CN216597292U

CN216597292U - Capacitor and plastic shell heat radiation structure thereof

Info

Publication number: CN216597292U
Application number: CN202123026499.8U
Authority: CN
Inventors: 郝宝平; 张晨; 张聪慧
Original assignee: XIAMEN FARATRONIC CO Ltd
Current assignee: XIAMEN FARATRONIC CO Ltd
Priority date: 2021-12-03
Filing date: 2021-12-03
Publication date: 2022-05-24
Anticipated expiration: 2031-12-03

Abstract

The utility model discloses a capacitor and a plastic shell heat dissipation structure thereof, wherein the plastic shell heat dissipation structure comprises a plastic shell and a metal heat dissipation plate, and the plastic shell is provided with a first opening and a second opening; the metal heat dissipation plate is arranged at the second opening of the plastic shell and is integrally injection-molded with the plastic shell to form an accommodating cavity with a first opening; therefore, according to the requirement of a product, a metal heat dissipation plate is embedded in the die opening shell, the requirement for efficient heat dissipation of the product is met in an in-die injection molding mode, the metal heat dissipation plate is used as a heat dissipation surface, and the using temperature range is wide; the metal heat dissipation plate is used as a medium, so that heat conduction is fast, and the performance of the capacitor is improved; and an integrated injection molding process is adopted, so that the assembly is simplified, and the sealing problem of combination of different materials is solved.

Description

Capacitor and plastic shell heat radiation structure thereof

Technical Field

The utility model relates to the technical field of capacitors, in particular to a capacitor and a plastic shell heat dissipation structure thereof.

Background

In the related technology, the film capacitor mainly comprises a core, electrodes, filling resin and a shell, wherein the electrodes and the core are welded together according to requirements, and then the shell filling resin is filled; with the wide application of the film capacitor to new energy automobiles such as electric vehicles, hybrid vehicles and the like, the voltage and the current of the film capacitor are further customized, so that higher requirements are provided for the heat dissipation performance of the capacitor; the existing shell is usually of a plastic structure, and the temperature which can be borne or not is limited; and the radiating efficiency of shell is lower, and coefficient of thermal conductivity is lower, if with the shell switching join in marriage the metal sheet, the hookup location needs extra sealed glue to fill, and it is unstable easily inefficacy to fill.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving, at least to some extent, one of the technical problems in the art described above. Therefore, an object of the present invention is to provide a plastic casing heat dissipation structure, which can meet the mechanical performance requirement and heat dissipation requirement of the product in the using process, and has simple and efficient production process.

A second object of the present invention is to provide a capacitor.

In order to achieve the above object, an embodiment of a first aspect of the present invention provides a heat dissipation structure for a plastic case of a capacitor, including:

a plastic housing provided with a first opening and a second opening;

and the metal heat dissipation plate is arranged at the second opening of the plastic shell and is integrally injection-molded with the plastic shell to form an accommodating cavity with a first opening.

According to the plastic shell heat dissipation structure of the capacitor, the first opening and the second opening are formed in the plastic shell; the metal heat dissipation plate is arranged at the second opening of the plastic shell and is integrally formed with the plastic shell in an injection molding mode to form an accommodating cavity with a first opening; therefore, according to the requirement of a product, a metal heat dissipation plate is embedded in the die opening shell, the requirement for efficient heat dissipation of the product is met in an in-die injection molding mode, the metal heat dissipation plate is used as a heat dissipation surface, and the using temperature range is wide; the metal heat dissipation plate is used as a medium, so that heat conduction is fast, and the performance of the capacitor is improved; and an integrated injection molding process is adopted, so that the assembly is simplified, and the sealing problem of combination of different materials is solved.

In addition, the plastic casing heat dissipation structure of the capacitor proposed by the above embodiments of the present invention may further have the following additional technical features:

optionally, the first opening is larger than the second opening.

Optionally, a groove is formed in the periphery of the second opening, and a convex edge is formed in the periphery of the metal heat dissipation plate, and the convex edge is arranged in the groove so that the plastic shell and the metal heat dissipation plate are integrally formed through in-mold injection molding.

Alternatively, the metal heat dissipation plate may be any one of a copper plate, an aluminum plate, or an alloy metal plate.

In order to achieve the above object, a second embodiment of the present invention provides a capacitor, which includes the above plastic housing heat dissipation structure.

According to the capacitor provided by the embodiment of the utility model, the capacitor comprises a plastic shell heat dissipation structure, so that a metal heat dissipation plate is embedded in a die opening shell according to the requirement of a product, the requirement on high-efficiency heat dissipation of the product is realized in an in-die injection molding mode, and the metal heat dissipation plate is adopted as a heat dissipation surface, so that the application temperature range is wide; the metal heat dissipation plate is used as a medium, so that heat conduction is fast, and the performance of the capacitor is improved; and an integrated injection molding process is adopted, so that the assembly is simplified, and the sealing problem of combination of different materials is solved.

Optionally, the capacitor further comprises a capacitor core and electrodes welded on the capacitor core to form a capacitor core group unit, the capacitor core group unit is arranged in the accommodating cavity of the plastic shell, and resin is filled between the plastic shell and the capacitor core group unit.

Drawings

FIG. 1 is a schematic structural diagram of a capacitor according to an embodiment of the present invention;

FIG. 2 is a schematic cross-sectional view of a capacitor according to an embodiment of the present invention;

fig. 3 is an exploded view of a capacitor according to an embodiment of the utility model.

Description of the reference symbols

Plastic housing 1 receiving chamber 11

First opening 12 of metal heat dissipation plate 2

Second opening 13 groove 14

Convex edge 21 capacitor core group unit 3

Capacitor core 31 electrode 32

And (4) a resin.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.

In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the utility model are shown in the drawings, it should be understood that the utility model can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

As shown in fig. 1 to fig. 3, a heat dissipation structure of a plastic case of a capacitor according to an embodiment of the present invention includes a plastic case 1 and a metal heat dissipation plate 2.

Wherein the plastic housing 1 is provided with a first opening 12 and a second opening 13; the metal heat sink 2 is disposed at the second opening 13 of the plastic case 1 and is integrally injection-molded with the plastic case 1 to form the receiving cavity 11 having the first opening 12.

That is to say, the metal heating panel that embedded thermal conductivity is good in the die sinking shell through the mode of mould plastics in the mould, realizes the high-efficient heat dissipation demand to the product.

As an example, the first opening 12 is larger than the second opening 13.

In one embodiment, the first opening 12 and the second opening 13 are both rectangular, and the length and width of the first opening 12 are longer than those of the second opening 13.

As an embodiment, the periphery of the second opening 13 is provided with a groove 14, the periphery of the metal heat-dissipating plate 2 is provided with a raised edge 21, and the raised edge 21 is disposed in the groove 14 so that the plastic case 1 and the metal heat-dissipating plate 2 are integrally formed by in-mold injection.

That is, the thickness of the plastic shell 1 can bear the structure of the metal heat dissipation plate 2; and the thickness of the metal heat dissipation plate 2 can be added with a convex edge as a positioning structure.

It should be noted that the transition connection area between the plastic housing 1 and the metal heat sink 2 needs to have details of the bonding material.

As an example, the metal heat sink may be any one of a copper plate, an aluminum plate, or an alloy metal plate, and the utility model is not limited thereto.

In summary, according to the plastic housing heat dissipation structure of the capacitor in the embodiment of the utility model, the plastic housing is provided with the first opening and the second opening; the metal heat dissipation plate is arranged at the second opening of the plastic shell and is integrally injection-molded with the plastic shell to form an accommodating cavity with a first opening; therefore, according to the requirement of a product, a metal heat dissipation plate is embedded in the die opening shell, the requirement for efficient heat dissipation of the product is met in an in-die injection molding mode, the metal heat dissipation plate is used as a heat dissipation surface, and the using temperature range is wide; the metal heat dissipation plate is used as a medium, so that heat conduction is fast, and the performance of the capacitor is improved; and an integrated injection molding process is adopted, so that the assembly is simplified, and the sealing problem of combination of different materials is solved.

As shown in fig. 1 to fig. 3, a second embodiment of the present invention provides a capacitor, including the above plastic housing heat dissipation structure, where the plastic housing heat dissipation structure includes a plastic housing 1 and a metal heat dissipation plate 2; the plastic housing 1 is provided with a first opening 12 and a second opening 13; the metal heat sink 2 is disposed at the second opening 13 of the plastic case 1 and is integrally injection-molded with the plastic case 1 to form the receiving cavity 11 having the first opening 12.

The capacitor comprises the plastic shell heat dissipation structure, therefore, according to the requirement of a product, the metal heat dissipation plate is embedded in the shell of the opened die, the requirement on high-efficiency heat dissipation of the product is met in an in-die injection molding mode, the metal heat dissipation plate is used as a heat dissipation surface, and the using temperature range is wide; the metal heat dissipation plate is used as a medium, so that heat conduction is fast, and the performance of the capacitor is improved; and an integrated injection molding process is adopted, so that the assembly is simplified, and the sealing problem of combination of different materials is solved.

As an embodiment, the capacitor further includes a capacitor core 31 and electrodes 32, the electrodes 32 are welded on the capacitor core 31 to form a capacitor core group unit 3, the capacitor core group unit 3 is disposed in the accommodating cavity 11 of the plastic outer shell 1, and the resin 4 is filled between the plastic outer shell 1 and the capacitor core group unit 3.

In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless expressly stated or limited otherwise, the recitation of a first feature "on" or "under" a second feature may include the recitation of the first and second features being in direct contact, and may also include the recitation that the first and second features are not in direct contact, but are in contact via another feature between them. Also, the first feature "on," "above" and "over" the second feature may include the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.

Claims

1. A plastic casing heat radiation structure of condenser, its characterized in that includes:

a plastic housing provided with a first opening and a second opening;

2. The plastic casing heat dissipation structure for capacitors as claimed in claim 1, wherein the first opening is larger than the second opening.

3. The plastic case heat dissipation structure for capacitors as claimed in claim 1, wherein the second opening is provided at a periphery thereof with a groove, and the metal heat dissipation plate is provided at a periphery thereof with a ledge, the ledge being provided in the groove so that the plastic case is integrally formed with the metal heat dissipation plate by in-mold injection.

4. The plastic case heat dissipation structure of capacitor as claimed in claim 1, wherein the metal heat dissipation plate is any one of copper plate, aluminum plate, or alloy metal plate.

5. A capacitor comprising the plastic case heat dissipation structure of any one of claims 1 to 4.

6. The capacitor according to claim 5, further comprising a capacitor core and electrodes welded on the capacitor core to form a capacitor core assembly unit, the capacitor core assembly unit being disposed in the receiving cavity of the plastic outer case, and a resin being filled between the plastic outer case and the capacitor core assembly unit.