CN113423258A - Automatic assembling and disassembling machine for chip mounting jig - Google Patents
Automatic assembling and disassembling machine for chip mounting jig Download PDFInfo
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- CN113423258A CN113423258A CN202110744665.3A CN202110744665A CN113423258A CN 113423258 A CN113423258 A CN 113423258A CN 202110744665 A CN202110744665 A CN 202110744665A CN 113423258 A CN113423258 A CN 113423258A
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- 230000007246 mechanism Effects 0.000 claims abstract description 161
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 13
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 19
- 230000007306 turnover Effects 0.000 claims description 15
- 230000000712 assembly Effects 0.000 claims description 10
- 238000000429 assembly Methods 0.000 claims description 10
- 238000006073 displacement reaction Methods 0.000 claims description 3
- 230000001174 ascending effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 14
- 230000032258 transport Effects 0.000 description 8
- 210000000078 claw Anatomy 0.000 description 6
- 238000007599 discharging Methods 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Automatic Assembly (AREA)
Abstract
The invention discloses an automatic disassembling and assembling machine for a patch jig, which comprises a rack, a carrier feeding mechanism, an XZY manipulator mechanism, a production line mechanism, a plate disassembling and assembling mechanism, a plate turning mechanism and a plate collecting mechanism, wherein the production line mechanism is arranged in the rack, the plate disassembling and assembling mechanism and the plate turning mechanism are both arranged on the production line mechanism, the XZY manipulator mechanism is arranged above the production line mechanism, and the carrier feeding mechanism and the plate collecting mechanism are both arranged on one side of the production line mechanism. The automatic assembling and disassembling machine for the chip mounting jig adopts the assembly line mechanism to receive the jig from the upstream chip mounting station, and completes the assembling and disassembling of the chip mounting jig through the cooperation among the XZY manipulator mechanism, the assembling and disassembling plate mechanism and the plate turning mechanism, thereby avoiding the manual removal of a circuit board, ensuring the quality of the circuit board, and simultaneously adopting an automatic assembling and disassembling mode, improving the chip mounting efficiency and ensuring the quality of the chip mounting.
Description
Technical Field
The invention relates to the field of jig dismounting machines, in particular to an automatic dismounting machine for a patch jig.
Background
The paster refers to the abbreviation of a series of process flows processed on the basis of the PCB. Pcb (printed Circuit board) is a printed Circuit board. Is Surface mount Technology (acronym for Surface Mounted Technology), which is one of the most popular techniques and processes in the electronic assembly industry. In the paster production of electronic equipment, in order to prevent that the PCB board from crossing the stove and taking place deformation, guarantee the welding quality, we all need use the paster tool usually. Specifically in the production process, need operating personnel to place the circuit board on the paster tool by hand and fix the circuit board, this kind of manual in-process of taking the circuit board, the tin cream on the circuit board is touched easily to the finger, and serious still probably rubs off the tin cream on the circuit board to cause the quality of circuit board bad. In addition, after the chip mounting is completed, an operator needs to manually take out the circuit board and transfer the circuit board to a reflow oven for reflow soldering, and the chip mounting efficiency is low due to the purely manual dismounting mode, and the chip mounting quality is difficult to guarantee.
Disclosure of Invention
The invention aims to design an automatic dismounting and mounting machine for a surface mount device, which aims to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme:
an automatic disassembling and assembling machine for a patch jig comprises a rack, a carrier feeding mechanism, an XZY manipulator mechanism, a pipeline mechanism, a plate disassembling and assembling mechanism, a plate turning mechanism and a plate collecting mechanism, wherein the pipeline mechanism is arranged in the rack, the plate disassembling and assembling mechanism and the plate turning mechanism are both arranged on the pipeline mechanism, the XZY manipulator mechanism is arranged above the pipeline mechanism, and the carrier feeding mechanism and the plate collecting mechanism are both arranged on one side of the pipeline mechanism; the assembly line mechanism receives a jig from an upstream chip mounting station and completes the assembly and disassembly of the chip mounting jig through the cooperation among the XZY manipulator mechanism, the board assembly and disassembly mechanism and the board turnover mechanism.
Further, assembly line mechanism includes A track group, B track group and is used for conveying the conveyer of paster tool, A track group with the inboard side of B track group all is equipped with dismouting board mechanism with turn over board mechanism.
Furthermore, the outer side of the track group A is provided with two carrier feeding mechanisms, and the outer side of the track group B is provided with one carrier feeding mechanism.
Further, the outer side of the track group A is also provided with a plastic sucking disc feeder.
Furthermore, the plate collecting mechanism is provided with two conveying assemblies, and the conveying assemblies are arranged between the two plate collecting mechanisms and the track group B.
Further, the plate dismounting and mounting mechanism comprises a left shifting claw assembly, a right shifting claw assembly, a front shifting claw assembly and a rear shifting claw assembly, wherein the left shifting claw assembly and the right shifting claw assembly clamp and fix the surface mount jig through displacement; the board turnover mechanism comprises a turnover component and a third sucker group used for sucking a PCB or PCBA board, wherein the third sucker group is driven by the turnover component to turn over for 180 degrees and can be positioned above or in front of the board disassembly and assembly mechanism.
Further, the XZY manipulator mechanism includes transport longmen, along Y to locating the tow chain fixed plate on transport longmen, with the Y of tow chain fixed plate connection to tow chain, locate the X axle base of transport longmen below, with the X of X axle base connection to tow chain and on X axle base along the manipulator subassembly of X to the removal.
Further, the manipulator assembly comprises a first sucking disc group for sucking the patch jig, a second sucking disc group for sucking the PCB or the PCBA, a support for connecting the first sucking disc group and the second sucking disc group, a rotator for rotating the support, a driving cylinder for enabling the support to move along the Z direction, and a vacuum generator for enabling the first sucking disc group and the second sucking disc group to keep a vacuum state.
Further, one end of the assembly line mechanism is provided with a discharging assembly line, one side of the rack Y, which faces upwards, is provided with a discharging port enabling the discharging assembly line to extend out, and the other side of the rack Y is provided with a feeding port enabling the assembly line mechanism to receive an upstream patch jig.
The invention has the beneficial effects that: compared with the prior art, the automatic assembling and disassembling machine for the chip mounting jig adopts the assembly line mechanism to receive the jig from the upstream chip mounting station, and completes the assembling and disassembling of the chip mounting jig through the cooperation among the XZY manipulator mechanism, the assembling and disassembling plate mechanism and the plate turning mechanism, thereby avoiding the manual removal of a circuit board, ensuring the quality of the circuit board, and simultaneously adopting an automatic assembling and disassembling mode, improving the chip mounting efficiency and ensuring the chip mounting quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic view of the internal structure of an automatic mounter for mounting and demounting a chip jig according to the present invention;
FIG. 2 is a schematic view of the structure of the surface mount device assembly line mechanism, the carrier feeding mechanism and the suction tray feeder of the present invention;
FIG. 3 is a schematic structural view of a plate retracting mechanism of the automatic assembling and disassembling machine for chip jigs according to the present invention;
FIG. 4 is a schematic structural view of a manipulator mechanism XZY of the automatic mounter for mounting and demounting a chip jig according to the present invention;
FIG. 5 is a schematic view of the frame structure of the automatic mounter for mounting and demounting a chip jig according to the present invention;
FIG. 6 is a schematic structural view of a manipulator assembly of the automatic mounter for mounting and demounting a chip jig according to the present invention;
FIG. 7 is a schematic view of a discharging line structure of the automatic assembling and disassembling machine for chip jigs of the present invention;
fig. 8 is a schematic structural view of a plate turnover mechanism and a plate dismounting mechanism of the automatic mounting and dismounting machine for a surface mount device of the invention.
The names of the components identified in the figures are as follows: 1. XZY a robot mechanism; 11. carrying the gantry; 12. a drag chain fixing plate; 13. a Y-direction drag chain; 14. an X-axis base; 15. an X-direction drag chain; 16. a manipulator assembly; 17. a first XZY robot; 18. a second XZY robot; 161. a first suction disc group; 162. a second sucker group; 163. a support; 164. a rotator; 165. a driving cylinder; 166. a vacuum generator; 2. a pipelining mechanism; 21. b, a track group; 22. a, a track group; 23. a conveyor belt; 24. a bottom camera light source; 3. a carrier feeding mechanism; 31. a first carrier feeding mechanism; 32. a second carrier feeding mechanism; 33. a third carrier feeding mechanism; 4. a plate collecting mechanism; 41. a first plate collecting mechanism; 42. a second plate collecting mechanism; 43. a transfer assembly; 5. a frame; 51. a discharge port; 52. a feed inlet; 6. a panel turnover mechanism; 61. a lifting motor; 62. a drive motor; 63. a transmission belt; 64. a rotating plate; 65. an electronic control module; 66. a third sucker group; 7. a plate disassembling and assembling mechanism; 71. a left pusher dog assembly and a right pusher dog assembly; 72. a front and rear pusher dog assembly; 8. a discharge assembly line; 81. a fixed mount; 82. a movable rail group; 83. a drive belt; 84. a stepping motor; 9. provided is a plastic sucking disc feeder.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and obviously, the description is only a part of the embodiments of the present invention, not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
Referring to fig. 1 to 8, the automatic assembling and disassembling machine for a chip mounter according to the present invention includes a frame 5, a carrier feeding mechanism 3, XZY a manipulator mechanism 1, a pipeline mechanism 2, a board assembling and disassembling mechanism 7, a board turning mechanism 6, and a board collecting mechanism 4, wherein the pipeline mechanism 2 is disposed in the frame 5, the board assembling and disassembling mechanism 7 and the board turning mechanism 6 are both disposed on the pipeline mechanism 2, the manipulator mechanism 1 XZY is disposed above the pipeline mechanism 2, and the carrier feeding mechanism 3 and the board collecting mechanism 4 are both disposed on one side of the pipeline mechanism 2; the assembly line mechanism 2 receives the jig from the upstream chip mounting station and completes the assembly and disassembly of the chip mounting jig through the cooperation among the XZY manipulator mechanism 1, the plate assembly and disassembly mechanism 7 and the plate turnover mechanism 6.
The assembly line mechanism 2 comprises an A track group 22, a B track group 21 and a conveying belt 23 for conveying the surface mounting jig, and the inner sides of the A track group 22 and the B track group 21 are respectively provided with a plate dismounting and mounting mechanism 7 and a plate turning mechanism 6. The inner sides of the track A group 22 and the track B group 21 are provided with bottom camera light sources 24. When the XZY robot mechanism 1 sucks the PCB board to move above the bottom camera light source 24, the bottom camera light source 24 can be used to position the PCB board at the A track group 22 or the B track group 21.
Two carrier feeding mechanisms 3 are arranged on the outer side of the track group A22, and one carrier feeding mechanism 3 is arranged on the outer side of the track group B21. One of the carrier feeding mechanisms 3 on the outer side of the a track group 22 for carrying the B-side jigs after removing the finished PCBA boards is a first carrier feeding mechanism 31, the other carrier feeding mechanism 3 for carrying the PBC boards which have not been subjected to surface mounting is a second carrier feeding mechanism 32, and the carrier feeding mechanism 3 on the outer side of the B track group 21 for carrying the B-side jigs is a third carrier feeding mechanism 33.
And a plastic sucking disc feeder 9 is arranged on the outer side of the A track group 22. The combination of the PCBA board and the chip jig with the surface a and the surface B already mounted is carried in the plastic tray feeder 9, and when the track group B21 does not receive the chip jig from the upstream, the XZY robot mechanism 1 can suck the PCBA board jig cached in the plastic tray feeder 9.
The plate collecting mechanism 4 is provided with two and a conveying assembly 43 is arranged between the two and the B track group 21. One of the board collecting mechanisms 4 is used for collecting a combination of a semi-finished PCB and a chip mounting jig, and is a first board collecting mechanism 41, the semi-finished PCB is already provided with an A surface, the other board collecting mechanism 4 is used for collecting a combination of a PCB and a chip mounting jig, and is a second board collecting mechanism 42, and the PCB is not subjected to any chip mounting. The conveying assembly in this embodiment comprises a conveying belt, a connecting frame and a driving motor 62 arranged in the connecting frame and used for driving the conveying belt, and the plate receiving mechanism 4 is a customized plate 330 plate receiving machine.
The plate dismounting and mounting mechanism 7 comprises a left and right pusher dog assembly 71 and a front and rear pusher dog assembly 72 which clamp and fix the surface mounting jig through displacement; the board turning mechanism 6 comprises a turning component and a third sucker group 66 for sucking a PCB or PCBA board, and the third sucker group 66 is driven by the turning component to turn 180 degrees and can be positioned above or in front of the board dismounting mechanism 7. The plate turnover mechanism 6 comprises a lifting motor 61, a driving motor 62, a transmission belt 63, a rotating plate 64 and an electric control module 65, wherein the third sucker group 66 is installed on the rotating plate 64. The driving belt 83 is respectively wound around the driving motor 62 and the rotating plate 64, the rotating plate 64 can rotate 180 degrees under the driving of the driving motor 62, and fig. 8 shows the condition that the rotating plate 64 is above the plate detaching mechanism 7.
The robot assembly 16 includes a first suction cup group 161 for sucking the jig, a second suction cup group 162 for sucking the PCB or PCBA board, a bracket 163 connecting the first suction cup group 161 and the second suction cup group 162, a rotator 164 for rotating the bracket 163, a driving cylinder 165 for moving the bracket 163 in the Z direction, and a vacuum generator 166 for maintaining the first suction cup group 161 and the second suction cup group 162 in a vacuum state. Because the size of paster tool and PBC board or PCBA board is different, two sets of different sucking discs are favorable to accurate plant the PBC board or PCBA board in the paster tool.
One end of the assembly line mechanism 2 is provided with a discharge assembly line 8, one upward side of the rack 5Y is provided with a discharge hole 51 for extending the discharge assembly line 8, and the other side is provided with a feed inlet 52 for receiving an upstream patch fixture by the assembly line mechanism 2. The discharging assembly line 8 comprises a fixed frame 81, a movable rail group 82 arranged on the fixed frame 81, a transmission belt 83 arranged on the inner side of the movable rail group 82, and a stepping motor 84 for driving the transmission belt 83. The discharge line 8 may transport the finished PCBA board to equipment for storing the PCBA board.
The working principle of the embodiment is as follows: the automatic assembling and disassembling machine for the chip jig can carry out two working processes, namely a board assembling process and a board disassembling process. The plate mounting process can be divided into a plate mounting process of the B-surface jig and a plate mounting process of the A-surface jig. B surface jig plate loading process: the conveyor belt 23 on the track group B21 is used for receiving the a-side jig sent from the upstream placement station, the PCB board with the a-side mounted is implanted into the a-side jig at this time, the conveyor belt 23 transports the a-side jig to the position of the board mounting and dismounting mechanism 7, the left and right pusher dog assemblies 71 and the front and rear pusher dog assemblies 72 of the board mounting and dismounting mechanism 7 clamp and fix the a-side jig, the board turning mechanism 6 is driven by the lifting motor 61 to ascend, then the rotating plate 64 is driven by the driving motor 62 to rotate clockwise by 180 degrees, so that the third sucker group 66 on the rotating plate 64 sucks the a-side PCB board under the action of the vacuum generator 166, the rotating plate 64 rotates counterclockwise by 180 degrees, the lifting motor 61 descends, the original position is recovered, and the a-side jig waits for the second XZY manipulator 18 to grab the PCB board. The second XZY manipulator 18 moves to the top of the third carrier feeding mechanism 33, uses the first sucking disc set 161 to suck the B-side jig and then moves to the position of the board mounting and dismounting mechanism 7 on the a-track set 22, uses the left and right pusher dog assemblies 71 and the front and rear pusher dog assemblies 72 to clamp and fix the B-side jig, and waits for the second XZY manipulator 18 to grab the a-side PCB board and implant the PCB board. The second XZY manipulator 18 loosens the B-side jig and then moves to the position above the A-side PCB to be grabbed, the second sucker group 162 is used for sucking the A-side PCB, the second sucker group 162 moves to the position above the bottom camera light source 24 in the B track group 21 for positioning, the second sucker group 162 moves to the position above the bottom camera light source 24 in the A track group 22 for secondary positioning, the second sucker group 162 is confirmed to be positioned and then moves to the position above the B-side jig to be planted with the A-side PCB, the left and right pusher dog assemblies 71 and the front and rear pusher dog assemblies 72 are loosened, the first sucker group 161 is used for sucking the combination of the A-side PCB and the B-side jig, after rotating 180 degrees horizontally by the rotator 164, the combined body is moved to the position of the conveying assembly 43 between the first board collecting mechanism 41 and the B rail set 21, and the conveying assembly 43 is used to convey the combined body into the first board collecting mechanism 41, and subsequently, the combined body is conveyed back to the upstream pasting station for B-side pasting. The plate loading process of the A-side jig comprises the following steps: the board loading process of the B-side jig is that the a-side jig which takes away the a-side PCB board waits for the implantation of the PCB board which has not been mounted, the first XZY robot 17 moves to the upper side of the second carrier feeding mechanism 32, sucks a brand new PCB board, moves to the a-side jig after being positioned by the bottom camera light source 24 on the a track group 22, implants the PCB board, then horizontally rotates 180 degrees under the action of the rotator 164, and then sends the combined body to the second board collecting mechanism 42, and subsequently, the combined body is sent to the mounting station at the upstream for a-side mounting. The plate detaching process: the conveyor belt 23 on the track group B21 is used for receiving a finished product PCBA's fixture from the upstream paster station, and the process of board removal is the same as the process of removing a PCB board from the fixture, so it is not described again. Except that the finished PCBA boards will continue to be transported by the conveyor belt 23 on the B track group 21 to the discharge line 8, from which discharge line 8 the finished PCBA boards will be transported to the apparatus for storing the PCBA boards. If the surface B jig of the finished PCBA is not sent to the upstream chip mounting station, the PCBA jig cached in the feeder can be dismounted. The B-side jig on the B-track group 21 is picked by the second XZY robot 18 and then moved to the first carrier feeding mechanism 31 for buffering.
It should be noted that the operation of the devices in all the embodiments described above is controlled by a central control system, which may include a common programmable controller, a PLC, a single chip microcomputer, etc. on the market, and wires and valves for controlling the opening and closing of a motor or an air cylinder, etc., and the central control system may make corresponding action instructions for each mechanism according to feedback signals to control the operation of the assembly machine to assemble a product, and the specific control mode of the central control system is not within the protection scope of the present invention, and is not described herein.
While the preferred embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. The utility model provides a paster tool automatic dismounting machine which characterized in that: the automatic plate-folding device comprises a rack, a carrier feeding mechanism, an XZY manipulator mechanism, a production line mechanism, a plate-dismounting mechanism, a plate-turning mechanism and a plate-folding mechanism, wherein the production line mechanism is arranged in the rack, the plate-dismounting mechanism and the plate-turning mechanism are both arranged on the production line mechanism, the XZY manipulator mechanism is arranged above the production line mechanism, and the carrier feeding mechanism and the plate-folding mechanism are both arranged on one side of the production line mechanism; the assembly line mechanism receives the jig transported from the upstream chip mounting station and completes the assembly and disassembly of the chip mounting jig through the cooperation among the XZY manipulator mechanism, the plate assembly and disassembly mechanism and the plate turnover mechanism.
2. The automatic assembling and disassembling machine for chip jigs according to claim 1, characterized in that: the assembly line mechanism comprises an A track group, a B track group and a conveying belt for conveying the surface mounting jig, wherein the A track group and the B track group are both provided with the dismounting plate mechanism and the plate turning mechanism on the inner side.
3. The automatic assembling and disassembling machine for chip jigs according to claim 2, characterized in that: the outer side of the track group A is provided with two carrier feeding mechanisms, and the outer side of the track group B is provided with one carrier feeding mechanism.
4. The automatic assembling and disassembling machine for chip jigs according to claim 3, characterized in that: and a plastic sucking disc feeder is also arranged on the outer side of the track group A.
5. The automatic assembling and disassembling machine for chip jigs according to claim 2, characterized in that: the plate collecting mechanism is provided with two conveying assemblies, and the conveying assemblies are arranged between the two plate collecting mechanisms and the track group B.
6. The automatic assembling and disassembling machine for chip jigs according to claim 1, characterized in that: the plate disassembling and assembling mechanism comprises a left pusher dog assembly, a right pusher dog assembly, a front pusher dog assembly and a rear pusher dog assembly, wherein the left pusher dog assembly and the right pusher dog assembly clamp and fix the surface mounting jig through displacement; the board turnover mechanism comprises a turnover component and a third sucker group used for sucking a PCB or PCBA board, wherein the third sucker group is driven by the turnover component to turn over for 180 degrees and can be positioned above or in front of the board disassembly and assembly mechanism.
7. The automatic assembling and disassembling machine for chip jigs according to claim 1, characterized in that: the XZY manipulator mechanism comprises a transport gantry, a drag chain fixing plate arranged on the transport gantry along the Y direction, a Y-direction drag chain connected with the drag chain fixing plate, an X-axis base arranged below the transport gantry, an X-direction drag chain connected with the X-axis base and a manipulator assembly moving on the X-axis base along the X direction.
8. The automatic assembling and disassembling machine for chip jigs according to claim 7, characterized in that: the manipulator assembly comprises a first sucking disc group for sucking the patch jig, a second sucking disc group for sucking the PCB or PCBA, a support for connecting the first sucking disc group and the second sucking disc group, a rotator for rotating the support, a driving cylinder for enabling the support to move along the Z direction, and a vacuum generator for enabling the first sucking disc group and the second sucking disc group to keep a vacuum state.
9. The automatic assembling and disassembling machine for chip jigs according to claim 1, characterized in that: wherein one end of assembly line mechanism is equipped with ejection of compact assembly line, the ascending wherein one side of frame Y is seted up and is made ejection of compact assembly line extends out's discharge gate, and the opposite side is seted up and is made assembly line mechanism receives the feed inlet of upper reaches paster tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110744665.3A CN113423258A (en) | 2021-06-30 | 2021-06-30 | Automatic assembling and disassembling machine for chip mounting jig |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110744665.3A CN113423258A (en) | 2021-06-30 | 2021-06-30 | Automatic assembling and disassembling machine for chip mounting jig |
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| CN113423258A true CN113423258A (en) | 2021-09-21 |
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| CN202110744665.3A Pending CN113423258A (en) | 2021-06-30 | 2021-06-30 | Automatic assembling and disassembling machine for chip mounting jig |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113784542A (en) * | 2021-09-22 | 2021-12-10 | 深圳市艾励美特科技有限公司 | Method for dismounting equipment of PCB (printed Circuit Board) jig |
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| CN109319478A (en) * | 2018-10-16 | 2019-02-12 | 珠海市广浩捷精密机械有限公司 | A kind of automatic assembling/disassembling machine of circuit board producing line and technique |
| CN110677998A (en) * | 2019-09-30 | 2020-01-10 | 东莞华贝电子科技有限公司 | Automatic dismounting device for PCB (printed circuit board) |
| CN112607414A (en) * | 2020-12-18 | 2021-04-06 | 深圳市聚亿鑫电子科技有限公司 | Tear open and plant trigger |
| CN112672540A (en) * | 2020-12-18 | 2021-04-16 | 深圳市聚亿鑫电子科技有限公司 | Jig return line body is installed and removed automatically to mixed paster of PCB board AB face |
| CN112693889A (en) * | 2021-01-05 | 2021-04-23 | 北京航天军创技术有限公司 | Full-automatic intelligent PCB (printed circuit board) dismounting system and using method |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113784542A (en) * | 2021-09-22 | 2021-12-10 | 深圳市艾励美特科技有限公司 | Method for dismounting equipment of PCB (printed Circuit Board) jig |
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Application publication date: 20210921 |