CN210808039U - Upper and lower cover cavity phase change flange structure - Google Patents

Abstract

The utility model relates to a go up lower cover cavity phase transition flange structure, flange structure include metal cover plate, lower metal cover plate, metal support frame, phase transition cavity, through-hole foam metal and can the phase transition medium, the inside cavity that goes up metal cover plate, lower metal cover plate and metal support frame constitute becomes the phase transition cavity, the phase transition cavity is filled with through-hole foam metal, through-hole foam metal fills up and is full of the phase transition cavity, be full of the phase transition medium among the through-hole foam metal. The phase change flange structure with the upper cover cavity and the lower cover cavity has the functions of conduction heat dissipation and phase change heat dissipation, ensures the heat dissipation efficiency of a chip, improves the deformation resistance of the cavity, enables the flange not to be easily damaged, and prolongs the service life of the flange.

Description

Upper and lower cover cavity phase change flange structure

Technical Field

The utility model relates to a high-power electronic device's encapsulation field particularly, indicates upper and lower cover cavity phase transition flange structure.

Background

As the size of a product is smaller and smaller, the power density is increased and the heat productivity of the high-power electronic device is larger and larger, the requirement on the heat dissipation capability of a flange used for attaching a chip is higher and higher. The flanges for electronic packaging adopted at present are mainly made of tungsten copper, molybdenum copper alloy or multilayer structure products, and the heat conductivity can not meet the heat dissipation requirement of high-power electronic devices more and more. This problem is difficult to solve by simple conduction heat dissipation, and a novel efficient heat dissipation mode needs to be developed.

The appearance of the phase-change heat dissipation technology provides a new solution for efficient heat dissipation of electronic devices, and the appearance of the foam metal can realize the storage of two different phases of a phase-change medium at the same time, so that the idea can really become a product. The idea of heat conduction and phase change can be used for transferring the heat of electronic devices more efficiently, so that people are more and more concerned. However, no effective structure capable of producing the cavity phase change flange with low cost is available in the industry at present; therefore, how to design a low-cost and efficient structure becomes an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a cavity phase transition flange structure, this structure can double-purpose conduction heat dissipation and phase transition radiating function, has good resistance to deformation performance again.

To achieve the purpose, the utility model adopts the following technical proposal:

the utility model provides an upper and lower lid cavity phase transition flange structure, but including last metal covering plate 001, lower metal covering plate 002, metal support frame 003, phase transition cavity 004, through-hole foam metal 005 and phase transition medium 006, the inside cavity that goes up metal covering plate 001, lower metal covering plate 002 and metal support frame 003 and constitute forms phase transition cavity 004, phase transition cavity 004 is filled with through-hole foam metal 005, through-hole foam metal 005 fills full phase transition cavity 004, but be full of phase transition medium 006 in the through-hole foam metal 005.

Further, the upper metal cover plate 001 and the lower metal cover plate 002 are metal plates with the same shape and made of high thermal conductivity metal such as aluminum, copper, silver, and the like.

Furthermore, the metal support frame 003 is distributed with uniform ribs, the outer contour dimension of the metal support frame 003 is the same as the outer contour dimensions of the upper metal cover plate 001 and the lower metal cover plate 002, and the material of the metal support frame 003 is the same as the material of the upper metal cover plate 001 and the lower metal cover plate 002.

Further, the size of the outer contour of the through-hole foam metal 005 is the same as the size of the inner space of the metal support frame 003, the thickness of the through-hole foam metal 005 is the same as the thickness of the metal support frame 003, and the through-hole foam metal 005 is tightly attached to the upper metal cover plate 001 and the lower metal cover plate 002.

Further, the phase-changeable medium 006 is a medium with a low phase-change temperature, and can perform heat dissipation and cooling effects.

The utility model has the advantages that: the anti-deformation performance of the cavity phase change flange is guaranteed due to the existence of the metal support frame, the upper metal cover plate and the lower metal cover plate are well combined with the chip, the phase change heat dissipation performance is achieved due to the existence of the phase change medium, and the heat dissipation performance of the flange is remarkably improved. When heat dispersion effectively improves, the utility model discloses simple structure, the production of being convenient for. The flange structure for electronic packaging is low in cost and effective.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a schematic structural view of a metal support frame in the present invention;

FIG. 3 is a schematic structural view of the through-hole foam metal of the present invention;

in the attached drawings, 001 is an upper metal cover plate, 002 is a lower metal cover plate, 003 is a metal support frame, 004 is a phase change cavity, 005 is through-hole foam metal, and 006 is a phase-changeable medium.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 3, the upper and lower cover cavity phase change flange structure includes an upper metal cover plate 001, a lower metal cover plate 002, and a copper plate is selected as a metal, because copper has good heat conductivity, and is machined into a certain shape; the metal support frame 003, as shown in fig. 2, is made of a copper plate with a certain thickness by machining to have an outer shape as shown in the figure, and the outer contour dimension is consistent with that of the upper and lower metal cover plates; as shown in fig. 3, the through-hole foam metal 005 is formed by selecting copper foam having the same thickness as the metal support 003 as a raw material and machining the copper foam into a shape similar to the inner contour of the metal support; the phase-changeable medium 006 is injected into the phase-changeable cavity before the structure is sealed, and finally the structure is sealed.

It should be understood that the above-described embodiments are merely illustrative of the preferred embodiments of the present invention and the technical principles thereof. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, these modifications are within the scope of the present invention as long as they do not depart from the spirit of the present invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.

Claims (4)

1. The utility model provides an upper and lower lid cavity phase transition flange structure which characterized in that: including last metal covering plate (001), lower metal covering plate (002), metal support frame (003), phase transition cavity (004), through-hole foam metal (005) and phase transition medium (006), the inside cavity that goes up metal covering plate (001), lower metal covering plate (002) and metal support frame (003) and constitute forms phase transition cavity (004), phase transition cavity (004) is filled with through-hole foam metal (005), through-hole foam metal (005) are filled with phase transition cavity (004), but be full of phase transition medium (006) in through-hole foam metal (005).

2. The upper and lower cover cavity phase change flange structure of claim 1, wherein: the upper metal cover plate (001) and the lower metal cover plate (002) are metal plates with the same appearance.

3. The upper and lower cover cavity phase change flange structure of claim 1, wherein: the metal support frame (003) is distributed with even rib, the outer contour dimension of metal support frame (003) is the same with the outer contour dimension of last metal apron (001), lower metal apron (002), the material of metal support frame (003) is the same with last metal apron (001), lower metal apron (002).

4. The upper and lower cover cavity phase change flange structure of claim 1, wherein: through-hole foam metal (005) outline size is the same with metal support frame (003) inner space size, the thickness of through-hole foam metal (005) is the same with metal support frame (003), through-hole foam metal (005) and last metal covering plate (001), lower metal covering plate (002) laminating are inseparable.

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