CN210837770U - Rectifier diode - Google Patents
Rectifier diode Download PDFInfo
- Publication number
- CN210837770U CN210837770U CN201922182334.6U CN201922182334U CN210837770U CN 210837770 U CN210837770 U CN 210837770U CN 201922182334 U CN201922182334 U CN 201922182334U CN 210837770 U CN210837770 U CN 210837770U
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- Prior art keywords
- pin
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- shell
- cover plate
- diode according
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000003466 welding Methods 0.000 claims abstract description 28
- 239000003292 glue Substances 0.000 claims abstract description 24
- 239000004033 plastic Substances 0.000 claims abstract description 24
- 239000000565 sealant Substances 0.000 claims abstract description 12
- 238000007789 sealing Methods 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims description 11
- 238000004804 winding Methods 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 5
- 238000005253 cladding Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 14
- 230000003014 reinforcing effect Effects 0.000 abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000007711 solidification Methods 0.000 description 3
- 230000008023 solidification Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- WCCJDBZJUYKDBF-UHFFFAOYSA-N copper silicon Chemical group [Si].[Cu] WCCJDBZJUYKDBF-UHFFFAOYSA-N 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
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Abstract
The utility model discloses a rectifier diode relates to semiconductor device technical field, aims at solving current rectifier diode's plastic envelope glue and easily breaks to lead to the problem that sealed inefficacy, life shorten. The technical scheme is characterized in that welding pieces are arranged on two sides of a rectifier chip, two pins respectively correspond to the two welding pieces, and the rectifier chip and the two welding pieces are coated by plastic sealing glue; one end of each pin is connected with the corresponding welding sheet, and the other end of each pin extends out of the plastic sealant; the plastic envelope is glued the outside and is established along the length direction cover of pin and be annular shell, and the both ends of shell all are connected with the apron, all are provided with the first through-hole that supplies the pin to stretch out on two apron. Because the pin stretches out through the first through-hole on the apron, so when buckling the pin, the atress part of diode is in the first through-hole position of apron, and its inside plastic envelope is glued and is difficult for breaking to reach the sealed effect of reinforcing, improve life's effect.
Description
Technical Field
The utility model belongs to the technical field of semiconductor device's technique and specifically relates to a rectifier diode is related to.
Background
Rectifier diodes are the most basic semiconductor devices, mainly used for converting alternating current into direct current, and widely applied to various electronic circuits.
The current chinese patent with publication number CN201540895U discloses a rectifier diode, which includes a silicon wafer, soldering lugs and pins, wherein both side surfaces of the silicon wafer are provided with soldering lugs, each soldering lug is fixed with a conductor, the silicon wafer and the soldering lugs fixed with the conductors are covered by a molding compound, the silicon wafer is a polygonal body with more than four sides, each side of the silicon wafer of the polygonal body is formed with a protruding structure towards both side surfaces of the silicon wafer, and the surface of the protruding structure is provided with a protective layer, thereby achieving the effects of improving the on-state voltage and improving the heat dissipation performance.
However, the above prior art solutions have the following drawbacks: after the rectifier diode is packaged, when the pins are stressed and bent in the assembling process, the plastic package glue is easily broken, so that the sealing failure is caused, and the service life of the rectifier diode is shortened.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a rectifier diode, it has the sealed effect of reinforcing, improves life's effect.
The above utility model discloses an above-mentioned utility model purpose can realize through following technical scheme: a rectifier diode comprises a rectifier chip, a plastic package adhesive and two pins, wherein welding sheets are arranged on two sides of the rectifier chip, the two pins respectively correspond to the two welding sheets, the rectifier chip and the two welding sheets are wrapped by the plastic package adhesive, one end of each pin is connected with the corresponding welding sheet, and the other end of each pin extends out of the plastic package adhesive; the plastic packaging glue is characterized in that an annular shell is sleeved on the outer side of the plastic packaging glue along the length direction of the pins, cover plates are connected to two ends of the shell, and first through holes for the pins to extend out are formed in the cover plates.
Through adopting above-mentioned technical scheme, the pin stretches out through the first through-hole on the apron, and when buckling the pin, the atress part of diode is in the first through-hole position of apron, and its inside plastic envelope is glued and is difficult for breaking to reach the sealed effect of reinforcing, improve life's effect.
The utility model discloses further set up to: and one end of the cover plate close to the welding sheet is provided with an annular groove, two ends of the shell are respectively inserted into the corresponding annular grooves, and the annular grooves are filled with sealant.
Through adopting above-mentioned technical scheme, put into the shell rectifier chip, welding piece and pin, insert the one end of shell and establish in the ring channel that corresponds, then pour into the plastic sealant, insert the other end of shell again and establish in the ring channel of another apron at last, can firmly fix two apron and shells, have the effect of the assembly of being convenient for. On the other hand, the annular groove is filled with sealant, so that the sealing performance between the cover plate and the shell is ensured.
The utility model discloses further set up to: one end of the shell close to the cover plate is provided with a clamping hook.
Through adopting above-mentioned technical scheme for the sealed glue in the difficult ring channel that breaks away from of shell has increased the fastness of connection between shell and the apron.
The utility model discloses further set up to: the clamping hook is formed by bending one end of the shell close to the cover plate outwards, and the clamping hook is arranged in an annular shape.
By adopting the technical scheme, the clamping hook is formed by bending one end of the shell close to the cover plate outwards, and an annular clamping hook is formed, so that the connection stability of the cover plate and the shell is further improved.
The utility model discloses further set up to: the annular grooves are in trapezoidal arrangement.
Through adopting above-mentioned technical scheme, the width of ring channel diapire is greater than ring channel open-ended width, also is trapezoidal after sealed glue in the ring channel solidifies for sealed glue is difficult for breaking away from out of the ring channel, has further guaranteed the connection stability of apron and shell.
The utility model discloses further set up to: the cover plate is provided with a fixing block at one end far away from the welding sheet, and the fixing block is provided with a second through hole communicated with the first through hole and used for extending out of the pin.
Through adopting above-mentioned technical scheme, the fixed block sets up on the apron, has increased the apron thickness, and when the pin atress was crooked, the stress part of diode was in the position of second through-hole, avoided the position fracture at first through-hole place on the apron, had improved the life of apron.
The utility model discloses further set up to: the end, away from the welding sheet, of the cover plate is provided with a yielding groove, the first through hole is formed in the bottom wall of the yielding groove, the fixing block is arranged in the yielding groove and attached to the bottom wall of the yielding groove, and the yielding groove is filled with solidified glue; and a rubber pad is arranged between the inner side wall of the second through hole and the pin.
Through adopting above-mentioned technical scheme, when the pin atress was crooked, pin and rubber pad contacted, under the cushioning effect of rubber pad, the pin is difficult for being broken.
The utility model discloses further set up to: one end of the rubber pad, which is far away from the welding sheet, extends out of the second through hole.
Through adopting above-mentioned technical scheme, the one end that the welding piece was kept away from to the rubber pad stretches out the second through-hole, avoids the pin to offset with the one end that the welding piece was kept away from to the second through-hole when the bending, makes the pin avoid being broken under the cushioning effect of rubber pad.
The utility model discloses further set up to: the pins are bent to form a winding ring, and the winding ring is positioned between one end of each pin extending out of the cover plate and the corresponding fixing block.
By adopting the technical scheme, when the pin is stressed and bent in the assembling process, the winding ring is stretched, so that the pin is not easily broken under the buffer action. On the other hand, through the cushioning effect of encircleing, the effort can not transmit the junction of pin and welding piece, has improved the connection steadiness between pin and the welding piece.
The utility model discloses further set up to: the pins are in threaded connection with the corresponding soldering lugs.
Through adopting above-mentioned technical scheme, pin welding piece threaded connection, simple to operate.
To sum up, the utility model discloses a beneficial technological effect does:
1. through the arrangement of the shell and the two cover plates, the plastic packaging glue inside is prevented from being broken, so that the effects of enhancing the sealing effect and prolonging the service life are achieved;
2. the annular groove is matched with the clamping hook, so that the operation is convenient, and the connection stability of the cover plate and the shell is further ensured;
3. through the setting of groove, fixed block and rubber pad of stepping down, improved the life of apron on the one hand, on the other hand avoids the pin to be broken when the bending.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a rectifier diode according to an embodiment of the present invention;
fig. 2 is a cross-sectional view of a rectifier diode according to an embodiment of the present invention;
fig. 3 is an enlarged view of a portion a in fig. 2 according to an embodiment of the present invention;
fig. 4 is an enlarged view of a portion B in fig. 2 according to an embodiment of the present invention.
In the figure, 1, a housing; 11. a hook; 2. a cover plate; 21. a first through hole; 22. an annular groove; 23. sealing glue; 24. a fixed block; 25. a second through hole; 26. a yielding groove; 27. solidifying glue; 28. a rubber pad; 3. a rectifying chip; 4. welding the sheet; 5. a pin; 51. encircling; 6. and (5) molding and sealing the adhesive.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
The utility model provides a rectifier diode, refers to fig. 1 and 2, includes rectifier chip 3, plastic envelope glue 6 and two pins 5, and rectifier chip 3's the equal fixedly connected with soldering lug 4 in both sides, rectifier chip 3 and two soldering lugs 4 all wrap through plastic envelope glue 6, and plastic envelope glue 6 is epoxy. The outer side of the plastic sealing glue 6 is sleeved with an annular shell 1 along the length direction of the pins 5, and both ends of the shell 1 are connected with cover plates 2.
Referring to fig. 2 and 3, one end of the cover plate 2, which is far away from the housing 1, is provided with a yielding groove 26, a first through hole 21 is formed in the bottom wall of the yielding groove 26, a fixing block 24 is arranged in the yielding groove 26, the fixing block 24 is attached to the bottom wall of the yielding groove 26, and a second through hole 25 communicated with the first through hole 21 is formed in the fixing block 24. Taking one of the pins 5 as an example, one end of the pin 5 is screwed with the corresponding soldering tab 4, and the other end of the pin 5 extends out of the fixing block 24 through the first through hole 21 and the second through hole 25. The pins 5 extending out of the fixing blocks 24 are bent to form loops 51, and the loops 51 are located between the end portions of the pins 5 extending out of the cover plate 2 and the corresponding fixing blocks 24.
Referring to fig. 2 and 3, taking one of the fixing blocks 24 as an example, a solidification glue 27 is filled between the inner side wall of the yielding groove 26 and the fixing block 24, the solidification glue 27 is used for fixing the fixing block 24 in the yielding groove 26, and the solidification glue 27 in this embodiment is a silicon copper sealant. A rubber pad 28 is arranged between the inner side wall of the second through hole 25 and the pin 5, and one end, far away from the welding sheet 4, of the rubber pad 28 extends out of the second through hole 25.
Referring to fig. 2 and 4, the cover plate 2 is provided with an annular groove 22 at one end close to the welding sheet 4, the annular groove 22 is trapezoidal, and the width of the bottom wall of the annular groove 22 is greater than the width of the opening of the annular groove 22. The two ends of the housing 1 are bent outwards to form hooks 11, the hooks 11 are annular, and the hooks 11 are inserted into the corresponding annular grooves 22. The annular groove 22 is filled with sealant 23, and the hook 11 is covered by the sealant 23, so that the cover plate 2 and the housing 1 are firmly fixed. In this embodiment, the sealant 23 is also silicon copper sealant.
The implementation principle of the embodiment is as follows:
the pins 5 are in threaded connection with the welding pieces 4, the outer side of the plastic package glue 6 is sleeved with the shell 1, the clamping hooks 11 at two ends of the shell 1 are respectively inserted into the annular grooves 22 of the corresponding cover plates 2, the annular grooves 22 are filled with the sealant 23, and the clamping hooks 11 are covered by the sealant 23, so that the cover plates 2 and the shell 1 are firmly fixed. The inner side wall of the second through hole 25 is provided with a rubber pad 28, and the pin 5 passes through the corresponding second through hole 25 and the corresponding rubber pad 28 and extends out of the cover plate 2. Since the pin 5 is bent to form the winding ring 51, the pin 5 can be prevented from being broken under the buffer action of the rubber pad 28 and the winding ring 51 when the pin 5 is mounted to be bent or when the pin 5 is pulled.
The embodiment of this specific implementation mode is the preferred embodiment of the present invention, not limit according to this the utility model discloses a protection scope, so: all equivalent changes made according to the structure, shape and principle of the utility model are covered within the protection scope of the utility model.
Claims (10)
1. The utility model provides a rectifier diode, includes rectifier chip (3), plastic envelope and glues (6) and two pins (5), the both sides of rectifier chip (3) all are provided with soldering lug (4), two pin (5) correspond with two soldering lugs (4) respectively, rectifier chip (3) and two soldering lugs (4) all are through plastic envelope (6) cladding, its characterized in that: one end of each pin (5) is connected with the corresponding welding sheet (4), and the other end of each pin (5) extends out of the plastic package glue (6); the plastic sealing glue is characterized in that an annular shell (1) is sleeved on the outer side of the plastic sealing glue (6) along the length direction of the pins (5), cover plates (2) are connected to two ends of the shell (1), and first through holes (21) for the pins (5) to extend out are formed in the cover plates (2).
2. A rectifying diode according to claim 1, wherein: the cover plate is characterized in that one end, close to the welding sheet (4), of the cover plate (2) is provided with an annular groove (22), two ends of the shell (1) are respectively inserted into the corresponding annular grooves (22), and the annular grooves (22) are filled with sealant (23).
3. A rectifying diode according to claim 2, wherein: one end of the shell (1) close to the cover plate (2) is provided with a clamping hook (11), and the clamping hook (11) is positioned in the corresponding annular groove (22).
4. A rectifying diode according to claim 3, wherein: the clamping hook (11) is formed by bending one end of the shell (1) close to the cover plate (2) outwards, and the clamping hook (11) is annular.
5. A rectifying diode according to claim 3, wherein: the annular grooves (22) are arranged in a trapezoidal shape.
6. A rectifying diode according to claim 1, wherein: and a fixing block (24) is arranged at one end, far away from the welding sheet (4), of the cover plate (2), and a second through hole (25) which is communicated with the first through hole (21) and is used for the pin (5) to pass through is arranged on the fixing block (24).
7. A rectifying diode according to claim 6, wherein: one end, far away from the welding sheet (4), of the cover plate (2) is provided with a yielding groove (26), the first through hole (21) is formed in the bottom wall of the yielding groove (26), the fixing block (24) is arranged in the yielding groove (26) and attached to the bottom wall of the yielding groove (26), and a solidifying adhesive (27) is filled between the inner side wall of the yielding groove (26) and the fixing block (24); and a rubber pad (28) is arranged between the inner side wall of the second through hole (25) and the pin (5).
8. A rectifying diode according to claim 7, wherein: one end of the rubber pad (28) far away from the welding sheet (4) extends out of the second through hole (25).
9. A rectifying diode according to claim 6, wherein: the pins (5) are bent to form a winding ring (51), and the winding ring (51) is positioned between one end, extending out of the cover plate (2), of each pin (5) and the corresponding fixing block (24).
10. A rectifying diode according to claim 1, wherein: the pins (5) are in threaded connection with the corresponding welding sheets (4).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201921049259X | 2019-07-06 | ||
CN201921049259 | 2019-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN210837770U true CN210837770U (en) | 2020-06-23 |
Family
ID=71262631
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201922182334.6U Expired - Fee Related CN210837770U (en) | 2019-07-06 | 2019-12-06 | Rectifier diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN210837770U (en) |
-
2019
- 2019-12-06 CN CN201922182334.6U patent/CN210837770U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200623 |