CN215647620U - SMT paster device - Google Patents
SMT paster device Download PDFInfo
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- CN215647620U CN215647620U CN202121800528.9U CN202121800528U CN215647620U CN 215647620 U CN215647620 U CN 215647620U CN 202121800528 U CN202121800528 U CN 202121800528U CN 215647620 U CN215647620 U CN 215647620U
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Abstract
The utility model discloses an SMT chip mounting device, relates to the technical field of chip mounting devices, and particularly relates to an SMT chip mounting device which comprises a processing cabin, wherein two connecting shafts are movably sleeved inside the processing cabin, a servo motor is fixedly mounted outside the processing cabin, an output shaft of the servo motor extends into the processing cabin and is fixedly connected with one end of a right connecting shaft, and a chip mounter is arranged at the top of the processing cabin. This SMT paster device, cooperation through activity post and electronic flexible post and telescopic link and bell and spigot joint pipe is used, make this SMT paster device can control the flexible of telescopic link through starting electronic flexible post, then drive the bell and spigot joint pipe through the telescopic link and remove and drive the outside connecting axle in processing cabin and remove, electronic flexible post deflects under the effect of activity post simultaneously, change the position of processing the outside cylinder in cabin then, make the butt joint height of conveyer belt change, the adaptation scope of this SMT paster device has been promoted.
Description
Technical Field
The utility model relates to the technical field of surface mount devices, in particular to an SMT surface mount device.
Background
The SMT paster refers to the short name of a series of process flows processed on the basis of a PCB, the PCB is a printed circuit board, the SMT is a surface assembly technology and is the most popular technology and process in the electronic assembly industry, electronic products are pursued to be miniaturized, a punching plug-in component used before cannot be reduced, the functions of the electronic products are more complete, an adopted Integrated Circuit (IC) has no punching component, particularly a large-scale and high-integration IC, and a surface paster component has to be adopted, so the importance of the SMT paster in the electronic processing industry is more obvious.
The SMT paster needs to use a special SMT paster device, but common SMT paster devices in the market still have certain not enough when using, and at first the paster is just a ring in SMT paster process flow, and the paster device still needs to dock with other equipment, and common paster device is because the height of unable adjustment butt joint conveyer belt, and consequently the equipment that can dock is limited, and the adaptation scope of device is less, for this reason, we have designed a SMT paster device and have solved above-mentioned problem.
SUMMERY OF THE UTILITY MODEL
In view of the deficiencies of the prior art, the present invention provides an SMT pick and place device that solves the problems set forth above in the background art.
In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a SMT paster device, includes the processing cabin, the inside movable sleeve in processing cabin is equipped with two connecting axles, and the outside fixed mounting in processing cabin has servo motor, servo motor's output shaft extend to the inside in processing cabin and with the one end fixed connection of right side connecting axle, the top in processing cabin is provided with the chip mounter, and the top fixed mounting in processing cabin has the fixed plate that is located the chip mounter right side, the fixed cover in inside of fixed plate is equipped with movable post, the outside movable sleeve of activity post is equipped with electronic flexible post, the outside of electronic flexible post is provided with the telescopic link, the terminal fixed cover of telescopic link is equipped with the socket pipe, the inside movable sleeve of socket pipe is equipped with the connecting axle, the outside fixed cover of connecting axle is equipped with the cylinder, and the conveyer belt has been cup jointed to the outside of cylinder.
Optionally, a clamping pipe is arranged outside the roller, and a clamping column matched with the clamping pipe is arranged on the inner side of the conveyor belt.
Optionally, the conveyor belt is made of hard rubber, and the outer portion of the conveyor belt is provided with anti-slip lines which are uniformly distributed.
Optionally, a movable groove matched with the electric telescopic column is formed in the top of the processing cabin, and the length value of the fixing plate is larger than that of the telescopic rod.
Optionally, a discharge hole is formed in the left side of the processing cabin, and damping bases which are uniformly distributed are fixedly mounted at the bottom of the processing cabin.
Optionally, the processing cabin and the fixed plate, the telescopic rod and the sleeve pipe are made of metal, and the chip mounter is electrically connected with the servo motor.
The utility model provides an SMT chip mounting device, which has the following beneficial effects:
1. this SMT paster device, cooperation through activity post and electronic flexible post and telescopic link and bell and spigot joint pipe is used, make this SMT paster device can control the flexible of telescopic link through starting electronic flexible post, then drive the bell and spigot joint pipe through the telescopic link and remove and drive the outside connecting axle in processing cabin and remove, electronic flexible post deflects under the effect of activity post simultaneously, change the position of processing the outside cylinder in cabin then, make the butt joint height of conveyer belt change, the adaptation scope of this SMT paster device has been promoted.
2. This SMT paster device, cooperation through connecting axle and cylinder and conveyer belt is used, make this SMT paster device can guarantee cup jointing of cylinder and conveyer belt through the outside joint pipe of cylinder and the inboard joint post of conveyer belt, thereby make this SMT paster device when changing the height of conveyer belt butt joint end, the conveyer belt can with the surface in close contact with of cylinder, thereby avoid conveyer belt butt joint end height to change the back, the surface and the cylinder separation of conveyer belt, then influence the transport work of product, thereby guarantee that this SMT paster device can be stable carry the product.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the exterior of the conveyor belt of the present invention;
FIG. 3 is a schematic structural view of an electric telescopic column and a fixing plate according to the present invention;
fig. 4 is a schematic structural view of the connecting shaft and the drum of the present invention.
In the figure: 1. a processing cabin; 2. an electric telescopic column; 3. a telescopic rod; 4. a connecting shaft; 5. a conveyor belt; 6. a fixing plate; 7. a chip mounter; 8. a discharge port; 9. a servo motor; 10. a damping mount; 11. a drum; 12. sleeving a pipe; 13. a movable column.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1 to 3, the present invention provides a technical solution: an SMT chip mounting device comprises a processing cabin 1, wherein two connecting shafts 4 are movably sleeved inside the processing cabin 1, a servo motor 9 is fixedly installed outside the processing cabin 1, an output shaft of the servo motor 9 extends into the processing cabin 1 and is fixedly connected with one end of the right connecting shaft 4, a chip mounter 7 is arranged at the top of the processing cabin 1, a fixing plate 6 located on the right side of the chip mounter 7 is fixedly installed at the top of the processing cabin 1, a movable column 13 is fixedly sleeved inside the fixing plate 6, an electric telescopic column 2 is movably sleeved outside the movable column 13, a telescopic rod 3 is arranged outside the electric telescopic column 2, a sleeve pipe 12 is fixedly sleeved at the tail end of the telescopic rod 3, the connecting shaft 4 is movably sleeved inside the sleeve pipe 12, a movable groove matched with the electric telescopic column 2 is formed in the top of the processing cabin 1, the length value of the fixing plate 6 is larger than the length value of 3, the electric telescopic column 2 can control the telescopic rod 3 to stretch when in work, so that the telescopic rod 3 drives the sleeve 12 to move and drives the connecting shaft 4 outside the processing cabin 1 to move, thereby changing the height of the conveyor belt 5 outside the processing cabin 1, meanwhile, the electric telescopic column 2 can deflect under the action of the movable column 13, a movable groove at the top of the processing cabin 1 can provide a movable space for the deflection of the electric telescopic column 2, a discharge port 8 is arranged at the left side of the processing cabin 1, and the bottom of the processing cabin 1 is fixedly provided with the uniformly distributed shock absorption bases 10, products can continue to move along with the conveyor belt 5 after completing the processing work inside the processing cabin 1 and are discharged through the discharge port 8 at the left side of the processing cabin 1, so that the products can be collected by workers, the shock absorption bases 10 at the bottom of the processing cabin 1 can enhance the shock absorption effect of the processing cabin 1, and reduce the shock influence on the device in the working process, the precision of assurance device during operation, processing cabin 1 and fixed plate 6 and telescopic link 3 and socket pipe 12 all adopt the metal to make, electric connection between chip mounter 7 and servo motor 9, processing cabin 1 and fixed plate 6 and telescopic link 3 and socket pipe 12 adopt the metal to make the stability that can strengthen their structure, other structures associated with them provide stable supporting role, and good safety protection effect, electric connection makes chip mounter 7 stop the operation at during operation servo motor 9 between chip mounter 7 and the servo motor 9, the chip mounter 7 of being convenient for processes the product, the principle and the use of this chip mounter 7 all are the same with prior art, no longer describe herein.
Referring to fig. 4, a roller 11 is fixedly sleeved outside a connecting shaft 4, a conveyor belt 5 is sleeved outside the roller 11, a clamping pipe is arranged outside the roller 11, a clamping column matched with the clamping pipe is arranged inside the conveyor belt 5, the clamping pipe outside the roller 11 and the clamping column inside the conveyor belt 5 can ensure the sleeving of the roller 11 and the conveyor belt 5, so that when the height of the butt joint end of the conveyor belt 5 is changed, the conveyor belt 5 can be in close contact with the outer surface of the roller 11, the separation of the outer surface of the conveyor belt 5 from the roller 11 after the height of the butt joint end of the conveyor belt 5 is changed is avoided, the conveyor belt 5 can stably convey products, the conveyor belt 5 is made of hard rubber, anti-slip patterns uniformly distributed are arranged outside the conveyor belt 5, and the conveyor belt 5 is made of hard rubber so that the conveyor belt 5 has good deformation capability, the shape of the conveyor belt 5 can be changed along with the change of the external connecting shaft 4 and the roller 11 of the processing cabin 1, and the stability of the conveyor belt 5 when driving a product to move can be further improved by the anti-skid lines outside the conveyor belt 5.
In conclusion, the SMT chip mounting device is used, the servo motor 9 is started, the servo motor 9 drives the connecting shaft 4 on the left side of the processing cabin 1 to rotate through an output shaft of the servo motor 9, the connecting shaft 4 drives the roller 11 to rotate, the conveyor belt 5 moves along with the roller 11 under the action of the clamping pipe on the outer portion of the roller 11, the electric telescopic column 2 is started, the electric telescopic column 2 controls the telescopic rod 3 to stretch, the telescopic rod 3 drives the sleeve pipe 12 to move and drives the connecting shaft 4 on the outer portion of the processing cabin 1 to move, meanwhile, the electric telescopic column 2 deflects under the action of the movable column 13, the position of the roller 11 on the outer portion of the processing cabin 1 changes along with the connecting shaft 4, the butt joint height of the conveyor belt 5 changes, a product to be processed is placed above the conveyor belt 5, the product moves along with the conveyor belt 5 to the inner portion of the processing cabin 1, the chip mounter 7 is started and processes the product, and the processed product continues to move along with the conveyor belt 5, and (4) discharging from the processing cabin 1 through the discharge hole 8 to complete the working process of the whole SMT chip mounting device.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An SMT paster device, includes processing cabin (1), its characterized in that: the processing cabin is characterized in that two connecting shafts (4) are movably sleeved in the processing cabin (1), a servo motor (9) is fixedly installed outside the processing cabin (1), an output shaft of the servo motor (9) extends to the inside of the processing cabin (1) and is fixedly connected with one end of the right connecting shaft (4), a chip mounter (7) is arranged at the top of the processing cabin (1), a fixing plate (6) located on the right side of the chip mounter (7) is fixedly installed at the top of the processing cabin (1), a movable column (13) is fixedly sleeved in the fixing plate (6), an electric telescopic column (2) is movably sleeved outside the movable column (13), a telescopic rod (3) is arranged outside the electric telescopic column (2), a sleeve pipe (12) is fixedly sleeved at the tail end of the telescopic rod (3), and a connecting shaft (4) is movably sleeved in the sleeve pipe (12), the outer portion of the connecting shaft (4) is fixedly sleeved with a roller (11), and the outer portion of the roller (11) is sleeved with a conveyor belt (5).
2. An SMT patch device according to claim 1, wherein: the outside of cylinder (11) is provided with the joint pipe, the inboard of conveyer belt (5) is seted up with joint pipe assorted joint post.
3. An SMT patch device according to claim 1, wherein: the conveying belt (5) is made of hard rubber, and anti-skid grains which are uniformly distributed are arranged outside the conveying belt (5).
4. An SMT patch device according to claim 1, wherein: the top of the processing cabin (1) is provided with a movable groove matched with the electric telescopic column (2), and the length value of the fixing plate (6) is larger than that of the telescopic rod (3).
5. An SMT patch device according to claim 1, wherein: the left side of processing cabin (1) is provided with discharge gate (8), and the bottom fixed mounting of processing cabin (1) has evenly distributed's vibration damping mount (10).
6. An SMT patch device according to claim 1, wherein: the processing cabin (1), the fixing plate (6), the telescopic rod (3) and the sleeve pipe (12) are made of metal, and the chip mounter (7) is electrically connected with the servo motor (9).
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CN202121800528.9U CN215647620U (en) | 2021-08-04 | 2021-08-04 | SMT paster device |
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CN202121800528.9U CN215647620U (en) | 2021-08-04 | 2021-08-04 | SMT paster device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113710004A (en) * | 2021-08-04 | 2021-11-26 | 苏州瀚派电子科技有限公司 | SMT (surface mount technology) chip mounting device and chip mounting process |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113710004A (en) * | 2021-08-04 | 2021-11-26 | 苏州瀚派电子科技有限公司 | SMT (surface mount technology) chip mounting device and chip mounting process |
CN113710004B (en) * | 2021-08-04 | 2024-06-25 | 苏州瀚派电子科技有限公司 | SMT (surface mount technology) chip mounting device and chip mounting process |
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