CN210671136U - Decoding deck that heat dispersion is good - Google Patents
Decoding deck that heat dispersion is good Download PDFInfo
- Publication number
- CN210671136U CN210671136U CN201921738710.9U CN201921738710U CN210671136U CN 210671136 U CN210671136 U CN 210671136U CN 201921738710 U CN201921738710 U CN 201921738710U CN 210671136 U CN210671136 U CN 210671136U
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- substrate
- heat dissipation
- printed circuit
- circuit layer
- board
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- Expired - Fee Related
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Abstract
The utility model discloses a decoding board with good heat dispersion, which relates to the technical field of decoding boards and comprises a substrate, wherein a plurality of element welding surfaces are distributed on the upper surface of the substrate, a core plate is welded in the middle of the substrate, a plug terminal row is adjacently arranged at the lower end of the core plate, the plug terminal row is plugged with the edge of the substrate, a pin head and a power seat are adjacently arranged at the left side of the plug terminal row, the power seat is arranged at the upper end of the pin head, and the pin head and the power seat are both embedded with the substrate; the lower surface of the substrate is welded with a printed circuit layer, and welding pins are uniformly distributed on the lower surface of the printed circuit layer and are respectively in electric conduction with the plug terminal strip, the core plate, the power supply seat and the pin head metal; the lower extreme of printed wiring layer has inlayed and has connect the heat dissipation cover plate, and this decoding board structure accessible link up the fin that sets up and the heat dissipation cover plate that the bottom set up mutually supports to avoid the overheated stability of influencing decoding board of component to the heat between the heat conduction metal water conservancy diversion component of shielding treatment, improve decoding board's suitability.
Description
Technical Field
The utility model relates to a decode Decode technical field, concretely relates to decoding deck that heat dispersion is good.
Background
The decoding board is a device capable of outputting a switching value signal during working, and is commonly used for system integration, for example, an interphone needs to be linked with equipment such as a monitoring camera, and after the talkback system and the monitoring system are integrated, when no talkback request exists, the monitoring camera is in a disconnected state; when a talkback request exists, the monitoring camera immediately switches to a working state; therefore, the intercommunication and the video monitoring are synchronous;
under the limitation of a carrying plate structure and an installation and application environment of the decoding deck, an external heat dissipation component suitable for a traditional PCB (printed circuit board) limits the size and specification of the structure of the decoding deck and directly influences the applicability of the decoding deck, however, the heat accumulation in the application process of the decoding deck influences the stability and the service life of elements, and a heat dissipation structure suitable for the decoding deck is not available in the prior art so as to improve the heat dissipation performance of the decoding deck.
SUMMERY OF THE UTILITY MODEL
Solves the technical problem
The to-be-solved technical problem of the utility model is to above not enough, provide a decoding deck that heat dispersion is good.
For solving the technical problem, the utility model discloses a following technical scheme: a decoding board with good heat dissipation performance comprises a substrate, wherein a plurality of element welding surfaces are distributed on the upper surface of the substrate, a core board is welded in the middle of the substrate, a plug terminal row is adjacently arranged at the lower end of the core board, the plug terminal row is plugged with the edge of the substrate, a pin head and a power supply seat are adjacently arranged on the left side of the plug terminal row, the power supply seat is arranged at the upper end of the pin head, and the pin head and the power supply seat are both embedded in the substrate; the printed circuit board is characterized in that a printed circuit layer is welded on the lower surface of the substrate, and welding pins are uniformly distributed on the lower surface of the printed circuit layer and are respectively in electric conduction with the plug-in terminal row, the core board, the power supply seat and the pin head through tinning; the heat dissipation structure is characterized in that a heat dissipation cover plate is embedded at the lower end of the printed circuit layer, two concave grooves are formed in the left side and the right side of the heat dissipation cover plate, a separation groove is formed between the heat dissipation cover plate and the printed circuit layer and is communicated with the concave grooves, and heat dissipation fins are adjacently arranged on the left side of the core plate and longitudinally penetrate through the surfaces of the substrate and the printed circuit layer.
Further, the heat dissipation cover plate is a graphite sheet.
Furthermore, the radiating fins are formed by transversely arranging a plurality of copper sheets at equal intervals, and gaps of the radiating fins are communicated with the separation grooves.
Furthermore, the connection part of the radiating fin, the substrate and the printed circuit board is embedded with a shielding sleeve, and the shielding sleeve is formed by weaving an insulating cloth net.
Furthermore, the printed circuit layer is a single-side lead PCB bare board.
Because of the application of the technical scheme, compared with the prior art, the utility model has the following advantages: a decoding deck with good heat dissipation performance is characterized in that on the basis of carrying a component circuit on the existing decoding deck, a heat radiating fin penetrating through the surface of a substrate is used as a conduction structure of heat around the component, meanwhile, a heat radiating cover plate arranged at the lower end of the substrate is used as a flow-guiding heat radiating end, and a separation groove and a concave groove channel are formed by the heat radiating fin and the heat radiating cover plate in an intercommunicating mode.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic plan view of the present invention.
In the attached drawing, 1-substrate, 2-heat radiation cover plate, 3-element welding surface, 4-concave groove, 5-plug terminal row, 6-core plate, 7-heat radiation sheet, 8-power supply seat, 9-pin head, 10-welding pin, 11-printed circuit layer, 12-shielding sleeve and 13-isolation groove.
Detailed Description
In order to make the technical means, creation features, achievement purpose and efficacy of the present invention easy to understand, the following will combine the drawings in the embodiments of the present invention to clearly and completely describe the technical solution in the embodiments of the present invention.
In the embodiment, as shown in fig. 1 and 2, a decoding board with good heat dissipation performance includes a substrate 1, a plurality of element soldering surfaces 3 are distributed on the upper surface of the substrate 1, a core board 6 is welded in the middle of the substrate 1, a plug terminal row 5 is adjacently arranged at the lower end of the core board 6, the plug terminal row 5 is plugged with the edge of the substrate 1, a pin head 9 and a power base 8 are adjacently arranged on the left side of the plug terminal row 5, the power base 8 is arranged at the upper end of the pin head 9, and the pin head 9 and the power base 8 are all embedded with the substrate 1, wherein the element soldering surfaces 3, the core board 6, the plug terminal row 5, the power base 8 and the pin head 9 which are arranged on the upper surface of the substrate 1 are all of various elements and terminals which meet the basic requirements of the decoding board;
the lower surface of the substrate 1 is welded with a printed circuit layer 11, welding feet 10 are uniformly distributed on the lower surface of the printed circuit layer 11, the welding feet 10 are respectively connected with the plug-in terminal row 5, the core plate 6, the power supply seat 8 and the pin head 9 through tinning conduction, the printed circuit layer 11 is a single-side lead PCB bare board, the decoding board structure is formed by separating circuit elements and printed circuits through the substrate 1 and the printed circuit layer 11 which are formed on two sides, and the double-layer structure of the decoding board structure is convenient for heat to be distinguished and formed on various elements carried on the upper surface of the substrate 1 so as to uniformly manage the heat;
the lower end of a printed circuit layer 11 is embedded with a heat dissipation cover plate 2, the left side and the right side of the heat dissipation cover plate 2 are provided with two concave grooves 4 in a groove manner, a separation groove 13 is formed between the heat dissipation cover plate 2 and the printed circuit layer 11, the separation groove 13 is communicated with the concave grooves 4, the left side of a core plate 6 is provided with a heat dissipation plate 7 adjacently, the heat dissipation plate 7 longitudinally penetrates through the surfaces of a substrate 1 and the printed circuit layer 11, the heat dissipation cover plate 2 is a graphite sheet, the heat dissipation plate 7 is formed by transversely arranging a plurality of copper sheets at equal intervals, the gap of the heat dissipation plate 7 is communicated with the separation groove 13, the joint of the heat dissipation plate 7, the substrate 1 and the printed circuit layer 11 is embedded with a shielding sleeve 12, the shielding sleeve 12 is woven by an insulating cloth net, when the decoding plate is put into use, the heat dissipation plate 7 penetrating through the substrate 1 and the printed circuit layer 11 absorbs the heat of circuit elements distributed on the periphery by the excellent heat conduction, the transversely arranged concave groove 4 is communicated with the separation groove 13 outside, so that heat flow among circuit elements of the decoding board is guaranteed, heat dissipation performance is improved, the shielding sleeve 12 arranged on the outer side of the radiating fin 7 isolates the conduction between the radiating fin 7 and a circuit, and the influence of the metal characteristic of the radiating fin 7 on the circuit is avoided.
Here, the upper, lower, left, right, front, and rear represent only relative positions thereof and do not represent absolute positions thereof. The above is only the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and all the same principles are included in the protection scope of the present invention.
Claims (5)
1. The utility model provides a decoding board that heat dispersion is good, includes base plate (1), its characterized in that: the upper surface of the substrate (1) is distributed with a plurality of element welding surfaces (3), a core plate (6) is welded in the middle of the substrate (1), a plug-in terminal row (5) is adjacently arranged at the lower end of the core plate (6), the plug-in terminal row (5) is plugged with the edge of the substrate (1), pin heads (9) and power supply seats (8) are adjacently arranged on the left side of the plug-in terminal row (5), the power supply seats (8) are arranged at the upper ends of the pin heads (9), and the pin heads (9) and the power supply seats (8) are both embedded with the substrate (1); the printed circuit board is characterized in that a printed circuit layer (11) is welded on the lower surface of the substrate (1), welding pins (10) are uniformly distributed on the lower surface of the printed circuit layer (11), and the welding pins (10) are respectively in electric conduction with the plug-in terminal row (5), the core board (6), the power supply seat (8) and the pin head (9) through tinning; the printed circuit layer (11) lower extreme scarf joint has heat dissipation cover plate (2), the fluting of heat dissipation cover plate (2) left and right sides is provided with twice concave groove (4), be formed with between heat dissipation cover plate (2) and printed circuit layer (11) and separate groove (13), separate groove (13) and concave groove (4) intercommunication, core (6) left side adjacent is provided with fin (7), fin (7) vertically run through in base plate (1) and printed circuit layer (11) surface.
2. The decoding board with good heat dissipation performance as recited in claim 1, wherein: the heat dissipation cover plate (2) is a graphite sheet.
3. The decoding board with good heat dissipation performance as recited in claim 1, wherein: the radiating fins (7) are formed by arranging a plurality of copper sheets transversely at equal intervals, and gaps of the radiating fins (7) are communicated with the separation grooves (13).
4. The decoding board with good heat dissipation performance as recited in claim 1, wherein: the radiating fin (7) is connected with the base plate (1) and the printed circuit layer (11) in an embedded mode through a shielding sleeve (12), and the shielding sleeve (12) is formed by weaving an insulating cloth net.
5. The decoding board with good heat dissipation performance as recited in claim 1, wherein: the printed circuit layer (11) is a single-side lead PCB bare board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921738710.9U CN210671136U (en) | 2019-10-16 | 2019-10-16 | Decoding deck that heat dispersion is good |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921738710.9U CN210671136U (en) | 2019-10-16 | 2019-10-16 | Decoding deck that heat dispersion is good |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210671136U true CN210671136U (en) | 2020-06-02 |
Family
ID=70818276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921738710.9U Expired - Fee Related CN210671136U (en) | 2019-10-16 | 2019-10-16 | Decoding deck that heat dispersion is good |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210671136U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112689381A (en) * | 2021-02-04 | 2021-04-20 | 深圳市同创鑫电子有限公司 | Printed circuit board and manufacturing method thereof |
-
2019
- 2019-10-16 CN CN201921738710.9U patent/CN210671136U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112689381A (en) * | 2021-02-04 | 2021-04-20 | 深圳市同创鑫电子有限公司 | Printed circuit board and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200602 Termination date: 20211016 |