CN210801094U

CN210801094U - Heat dissipation structure for LED street lamp

Info

Publication number: CN210801094U
Application number: CN201921906381.4U
Authority: CN
Inventors: 戈兵; 刘宏; 张芳芳; 尹巍巍
Original assignee: Jiangsu Handing Energy Co ltd
Current assignee: Jiangsu Handing Energy Co ltd
Priority date: 2019-11-07
Filing date: 2019-11-07
Publication date: 2020-06-19
Anticipated expiration: 2029-11-07

Abstract

The utility model provides a heat radiation structure for LED street lamp, including radiating basal plate (1), radiating fin group (7) and LED circuit board (3), radiating basal plate (1) upside is connected with radiating fin group (7), and radiating basal plate (1) downside is equipped with LED heat dissipation copper post (2), LED heat dissipation copper post (2) are embedded to have LED circuit board (3), be equipped with LED chip (4) on LED circuit board (3), LED chip (4) bond with LED circuit board (3) through bonding agent (5), LED chip (4) carry out the light source through lens (6) and disperse. The utility model adopts high-quality aluminum with high heat conductivity as the heat dissipation substrate and the heat dissipation fin group, and the heat dissipation structure can effectively transfer the heat brought by the light emitting of the LED; meanwhile, the heat-conducting glue with the polyurethane substrate has excellent heat conductivity, adhesiveness and environmental friendliness, and can well and quickly transfer heat generated by LED luminescence.

Description

Heat dissipation structure for LED street lamp

Technical Field

The utility model relates to a heat radiation structure especially relates to a heat radiation structure for LED street lamp.

Background

The LED lighting has been widely recognized and popularized as green lighting, and compared with the conventional light source, the LED has the advantages of high energy conversion efficiency, long service life, small volume, no pollution and the like, and is also vigorously developed as a key industry in various countries.

However, the light emitting efficiency of the LED in mass production has reached 100Lm/W, the electro-optic conversion efficiency of the LED is still only 15-25%, and the rest 75-85% of the electric energy is converted into heat energy, which further increases the temperature of the lighting assembly, reduces the light emitting efficiency and prolongs the service life of the assembly.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current technical defect, provide a heat radiation structure for LED street lamp, through being equipped with the good radiating basal plate and the heat radiation fins of heat conductivity to and the thermal adhesive of quick transmission, can be fine carry out effectual heat dissipation with the luminous heat of bringing of LED.

In order to solve the technical problem, the utility model provides a following technical scheme:

the utility model provides a heat radiation structure for LED street lamp, includes radiating basal plate, radiating fin group and LED circuit board, radiating basal plate upside is connected with radiating fin group, and radiating basal plate downside is equipped with LED heat dissipation copper post, and the copper post is embedded to have the LED circuit board, be equipped with the LED chip on the LED circuit board, the LED chip bonds with the LED circuit board through the bonding agent, the LED chip carries out the light source through lens and disperses.

The radiating substrate and the radiating fin group are made of high-quality aluminum, rigid aluminum oxide is coated on the outer layer of the radiating substrate and the radiating fin group, the radiating fin group is composed of 20-30 fins, and the heat conductivity coefficient of the radiating substrate is 220-²K), the heat conductivity coefficient of the LED heat dissipation copper column is 380-²·K)。

The LED chip is composed of 25-49 LED lamp beads, the power of the lamp beads is 1-1.5W, the adhesive is a heat-conducting adhesive layer with polyurethane as a substrate, and the heat conductivity of the heat-conducting adhesive is 4-6W/(m)²K), the thickness of the adhesive is 0.8-1mm, and the thickness of the LED chip is 2.5-3 mm.

The thickness of the radiating substrate is 2-2.5mm, the thickness of a single radiating fin in the radiating fin group is 0.8-1.2mm, the distance between the radiating fins is 1-1.5mm, and the thickness of the LED radiating copper column is 3-3.5 mm.

Advantageous effects

① the utility model adopts high-quality aluminum with high thermal conductivity as the heat dissipation substrate and the heat dissipation fin set, and the heat dissipation structure can effectively transfer the heat brought by the LED luminescence;

② the utility model discloses an use the heat conduction of polyurethane basement to glue, its excellent heat conductivity, adhesion and environment-friendly type, the heat to the luminous production of LED that can be fine carries out the fast transmission.

Drawings

Fig. 1 is a schematic view of the assembly structure of the heat dissipation structure of the present invention;

fig. 2 is a bottom view of the heat dissipation structure of the present invention;

in the figure, 1, a heat dissipation substrate; 2. LED heat dissipation copper columns; 3. an LED circuit board; 4. an LED chip; 5. an adhesive; 6. a lens; 7. a heat radiation fin set.

Detailed Description

The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, which are used only for illustrating the present invention and are not intended to limit the present invention.

As shown in fig. 1 and 2, a heat radiation structure for an LED street lamp, including heat radiation substrate (1) heat radiation fin group (7) and LED circuit board (3), heat radiation substrate (1) upside is connected with heat radiation fin group (7), heat radiation substrate (1) downside is equipped with LED heat radiation copper post (2), LED heat radiation copper post (2) is embedded to have LED circuit board (3), be equipped with LED chip (4) on LED circuit board (3), LED chip (4) bond with LED circuit board (3) through bonding agent (5), LED chip (4) carry out the light source through lens (6) and disperse.

Furthermore, the radiating substrate (1) and the radiating fin group (7) are made of high-quality aluminum, the outer layer of the radiating substrate is coated with rigid aluminum oxide, the radiating fin group (7) is composed of 24 fins, and the heat conductivity coefficient of the radiating substrate is 250W/(m)²K), the heat conductivity coefficient of the LED heat dissipation copper column is 400W/(m)²·K)。

Furthermore, the LED chip (4) is composed of 36 LED lamp beads, the power of the lamp beads is 1W, the adhesive (5) is a heat-conducting adhesive layer with polyurethane as a substrate, and the heat conductivity of the heat-conducting adhesive is 5W/(m)²K), the thickness of the adhesive (5) is 0.8mm, and the thickness of the LED chip (4) is 2.5 mm.

Furthermore, the thickness of the radiating substrate (1) is 2mm, the thickness of a single radiating fin in the radiating fin group (7) is 0.8mm, the distance between the radiating fins is 1mm, and the thickness of the LED radiating copper column (2) is 3 mm.

The utility model discloses a pass through thermal conductive adhesive layer, heat dissipation copper post, heat dissipation base plate and radiating fin group with the heat transfer process of LED chip to air, compare with traditional mode, reduce the thermal resistance, simultaneously, radiating fin group, its spatial structure and great heat radiating area, heat dispersion is better.

Although the present invention has been described in detail with reference to the foregoing examples, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principles of the present invention should be included within the scope of the present invention.

Claims

1. The utility model provides a heat radiation structure for LED street lamp, its characterized in that, includes radiating basal plate (1), radiating fin group (7) and LED circuit board (3), radiating basal plate (1) upside is connected with radiating fin group (7), and radiating basal plate (1) downside is equipped with LED heat dissipation copper post (2), LED heat dissipation copper post (2) are embedded to have LED circuit board (3), be equipped with LED chip (4) on LED circuit board (3), LED chip (4) bond with LED circuit board (3) through bonding agent (5), LED chip (4) carry out the light source through lens (6) and disperse.

2. The heat dissipation structure for LED street lamp as claimed in claim 1, wherein the heat dissipation substrate (1) and the heat dissipation fin set (7) are made of high quality aluminum, the outer layer is covered with rigid aluminum oxide, the heat dissipation fin set (7) is composed of 20-30 fins, and the heat conductivity of the heat dissipation substrate is 220-²K), the heat conductivity coefficient of the LED heat dissipation copper column is 380-²·K)。

3. The heat dissipation structure for LED street lamp according to claim 1, wherein the LED chip (4) is composed of 25-49 LED lamp beads, the power of the lamp beads is 1-1.5W, the adhesive (5) is a heat conductive adhesive layer with polyurethane as a base, and the heat conductivity of the heat conductive adhesive is 4-6W/(m) W²K), the thickness of the adhesive (5) is 0.8-1mm, and the thickness of the LED chip (4) is 2.5-3 mm.

4. The heat dissipation structure for the LED street lamp according to claim 1, wherein the thickness of the heat dissipation substrate (1) is 2-2.5mm, the thickness of a single heat dissipation fin in the heat dissipation fin group (7) is 0.8-1.2mm, the distance between the heat dissipation fins is 1-1.5mm, and the thickness of the LED heat dissipation copper column (2) is 3-3.5 mm.