CN210692537U - Pit type lead frame infrared receiver - Google Patents
Pit type lead frame infrared receiver Download PDFInfo
- Publication number
- CN210692537U CN210692537U CN201922384453.XU CN201922384453U CN210692537U CN 210692537 U CN210692537 U CN 210692537U CN 201922384453 U CN201922384453 U CN 201922384453U CN 210692537 U CN210692537 U CN 210692537U
- Authority
- CN
- China
- Prior art keywords
- infrared
- lead frame
- pit
- infrared receiver
- diode chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Light Receiving Elements (AREA)
Abstract
A pit type lead frame infrared receiver relates to the technical field of infrared receivers. The novel infrared receiver comprises a lead frame, an amplifier IC chip, an infrared receiving diode chip, a gold wire and an epoxy resin packaging body, and has no great difference from the traditional receiver in appearance, but has great improvement in sensitivity and axial size. The pit is punched on the lead frame, the infrared receiving diode chip is attached to the pit, and the pit can play a role of a reflecting cup, so that more infrared light is reflected, focused and irradiated on the infrared receiving diode chip, the product sensitivity is improved, the size of the infrared receiver in the axial direction is reduced, and the material cost is saved. The infrared receiver is not more complex in manufacturing process than the traditional infrared receiver, so that the manufacturing cost is not increased, and the mass production is convenient to realize.
Description
Technical Field
The utility model relates to an infrared receiver technical field, concretely relates to pit type lead frame infrared receiver.
Background
The most important parameters for evaluating the performance of the infrared receiver are the receiving sensitivity and the receiving angle, and it is desirable that the higher the receiving sensitivity is, the better the receiving angle is, and the wider the receiving angle is.
At present, the technical scheme adopted for manufacturing the infrared receiver is as follows: a convex lens is arranged at a specific position right in front of the photodiode chip, and an infrared light signal is focused on the photodiode chip through the convex lens, so that the purpose of improving the sensitivity of the infrared receiver is achieved. The technical scheme is the only scheme for improving the sensitivity of the infrared receiver adopted by the infrared receiver industry in the world at present. The disadvantages of this design are: the axial sensitivity of the infrared receiver is improved, and meanwhile, the receiving angle of the infrared receiver is narrowed. Meanwhile, due to the existence of the convex lens, the axial size of the infrared receiver is thickened, and the appearance of the infrared receiver is difficult to manufacture into a Surface Mount Device (SMD). The above disadvantages limit the application of infrared receivers in certain conditions and special situations, such as in subminiature, portable products (remote digital cameras, video cameras and portable DVDs, station GPS, remote toys, etc.).
Disclosure of Invention
An object of the utility model is to prior art's defect and not enough, provide a pit type lead frame infrared receiver, this kind of novel infrared receiver does not have very big difference with traditional receiver in appearance, there is very big improvement on sensitivity and the axial dimension, enlarged receiving angle when effectively improving sensitivity, reduced the axial dimension, the infrared receiver technical design scheme of raw and other materials cost has been reduced, this infrared receiver is complicated than traditional infrared receiver in the processing procedure, so do not increase on manufacturing cost, conveniently realize large-scale production.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the lead frame 1 is arranged on the epoxy resin packaging body 5, the amplifier IC chip 2 is arranged on the lower portion of the lead frame 1, the amplifier IC chip 2 is connected with the gold wire 4, the gold wire 4 is connected with the infrared receiving diode chip 3, and the lead frame 1, the amplifier IC chip 2 and the infrared receiving diode chip 3 are connected in series through the gold wire 4, so that the steps of normal process flow, flip, bar cutting, packaging, forming and the like are carried out.
Furthermore, a pit is punched on the lead frame 1, and the infrared receiving diode chip 3 is attached in the pit, so that the inner wall of the pit becomes a 'reflection cup' of the infrared receiving diode chip 3, and the 'reflection cup' can reflect, focus and irradiate infrared light on the infrared receiving diode chip 3, so that the infrared light received by the infrared receiving diode chip 3 is stronger, and the sensitivity is greatly improved. Meanwhile, the axial size of the infrared receiving diode chip 3 is greatly reduced, the chip can be applied to SMD and direct-insert encapsulation occasions, and the manufacturing procedure and the use cannot be influenced.
Furthermore, the front end part of the epoxy resin packaging body 5 is provided with a spherical crown 51 for receiving infrared signals sent from various angles, and partial entities are removed from two sides of the spherical crown 51, so that the area is reduced, the cost is reduced, and the receiving sensitivity is effectively improved.
The utility model discloses a theory of operation: the utility model provides a pit formula lead frame infrared receiver, is through making the pit on the lead frame, pastes infrared receiving diode chip in the pit, and the pit can play the effect of "reflection cup" to on reflecting, focusing, shining infrared receiving diode chip more infrared light, improve the sensitivity of product, reduce infrared receiver at the ascending size of axial simultaneously, save material cost.
After the technical scheme is adopted, the utility model discloses beneficial effect does: with this pit type lead frame infrared receiver, there is not very big difference with traditional receiver in the outward appearance, has very big improvement in sensitivity and the axial dimensions, has enlarged the receiving angle when effectively improving sensitivity, has reduced the axial dimensions, has reduced the infrared receiver technical design scheme of raw and other materials cost, and this infrared receiver is not complicated than traditional infrared receiver in the processing procedure, so does not increase in manufacturing cost, conveniently realizes large-scale production.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.
Fig. 1 is a schematic perspective view of the present invention;
fig. 2 is a right-hand side view of fig. 1.
Description of reference numerals: the lead frame 1, the amplifier IC chip 2, the infrared receiving diode chip 3, the gold wire 4, the epoxy resin packaging body 5 and the spherical cap 51.
Detailed Description
Referring to fig. 1 to 2, the technical solution adopted by the present embodiment is: the lead frame 1 is arranged on the epoxy resin packaging body 5, the amplifier IC chip 2 is arranged on the lower portion of the lead frame 1, the amplifier IC chip 2 is connected with the gold wire 4, the gold wire 4 is connected with the infrared receiving diode chip 3, and the lead frame 1, the amplifier IC chip 2 and the infrared receiving diode chip 3 are connected in series through the gold wire 4, so that the steps of normal process flow, flip, bar cutting, packaging, forming and the like are carried out.
The lead frame 1 is punched with a pit, the infrared receiving diode chip 3 is pasted in the pit, so that the inner wall of the pit becomes a 'reflecting cup' of the infrared receiving diode chip 3, the 'reflecting cup' can reflect, focus and irradiate infrared light on the infrared receiving diode chip 3, and thus the infrared light received by the infrared receiving diode chip 3 is stronger, and the sensitivity is greatly improved. Meanwhile, the axial size of the infrared receiving diode chip 3 is greatly reduced, the chip can be applied to SMD and direct-insert encapsulation occasions, and the manufacturing procedure and the use cannot be influenced.
The front end part of the epoxy resin packaging body 5 is provided with the spherical crown 51 for receiving infrared signals sent from various angles, and partial entities are removed from two sides of the spherical crown 51, so that the area is reduced, the cost is reduced, and the receiving sensitivity is effectively improved.
The utility model discloses a theory of operation: the utility model provides a pit formula lead frame infrared receiver, is through making the pit on the lead frame, pastes infrared receiving diode chip in the pit, and the pit can play the effect of "reflection cup" to on reflecting, focusing, shining infrared receiving diode chip more infrared light, improve the sensitivity of product, reduce infrared receiver at the ascending size of axial simultaneously, save material cost.
After the technical scheme is adopted, the utility model discloses beneficial effect does: with this pit type lead frame infrared receiver, there is not very big difference with traditional receiver in the outward appearance, has very big improvement in sensitivity and the axial dimensions, has enlarged the receiving angle when effectively improving sensitivity, has reduced the axial dimensions, has reduced the infrared receiver technical design scheme of raw and other materials cost, and this infrared receiver is not complicated than traditional infrared receiver in the processing procedure, so does not increase in manufacturing cost, conveniently realizes large-scale production.
The above description is only for the purpose of illustrating the technical solutions of the present invention and not for the purpose of limiting the same, and other modifications or equivalent replacements made by those of ordinary skill in the art to the technical solutions of the present invention should be covered within the scope of the claims of the present invention as long as they do not depart from the spirit and scope of the technical solutions of the present invention.
Claims (3)
1. The utility model provides a pit formula lead frame infrared receiver which characterized in that: the infrared receiving diode chip comprises a lead frame (1), an amplifier IC chip (2), an infrared receiving diode chip (3), gold wires (4) and an epoxy resin packaging body (5), wherein the lead frame (1) is arranged on the epoxy resin packaging body (5), the amplifier IC chip (2) is arranged on the lower portion of the lead frame (1), the amplifier IC chip (2) is connected with the gold wires (4), the gold wires (4) are connected with the infrared receiving diode chip (3), and the lead frame (1), the amplifier IC chip (2) and the infrared receiving diode chip (3) are all connected in series through the gold wires (4).
2. The crater-type lead frame infrared receiver of claim 1, wherein: a pit is punched on the lead frame (1), the infrared receiving diode chip (3) is attached to the pit, and the inner wall of the pit is a reflecting cup of the infrared receiving diode chip (3).
3. The crater-type lead frame infrared receiver of claim 1, wherein: the front end part of the epoxy resin packaging body (5) is provided with a spherical crown (51), and two sides of the spherical crown (51) are respectively removed with partial solid bodies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922384453.XU CN210692537U (en) | 2019-12-26 | 2019-12-26 | Pit type lead frame infrared receiver |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922384453.XU CN210692537U (en) | 2019-12-26 | 2019-12-26 | Pit type lead frame infrared receiver |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210692537U true CN210692537U (en) | 2020-06-05 |
Family
ID=70888114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922384453.XU Active CN210692537U (en) | 2019-12-26 | 2019-12-26 | Pit type lead frame infrared receiver |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210692537U (en) |
-
2019
- 2019-12-26 CN CN201922384453.XU patent/CN210692537U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100448005C (en) | Photoelectric integrative infrared receiver and packaging method | |
| CN101123036A (en) | Compound encapsulation infrared receiver | |
| CN108461615B (en) | Patch type diode | |
| CN206498078U (en) | 10G minimizes the encapsulating structure of coaxial EML lasers | |
| CN210692537U (en) | Pit type lead frame infrared receiver | |
| CN201549509U (en) | Focusing infrared receiver with internal reflective cup | |
| CN101582420B (en) | Focusing infrared receiver with built-in reflective cup | |
| CN210835350U (en) | TO-CAN detector based on positive spherical lens tube cap | |
| CN201663160U (en) | Laser diode module | |
| CN214012949U (en) | Metal tube shell structure for packaging optical window | |
| CN203217125U (en) | Coaxial photoelectric assembly of high echo loss structure | |
| CN204696627U (en) | A kind of plastic TO46 base | |
| CN214011578U (en) | Novel optical window pipe cap | |
| CN112289876A (en) | Metal tube shell structure for packaging optical window | |
| CN203415562U (en) | Sensor of environmental light and approaching distance of secondary compression molding encapsulation | |
| CN202443423U (en) | Sensor module of optical mouse | |
| CN221150031U (en) | Integrated infrared receiving head | |
| CN209374477U (en) | A kind of novel more bowls | |
| CN2363385Y (en) | High-detectivity infrared focal plane detector | |
| CN201689916U (en) | LED package structure | |
| CN214667295U (en) | Pyroelectric sensor | |
| CN218602438U (en) | Straight wall packaged optical window | |
| CN216861843U (en) | Compact photoelectric pod and compact pod spherical shell | |
| JPS61268059A (en) | Solid-state image pickup device | |
| CN208400834U (en) | A kind of chip diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |