CN210723012U - 一种车规级igbt模块核心板 - Google Patents

一种车规级igbt模块核心板 Download PDF

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CN210723012U
CN210723012U CN201922365836.2U CN201922365836U CN210723012U CN 210723012 U CN210723012 U CN 210723012U CN 201922365836 U CN201922365836 U CN 201922365836U CN 210723012 U CN210723012 U CN 210723012U
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袁磊
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Hefei Zhongheng Micro Semiconductor Co ltd
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Abstract

本实用新型公开了一种车规级IGBT模块核心板，包括陶瓷覆铜板，贴装于所述陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻，以及连接IGBT芯片、二极管、热敏电阻的键合引线；所述陶瓷覆铜板分为独立且形状相同的三块，均由正面覆铜板、中间陶瓷基板和背面覆铜板构成，其中正面覆铜板采用相同布局，贴附于三块陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻的键合引线采用同一种引线设计。此核心板可以兼容各种封装结构的汽车级功率半导体模块，三块陶瓷覆铜板采用相同布局，能够降低因芯片位置产生的差异电感，提高芯片的均流性，能够兼容各种形状尺寸的IGBT芯片、二极管、热敏电阻。

Description

一种车规级IGBT模块核心板
技术领域
本实用新型涉及功率半导体器件技术领域，尤其是一种车规级IGBT模块核心板。
背景技术
车规级功率半导体模块是一种应用于新能源汽车领域的大功率器件。目前，车规级功率半导体模块封装结构差异，导致车规级功率半导体模块中DBC布局和Layout设计的种类冗杂，不具有兼容特性，带来制造成本的提高。
不同规格的DBC组成了形状、大小各异的DBC布局，进而造成键合引线Layout设计差异，使得通过芯片的电流大小产生误差，形成影响芯片工作的电感，从而降低了模块的可靠性。
实用新型内容
针对上述问题，本实用新型提供一种车规级IGBT模块核心板。
一种车规级IGBT模块核心板，包括陶瓷覆铜板，贴装于所述陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻，以及连接IGBT芯片、二极管、热敏电阻的键合引线；
所述陶瓷覆铜板分为独立且形状相同的三块，均由正面覆铜板、中间陶瓷基板和背面覆铜板构成，其中正面覆铜板采用相同布局，贴附于三块陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻的键合引线采用同一种引线设计。
进一步的，所述键合引线采用铝线、铜线或银线。
本实用新型的有益效果：此核心板可以兼容各种封装结构的汽车级功率半导体模块，三块陶瓷覆铜板采用相同布局，能够降低因芯片位置产生的差异电感，提高芯片的均流性，能够兼容各种形状尺寸的IGBT芯片、二极管、热敏电阻；所述键合引线采用铝线、铜线或银线，形成Layout设计，能简化芯片与铜层之间的连接线，提高芯片的功率密度，进而提高车规级IGBT模块的功率和应用范围。
附图说明
图1为三块为独立且形状相同的陶瓷覆铜板示意图；
图2为陶瓷覆铜板结构组成示意图；
图3为键合引线示意图；
图4为核心板应用于超声波引线键合型壳体的示意图；
图5为核心板应用于超声波功率端子焊接型壳体的示意图。
具体实施方式
下面结合附图和具体实施方式对本实用新型作进一步详细的说明。本实用新型的实施例是为了示例和描述起见而给出的，而并不是无遗漏的或者将本实用新型限于所公开的形式。很多修改和变化对于本领域的普通技术人员而言是显而易见的。选择和描述实施例是为了更好说明本实用新型的原理和实际应用，并且使本领域的普通技术人员能够理解本实用新型从而设计适于特定用途的带有各种修改的各种实施例。
实施例1
一种车规级IGBT模块核心板，包括陶瓷覆铜板，贴装于所述陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻，以及连接IGBT芯片、二极管、热敏电阻的键合引线。
所述陶瓷覆铜板分为独立且形状相同的三块，如图1所示，均由正面覆铜板1、中间陶瓷基板2和背面覆铜板3构成，如图2所示，其中正面覆铜板采用相同布局，贴附于三块陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻的键合引线采用同一种引线设计，如图3所示。
此核心板可以兼容各种封装结构的汽车级功率半导体模块，三块陶瓷覆铜板采用相同布局，能够降低因芯片位置产生的差异电感，提高芯片的均流性。陶瓷覆铜板面积较常规且无阻焊，可以兼容不同规格形状、大小的IGBT芯片和二极管；热敏电阻目前常用的尺寸为3.5*1.5mm，本实施例中热敏电阻贴片区域较常规偏大些许，可以兼容。
所述键合引线采用铝线、铜线或银线，形成Layout设计，能简化芯片与铜层之间的连接线，提高芯片的功率密度，进而提高车规级IGBT模块的功率和应用范围。图4和图5分别为核心板应用于超声波引线键合型壳体、超声波功率端子焊接型壳体的示意图。
本申请的重点不在于IGBT芯片、二极管、热敏电阻之间如何连接以及如何输入输出，而在于采用三块独立且形状相同的陶瓷覆铜板，并且正面覆铜板采用相同布局，贴附于三块陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻的键合引线采用同一种引线设计，这种严格的一致性。
显然，所描述的实施例仅仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域及相关领域的普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例，都应属于本实用新型保护的范围。

Claims (2)

1.一种车规级IGBT模块核心板，其特征在于，包括陶瓷覆铜板，贴装于所述陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻，以及连接IGBT芯片、二极管、热敏电阻的键合引线；
所述陶瓷覆铜板分为独立且形状相同的三块，均由正面覆铜板、中间陶瓷基板和背面覆铜板构成，其中正面覆铜板采用相同布局，贴附于三块陶瓷覆铜板上的IGBT芯片、二极管、热敏电阻的键合引线采用同一种引线设计。
2.根据权利要求1所述的车规级IGBT模块核心板，其特征在于，所述键合引线采用铝线、铜线或银线。
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