter, the cooling and solidifying mechanism comprises a fan, the fan is positioned at the top of the outer side of the U-shaped mounting plate and is connected with a cooling box, and an air outlet of the cooling box mechanism is connected with a uniform fan mechanism arranged at the outer side of the movable telescopic chip mounter through a telescopic pipe. This SMT chip mounter of quick solidification paster, this device does not possess the problem of quick solidification paster function for solving current SMT chip mounter, through installing cooling solidification mechanism in the removal flexible chip mounter outside, accomplish the back to circuit board paster when removing flexible chip mounter, opens the refrigerator, and the refrigerator is through refrigerating the pipe to cooling box body inside, then starts the fan, carries out quick cooling solidification to the paster of below.

Description

SMT chip mounter of quick solidification paster

Technical Field

The utility model relates to the technical field of SMT chip mounters, in particular to an SMT chip mounter capable of rapidly solidifying a chip.

Background

SMT is a surface mount technology, which is currently the most popular technology and process in the electronics assembly industry. SMT patches refer to short for serial process flows that are processed on a PCB basis. SMT is a surface mount technology that is currently the most popular technology and process in the electronics assembly industry. Electronic circuit surface assembly techniques are known as surface mount or surface mount techniques. The circuit mounting technology is to mount no-pin or short-lead surface assembly components on the surface of a printed circuit board or the surface of other base plates, and to carry out welding assembly by reflow soldering or dip soldering and other methods.

Through retrieving, found among the prior art as the SMT chip mounter of publication number CN210868608U, including the frame, be equipped with transport mechanism and paster mechanism in the frame, paster mechanism is located transport mechanism's top, transport mechanism includes transmission motor and two transmission brackets, the top of two transmission brackets rotates respectively and is connected with from driving wheel and action wheel, and action wheel and from being equipped with synchronous transmission area around between the driving wheel, evenly distributed is provided with a plurality of anti-skidding bodies on the synchronous transmission area, transmission bracket and frame detachable connection, the bottom of frame is provided with buffer gear. The utility model has novel structure and ingenious design, prevents the printed circuit board from shifting in the transmission process, improves the working stability, and the transmission mechanism and the rack can be respectively and independently carried and transferred after being disassembled, thereby being convenient for carrying, reducing the carrying difficulty and having the damping and buffering effects by the buffer mechanism.

Above-mentioned SMT chip mounter can prevent through setting up the antiskid body that printed circuit board from shifting in transmission process, improves job stabilization nature, but above-mentioned SMT chip mounter paster work is accomplished the back and is needed to remove the circuit board that the paster was accomplished to other machinery and carry out paster solidification air-dry, perhaps wait its natural air-dry, and the process is very inconvenient, consequently proposes the SMT chip mounter of a quick solidification paster to solve above-mentioned problem.

Disclosure of Invention

The utility model aims to provide an SMT chip mounter capable of rapidly solidifying a chip, and aims to solve the problem that the conventional SMT chip mounter cannot be provided with a rapid solidification chip mounting function in the background art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a SMT chip mounter of quick solidification paster, includes the installation frame, the installation frame top is provided with conveyer belt mechanism, and conveyer belt surface mounting in the conveyer belt mechanism has a plurality of groups of stop gear, the installation frame top is connected with U type mounting panel, the inboard top of U type mounting panel is provided with the flexible chip mounter of removal, and removes flexible chip mounter outside and install cooling solidification mechanism, cooling solidification mechanism includes the fan, the fan is located U type mounting panel outside top, and the fan air outlet is connected with cooling tank mechanism air intake through the gas supply pipe, cooling tank mechanism air outlet is connected with the even fan mechanism of removing flexible chip mounter outside installation through flexible pipe.

Preferably, the cooling box mechanism comprises a cooling box body, an air inlet and an air outlet are formed in the cooling box body, a refrigerator is arranged in the cooling box body, and the top of the refrigerator is communicated with a refrigerating pipe.

By adopting the technical scheme, the cooling box is convenient to refrigerate inside the cooling box body.

Preferably, the air homogenizing mechanism comprises an air homogenizing plate, one side of the air homogenizing plate is connected with the telescopic pipe, and a plurality of groups of air homogenizing nozzles are arranged at the bottom of the air homogenizing plate.

By adopting the technical scheme, cold air is prevented from gathering at one place.

Preferably, the stop gear is including placing the board, place the board and be connected with the conveyer belt, and place the cladding of board outside and have one deck skid resistant course, place board top symmetry and be provided with two sets of fixed establishment, fixed establishment includes first electric telescopic handle, and first electric telescopic handle bottom is connected with placing the board through the connecting block, first electric telescopic handle output is connected with the fixed plate, and the fixed plate with place board sliding connection.

By adopting the technical scheme, the position of the circuit board is limited.

Preferably, remove flexible chip mounter and including removing the groove, and remove the groove top and be connected with the inboard top of U type mounting panel, remove groove internally mounted and have screw mechanism, and the screw mechanism outside is connected with the electronic telescopic link of second through the movable block, and the electronic telescopic link output of second is connected with the chip mounter body, CCD vision detector is installed to chip mounter body below.

Through adopting above-mentioned technical scheme, be convenient for adjust chip mounter body position.

Preferably, the air homogenizing plate is arranged on the outer side of the chip mounter body, and an installation opening matched with the chip mounter body is formed in the air homogenizing plate.

Through adopting above-mentioned technical scheme, be convenient for even aerofoil and the connection in the chip mounter body outside.

Compared with the prior art, the utility model has the beneficial effects that: this SMT chip mounter of quick solidification paster, this device is for solving the problem that current SMT chip mounter does not possess quick solidification paster function, through installing cooling solidification mechanism in the removal flexible chip mounter outside, accomplish the back to circuit board paster when removing flexible chip mounter, open the refrigerator, the refrigerator is through refrigerating pipe to cooling box body inside refrigerate, then start the fan, cold wind is followed flexible pipe flow direction air distribution board under the effect of fan, finally is spouted from even wind shower nozzle, carries out quick cooling solidification to the paster of below.

Drawings

FIG. 1 is a schematic diagram of the overall front cross-sectional structure of the present utility model;

FIG. 2 is a schematic top view of the present utility model;

FIG. 3 is a schematic view of a limiting mechanism according to the present utility model;

fig. 4 is a schematic structural diagram of a mobile telescopic chip mounter according to the present utility model;

FIG. 5 is an enlarged schematic view of the structure of the present utility model at A;

FIG. 6 is a schematic view of a cooling and solidifying mechanism according to the present utility model;

fig. 7 is a schematic structural diagram of the air homogenizing mechanism of the present utility model.

In the figure: 1. a frame is installed; 2. a conveyor belt mechanism; 201. a conveyor belt; 3. a limiting mechanism; 301. placing a plate; 302. an anti-slip layer; 303. a fixing mechanism; 304. a first electric telescopic rod; 305. a fixing plate; 4. a U-shaped mounting plate; 5. moving the telescopic chip mounter; 501. a moving groove; 502. a screw rod mechanism; 503. a moving block; 504. a second electric telescopic rod; 505. a chip mounter body; 506. a CCD visual detector; 6. cooling and solidifying mechanism; 601. a blower; 602. a cooling box mechanism; 603. a telescopic tube; 604. a wind homogenizing mechanism; 605. a cooling box body; 606. a refrigerator; 607. a refrigeration tube; 608. a wind homogenizing plate; 609. a wind homogenizing spray head; 610. and (5) an installation port.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-7, the present utility model provides a technical solution: according to the SMT chip mounter for rapidly curing chips, as shown in fig. 1-3, a conveyor belt mechanism 2 is arranged above a mounting frame 1, and a plurality of groups of limiting mechanisms 3 are arranged on the surface of a conveyor belt 201 in the conveyor belt mechanism 2.

In a further embodiment, the conveyor belt mechanism 2 comprises a mounting frame, a driving wheel and a driven wheel are arranged on the inner side of the mounting frame, one end of the driving wheel is connected with the output end of the transmission motor, and the driving wheel is connected with the driven wheel through the conveyor belt 201.

Specifically, the limiting mechanism 3 comprises a placing plate 301, the placing plate 301 is connected with the conveyor belt 201, a layer of anti-slip layer 302 is coated on the outer side of the placing plate 301, two groups of fixing mechanisms 303 are symmetrically arranged above the placing plate 301, each fixing mechanism 303 comprises a first electric telescopic rod 304, the bottom of each first electric telescopic rod 304 is connected with the placing plate 301 through a connecting block, the output end of each first electric telescopic rod 304 is connected with a fixing plate 305, and the fixing plates 305 are in sliding connection with the placing plate 301.

When the circuit board is used, the circuit board is placed above the placing plate 301, the anti-slip layer 302 wrapped on the outer side of the placing plate 301 can increase friction between the circuit board and the placing plate 301, after the placing is completed, the first electric telescopic rod 304 is opened, the fixing plate 305 moves under the action of the first electric telescopic rod 304 until the fixing plate 305 is tightly attached to the outer side of the circuit board, the position of the fixing plate 305 is limited, and the first electric telescopic rod 304 can be closed, so that the fixing plate is not stretched continuously.

According to the figures 1-2 and 4-7, a U-shaped mounting plate 4,U is connected above a mounting frame 1, a movable telescopic chip mounter 5 is arranged at the top of the inner side of the mounting plate 4, and a cooling and solidifying mechanism 6 is arranged on the outer side of the movable telescopic chip mounter 5.

Specifically, remove flexible chip mounter 5 includes and removes groove 501, and removes the groove 501 top and is connected with the inboard top of U type mounting panel 4, removes groove 501 internally mounted and has screw mechanism 502, and the screw mechanism 502 outside is connected with second electric telescopic handle 504 through movable block 503, and the second electric telescopic handle 504 output is connected with chip mounter body 505, and CCD visual detector 506 is installed to chip mounter body 505 below.

In still further embodiments, the screw mechanism 502 includes a screw, and one end of the screw is connected to a screw motor outside the moving slot 501, a screw block is disposed outside the screw, the screw block is connected to the moving block 503, and the screw can drive the screw block to perform linear motion, which is in the prior art, and is not described too much.

In a further embodiment, the chip mounter body 505 and the CCD vision detector 506 are related art, and will not be described in detail.

When the patch machine is used, the lead screw motor in the lead screw mechanism 502 is started, the lead screw motor drives the lead screw to rotate, so that the moving block 503 drives the second electric telescopic rod 504 and the patch machine body 505 to move, the position of the patch machine body 505 is observed through the CCD visual detector 506 until the patch machine body 505 moves to the position right above a circuit board placed by the lower placement plate 301, the movement can be stopped, the second electric telescopic rod 504 is started at the moment, the patch machine body 505 moves downwards under the action of the second electric telescopic rod 504, the patch machine body 505 is in contact with the circuit board placed below, and the patch operation is performed on the circuit board.

Specifically, the cooling and solidifying mechanism 6 comprises a fan 601, the fan 601 is located at the top of the outer side of the U-shaped mounting plate 4, an air outlet of the fan 601 is connected with an air inlet of the cooling box mechanism 602 through an air supply pipe, and an air outlet of the cooling box mechanism 602 is connected with an air homogenizing mechanism 604 mounted on the outer side of the movable telescopic surface mount device 5 through a telescopic pipe 603.

In a further embodiment, the cooling box mechanism 602 is connected to the dodging mechanism 604 through a telescopic tube 603, and the telescopic tube 603 is arranged to adjust the length of the telescopic tube 603 according to the position of the dodging mechanism 604.

Specifically, the cooling box mechanism 602 includes a cooling box body 605, and an air inlet and an air outlet are formed in the cooling box body 605, a refrigerator 606 is disposed in the cooling box body 605, and a refrigerating pipe 607 is communicated with the top of the refrigerator 606.

Specifically, the air homogenizing mechanism 604 includes an air homogenizing plate 608, one side of the air homogenizing plate 608 is connected with the telescopic tube 603, and a plurality of groups of air homogenizing nozzles 609 are installed at the bottom of the air homogenizing plate 608.

In a further embodiment, the air equalizing plate 608 is installed outside the chip mounter body 505, and an installation port 610 matched with the chip mounter body 505 is formed on the air equalizing plate 608.

After the movable telescopic chip mounter 5 completes the chip mounting of the circuit board, the refrigerator 606 is started, the refrigerator 606 refrigerates the inside of the cooling box body 605 through the refrigerating pipe 607, then the fan 601 is started, cold air flows from the telescopic pipe 603 to the air homogenizing plate 608 under the action of the fan 601, and finally the cold air is sprayed out from the air homogenizing nozzle 609 to rapidly cool the chip below.

The directional or positional relationships indicated by the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., are based on the directional or positional relationships shown in the drawings, are merely for convenience in describing the utility model, and do not indicate or imply that the device or element referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the scope of the utility model.

Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.

Claims

1. The utility model provides a SMT chip mounter of quick solidification paster, includes installing frame (1), installing frame (1) top is provided with conveyer belt mechanism (2), and conveyer belt (201) surface mounting in conveyer belt mechanism (2) has a plurality of group's stop gear (3), installing frame (1) top is connected with U type mounting panel (4), the inboard top of U type mounting panel (4) is provided with and removes flexible chip mounter (5), and removes flexible chip mounter (5) outside and install cooling solidification mechanism (6), its characterized in that: the cooling solidification mechanism (6) comprises a fan (601), the fan (601) is located at the top of the outer side of the U-shaped mounting plate (4), an air outlet of the fan (601) is connected with an air inlet of the cooling box mechanism (602) through an air supply pipe, and an air outlet of the cooling box mechanism (602) is connected with an air homogenizing mechanism (604) mounted on the outer side of the movable telescopic chip mounter (5) through a telescopic pipe (603).

2. The SMT pick and place machine for fast curing patches of claim 1, wherein: the cooling box mechanism (602) comprises a cooling box body (605), an air inlet and an air outlet are formed in the cooling box body (605), a refrigerator (606) is arranged in the cooling box body (605), and the top of the refrigerator (606) is communicated with a refrigerating pipe (607).

3. The SMT pick and place machine for fast curing patches of claim 1, wherein: the air homogenizing mechanism (604) comprises an air homogenizing plate (608), one side of the air homogenizing plate (608) is connected with the telescopic pipe (603), and a plurality of groups of air homogenizing nozzles (609) are arranged at the bottom of the air homogenizing plate (608).

4. The SMT pick and place machine for fast curing patches of claim 1, wherein: stop gear (3) are including placing board (301), place board (301) and conveyer belt (201) and be connected, and place board (301) outside cladding and have one deck skid resistant course (302), place board (301) top symmetry and be provided with two sets of fixed establishment (303), fixed establishment (303) include first electric telescopic handle (304), and first electric telescopic handle (304) bottom is connected with place board (301) through the connecting block, first electric telescopic handle (304) output is connected with fixed plate (305), and fixed plate (305) and place board (301) sliding connection.

5. The SMT pick and place machine for fast curing patches of claim 1, wherein: remove flexible chip mounter (5) including removing groove (501), and remove groove (501) top and the inboard top of U type mounting panel (4) and be connected, remove groove (501) internally mounted and have screw mechanism (502), and screw mechanism (502) outside is connected with second electric telescopic handle (504) through movable block (503), and second electric telescopic handle (504) output is connected with chip mounter body (505), CCD vision detector (506) are installed to chip mounter body (505) below.

6. A SMT pick and place machine for fast curing patches as claimed in claim 3, wherein: the air homogenizing plate (608) is arranged on the outer side of the chip mounter body (505), and an installation opening (610) matched with the chip mounter body (505) is formed in the air homogenizing plate (608).