CN210200708U

CN210200708U - Diamond heat dissipation packaging shell structure

Info

Publication number: CN210200708U
Application number: CN201921596219.7U
Authority: CN
Inventors: Wenzhen Ma; 马文珍
Original assignee: FOSHAN HUAZHI NEW MATERIAL Co Ltd
Current assignee: FOSHAN HUAZHI NEW MATERIAL Co Ltd
Priority date: 2019-09-24
Filing date: 2019-09-24
Publication date: 2020-03-27
Anticipated expiration: 2029-09-24

Abstract

The utility model relates to a diamond heat dissipation packaging shell structure, which comprises a traditional heat sink material frame 001, a metal-based diamond composite material inner core 002 and a sealing metal plate 003; a step-shaped blind hole A is formed in the center of the traditional heat sink material frame 001; the first step of the blind hole A can be filled with the metal-based diamond composite inner core 002; the sealing metal plate 003 and the metal-based diamond composite inner core 002 are pre-compounded together, and the second step of the blind hole a can be filled up. The diamond heat dissipation packaging shell structure can ensure good weldability and electroplating performance, and simultaneously has higher heat dissipation capacity, thereby meeting the requirement of packaging devices with higher energy density.

Description

Diamond heat dissipation packaging shell structure

Technical Field

The utility model relates to a high-power electronic device encapsulation is with heat sink field particularly, indicates a diamond heat dissipation encapsulation shell structure.

Background

In a high-power electronic device, the product volume is increasingly reduced, so that the power density is higher, and the requirement on the heat dissipation capacity of a packaging material is increasingly high in order to prevent the electronic device from being damaged and losing efficacy due to overhigh temperature of the product. At present, a package shell of a high-power electronic device usually adopts a heat sink material, mainly a high-thermal-conductivity heat sink material such as tungsten copper alloy, molybdenum copper alloy, CPC, CMC, kovar alloy and the like, but a simple traditional heat sink material is difficult to meet the requirement of efficient heat dissipation, so that a new package shell needs to be developed to meet the requirement.

The metal-based diamond composite material serving as a heat sink material for electronic packaging of the new generation with the most potential at present is a research hotspot of researchers in the field, has high thermal conductivity and low thermal expansion coefficient, and can meet the packaging requirement. However, the weldability and the electroplating performance of the metal-based diamond composite material are poor, the use of later-period packaging cannot be met, and an effective structure which can ensure good heat conductivity and simultaneously solve the two problems does not exist in the industry at present; therefore, how to develop a practical simple structure becomes an urgent problem to be solved.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a diamond heat dissipation encapsulation shell structure.

To achieve the purpose, the utility model adopts the following technical proposal:

the diamond heat dissipation packaging shell structure comprises a heat dissipation packaging shell structure, wherein the heat dissipation packaging shell structure comprises a traditional heat sink material frame 001, a metal-based diamond composite inner core 002 and a sealing metal plate 003, a step-shaped blind hole A is formed in the center of the traditional heat sink material frame 001, the blind hole A comprises a first step and a second step which are in gradient, and the metal-based diamond composite inner core 002 is provided with the first step which is filled in the blind hole A; the sealing metal plate 003 and the metal-based diamond composite inner core 002 are arranged together in a pre-compounding manner, and the sealing metal plate 003 is provided with a second step which is filled in the blind hole A.

Further, the material used by the conventional heat sink material frame 001 is a high thermal conductivity heat sink material such as tungsten copper alloy, molybdenum copper alloy, CPC, CMC, kovar alloy, and the like.

Further, the first step and the second step of the blind hole A are both subjected to thinning treatment.

Further, the metal-based diamond composite inner core 002 is made of a diamond composite material such as a copper/diamond composite material, an aluminum/diamond composite material, a silver/diamond composite material, and the like.

Further, an interference fit is formed between the metal-based diamond composite inner core 002 and the blind hole a.

Further, the sealing metal plate 003 is made of the same metal as that of the metal-based diamond composite core 002.

Further, the seal metal plate 003 is previously compounded with the metal matrix diamond composite inner core 002 to be integrated.

The utility model has the advantages that: the existence of the metal-based diamond composite inner core ensures that the heat dissipation packaging shell structure has excellent heat conduction capability and matched thermal expansion coefficient, the traditional heat sink material frame realizes tight wrapping of the metal-based diamond composite inner core, the sealing metal plate ensures the integrity of the shell structure, and the frame and the sealing metal plate jointly realize good weldability and electroplating performance of the composite material. Provides a simple and effective heat dissipation packaging shell structure for the industry.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be obtained from these drawings without inventive effort.

Fig. 1 is a schematic structural view of the present invention;

fig. 2 is a conventional heat sink material frame in the present invention;

FIG. 3 is a top view of an example conventional heat sink material frame sample;

in the drawing, 001 is a traditional heat sink material frame, 002 is a metal-based diamond composite inner core, 003 is a sealing metal plate, and A is a blind hole.

Detailed Description

The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.

Wherein the showings are for the purpose of illustration only and are shown by way of illustration only and not in actual form, and are not to be construed as limiting the present patent; for a better understanding of the embodiments of the present invention, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.

The same or similar reference numerals in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right", "inner", "outer", etc. are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not indicated or implied that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are used only for illustrative purposes and are not to be construed as limiting the present patent, and the specific meaning of the terms will be understood by those skilled in the art according to the specific circumstances.

In the description of the present invention, unless otherwise explicitly specified or limited, the term "connected" or the like, if appearing to indicate a connection relationship between the components, is to be understood broadly, for example, as being either a fixed connection, a detachable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or may be connected through one or more other components or may be in an interactive relationship with one another. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1 to 3, a diamond heat dissipation package casing structure includes a conventional heat sink material frame 001, CMC is selected as a material to be used, and is machined into a desired shape including a step-shaped blind hole a, as shown in fig. 2; the metal-based diamond composite inner core 002 is processed according to the size of the blind hole A by selecting a copper/diamond composite material as the inner core, and is in interference fit with the blind hole A; the sealing metal plate 003 is made of a copper plate, is processed into a required shape, and is combined with a copper/diamond inner core into a whole through a hot pressing process; the various components are finally welded together to form a unitary body.

It should be understood that the above-described embodiments are merely illustrative of the preferred embodiments of the present invention and the technical principles thereof. It will be understood by those skilled in the art that various modifications, equivalents, changes, and the like can be made to the present invention. However, these modifications are within the scope of the present invention as long as they do not depart from the spirit of the present invention. In addition, certain terms used in the specification and claims of the present application are not limiting, but are used merely for convenience of description.

Claims

1. The utility model provides a diamond heat dissipation encapsulation shell structure, includes heat dissipation encapsulation shell structure, its characterized in that: the heat dissipation packaging shell structure comprises a traditional heat sink material frame (001), a metal-based diamond composite inner core (002) and a sealing metal plate (003), wherein a step-shaped blind hole (A) is formed in the center of the traditional heat sink material frame (001), the blind hole (A) comprises a first step and a second step which are in gradient, and the metal-based diamond composite inner core (002) is provided with the first step which is filled in the blind hole (A); the sealing metal plate (003) and the metal-based diamond composite inner core (002) are arranged together in a pre-compounding manner, and the sealing metal plate (003) is provided with a second step which is filled in the blind hole (A).

2. The diamond heat dissipation package housing structure of claim 1, wherein: the traditional heat sink material frame (001) is made of high-thermal-conductivity heat sink materials such as tungsten-copper alloy, molybdenum-copper alloy, CPC, CMC and kovar alloy.

3. The diamond heat dissipation package housing structure of claim 1, wherein: and the first step and the second step of the blind hole (A) are both subjected to thinning treatment.

4. The diamond heat dissipation package housing structure of claim 1, wherein: the metal-based diamond composite inner core (002) is made of diamond composite materials such as copper/diamond composite materials, aluminum/diamond composite materials and silver/diamond composite materials.

5. The diamond heat dissipation package housing structure of claim 1, wherein: and an interference fit is formed between the metal-based diamond composite inner core (002) and the blind hole (A).

6. The diamond heat dissipation package housing structure of claim 1, wherein: the sealing metal plate (003) is made of the same metal as the metal of the metal-based diamond composite material inner core (002).

7. The diamond heat dissipation package housing structure of claim 1, wherein: the sealing metal plate (003) is compounded with the metal-based diamond composite material inner core (002) into a whole in advance.