CN210736646U - Nano copper foil of front shell of mobile phone - Google Patents
Nano copper foil of front shell of mobile phone Download PDFInfo
- Publication number
- CN210736646U CN210736646U CN201921808282.2U CN201921808282U CN210736646U CN 210736646 U CN210736646 U CN 210736646U CN 201921808282 U CN201921808282 U CN 201921808282U CN 210736646 U CN210736646 U CN 210736646U
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- CN
- China
- Prior art keywords
- heat
- heat dissipation
- copper foil
- copper
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 69
- 239000011889 copper foil Substances 0.000 title claims abstract description 38
- 230000017525 heat dissipation Effects 0.000 claims abstract description 78
- 229920001296 polysiloxane Polymers 0.000 claims abstract description 24
- 239000004519 grease Substances 0.000 claims abstract description 22
- 229910021392 nanocarbon Inorganic materials 0.000 claims abstract description 16
- 238000005507 spraying Methods 0.000 claims abstract description 7
- WBLJAACUUGHPMU-UHFFFAOYSA-N copper platinum Chemical compound [Cu].[Pt] WBLJAACUUGHPMU-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 229910052802 copper Inorganic materials 0.000 claims description 18
- 239000010949 copper Substances 0.000 claims description 18
- 229910000838 Al alloy Inorganic materials 0.000 claims description 4
- 238000009826 distribution Methods 0.000 claims description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 10
- 229910052697 platinum Inorganic materials 0.000 claims 5
- 239000003292 glue Substances 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 10
- 241000784732 Lycaena phlaeas Species 0.000 description 3
- 239000002159 nanocrystal Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000013543 active substance Substances 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003463 adsorbent Substances 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000003242 anti bacterial agent Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000003380 propellant Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model belongs to the technical field of electronic equipment accessories, especially, be a cell-phone front shell nanometer copper platinum, including non-conductive heat-sensitive glue, copper foil, first nano carbon layer, netted fixed heat dissipation layer and heat dissipation rectangular plate, be equipped with heat conduction silicone grease on the non-conductive heat-sensitive glue, heat conduction silicone grease is close to the one end of copper foil with the copper foil contact, non-conductive heat-sensitive glue top is equipped with the copper foil, copper foil top spraying has first nano carbon layer, netted fixed heat dissipation layer has been bonded to first nano carbon layer top; tearing can laminate the device to needs heat abstractor's surface through non-conductive heat-sensitive glue from type paper, the network structure through non-conductive heat-sensitive glue and the network structure on netted fixed heat dissipation layer can play a reinforced effect to copper foil and first nano carbon layer, increases the toughness of device, lets the device play the effect of a protection when receiving external force impact in processing transportation and use, thereby prevents that it from taking place deformation and influence the result of use.
Description
Technical Field
The utility model belongs to the technical field of the electronic equipment accessory, concretely relates to shell nanometer copper platinum before cell-phone.
Background
Articles made of nano materials have many peculiar properties, for example, nano copper has superplastic ductility, can be elongated by more than 50 times at room temperature without cracks, researchers of French national research center find that the mechanical properties of copper nano crystals with the average volume of only 80 nanometers are remarkable, the strength is higher than that of common copper by 3 times, the deformation is very uniform, and no obvious regional narrowing phenomenon exists, which is the elastoplasticity behavior of the materials which is observed by scientists for the first time. The mechanical characteristics of the copper nanocrystals open bright prospects for manufacturing elastic substances at normal temperature, and the copper nanocrystals can be used as a hot hydrogen generator, a gel propellant, a combustion active agent, a catalyst, a water cleaning adsorbent, a sintering active agent, an antibacterial agent and the like, are easier to react with oxygen than common copper, are the same as copper atoms of common copper, are small in nano copper particles, and are widely applied to heat dissipation of smart phones, tablet computers and notebook computers.
The existing nano copper foil generally generates certain deformation due to the action of external force in the processing, transportation and use processes, so that the structure and the shape of the existing nano copper foil are changed, the existing nano copper foil is not tightly attached to a using device, and the heat dissipation efficiency is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a shell nanometer copper platinum before cell-phone to solve the problem that proposes in the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a cell-phone front-shell nanometer copper platinum, includes non-conductive heat-sensitive glue, copper foil, first nano carbon layer, netted fixed heat dissipation layer and heat dissipation rectangular plate, be equipped with heat conduction silicone grease on the non-conductive heat-sensitive glue, heat conduction silicone grease is close to the one end of copper foil with the copper foil contact, the non-conductive heat-sensitive glue top is equipped with the copper foil, copper foil top spraying has first nano carbon layer, first nano carbon layer top bonds and has netted fixed heat dissipation layer, netted fixed heat dissipation layer comprises the miniature copper wire of heat dissipation of cross distribution, fixedly connected with heat dissipation rectangular plate on the miniature copper wire of heat dissipation, heat dissipation rectangular plate outer wall spraying has second nano carbon layer.
Preferably, the non-conductive heat-sensitive adhesive is in a mesh shape, and the heat-conductive silicone grease is located in the mesh of the non-conductive heat-sensitive adhesive.
Preferably, the bottom surface of the heat-conducting silicone grease is flush with the bottom surface of the non-heat-conducting thermosensitive adhesive.
Preferably, the bottom of the non-conductive thermosensitive adhesive is bonded with release paper.
Preferably, the heat dissipation strip plate is made of aluminum alloy.
Preferably, the number of the heat dissipation strip plates is a plurality, and the heat dissipation strip plates are uniformly arranged on the heat dissipation micro copper wires.
Compared with the prior art, the beneficial effects of the utility model are that:
when using this device, it can laminate the device to the surface that needs heat abstractor through non-conductive thermal sensitive adhesive to tear from type paper, network structure through non-conductive thermal sensitive adhesive and the network structure of netted fixed heat dissipation layer can play a reinforced effect to copper foil and first nanometer carbon layer, increase the toughness of device, let the device play a guard's effect when receiving external force impact in processing transportation and use, thereby prevent that it from taking place deformation and influencing the result of use, and can play the radiating effect to the device through the rectangular board that dispels the heat in addition, can also consolidate netted fixed heat dissipation layer.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention, and together with the description serve to explain the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the fixed heat dissipation layer and the heat dissipation strip plate;
FIG. 3 is a schematic view of the structure of the fixed heat dissipation layer of the present invention;
fig. 4 is a schematic structural diagram of the non-conductive heat-sensitive adhesive and the heat-conductive silicone grease of the present invention.
In the figure: 1. a non-conductive heat-sensitive adhesive; 11. heat-conducting silicone grease; 12. release paper; 2. copper foil; 3. a first nano-carbon layer; 4. fixing a heat dissipation layer in a net shape; 41. a heat-dissipating micro copper wire; 5. a heat dissipation strip plate; 51. a second nano carbon layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a shell nanometer copper platinum before cell-phone, including non-conductive heat-sensitive glue 1, copper foil 2, first nanometer carbon-layer 3, netted fixed heat dissipation layer 4 and heat dissipation rectangular board 5, be equipped with heat conduction silicone grease 11 on the non-conductive heat-sensitive glue 1, the one end and the copper foil 2 contact that heat conduction silicone grease 11 is close to copper foil 2, non-conductive heat-sensitive glue 1 top is equipped with copper foil 2, 2 top spraying of copper foil has first nanometer carbon-layer 3, 3 top bonding of first nanometer carbon-layer have netted fixed heat dissipation layer 4, netted fixed heat dissipation layer 4 comprises cross distribution's heat dissipation miniature copper wire 41, fixedly connected with heat dissipation rectangular board 5 on the heat dissipation miniature copper wire 41, 5 outer wall spraying of heat dissipation rectangular board has second nanometer carbon-layer 51.
In this embodiment: the non-conductive heat-sensitive adhesive 1 is provided with heat-conducting silicone grease 11, the top of the non-conductive heat-sensitive adhesive 1 is provided with a copper foil 2, the copper foil 2 can be attached to a device needing heat dissipation through the non-conductive heat-sensitive adhesive 1, one end of the heat-conducting silicone grease 11 close to the copper foil 2 is in contact with the copper foil 2, the heat-conducting silicone grease 11 takes organic silicone as a main raw material, a material with excellent heat resistance and heat conductivity is added, a prepared heat-conducting type silicone grease-shaped compound is used for heat conduction and heat dissipation of electronic components, heat on the device attached to the non-conductive heat-sensitive adhesive 1 can be conducted to the copper foil 2, the top of the copper foil 2 is sprayed with a first nano carbon layer 3, nano carbon can quickly convert a point heat source into a surface heat source along transverse soaking heat conduction with higher chemical stability, good corrosion resistance and excellent high temperature resistance, and heat conductivity and low thermal, 3 tops bonds at first nanometer carbon-layer has netted fixed heat dissipation layer 4, netted fixed heat dissipation layer 4 comprises the miniature copper wire 41 of heat dissipation of cross distribution, fixedly connected with heat dissipation rectangular plate 5 on the miniature copper wire 41 of heat dissipation, 5 outer wall spraying of heat dissipation rectangular plate has second nanometer carbon-layer 51, when using this device, network structure through non-conductive heat-sensitive adhesive 1 and netted fixed heat dissipation layer 4 can play a reinforced effect to copper foil 2 and first nanometer carbon-layer 3, increase the toughness of device, let the device play the effect of a protection when receiving external force impact in processing transportation and use, thereby prevent that it from taking place deformation and influencing the result of use, and can play the radiating effect to the device through heat dissipation rectangular plate 5 in, can also consolidate netted fixed heat dissipation layer 4.
Specifically, the shape of the non-conductive heat-sensitive adhesive 1 is a net, and the heat-conductive silicone grease 11 is positioned in meshes of the non-conductive heat-sensitive adhesive 1; the heat-sensitive adhesive uses the compound cloth of aluminium foil as the substrate, and special heat-sensitive adhesive of even coating high performance, peel strength is high, just viscidity is good, the cohesion is outstanding, weather-resistant performance is good, and the heat-sensitive adhesive is more sensitive to the heat, can demonstrate viscidity under the heating condition, just can glue after cooling down, also can keep good viscidity when the device that can laminate mutually with non-conductive heat-sensitive adhesive 1 generates heat, and the space that can save the device in the 1 mesh of non-conductive heat-sensitive adhesive in addition.
Specifically, the bottom surface of the heat-conducting silicone grease 11 is flush with the bottom surface of the non-electric-conduction heat-sensitive adhesive 1; when the non-conductive heat-sensitive adhesive 1 is attached to a device needing heat dissipation, the heat-conducting silicone grease 11 is prevented from affecting the attaching effect.
Specifically, the bottom of the non-conductive thermal sensitive adhesive 1 is bonded with a release paper 12; the release paper 12 is also called release paper, silicone oil paper, and is release paper that prevents adhesion of the prepreg and protects the prepreg from contamination, and the release paper 12 is made of paper coated with an anti-sticking substance and can protect the non-conductive thermal sensitive adhesive 1 and the thermal silicone grease 11.
Specifically, the heat dissipation strip plate 5 is made of aluminum alloy; the heat capacity of copper is large, the heat absorption is fast, the heat resistance is small, but the heat dissipation performance is not the best, aluminum is opposite to copper, but the density is one fourth of copper, copper which is in contact with a heat source and aluminum for heat dissipation are conducted to the heat dissipation strip plate 5 through the copper foil 2, then heat dissipation is conducted through the heat dissipation strip plate 5, and the heat dissipation strip plate 5 is made of aluminum alloy, so that the weight of the device can be effectively reduced.
Specifically, the number of the heat dissipation strip plates 5 is several, and the heat dissipation strip plates are uniformly arranged on the heat dissipation micro copper wires 41; the heat can be uniformly dissipated to the outside through the uniform distribution of the heat dissipation strip plates 5, and the heat dissipation micro copper wires 41 can be reinforced through the heat dissipation strip plates 5.
The utility model discloses a theory of operation and use flow: when the device is used, the release paper 12 is torn to attach the device to the surface of a device needing heat dissipation through the non-conductive heat-sensitive adhesive 1, the heat on the device jointed with the non-conductive thermal sensitive adhesive 1 can be conducted to the copper foil 2 through the heat-conducting silicone grease 11, then the heat is transmitted to the heat dissipation strip plate 5 through the first nano carbon layer 3 and the net-shaped fixed heat dissipation layer 4 for heat dissipation, moreover, the mesh structure of the non-conductive heat-sensitive adhesive 1 and the mesh structure of the mesh-shaped fixed heat dissipation layer 4 can reinforce the copper foil 2 and the first nano carbon layer 3, increase the toughness of the device, protect the device when being impacted by external force during processing, transportation and use, prevent the device from deforming so as to influence the use effect, and the net-shaped fixed heat dissipation layer 4 can be reinforced by the connection of the heat dissipation strip plate 5 and the net-shaped fixed heat dissipation layer 4.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. The nano copper platinum for the front shell of the mobile phone is characterized by comprising a non-conductive heat-sensitive adhesive (1), a copper foil (2), a first nano carbon layer (3), a net-shaped fixed heat dissipation layer (4) and a heat dissipation strip plate (5), wherein a heat-conducting silicone grease (11) is arranged on the non-conductive heat-sensitive adhesive (1), one end, close to the copper foil (2), of the heat-conducting silicone grease (11) is in contact with the copper foil (2), the copper foil (2) is arranged on the top of the non-conductive heat-sensitive adhesive (1), and the first nano carbon layer (3) is sprayed on the top of the copper foil (2);
first nano carbon-layer (3) top bonds has netted fixed heat dissipation layer (4), netted fixed heat dissipation layer (4) comprises the miniature copper wire (41) of heat dissipation of cross distribution, fixedly connected with heat dissipation rectangular plate (5) on heat dissipation miniature copper wire (41), heat dissipation rectangular plate (5) outer wall spraying has second nano carbon-layer (51).
2. The nano copper and platinum for the front shell of the mobile phone according to claim 1, wherein: the non-conductive heat-sensitive adhesive (1) is net-shaped, and the heat-conductive silicone grease (11) is positioned in meshes of the non-conductive heat-sensitive adhesive (1).
3. The nano copper and platinum for the front shell of the mobile phone according to claim 1, wherein: the bottom surface of the heat-conducting silicone grease (11) is flush with the bottom surface of the non-conductive heat-sensitive adhesive (1).
4. The nano copper and platinum for the front shell of the mobile phone according to claim 1, wherein: and the bottom of the non-conductive heat-sensitive adhesive (1) is bonded with release paper (12).
5. The nano copper and platinum for the front shell of the mobile phone according to claim 1, wherein: the heat dissipation strip plate (5) is made of aluminum alloy.
6. The nano copper and platinum for the front shell of the mobile phone according to claim 1, wherein: the number of the heat dissipation long strips (5) is a plurality, and the heat dissipation long strips are uniformly arranged on the heat dissipation micro copper wires (41).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921808282.2U CN210736646U (en) | 2019-10-25 | 2019-10-25 | Nano copper foil of front shell of mobile phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921808282.2U CN210736646U (en) | 2019-10-25 | 2019-10-25 | Nano copper foil of front shell of mobile phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210736646U true CN210736646U (en) | 2020-06-12 |
Family
ID=70984272
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921808282.2U Expired - Fee Related CN210736646U (en) | 2019-10-25 | 2019-10-25 | Nano copper foil of front shell of mobile phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210736646U (en) |
-
2019
- 2019-10-25 CN CN201921808282.2U patent/CN210736646U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 |