CN113710004B - SMT (surface mount technology) chip mounting device and chip mounting process - Google Patents
SMT (surface mount technology) chip mounting device and chip mounting process Download PDFInfo
- Publication number
- CN113710004B CN113710004B CN202110889076.4A CN202110889076A CN113710004B CN 113710004 B CN113710004 B CN 113710004B CN 202110889076 A CN202110889076 A CN 202110889076A CN 113710004 B CN113710004 B CN 113710004B
- Authority
- CN
- China
- Prior art keywords
- processing platform
- pcb
- smt
- outside
- servo motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 19
- 238000005516 engineering process Methods 0.000 title abstract description 25
- 238000002347 injection Methods 0.000 claims description 21
- 239000007924 injection Substances 0.000 claims description 21
- 238000005507 spraying Methods 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 6
- 238000007599 discharging Methods 0.000 claims description 4
- 229920001875 Ebonite Polymers 0.000 claims description 3
- 238000007664 blowing Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention discloses an SMT (surface mount technology) patch device and a surface mount technology, which relate to the technical field of SMT patches, and particularly relate to an SMT patch device and a surface mount technology. This SMT paster device and paster technology uses through the cooperation of controller and electric telescopic column and telescopic link and splint for this SMT paster device can be transported the PCB board through the conveyer belt, starts the electric telescopic column through controller control after transporting the PCB board to appointed position, stretches out the telescopic link and drives splint removal after the electric telescopic column starts, makes splint to hold the PCB board clamp of conveyer belt top fixed, prevents that the PCB board from rocking, thereby promotes the accuracy of this SMT paster device during operation.
Description
Technical Field
The invention relates to the technical field of SMT (surface mounted technology) paster, in particular to an SMT paster device and paster technology.
Background
The SMT patch refers to a short term of a series of process flows for processing on the basis of a PCB, the PCB is a printed circuit board, the SMT is a surface mount technology (surface mount technology), which is one of the most popular technologies and processes in the electronic assembly industry, and the surface mount technology of the electronic circuit is called surface mount or surface mount technology, which is a circuit mounting technology for mounting a pin-less or short-lead surface mount component (SMC/SMD, chinese called chip component) on the surface of the printed circuit board or the surface of other substrates, and performing welding assembly by reflow soldering or dip soldering, etc., so that in general, all electronic products used by us are designed by the PCB plus various electronic components such as capacitors, resistors, etc. according to the designed circuit diagram, and therefore, various SMT patch processing technologies are required for various kinds of electric appliances.
The special surface mounting device is needed to be used in the SMT surface mounting process flow and is realized by being assisted by a specific process flow, but the common surface mounting device in the market still has certain defects when in use, firstly, the fixing effect of the common surface mounting device on a PCB (printed Circuit Board) in the surface mounting process is poor, the PCB is easy to cause errors in surface mounting work once swaying, secondly, the common surface mounting device is often used for not preprocessing the PCB before processing, so that dust exists on the surface, and then the surface mounting quality is influenced.
Disclosure of Invention
Aiming at the defects of the prior art, the invention provides an SMT (surface mount technology) paster device and a paster process, which solve the problems in the background art.
In order to achieve the above purpose, the invention is realized by the following technical scheme: the utility model provides a SMT paster device and paster technology, includes the processing platform, the outside fixed mounting of processing platform has step motor, and the inside movable sleeve of processing platform has two connecting axles, step motor's output shaft extends to the inside of processing platform and with the one end fixed connection of rear connecting axle, the outside fixed sleeve of connecting axle has the cylinder, has cup jointed the conveyer belt between two cylinders, the outside fixed sleeve of processing platform has the controller, the outside of controller is provided with electric telescopic column, and right side controller and step motor electric connection, electric telescopic column's outside movable sleeve has the telescopic link, the outside fixed mounting of telescopic link has splint.
Preferably, the top fixed mounting of processing platform has two vertical guide rails, the inside movable sleeve of vertical guide rail is equipped with the fly leaf, two fixed mounting has the transverse guide rail between the fly leaf, the outside of transverse guide rail is provided with the chip mounter.
Preferably, a servo motor is fixedly arranged outside the movable plate, a gear is fixedly sleeved outside an output shaft of the servo motor, a rack is fixedly sleeved outside the vertical guide rail, and the rack and the gear are meshed with each other.
Preferably, the front of the processing platform is provided with a feed inlet, the back of the processing platform is provided with a discharge outlet, and the back of the processing platform is fixedly provided with a discharge plate.
Preferably, the front end of the discharging plate is inclined upwards, the front end of the discharging plate extends to the rear end of the conveying belt, and anti-skid patterns which are uniformly distributed are arranged outside the conveying belt.
Preferably, the outside fixed mounting of processing platform has strong fan, and the fixed cover in top of processing platform is equipped with the injection base, fixedly connected with communicating pipe between strong fan and the injection base.
Preferably, the bottom of the spraying base extends to the inner side of the feeding hole, and the bottom of the spraying base is provided with evenly distributed spraying openings.
Preferably, the bottom fixed mounting of processing platform has evenly distributed's support base, splint are provided with the arc curved surface, and the inside fixed cover of splint is equipped with the protection pad, the protection pad adopts hard rubber to make.
An SMT (surface Mount technology) paster device and paster process comprise the following operation steps:
s1, starting a stepping motor and a strong fan, driving a connecting shaft to rotate through an output shaft of the stepping motor after the stepping motor is started, driving a roller to roll through the connecting shaft, enabling a conveyor belt to move along with the roller, preparing strong wind after the strong fan is started, filling the strong wind into the spraying base through a communicating pipe, and spraying the strong wind to the lower side through an air outlet formed in the bottom of the spraying base;
S2, inserting a PCB to be processed from a feed port and placing the PCB above a conveyor belt, blowing off external dust when the PCB moves along the conveyor belt and passes through a spraying base, stopping working of a stepping motor when the PCB moves between two clamping plates, controlling a motor telescopic column to start by a controller, extending a telescopic rod and driving the clamping plates to move after the motor telescopic column is started, shoveling the PCB by the clamping plates through an external arc-shaped curved surface of the clamping plates, and clamping and fixing the PCB to prevent the PCB from shaking;
S3, starting a servo motor, wherein an output shaft of the servo motor drives a gear to rotate, the gear and the servo motor are driven to move outside a vertical guide rail through meshing of the gear and a rack, and the servo motor drives a movable plate to move when moving until a chip mounter follows the movable plate to move to the upper side of a PCB (printed circuit board), and then the chip mounter works, after the chip mounter works, a telescopic rod retracts into the electric telescopic column, and the PCB follows the movement of a conveying belt again until the PCB is discharged from a discharge hole along the discharge plate.
The invention provides an SMT (surface mount technology) paster device and a paster process, which have the following beneficial effects:
1. This SMT paster device and paster technology uses through the cooperation of controller and electric telescopic column and telescopic link and splint for this SMT paster device can be transported the PCB board through the conveyer belt, starts the electric telescopic column through controller control after transporting the PCB board to appointed position, stretches out the telescopic link and drives splint removal after the electric telescopic column starts, makes splint to hold the PCB board clamp of conveyer belt top fixed, prevents that the PCB board from rocking, thereby promotes the accuracy of this SMT paster device during operation.
2. This SMT paster device and paster technology is through strong fan and communicating pipe and the cooperation of spraying the base use for this SMT paster device can be when inserting the PCB board that waits to process inside the feed inlet start strong fan, and strong fan can prepare strong wind and pour the inside of spraying the base into strong wind through communicating pipe, then sprays the upper surface of PCB through the air outlet of spraying the base bottom and offer, with the dust clean up on PCB board surface, the going on of paster work behind the being convenient for, thereby promotes product quality.
3. This SMT paster device and paster technology is used through the cooperation of fly leaf and servo motor and gear and rack for this SMT paster device can start servo motor and make servo motor's output shaft drive the gear rotation, then through the interlock of gear and rack, make gear and servo motor remove in the outside of vertical guide rail, and drive the fly leaf through servo motor and remove, thereby change the position of chip mounter in vertical orientation, the staff of being convenient for controls chip mounter motion to appropriate position and carries out the paster work, the degree of automation of this SMT paster device has been promoted.
Drawings
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the exterior of the processing platform of the present invention;
FIG. 3 is a schematic view of the structure of the outer part of the clamping plate of the present invention;
FIG. 4 is a schematic view of the structure of the vertical rail of the present invention;
fig. 5 is a schematic structural view of the strong fan and the spray base of the present invention.
In the figure: 1. a processing platform; 2. an electric telescopic column; 3. a controller; 4. a stepping motor; 5. a servo motor; 6. a chip mounter; 7. a transverse guide rail; 8. a movable plate; 9. a rack; 10. a clamping plate; 11. a vertical guide rail; 12. a strong fan; 13. a roller; 14. a feed inlet; 15. a spray base; 16. a conveyor belt; 17. a support base; 18. a discharge plate; 19. a discharge port; 20. a connecting shaft; 21. a communicating pipe; 22. a telescopic rod; 23. a gear.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments.
Referring to fig. 1 and 2, the present invention provides a technical solution: an SMT (surface mount technology) chip mounting device and chip mounting technology comprises a processing platform 1, wherein a stepping motor 4 is fixedly arranged outside the processing platform 1, two connecting shafts 20 are movably sleeved in the processing platform 1, an output shaft of the stepping motor 4 extends into the processing platform 1 and is fixedly connected with one end of a rear connecting shaft 20, a roller 13 is fixedly sleeved outside the connecting shaft 20, a conveyor belt 16 is sleeved between the two rollers 13, a controller 3 is fixedly sleeved outside the processing platform 1, an electric telescopic column 2 is arranged outside the controller 3, a right side controller 3 is electrically connected with the stepping motor 4, a feed inlet 14 is formed in the front side of the processing platform 1, a discharge outlet 19 is formed in the back side of the processing platform 1, a discharge plate 18 is fixedly arranged in the back side of the processing platform 1, the feed inlet 14 is used for facilitating a worker to place a PCB (printed circuit board) to be processed in the processing platform 1, the PCB board after finishing the processing work can finally be discharged from the inside of the processing platform 1 through the discharge hole 19, the front end of the discharge plate 18 is inclined upwards, the front end of the discharge plate 18 extends to the rear end of the conveyor belt 16, the outside of the conveyor belt 16 is provided with evenly distributed anti-skid patterns, the PCB board is positioned above the conveyor belt 16 after being put into the inside of the processing platform 1, if the conveyor belt 16 is in a moving state, the PCB board can move along with the conveyor belt 16, the finished PCB board contacts with the discharge plate 18 when moving along with the conveyor belt 16 to the rear end, and leaves the processing platform 1 from the discharge hole 19 along the discharge plate 18, two vertical guide rails 11 are fixedly arranged at the top of the processing platform 1, movable plates 8 are sleeved in the inside of the vertical guide rails 11, a transverse guide rail 7 is fixedly arranged between the two movable plates 8, a surface-mounted machine 6 is arranged outside the transverse guide rail 7, the chip mounter 6 is used for carrying out the chip mounter work to the PCB board that is located its below, and transverse guide 7 makes chip mounter 6 carry out lateral shifting in the top of PCB board, and fly leaf 8 is used for supporting fixedly transverse guide 7 for there is certain space between chip mounter 6 and the PCB board, the going on of the chip mounter work of being convenient for, and the principle and the use of this chip mounter 6 are the same with prior art, and no more detailed description here.
Referring to fig. 3, the telescopic rod 22 is movably sleeved outside the electric telescopic column 2, the clamping plate 10 is fixedly mounted outside the telescopic rod 22, the supporting base 17 which is uniformly distributed is fixedly mounted at the bottom of the processing platform 1, the clamping plate 10 is provided with an arc-shaped curved surface, the protection pad is fixedly sleeved inside the clamping plate 10 and made of hard rubber, the telescopic rod 22 extends out after the electric telescopic column 2 is started and drives the clamping plate 10 to move, the clamping plate 10 scoops up a PCB board through the arc-shaped curved surface outside the clamping plate, the PCB board is clamped and fixed, the PCB board is prevented from shaking, the supporting base 17 is used for supporting and protecting the processing platform 1, the vibration influence on the processing platform 1 is reduced, and the protection pad inside the clamping plate 10 can effectively prevent the clamping plate 10 from damaging the PCB board in the process of clamping the PCB board.
Referring to fig. 4, a servo motor 5 is fixedly installed outside the movable plate 8, a gear 23 is fixedly sleeved outside an output shaft of the servo motor 5, a rack 9 is fixedly sleeved outside the vertical guide rail 11, the rack 9 and the gear 23 are meshed with each other, the servo motor 5 can drive the gear 23 to rotate through an output shaft of the servo motor after being started, and the gear 23 can move outside the vertical guide rail 11 along with the gear 23 when the gear 23 rotates due to the mutual meshing between the gear 23 and the rack 9, and meanwhile, the movable plate 8 is driven to move when the servo motor 5 moves until the chip mounter 6 moves above the PCB board along with the movable plate 8, so that the chip mounter 6 can conveniently carry out subsequent chip mounting work.
Referring to fig. 5, the strong fan 12 is fixedly installed on the outside of the processing platform 1, the injection base 15 is fixedly sleeved on the top of the processing platform 1, the communicating pipe 21 is fixedly connected between the strong fan 12 and the injection base 15, strong wind can be prepared after the strong fan 12 is started and is injected into the inside of the injection base 15 through the communicating pipe 21, then the outside of the PCB board is injected through the injection base 15, dust on the surface of the PCB board is cleaned, the follow-up patch work is convenient to carry out, the bottom of the injection base 15 extends to the inner side of the feed inlet 14, and the bottom of the injection base 15 is provided with evenly distributed injection ports, and as the PCB board enters the processing platform 1 through the feed inlet 14, the injection base 15 is arranged above the feed inlet 14 to ensure the injection effect of the injection base 15, and the injection ports at the bottom of the injection base 15 can ensure the uniformity of the injection effect.
An SMT (surface Mount technology) paster device and paster process comprise the following operation steps:
S1, starting a stepping motor 4 and a strong fan 12, driving a connecting shaft 20 to rotate through an output shaft of the stepping motor 4 after the stepping motor 4 is started, driving a roller 13 to roll through the connecting shaft 20, enabling a conveyor belt 16 to move along with the roller 13, preparing strong wind after the strong fan 12 is started, filling the strong wind into the injection base 15 through a communicating pipe 21, and then injecting the strong wind to the lower side through an air outlet formed in the bottom of the injection base 15;
S2, inserting a PCB to be processed from a feed port 14 and placing the PCB above a conveyor belt 16, blowing off external dust when the PCB moves along the conveyor belt 16 and passes through a spraying base 15, stopping the operation of a stepping motor 4 when the PCB moves between two clamping plates 10, simultaneously controlling the starting of an electric telescopic column 2 by a controller 3, extending a telescopic rod 22 and driving the clamping plates 10 to move after the electric telescopic column 2 is started, and the clamping plates 10 scoop up the PCB through an external arc-shaped curved surface and clamp and fix the PCB to prevent the PCB from shaking;
S3, starting the servo motor 5, wherein an output shaft of the servo motor 5 drives the gear 23 to rotate, and driving the gear 23 and the servo motor 5 to move outside the vertical guide rail 11 through engagement of the gear 23 and the rack 9, and driving the movable plate 8 to move when the servo motor 5 moves until the chip mounter 6 moves to the upper side of the PCB along with the movable plate 8, and performing chip mounting work, after the chip mounting work is completed, the telescopic rod 22 retracts into the electric telescopic column 2, and the PCB moves along with the conveying belt 16 again until being discharged from the discharge hole 19 along with the discharge plate 18.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present invention; the terms "first," "second," "third," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "coupled," and the like are to be construed broadly, and may be fixedly coupled, detachably coupled, or integrally coupled, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. An SMT paster device, includes processing platform (1), its characterized in that: the device is characterized in that a stepping motor (4) is fixedly arranged outside the processing platform (1), two connecting shafts (20) are movably sleeved inside the processing platform (1), an output shaft of the stepping motor (4) extends to the inside of the processing platform (1) and is fixedly connected with one end of a rear connecting shaft (20), a roller (13) is fixedly sleeved outside the connecting shaft (20), a conveyor belt (16) is sleeved between the two rollers (13), a controller (3) is fixedly sleeved outside the processing platform (1), an electric telescopic column (2) is arranged outside the controller (3), the right side controller (3) is electrically connected with the stepping motor (4), a telescopic rod (22) is movably sleeved outside the electric telescopic column (2), and a clamping plate (10) is fixedly arranged outside the telescopic rod (22);
The top of the processing platform (1) is fixedly provided with two vertical guide rails (11), a movable plate (8) is movably sleeved in the vertical guide rails (11), a transverse guide rail (7) is fixedly arranged between the two movable plates (8), and a chip mounter (6) is arranged outside the transverse guide rail (7);
The external part of the movable plate (8) is fixedly provided with a servo motor (5), a gear (23) is fixedly sleeved outside an output shaft of the servo motor (5), a rack (9) is fixedly sleeved outside the vertical guide rail (11), and the rack (9) is meshed with the gear (23);
the front of the processing platform (1) is provided with a feed inlet (14), the back of the processing platform (1) is provided with a discharge outlet (19), and the back of the processing platform (1) is fixedly provided with a discharge plate (18);
the front end of the discharging plate (18) is inclined upwards, the front end of the discharging plate (18) extends to the rear end of the conveying belt (16), and anti-skid patterns which are uniformly distributed are arranged outside the conveying belt (16).
2. An SMT patch device as claimed in claim 1, wherein: the outside fixed mounting of processing platform (1) has strong fan (12), and the fixed cover in top of processing platform (1) is equipped with injection base (15), fixedly connected with communicating pipe (21) between strong fan (12) and injection base (15).
3. An SMT patch apparatus as claimed in claim 2, wherein: the bottom of the spraying base (15) extends to the inner side of the feeding hole (14), and evenly distributed spraying openings are formed in the bottom of the spraying base (15).
4. An SMT patch device as claimed in claim 1, wherein: the bottom of the processing platform (1) is fixedly provided with a supporting base (17) which is uniformly distributed, the clamping plate (10) is provided with an arc-shaped curved surface, the inside of the clamping plate (10) is fixedly sleeved with a protection pad, and the protection pad is made of hard rubber.
5. A mounting process based on an SMT mounting device according to any of the claims 1-4, characterized in that: the method comprises the following operation steps:
s1, starting a stepping motor (4) and a strong fan (12), driving a connecting shaft (20) to rotate through an output shaft of the stepping motor (4) after the stepping motor (4) is started, driving a roller (13) to roll through the connecting shaft (20), enabling a conveyor belt (16) to move along with the roller (13), preparing strong wind after the strong fan (12) is started, filling the strong wind into the injection base (15) through a communicating pipe (21), and then injecting the strong wind to the lower side through an air outlet formed in the bottom of the injection base (15);
S2, inserting a PCB to be processed from a feed port (14) and placing the PCB above a conveyor belt (16), when the PCB moves along the conveyor belt (16) and passes through a spraying base (15), blowing off external dust, stopping working of a stepping motor (4) when the PCB moves between two clamping plates (10), simultaneously controlling a motor telescopic column (2) to start by a controller (3), extending a telescopic rod (22) after the motor telescopic column (2) is started and driving the clamping plates (10) to move, and scooping up the PCB by the clamping plates (10) through an arc-shaped curved surface outside the clamping plates and clamping the PCB to be fixed so as to prevent the PCB from shaking;
S3, starting a servo motor (5), wherein an output shaft of the servo motor (5) drives a gear (23) to rotate, the gear (23) and the servo motor (5) are driven to move outside a vertical guide rail (11) through meshing of the gear (23) and a rack (9), and the servo motor (5) drives a movable plate (8) to move when moving until a chip mounter (6) moves to the upper side of a PCB (printed circuit board) along with the movable plate (8) and performs chip mounting operation, after the chip mounting operation is completed, a telescopic rod (22) retracts into the electric telescopic column (2), and the PCB moves along a conveying belt (16) again until being discharged from a discharge hole (19) along a discharge plate (18).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110889076.4A CN113710004B (en) | 2021-08-04 | 2021-08-04 | SMT (surface mount technology) chip mounting device and chip mounting process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110889076.4A CN113710004B (en) | 2021-08-04 | 2021-08-04 | SMT (surface mount technology) chip mounting device and chip mounting process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113710004A CN113710004A (en) | 2021-11-26 |
| CN113710004B true CN113710004B (en) | 2024-06-25 |
Family
ID=78651510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110889076.4A Active CN113710004B (en) | 2021-08-04 | 2021-08-04 | SMT (surface mount technology) chip mounting device and chip mounting process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113710004B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117241495B (en) * | 2023-10-13 | 2024-09-27 | 合肥赛美泰克科技有限公司 | Chip mounter with stable chip mounting mechanism |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215647620U (en) * | 2021-08-04 | 2022-01-25 | 苏州瀚派电子科技有限公司 | SMT paster device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204948535U (en) * | 2015-10-10 | 2016-01-06 | 东莞首科电子科技有限公司 | Chip mounter drive system |
| CN207927149U (en) * | 2018-03-02 | 2018-09-28 | 深圳艾华信电子有限公司 | A kind of SMT chip mounters patch feed device |
| CN212876224U (en) * | 2020-08-12 | 2021-04-02 | 天津奇思奥特科技有限公司 | SMT bulk material paster equipment |
| CN112165790A (en) * | 2020-09-28 | 2021-01-01 | 鑫岭森(江苏)电子科技有限公司 | SMT chip mounter and chip mounting production process thereof |
-
2021
- 2021-08-04 CN CN202110889076.4A patent/CN113710004B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN215647620U (en) * | 2021-08-04 | 2022-01-25 | 苏州瀚派电子科技有限公司 | SMT paster device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113710004A (en) | 2021-11-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2648915B1 (en) | Combination stencil printer and dispenser and related methods | |
| EP2648917B1 (en) | Combination stencil printer and dispenser and related methods | |
| EP2648914B1 (en) | Method for depositing viscous material on a substrate with a combination stencil printer and dispenser | |
| EP2648916B1 (en) | Combination stencil printer and dispenser and related methods | |
| CN113710004B (en) | SMT (surface mount technology) chip mounting device and chip mounting process | |
| CN214683283U (en) | Novel online track is directly spouted plasma's treatment facility | |
| CN104551303A (en) | Online tin soldering machine | |
| CN215826268U (en) | Conveying device and ink-jet printer for printed circuit board | |
| CN211267292U (en) | Automatic chip mounter | |
| CN206088065U (en) | Automatic transfer wide platform of plugging into | |
| CN215647620U (en) | SMT paster device | |
| CN209379290U (en) | Spray equipment | |
| CN106684429A (en) | Automatic marking and cleaning mechanism of battery module | |
| CN113423258A (en) | Automatic assembling and disassembling machine for chip mounting jig | |
| CN111409363A (en) | Code spraying machine for printed circuit board | |
| CN110996532B (en) | Chip mounter drive mechanism with PCB board fixing device | |
| CN216414991U (en) | High-efficient full-automatic SMT assembly line | |
| CN221478729U (en) | PCB feeding device for full-automatic solder paste printer | |
| CN221873554U (en) | Defoaming printing line for solving problem of solder mask layer cavity in PCB printing | |
| CN216087153U (en) | SMT board feeding machine | |
| CN219107832U (en) | SMT chip mounter of quick solidification paster | |
| CN221560059U (en) | Tool rotation type soldering tin machine | |
| KR200200249Y1 (en) | A cleaner transportation apparatus for a pcb surface mounting screen printer | |
| CN113770595A (en) | A automatic welded platform for electric elements | |
| CN114760773A (en) | A prevent displacement paster device for SMT chip mounter |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |