CN112165790A - SMT chip mounter and chip mounting production process thereof - Google Patents

SMT chip mounter and chip mounting production process thereof Download PDF

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Publication number
CN112165790A
CN112165790A CN202011043338.7A CN202011043338A CN112165790A CN 112165790 A CN112165790 A CN 112165790A CN 202011043338 A CN202011043338 A CN 202011043338A CN 112165790 A CN112165790 A CN 112165790A
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China
Prior art keywords
rod
suction
conveying belt
air
fixed
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CN202011043338.7A
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Chinese (zh)
Inventor
宁大像
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Xinlingsen Jiangsu Electronic Technology Co ltd
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Xinlingsen Jiangsu Electronic Technology Co ltd
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Priority to CN202011043338.7A priority Critical patent/CN112165790A/en
Publication of CN112165790A publication Critical patent/CN112165790A/en
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16FSPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
    • F16F15/00Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
    • F16F15/02Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02Feeding of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408Incorporating a pick-up tool
    • H05K13/0409Sucking devices

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The invention discloses an SMT chip mounter and a chip mounting production process thereof, relates to the technical field of SMT chip mounting, and aims to solve the problems that an existing SMT chip mounter is not firm enough in element absorption, is easy to drop in a conveying process, and is poor in stability. The top of workstation is provided with the curb plate, and the curb plate is provided with two, two the top of curb plate is all fixed and is provided with the diaphragm, the inside of diaphragm is provided with the movable groove, the top in movable groove is provided with the lead screw, the lead screw passes through connecting plate and diaphragm fixed connection, the screw thread is provided with the movable block on the outer wall of lead screw, the transmission is provided with first conveyer belt on the workstation, one side of first conveyer belt is provided with the second conveyer belt, the fixed pneumatic push rod that is provided with in below of movable block, the fixed fly leaf that is provided with in below of pneumatic push rod, the below of fly leaf is provided with the collection chamber, the fixed sleeve that is provided with in outside of collection chamber, telescopic inside is provided with the sucking.

Description

SMT chip mounter and chip mounting production process thereof
Technical Field
The invention relates to the technical field of SMT paster, in particular to an SMT paster machine and a paster production process thereof.
Background
Chip mounter: also known as a mounter or a Surface Mount System (Surface Mount System), which is disposed behind a dispenser or a screen printer in a production line, is an apparatus for accurately placing Surface Mount components on PCB pads by moving a mounting head. The method is divided into manual operation and full-automatic operation. The full-automatic chip mounter is used for realizing full-automatic component mounting at high speed and high precision, and is the most critical and complex equipment in the whole SMT production. Chip mounters are main devices in SMT production lines, have been developed from early low-speed mechanical chip mounters to high-speed optical centering chip mounters, and have been developed towards multifunctional and flexible connection modularization. SMT is currently the most popular technique and process in the electronics assembly industry. In the surface mounting process, a chip mounter is required to be used for mounting electrical components, and the through groove of the chip mounter adopts a suction nozzle for adsorption when the materials are taken.
The existing SMT chip mounter is not firm enough to absorb components, is easy to drop in the conveying process, and is poor in stability; therefore, the existing requirements are not met, and an SMT chip mounter and a chip mounting production process thereof are provided.
Disclosure of Invention
The invention aims to provide an SMT chip mounter and a chip mounting production process thereof, and aims to solve the problems that the conventional SMT chip mounter in the background art is not firm enough for sucking components, is easy to drop in the conveying process and is poor in stability.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a SMT chip mounter, includes the workstation, the top of workstation is provided with the curb plate, and the curb plate is provided with two, two the top of curb plate is all fixed and is provided with the diaphragm, the inside of diaphragm is provided with movable groove, movable groove's top is provided with the lead screw, the lead screw passes through connecting plate and diaphragm fixed connection, the screw thread is provided with the movable block on the outer wall of lead screw, the transmission is provided with first conveyer belt on the workstation, one side of first conveyer belt is provided with the second conveyer belt, the fixed pneumatic putter that is provided with in below of movable block, pneumatic putter's the fixed fly leaf that is provided with in below, the below of fly leaf is provided with the collection chamber, the fixed sleeve that is provided with in outside of collection chamber, telescopic inside is provided with the sucking rod, the below of sucking rod is.
Preferably, the fixed landing leg that is provided with in below of workstation, and the landing leg is provided with four, four the landing leg all is through strengthening rib and workstation fixed connection, four the below of landing leg is all fixed and is provided with buffer gear, the last upper fixed plate that is provided with of buffer gear, the below of upper fixed plate is provided with the bottom plate, the fixed buffer layer that is provided with between bottom plate and the upper fixed plate.
Preferably, the motor is fixedly mounted at one end of the screw rod, a sliding rod is arranged at the rear end of the screw rod and fixedly connected with the connecting plate, and the movable block is slidably connected with the sliding rod through a sliding block.
Preferably, the top of first conveyer belt and second conveyer belt all is provided with the rack, the both sides of first conveyer belt and second conveyer belt all are provided with the baffle, the upper surface of first conveyer belt and second conveyer belt all is provided with non-slip raised, and non-slip raised is provided with a plurality of, one side of rack is through extrusion spring and baffle fixed connection, the opposite side of rack passes through electric putter and baffle fixed connection.
Preferably, an air pump is arranged on one side above the transverse plate and is fixedly connected with the air collection chamber through a hose.
Preferably, the inside of inhaling the pole is provided with recess two, the fixed gas pole that is provided with in bottom of plenum chamber, and the one end of gas pole extends to the inside of recess two, it is provided with compression spring to inhale fixedly between pole and the plenum chamber, and compression spring is located the outside of gas pole, recess two pass through passageway and suction nozzle fixed connection.
Preferably, the inside of suction nozzle is provided with the rubber pad, the inside of rubber pad is provided with inhales the hole, and inhales the hole and be provided with a plurality of.
Preferably, a sliding groove is fixedly arranged on the inner wall of the sleeve, and the suction rod is connected with the sleeve in a sliding mode through an annular sliding block.
Preferably, the first groove is formed in the placing frame.
A surface mount technology of a Surface Mount Technology (SMT) surface mount device comprises the following steps:
step 1: firstly, a driving mechanism drives a first conveying belt and a second conveying belt to transmit, a placing frame is placed on the first conveying belt and the second conveying belt respectively, a baffle plate can prevent the placing frame from falling off, friction force between the anti-slip bulge and the placing frame is increased, an anti-slip effect is achieved, and then a circuit board to be pasted and an element are placed in a first groove respectively;
step 2: when the placing rack is conveyed to a position close to the suction nozzle, the operation of the conveying belt is stopped, the placing rack can move towards the direction of the extrusion spring through the extension and contraction of the electric push rod, and the extrusion spring is compressed under stress, so that the placing rack is effectively fixed;
and step 3: the motor is started, so that the output end of the motor drives the screw rod to rotate, the movable block can be driven to horizontally move in the movable groove, the suction rod is driven to reciprocate above the first conveying belt and the second conveying belt, and the movable block can slide more stably through the matching of the slide rod and the slide block;
and 4, step 4: the air pump is started, the air pump conveys air to the air collection chamber through the hose, a through hole is formed in the air rod, the air in the air collection chamber can be conveyed to the suction nozzle conveniently through a channel in the air rod and the suction rod, the second groove can be matched with the air rod along with the suction or discharge of the air, the compression spring plays a role in buffering and resetting the sliding of the suction rod, the suction hole facilitates the inlet and outlet of the air, and the element can be effectively adsorbed;
and 5: can drive the fly leaf through pneumatic putter's flexible and go up and down, thereby make the suction nozzle be close to the rack adsorption element on the second conveyer belt, then leave, be close to the rack on the first conveyer belt with the suction nozzle again, carry out the paster to the circuit board, leave after pasting, the inside rubber pad of suction nozzle has certain elasticity, the effect of protection has been played, can increase frictional force simultaneously, make the component adsorb more stable, cooperation through spout and annular slider, make the sucking rod gliding more steady smoothly in the sleeve, the stability of sucking rod has been improved.
Step 6: and after the whole circuit board and the element are pasted, the circuit board and the element are conveyed to the next procedure by the first conveying belt and the second conveying belt, and then the actions of the steps 1-4 are continuously repeated.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the anti-skid protrusions are arranged on the upper surfaces of the first conveying belt and the second conveying belt, so that the friction force between the rack and the rack can be increased, and the anti-skid function is achieved.
2. Through buffer gear's setting, played the effect of buffering, when the landing leg received the vibration, the buffer layer had played the effect of damping buffering, and the strengthening rib has improved the stability of workstation, and output drive lead screw through the motor is rotatory, can drive the movable block and carry out horizontal migration, through the cooperation of slider and slider for the gliding more steady of movable block.
3. Through the setting of air pump and hose, can carry or take out gas to the collection chamber, be equipped with the through-hole in the gas pole, be convenient for carry the interior gas of gas collection chamber to the suction nozzle through the passageway in gas pole and the suction rod, recess two can be along with gaseous inspiration or discharge and gas pole cooperation, compression spring has played the effect of buffering and reseing to the slip of suction rod, the gaseous business turn over of suction hole convenient to, can carry out effectual absorption to the component, avoid the component to take place to drop at the in-process of carrying, influence paster efficiency, the rubber pad has certain elasticity, the effect of protection has been played, can increase frictional force simultaneously, make the component adsorb more stable, cooperation through spout and annular slider, make the suction rod gliding more steady smooth in the sleeve, the stability of suction rod has been improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic top view of the present invention;
FIG. 3 is a schematic view of a first conveyor belt structure of the present invention;
FIG. 4 is a schematic view of a buffering mechanism according to the present invention;
FIG. 5 is a schematic view of the internal structure of the sleeve of the present invention;
FIG. 6 is a schematic bottom view of the suction nozzle of the present invention;
in the figure: 1. a work table; 2. a support leg; 3. reinforcing ribs; 4. a buffer mechanism; 5. an upper fixing plate; 6. a lower fixing plate; 7. a shock-absorbing layer; 8. a transverse plate; 9. a connecting plate; 10. a screw rod; 11. a movable groove; 12. a movable block; 13. a motor; 14. an air pump; 15. a slide bar; 16. a slider; 17. a first conveyor belt; 18. a second conveyor belt; 19. anti-skid projections; 20. placing a rack; 21. a first groove; 22. a side plate; 23. a compression spring; 24. an electric push rod; 25. a pneumatic push rod; 26. a hose; 27. a movable plate; 28. a sleeve; 29. a gas collection chamber; 30. a gas lever; 31. a second groove; 32. a suction rod; 33. a channel; 34. a rubber pad; 35. a suction nozzle; 36. sucking holes; 37. a chute; 38. an annular slider; 39. a compression spring; 40. and a baffle plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-6, an embodiment of the present invention is shown: an SMT chip mounter comprises a workbench 1, side plates 22 are arranged above the workbench 1, two side plates 22 are arranged on each side plate 22, transverse plates 8 are fixedly arranged above the two side plates 22, movable grooves 11 are formed in the transverse plates 8, movable blocks 12 can drive pneumatic push rods 25 to horizontally move conveniently due to the movable grooves 11, lead screws 10 are arranged above the movable grooves 11, the lead screws 10 are fixedly connected with the transverse plates 8 through connecting plates 9, movable blocks 12 are arranged on the outer walls of the lead screws 10 in a threaded mode, a first conveying belt 17 is arranged on the workbench 1 in a transmission mode, a second conveying belt 18 is arranged on one side of the first conveying belt 17, the first conveying belt 17 and the second conveying belt 18 are respectively used for conveying circuit boards and components, pneumatic push rods 25 are fixedly arranged below the movable blocks 12, the pneumatic push rods 25 can drive the movable plates 27 to lift, and accordingly suction nozzles 35 are close to or far away from a, a movable plate 27 is fixedly arranged below the pneumatic push rod 25, a gas collection chamber 29 is arranged below the movable plate 27, a sleeve 28 is fixedly arranged outside the gas collection chamber 29, a suction rod 32 is arranged inside the sleeve 28, and a suction nozzle 35 is arranged below the suction rod 32.
Further, the fixed landing leg 2 that is provided with in below of workstation 1, and landing leg 2 is provided with four, four landing legs 2 all are through strengthening rib 3 and workstation 1 fixed connection, four landing legs 2's below is all fixed and is provided with buffer gear 4, be provided with upper fixed plate 5 on the buffer gear 4, upper fixed plate 5's below is provided with bottom plate 6, fixed buffer layer 7 that is provided with between bottom plate 6 and the upper fixed plate 5, landing leg 2 has played the effect of supporting whole chip mounter, strengthening rib 3 has improved the stability of workstation 1, buffer gear 4 has played the effect of buffering, when landing leg 2 receives the vibration, buffer layer 7 has played the effect of damping buffering.
Further, the one end fixed mounting of lead screw 10 has motor 13, and the rear end of lead screw 10 is provided with slide bar 15, and slide bar 15 and connecting plate 9 fixed connection, and movable block 12 passes through slider 16 and slide bar 15 sliding connection, and output drive lead screw 10 through motor 13 is rotatory, can drive movable block 12 and carry out horizontal migration, and through the cooperation of slide bar 15 and slider 16, it is more steady to make movable block 12 gliding.
Further, the placing racks 20 are arranged above the first conveying belt 17 and the second conveying belt 18, the baffles 40 are arranged on the two sides of the first conveying belt 17 and the second conveying belt 18, the anti-skid protrusions 19 are arranged on the upper surfaces of the first conveying belt 17 and the second conveying belt 18, and the anti-skid bumps 19 are provided with a plurality of, one side of the placing frame 20 is fixedly connected with the baffle 40 through the extrusion spring 23, the other side of the placing frame 20 is fixedly connected with the baffle 40 through the electric push rod 24, the placing frame 20 is respectively used for placing a circuit board and elements, the baffle 40 can prevent the placing frame 20 from falling, the anti-skid bumps 19 can increase the friction force between the anti-skid bumps and the placing frame 20, the anti-skid effect is achieved, the electric push rod 24 stretches out and draws back to enable the placing frame 20 to move towards the direction of the extrusion spring 23, the extrusion spring 23 is stressed and compressed, and therefore the placing frame 20 is effectively.
Further, an air pump 14 is arranged on one side above the transverse plate 8, the air pump 14 is fixedly connected with the air collection chamber 29 through a hose 26, the hose 26 facilitates horizontal movement of the air collection chamber 29, and the air pump 14 can convey or pump air out of the air collection chamber 29.
Further, a second groove 31 is formed in the suction rod 32, the air rod 30 is fixedly arranged at the bottom of the air collection chamber 29, one end of the air rod 30 extends into the second groove 31, a compression spring 39 is fixedly arranged between the suction rod 32 and the air collection chamber 29 and located outside the air rod 30, the second groove 31 is fixedly connected with the suction nozzle 35 through a channel 33, a through hole is formed in the air rod 30, gas in the air collection chamber 29 can be conveniently conveyed to the suction nozzle 35 through the channel 33 in the air rod 30 and the suction rod 32, the compression spring 39 plays a role in buffering and resetting, and the second groove 31 can be matched with the air rod 30 along with the suction or discharge of the gas.
Further, the inside of suction nozzle 35 is provided with rubber pad 34, and the inside of rubber pad 34 is provided with inhales the hole 36, and inhales the hole 36 and be provided with a plurality of, and rubber pad 34 has certain elasticity, has played the effect of protection, inhales the entrance and exit of hole 36 convenient to gas.
Further, the fixed spout 37 that is provided with of inner wall of sleeve 28, suction rod 32 pass through annular slider 38 and sleeve 28 sliding connection, through the cooperation of spout 37 and annular slider 38 for suction rod 32 is gliding more steady smooth in sleeve 28, has improved suction rod 32's stability.
Further, the inside of rack 20 is provided with recess one 21, and recess one 21 can carry out spacing to circuit board and component.
A surface mount technology of a Surface Mount Technology (SMT) surface mount device comprises the following steps:
step 1: firstly, the driving mechanism drives the first conveying belt 17 and the second conveying belt 18 to transmit, the placing frame 20 is placed on the first conveying belt 17 and the second conveying belt 18 respectively, the baffle 40 can prevent the placing frame 20 from falling off, the friction force between the antiskid protrusions 19 and the placing frame 20 is increased, an antiskid effect is achieved, and then the circuit board to be subjected to surface mounting and elements are placed in the first grooves 21 respectively;
step 2: when the placing rack 20 is conveyed to a position close to the suction nozzle 35, the operation of the conveying belt is stopped, the placing rack 20 can move towards the direction of the extrusion spring 23 through the extension and contraction of the electric push rod 24, and the extrusion spring 23 is stressed and compressed, so that the placing rack 20 is effectively fixed;
and step 3: the motor 13 is started, so that the output end of the motor 13 drives the screw rod 10 to rotate, the movable block 12 can be driven to horizontally move in the movable groove 11, the suction rod 32 is driven to reciprocate above the first conveying belt 17 and the second conveying belt 18, and the sliding of the movable block 12 is more stable through the matching of the sliding rod 15 and the sliding block 16;
and 4, step 4: the air pump 14 is started, the air pump 14 conveys air to the air collection chamber 29 through the hose 26, a through hole is formed in the air rod 30, the air in the air collection chamber 29 can be conveyed to the suction nozzle 35 through the air rod 30 and a channel 33 in the suction rod 32 conveniently, the second groove 31 can be matched with the air rod 30 along with the suction or discharge of the air, the compression spring 39 plays a role in buffering and resetting the sliding of the suction rod 32, the suction hole 36 is convenient for the air to enter and exit, and the elements can be effectively adsorbed;
and 5: can drive the fly leaf 27 through pneumatic putter 25's flexible going up and down, thereby make suction nozzle 35 be close to the rack 20 adsorption element on the second conveyer belt 18, then leave, be close to the rack 20 on the first conveyer belt 17 with suction nozzle 35 again, carry out the paster to the circuit board, leave after pasting, the inside rubber pad 34 of suction nozzle 35 has certain elasticity, the effect of protection has been played, can increase frictional force simultaneously, make the component adsorb more stably, cooperation through spout 37 and annular slider 38, make the pole 32 gliding more steady smoothly in sleeve 28, the stability of pole 32 has been improved.
Step 6: after the whole circuit board and the component are pasted, the circuit board and the component are conveyed to the next process by the first conveying belt 17 and the second conveying belt 18, and then the actions of the steps 1 to 4 are continuously repeated.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (10)

1. The SMT chip mounter comprises a workbench (1), and is characterized in that: the automatic conveying device is characterized in that side plates (22) are arranged above the workbench (1), two side plates (22) are arranged on the side plates, a transverse plate (8) is fixedly arranged above the two side plates (22), a movable groove (11) is arranged inside the transverse plate (8), a lead screw (10) is arranged above the movable groove (11), the lead screw (10) is fixedly connected with the transverse plate (8) through a connecting plate (9), a movable block (12) is arranged on the outer wall of the lead screw (10) in a threaded manner, a first conveying belt (17) is arranged on the workbench (1) in a transmission manner, a second conveying belt (18) is arranged on one side of the first conveying belt (17), a pneumatic push rod (25) is fixedly arranged below the movable block (12), a movable plate (27) is fixedly arranged below the pneumatic push rod (25), and a gas collection chamber (29) is arranged below the movable plate (27), a sleeve (28) is fixedly arranged outside the air collection chamber (29), a suction rod (32) is arranged inside the sleeve (28), and a suction nozzle (35) is arranged below the suction rod (32).
2. An SMT chip mounter according to claim 1, wherein: the fixed landing leg (2) that is provided with in below of workstation (1), and landing leg (2) are provided with four, four landing leg (2) all are through strengthening rib (3) and workstation (1) fixed connection, four the below of landing leg (2) is all fixed and is provided with buffer gear (4), be provided with on buffer gear (4) upper fixed plate (5), the below of upper fixed plate (5) is provided with bottom plate (6), fixed buffer layer (7) that is provided with between bottom plate (6) and upper fixed plate (5).
3. An SMT chip mounter according to claim 1, wherein: one end fixed mounting of lead screw (10) has motor (13), the rear end of lead screw (10) is provided with slide bar (15), and slide bar (15) and connecting plate (9) fixed connection, movable block (12) are through slider (16) and slide bar (15) sliding connection.
4. An SMT chip mounter according to claim 1, wherein: the top of first conveyer belt (17) and second conveyer belt (18) all is provided with rack (20), the both sides of first conveyer belt (17) and second conveyer belt (18) all are provided with baffle (40), the upper surface of first conveyer belt (17) and second conveyer belt (18) all is provided with skid resistant protrusion (19), and skid resistant protrusion (19) are provided with a plurality of, one side of rack (20) is through extrusion spring (23) and baffle (40) fixed connection, the opposite side of rack (20) passes through electric putter (24) and baffle (40) fixed connection.
5. An SMT chip mounter according to claim 1, wherein: an air pump (14) is arranged on one side above the transverse plate (8), and the air pump (14) is fixedly connected with the air collection chamber (29) through a hose (26).
6. An SMT chip mounter according to claim 1, wherein: inhale the inside of pole (32) and be provided with recess two (31), the fixed gas pole (30) that are provided with in bottom of plenum chamber (29), and the one end of gas pole (30) extends to the inside of recess two (31), it is provided with compression spring (39) to fix between pole (32) and the plenum chamber (29), and compression spring (39) are located the outside of gas pole (30), recess two (31) are through passageway (33) and suction nozzle (35) fixed connection.
7. An SMT chip mounter according to claim 1, wherein: the suction nozzle is characterized in that a rubber pad (34) is arranged inside the suction nozzle (35), a suction hole (36) is formed inside the rubber pad (34), and a plurality of suction holes (36) are formed in each suction hole.
8. An SMT chip mounter according to claim 1, wherein: the inner wall of the sleeve (28) is fixedly provided with a sliding groove (37), and the suction rod (32) is connected with the sleeve (28) in a sliding mode through an annular sliding block (38).
9. An SMT chip mounter according to claim 4, wherein: a first groove (21) is formed in the placing frame (20).
10. A chip mounting process according to any one of claims 1 to 9, comprising the steps of:
step 1: firstly, a driving mechanism drives a first conveying belt (17) and a second conveying belt (18) to transmit, a placing frame (20) is placed on the first conveying belt (17) and the second conveying belt (18) respectively, a baffle plate (40) can prevent the placing frame (20) from falling off, an anti-slip bulge (19) increases the friction force between the anti-slip bulge and the placing frame (20) to play a role of anti-slip, and then a circuit board to be pasted and an element are placed in a first groove (21) respectively;
step 2: when the placing rack (20) is conveyed to a position close to the suction nozzle (35), the operation of the conveying belt is stopped, the placing rack (20) can move towards the direction of the extrusion spring (23) through the extension and contraction of the electric push rod (24), and the extrusion spring (23) is stressed and compressed, so that the placing rack (20) is effectively fixed;
and step 3: the motor (13) is started, so that the output end of the motor (13) drives the screw rod (10) to rotate, the movable block (12) can be driven to horizontally move in the movable groove (11), the suction rod (32) is driven to reciprocate above the first conveying belt (17) and the second conveying belt (18), and the movable block (12) can slide more stably through the matching of the sliding rod (15) and the sliding block (16);
and 4, step 4: the air pump (14) is started, the air pump (14) conveys air to the air collection chamber (29) through the hose (26), a through hole is formed in the air rod (30), the air in the air collection chamber (29) is conveyed to the suction nozzle (35) through the air rod (30) and a channel (33) in the suction rod (32), the second groove (31) can be matched with the air rod (30) along with the suction or discharge of the air, the compression spring (39) plays a role in buffering and resetting the suction rod (32) in a sliding mode, the suction hole (36) facilitates the air to enter and exit, and the elements can be effectively adsorbed;
and 5: can drive fly leaf (27) through the flexible of pneumatic putter (25) and go up and down, thereby make suction nozzle (35) be close to rack (20) adsorption element on second conveyer belt (18), then leave, be close to rack (20) on first conveyer belt (17) with suction nozzle (35) again, carry out the paster to the circuit board, leave after pasting, rubber pad (34) inside suction nozzle (35) have certain elasticity, the effect of protection has been played, can increase frictional force simultaneously, make the component adsorb more stable, cooperation through spout (37) and annular slider (38), make sucking rod (32) gliding more steady smoothly in sleeve (28), the stability of sucking rod (32) has been improved.
Step 6: after the whole circuit board and the element are pasted, the circuit board and the element are conveyed to the next procedure by a first conveying belt (17) and a second conveying belt (18), and then the actions of the steps 1-4 are continuously repeated.
CN202011043338.7A 2020-09-28 2020-09-28 SMT chip mounter and chip mounting production process thereof Pending CN112165790A (en)

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Application Number Priority Date Filing Date Title
CN202011043338.7A CN112165790A (en) 2020-09-28 2020-09-28 SMT chip mounter and chip mounting production process thereof

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Application Number Priority Date Filing Date Title
CN202011043338.7A CN112165790A (en) 2020-09-28 2020-09-28 SMT chip mounter and chip mounting production process thereof

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CN112165790A true CN112165790A (en) 2021-01-01

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CN (1) CN112165790A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113490346A (en) * 2021-07-28 2021-10-08 苏州斯尔特微电子有限公司 Chip mounter and chip mounting method
CN113710004A (en) * 2021-08-04 2021-11-26 苏州瀚派电子科技有限公司 SMT (surface mount technology) chip mounting device and chip mounting process
CN114212533A (en) * 2021-11-29 2022-03-22 桂林光隆光学科技有限公司 Suction nozzle for automatic chip mounter and automatic chip mounter
CN115889310A (en) * 2022-12-29 2023-04-04 重庆宇隆电子技术研究院有限公司 Chip mounter suction nozzle belt cleaning device
CN117279359A (en) * 2023-11-24 2023-12-22 山西星心半导体科技有限公司 Lamp pearl chip mounter is used in circuit board processing

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113490346A (en) * 2021-07-28 2021-10-08 苏州斯尔特微电子有限公司 Chip mounter and chip mounting method
CN113710004A (en) * 2021-08-04 2021-11-26 苏州瀚派电子科技有限公司 SMT (surface mount technology) chip mounting device and chip mounting process
CN114212533A (en) * 2021-11-29 2022-03-22 桂林光隆光学科技有限公司 Suction nozzle for automatic chip mounter and automatic chip mounter
CN115889310A (en) * 2022-12-29 2023-04-04 重庆宇隆电子技术研究院有限公司 Chip mounter suction nozzle belt cleaning device
CN117279359A (en) * 2023-11-24 2023-12-22 山西星心半导体科技有限公司 Lamp pearl chip mounter is used in circuit board processing
CN117279359B (en) * 2023-11-24 2024-04-16 山西星心半导体科技有限公司 Lamp pearl chip mounter is used in circuit board processing

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