CN204696627U - A kind of plastic TO46 base - Google Patents
A kind of plastic TO46 base Download PDFInfo
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- CN204696627U CN204696627U CN201520368943.XU CN201520368943U CN204696627U CN 204696627 U CN204696627 U CN 204696627U CN 201520368943 U CN201520368943 U CN 201520368943U CN 204696627 U CN204696627 U CN 204696627U
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- round platform
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Abstract
The utility model discloses a kind of plastic TO46 base, round platform periphery is provided with round platform protective layer, and the top of round platform protective layer is higher than round platform end face 0.7cm; Bottom round platform protective layer, outer external diameter is greater than the external diameter of round platform protective layer, and bottom round platform protective layer, the diameter of outer is 5.4cm, and the diameter of round platform protective layer is 4.7cm; Bottom round platform, round platform protective layer, round platform protective layer, outer is one-body molded by mould; Round platform and pipeline pin one by pre-buried, be press-fitted and be connected with adhesive means; The connected mode of pipeline pin two, pipeline pin three, pipeline pin four, pipeline pin five and round platform is with pipeline pin one; Round platform circle centre position has groove, and bottom round platform protective layer, outer is provided with scarce limit, for the location of fool proof and fixture; Round platform and round platform protective layer all adopt plastic material, and plastics are PC or PEI etc.; The utility model cost is low, and the TO46 base of energy alternative metals material, substitutes traditional thermocompression bonding packaging technology.
Description
Technical field
This patent relates to the components and parts for optical communication field, relates to a kind of plastic TO46 base (4PIN, 5PIN) more specifically.Cost is low, and the TO46 base of energy alternative metals material, can realize the TO CAN coaxial packaging technique that brand-new plastics are gluing, to substitute traditional thermocompression bonding packaging technology.
Background technology
At optical communication field, coaxial TO CAN packaging technology is very ripe, special in the TO CAN scheme of receiving terminal, main raw material are shaped already, comprise the TO46 base (see figure 1) of filled gold material, the TO52 Cap(of metal material is shown in Fig. 2), detector receives optical chip (PD CHIP), ceramic transition block and trans-impedance amplifier chip (TIA) etc.
Wherein the TO46 base products of filled gold material is produced by the packaging technology of a kind of " metal-glass ", and this product is developed respectively by the Xin Guang company of Schott AG of Germany and Japan and realized volume production the earliest.However, in recent years, domestic Ye Youduo company can carry out copying (such as U.S., Yixing Ji Tai etc. are closed in Suzhou), can reach certain level, and occupy market segment.
The technics comparing that this product relates to is complicated, comprising: precision stamping, high temperature sintering process, plating nickel on surface, surface gold-plating etc.In addition, the reliability requirement of this product is also very high, and such as: after hot and humid process, the TO46 susceptor surface of metal material can not occur rust staining; Under the extreme condition of " salt fog ", can not there is rust staining in TO46 susceptor surface; Not only to resist certain pressure between " metal pin " and " glassine paper ", and very high air-tightness requirement will be ensured.In a word, in the TO CAN packaging technology of receiving terminal, be very high to the requirement of the TO46 base of filled gold material.
Fig. 2 is the schematic diagram of traditional metal materials TO52 Cap.Traditional metal materials TO52 Cap comprises glass lens, the cap body of metal material, the shade of metal material and solder.Under the high temperature conditions, the glass material of solid can become molten state, and again due to surface tension, glass material finally can become the glass lens of spherical shape.In addition, with under hot conditions, glass material again can well and metal material combine, ensure product reliability and bubble-tight requirement.
In addition, metallized TO52 Cap product is also the packaging technology of a kind of " metal-glass ", and this product is very high to the requirement of reliability equally.On the one hand, after hot and humid process, can not there is rust staining in TO52 Cap surface, and under the extreme condition of " salt fog ", TO52Cap surface can not occur rust staining; On the other hand, the part that metal and glass combine also needs to resist certain pressure, and ensures very high air-tightness.In addition, the effect of the glass part of TO52 Cap assembles infrared laser, so the curvature of glass surface will control very accurate especially.
Be encapsulate by thermocompression bonding technique between TO52 Cap and TO46 base, TO52 Cap shade has brazing metal, and when big current passes through, solder can melt, thus reaches the effect of sealing.
In a word, coaxial TO CAN packaging technology is very high to the requirement of material, so the cost of material is difficult to reduce further, to adapt to the requirement of low cost.
Summary of the invention
The purpose of this utility model is to disclose a kind of plastic TO46 base.Cost is low, and the TO46 base of energy alternative metals material, can realize the TO CAN coaxial packaging technique that brand-new plastics are gluing, to substitute traditional thermocompression bonding packaging technology.
For achieving the above object, following technical scheme is adopted:
A kind of plastic TO46 base, comprise round platform, pipeline pin one, is characterized in that:
Round platform periphery is provided with round platform protective layer, and the top of round platform protective layer is higher than round platform end face 0.7cm.
Bottom round platform protective layer, outer external diameter is greater than the external diameter of round platform protective layer, and bottom round platform protective layer, the diameter of outer is 5.4cm, and the diameter of round platform protective layer is 4.7cm.
Bottom round platform, round platform protective layer, round platform protective layer, outer is one-body molded by mould.
Round platform is connected by pre-buried, press-fit with pipeline pin one; The connected mode of pipeline pin two, pipeline pin three, pipeline pin four, pipeline pin five and round platform is with pipeline pin one.
Round platform circle centre position has groove.
Bottom round platform protective layer, outer is provided with scarce limit, for the location of fool proof and fixture.
Round platform and round platform protective layer all adopt plastic material, and plastics are PC or PEI etc.
The utility model compared with prior art tool has the following advantages:
1. save material.Not only original metal TO46 base is modified into the TO46 base of plastic, and by structure optimization, improves technique.
2. more reasonable structure.In conventional metals encapsulation scheme, the chip of attachment is all exposed on round platform surface (as shown in Figure 5), and the structure after improving, make chip be built in (as shown in Figure 6) in deep trouth, thus greatly can reduce the impaired risk of chip.In addition, conventional metals TO46 base is " complete circle " design, and the plastics TO46 base after improving has a scarce limit, is easier to fool proof, is easier to automated production.
3. technique is simpler.Plastic TO46 base instead of metal TO46 base, is not only conducive to automated production, and sticks with glue technique and instead of conventional thermocompression Welding, and make technique more succinct, be more easy to produce, the TO CAN achieving plastic encapsulates.
Accompanying drawing explanation
Fig. 1 is the TO46 base of existing metal material
Fig. 2 is the TO52 Cap of existing metal material
Fig. 3 is the TO46 base (5PIN) of plastic
Fig. 4 is the TO46 base (4PIN) of plastic
Fig. 5 is that existing metallization TO encapsulates schematic diagram
Fig. 6 is that plastic TO encapsulates schematic diagram
Wherein: 2201-round platform protective layer, outer bottom 2301-round platform protective layer, 2401-groove, 2501-round platform, 2101-pipeline pin one, 2102-pipeline pin two, 2103-pipeline pin three, 2104-pipeline pin four, 2105-pipeline pin five.
Embodiment
Below in conjunction with accompanying drawing in detail embodiment of the present utility model is described in detail:
A kind of plastic TO46 base, comprise round platform 2501, pipeline pin 1, is characterized in that:
Round platform 2501 periphery is provided with round platform protective layer 2201, and the top of round platform protective layer 2201 is higher than round platform 2501 end face 0.7cm.
Bottom round platform protective layer, outer 2301 external diameter is greater than the external diameter of round platform protective layer 2201, and bottom round platform protective layer, the diameter of outer 2301 is 5.4cm, and the diameter of round platform protective layer 2201 is 4.7cm.
Bottom round platform 2501, round platform protective layer 2201, round platform protective layer, outer 2301 is one-body molded by mould.
Round platform 2501 is connected by pre-buried, press-fit with pipeline pin 1; The connected mode of pipeline pin 2 2102, pipeline pin 3 2103, pipeline pin 4 2104, pipeline pin 5 2105 and round platform 2501 is with pipeline pin 1.
Round platform 2501 circle centre position has groove 2401.
Bottom round platform protective layer, outer 2301 is provided with scarce limit, for the location of fool proof and fixture.
Round platform 2501 and round platform protective layer 2201 all adopt plastic material, and plastics are PC or PEI etc.
The utility model can not only the TO46 base of alternative metals material completely, and can realize the gluing TO CAN coaxial packaging technique of brand-new plastics, to substitute traditional thermocompression bonding packaging technology.
This TO46 base is a kind of brand-new support element, mainly provides the platform installed for each element, provides the member base such as metal pin lead-in wire simultaneously.Wherein pin leads is metal structure, and the effect of this metal pin is conduction and differential signal transmission, and other parts are all then the structures of plastic.Each chip attachment, on the round platform of TO46 base, connects the metal pin of each TO base, for potted element provides the signal of telecommunication by spun gold.
In addition, the TO46 base of this plastic, can realize the TO CAN coaxial packaging technique that plastics are gluing, to substitute traditional thermocompression bonding packaging technology, thus reduces costs.
As shown in Figure 1, the round platform of traditional metal materials TO46 base is " circular configuration ", and metal pin lead-in wire is also " symmetrical structure ".This product has many problems in process of production:
1. the product of " circular configuration " and " symmetrical structure " is difficult to " fool proof ", is unfavorable for the production of automation;
2. the round platform of traditional metal materials TO46 base is exposed to surface completely, can not receive play a protective role (as Fig. 5) such as optical chip, ceramic transition block and trans-impedance amplifier chips the detector that round platform mounts;
3. metal pin lead-in wire protrudes from round platform plane, affects the space of mount components on round platform.
Relative to the many problems on traditional metal materials TO46 understructure, as shown in Figure 3, the improvement of plastic TO46 base is as follows:
1. plastic TO46 base designs includes outer 2301 bottom round platform protective layer, bottom this round platform protective layer, outer 2301 clearly has one " lacking limit " (as Fig. 3).This structural design can well " fool proof ", and is very beneficial in TO encapsulation process, the location of fixture;
2. plastic TO46 base designs includes round platform protective layer 2201, this round platform protective layer 2201 is clearly higher than plastics round platform 2501, this structure makes plastics round platform 2501 be exposed to surface, can well protect the element (as shown in Figure 6) of attachment on round platform 2501;
3. metal pin lead-in wire (Fig. 3) and plastics round platform is in a plane, and this design can make pin and round platform be press-fitted completely, can not only ensure product reliability, more can the space of enlarged elements attachment;
4. the deep trouth 2401 that is provided with of plastic round platform center, can be used for adjusting detector and receive the height of optical chip to plastics round platform, thus can meet the requirement of different focal TO CAN.
Fig. 3 and Fig. 4 is the schematic diagram of plastic TO46 base (4PIN and 5PIN) of new generation." pre-buried " and " being press-fitted " mode is adopted to combine closely, to reach the requirement of reliability between pin leads and round platform; The effect of plastic round platform 2501 is used to pasting chip and other component; Simultaneously bottom plastic round platform protective layer 2201 and round platform protective layer, the surface-pasted chip of round platform 2501 can be protected in outer 2301, simultaneously can to carry out coupling bonding with adapter; The groove 2401 that plastic round platform center is provided with is used to regulate receiving chip height, to adapt to the requirement of different focal TO CAN.
Claims (4)
1. a plastic TO46 base, comprises round platform (2501), and pipeline pin one (2101), is characterized in that:
Round platform (2501) periphery is provided with round platform protective layer (2201), and the top of round platform protective layer (2201) is higher than round platform (2501) end face 0.7cm;
Bottom round platform protective layer, outer (2301) external diameter is greater than the external diameter of round platform protective layer (2201), and bottom round platform protective layer, the diameter of outer (2301) is 5.4cm, and the diameter of round platform protective layer (2201) is 4.7cm;
Bottom round platform (2501), round platform protective layer (2201), round platform protective layer, outer (2301) is one-body molded by mould;
Round platform (2501) is connected by pre-buried, press-fit with pipeline pin one (2101); The connected mode of pipeline pin two (2102), pipeline pin three (2103), pipeline pin four (2104), pipeline pin five (2105) and round platform (2501) is with pipeline pin one (2101).
2. a kind of plastic TO46 base as claimed in claim 1, is characterized in that: round platform (2501) circle centre position has groove (2401).
3. a kind of plastic TO46 base as claimed in claim 1, is characterized in that: bottom round platform protective layer, outer (2301) are provided with scarce limit, for the location of fool proof and fixture.
4. a kind of plastic TO46 base as claimed in claim 1, is characterized in that: round platform (2501) and round platform protective layer (2201) all adopt plastic material, and plastics are PC or PEI.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520368943.XU CN204696627U (en) | 2015-06-01 | 2015-06-01 | A kind of plastic TO46 base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520368943.XU CN204696627U (en) | 2015-06-01 | 2015-06-01 | A kind of plastic TO46 base |
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| Publication Number | Publication Date |
|---|---|
| CN204696627U true CN204696627U (en) | 2015-10-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520368943.XU Expired - Fee Related CN204696627U (en) | 2015-06-01 | 2015-06-01 | A kind of plastic TO46 base |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572217A (en) * | 2019-08-19 | 2019-12-13 | 深圳市极致兴通科技有限公司 | Packaging device for high-speed light receiving device |
-
2015
- 2015-06-01 CN CN201520368943.XU patent/CN204696627U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110572217A (en) * | 2019-08-19 | 2019-12-13 | 深圳市极致兴通科技有限公司 | Packaging device for high-speed light receiving device |
| CN110572217B (en) * | 2019-08-19 | 2022-08-19 | 深圳市极致兴通科技有限公司 | Packaging device for high-speed light receiving device |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151007 Termination date: 20160601 |