KR200484643Y1 - Linkage structure of multi pcb - Google Patents

Linkage structure of multi pcb Download PDF

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KR200484643Y1
KR200484643Y1 KR2020130000101U KR20130000101U KR200484643Y1 KR 200484643 Y1 KR200484643 Y1 KR 200484643Y1 KR 2020130000101 U KR2020130000101 U KR 2020130000101U KR 20130000101 U KR20130000101 U KR 20130000101U KR 200484643 Y1 KR200484643 Y1 KR 200484643Y1
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South Korea
Prior art keywords
circuit board
male
connector
female
heat
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KR2020130000101U
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Korean (ko)
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KR20140004287U (en
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김효상
이원준
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주식회사 유라코퍼레이션
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Priority to KR2020130000101U priority Critical patent/KR200484643Y1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/04—Pins or blades for co-operation with sockets
    • H01R13/05—Resilient pins or blades
    • H01R13/055—Resilient pins or blades co-operating with sockets having a rectangular transverse section
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

본 고안은 2개 이상의 회로기판을 원터치형식으로 접속시켜서 복층으로 연결시킬 수 있는 복층 회로기판의 연결구조에 관한 것이다.
본 고안의 주요구성은 전기회로패턴(11)이 각기 편성된 상부회로기판(10)과 하부회로기판(10')과, 상기 상부회로기판(10)과 하부회로기판(10') 중 어느 하나에 전기적으로 연결되면서 고정되며 암형홀(22)이 형성되는 암형커넥터(20) 및 상기 상부회로기판(10)과 하부회로기판(10') 중 다른 하나에 전기적으로 연결되면서 고정되는 수형커넥터(30)를 포함하며, 상기 수형커넥터(30)는 상기 암형홀(22)에 대응되도록 일측에 형성되는 다수의 삽입홀(33) 및 상기 삽입홀(33)에 착탈식으로 삽입되어서 암형홀(22)에 접속되는 수형핀(32)을 포함하며, 상기 전기회로패턴을 관통하여서 회로기판에 고정되는 고정핀과, 상기 고정핀에 일체적으로 연결되어 전기회로패턴에서 상기 고정핀으로 전달되는 열을 외부로 방열하는 방열체로 이루어진 방열부재를 포함하는 것을 특징으로 한다.The present invention relates to a connection structure of a multi-layer circuit board in which two or more circuit boards are connected in a one-touch manner and can be connected in a double layer.
The main constitution of the present invention is that an electric circuit pattern 11 is formed on one of the upper circuit board 10 and the lower circuit board 10 'and the upper circuit board 10 and the lower circuit board 10' And a male connector 30 fixed to the other of the upper circuit board 10 and the lower circuit board 10 'while being electrically connected and fixed to the other of the upper circuit board 10 and the lower circuit board 10' The male connector 30 includes a plurality of insertion holes 33 formed at one side to correspond to the respective female type holes 22 and a plurality of insertion holes 33 inserted into the female type holes 22 in a detachable manner, A fixing pin fixed to the circuit board through the electrical circuit pattern and including a male pin (32) connected to the fixing pin; a heat transfer member And a heat dissipating member formed of a heat dissipating member for dissipating heat It shall be.

Description

복층 회로기판의 연결구조{LINKAGE STRUCTURE OF MULTI PCB}[0002] LINKAGE STRUCTURE OF MULTI PCB [0003]

본 고안은 2개의 회로기판을 복층으로 연결시킬 수 있는 복층 회로기판의 연결구조에 관한 것이다.The present invention relates to a connection structure of a multilayer circuit board capable of connecting two circuit boards in a multilayered manner.

일반적으로 회로기판은 합성수지재의 평판으로 형성된 기판의 상면 및 하면에 동판 등을 입혀 전류 및 신호가 흐르는 전기회로패턴을 형성하고, 기판상에 각종 부품이 삽입되는 다수의 관통공을 형성하여 관통공에 전자부품이 삽입된 상태에서 전기회로패턴과 납땜에 의해 도통되도록 함으로써, 각종 부품들이 정상적인 동작을 수행할 수 있게 된다.BACKGROUND ART [0002] Generally, a circuit board is formed by forming a plurality of through holes into which a variety of components are inserted on a substrate by forming an electric circuit pattern in which a current and a signal are flowed on a top surface and a bottom surface of a substrate formed of a synthetic resin material, The electronic parts are electrically connected to the electric circuit pattern by soldering while the electronic parts are inserted, so that the various parts can perform normal operations.

이러한 회로기판은 한정된 공간에 다수의 부품을 배치하기 위하여, 복수의 회로기판을 상하로 적층하여 고정하는 타입이 이용되고 있다.In order to arrange a large number of components in a limited space, a type in which a plurality of circuit boards are stacked vertically is used.

이러한, 상하로 적층된 회로기판들이 점퍼핀에 의해 고정될 수 있을 뿐만 아니라, 점퍼핀이 전기회로패턴에 도통되게 접속됨으로써 회로기판들이 전기적으로 연결된 상태가 된다. Not only can these vertically stacked circuit boards be fixed by the jumper pins, but also the jumper pins are electrically connected to the electric circuit pattern, so that the circuit boards become electrically connected.

그러나, 회로기판들에 다수의 점퍼핀들을 하나씩 압입하여서 고정하여야 하므로 점퍼핀작업시간이 많이 소요되는 문제점이 있고, 회로기판에 압입되어서 고정된 점퍼핀에 솔더링을 하는 경우 냉납이나 브릿지가 형성되어 회로불량이 발생되는 문제점이 있다. However, since a plurality of jumper pins are to be fixedly mounted on the circuit boards one by one, there is a problem that a jumper pin operation time is long. In the case of soldering to a jumper pin which is press- There is a problem that defects are generated.

또한, 회로기판에 점퍼핀이 압입되어서 고정되는 경우 회로기판이 휨변형되면서 동박의 전기회로패턴이 손상되는 문제점도 있다. Further, when the jumper pins are press-fitted and fixed to the circuit board, there is a problem that the electric circuit pattern of the copper foil is damaged due to bending deformation of the circuit board.

또한, 점퍼핀의 연결부위에서 발생되는 열에 의해 동박의 전기회로패턴이 소손되거나 회로기판에 탑재된 전자부품이 손상되는 문제점도 있다. Also, there is a problem that the electric circuit pattern of the copper foil is burned or the electronic parts mounted on the circuit board are damaged by the heat generated on the connection portion of the jumper pin.

대한민국 등록특허 제10-0945113호(2010.02.23)Korean Patent No. 10-0945113 (Feb. 23, 2010)

본 고안이 해결하고자 하는 과제는, 2개 이상의 회로기판을 원터치형식으로 접속시켜서 복층으로 연결시킬 수 있는 복층 회로기판의 연결구조를 제공하는 데 있다. A problem to be solved by the present invention is to provide a connection structure of a multi-layered circuit board in which two or more circuit boards are connected in a one-touch manner so as to be connected in a multi-layer structure.

본 고안의 다른 해결과제는, 2개의 회로기판을 솔더링 하지 않으면서 전기적으로 연결시킬 수 있고, 회로기판의 전기회로패턴들을 선택적으로 연결할 수 있는 복층 회로기판의 연결구조를 제공하는 데 있다. Another object of the present invention is to provide a connection structure of a multilayer circuit board which can electrically connect two circuit boards without soldering and selectively connect electric circuit patterns of the circuit board.

본 고안에 따른 복층 회로기판의 연결구조는, 전기회로패턴(11)이 각기 편성된 상부회로기판(10)과 하부회로기판(10')과, 상기 상부회로기판(10)과 하부회로기판(10') 중 어느 하나에 전기적으로 연결되면서 고정되며 암형홀(22)이 형성되는 암형커넥터(20) 및 상기 상부회로기판(10)과 하부회로기판(10') 중 다른 하나에 전기적으로 연결되면서 고정되는 수형커넥터(30)를 포함하며, 상기 수형커넥터(30)는 상기 암형홀(22)에 대응되도록 일측에 형성되는 다수의 삽입홀(33) 및 상기 삽입홀(33)에 착탈식으로 삽입되어서 암형홀(22)에 접속되는 수형핀(32)을 포함하며, 상기 전기회로패턴을 관통하여서 회로기판에 고정되는 고정핀과, 상기 고정핀에 일체적으로 연결되어 전기회로패턴에서 상기 고정핀으로 전달되는 열을 외부로 방열하는 방열체로 이루어진 방열부재를 포함하는 것을 특징으로 한다.The connecting structure of the multi-layer circuit board according to the present invention is composed of an upper circuit board 10 and a lower circuit board 10 'on which the electric circuit patterns 11 are knitted, and the upper circuit board 10 and the lower circuit board The female connector 20 is electrically connected to one of the upper circuit board 10 and the lower circuit board 10 'and is electrically connected to one of the upper circuit board 10 and the lower circuit board 10' The male connector 30 includes a plurality of insertion holes 33 formed at one side to correspond to the female type hole 22 and a plurality of insertion holes 33 formed in the insertion hole 33 so as to be removably inserted into the insertion hole 33, A fixing pin including a male pin (32) connected to the female hole (22) and fixed to the circuit board through the electric circuit pattern; and a fixing pin integrally connected to the fixing pin A heat dissipating member formed of a heat dissipating member that dissipates heat transmitted to the outside It characterized in that it comprises.

본 고안에 따른 복층 회로기판의 연결구조는, 2개 이상의 회로기판에 암형커넥터와 수형커넥터를 각각 설치하여 2개의 회로기판을 원터치형식으로 접속시켜서 복층으로 연결시킬 수 있다. The connection structure of the multilayer circuit board according to the present invention can connect two circuit boards in a one-touch manner and connect them in a multilayer by providing a female connector and a male connector on two or more circuit boards respectively.

또한, 암형커넥터에 접속되는 수형핀을 수형커넥터에 선택적으로 고정하여 상부회로기판과 하부회로기판들의 전기회로패턴들을 선택적으로 연결하도록 할 수 있다. In addition, the male pins connected to the female connector can be selectively fixed to the male connector to selectively connect the electrical circuit patterns of the upper circuit board and the lower circuit boards.

또한, 암형커넥터와 수형커넥터에 방열홀을 형성하여 암형커넥터와 수형커넥터에서 발생되는 열을 외부로 방열할 수 있어서, 열로부터 회로기판과 회로기판에 탐재된 전자부품을 보호할 수 있다. In addition, heat dissipating holes are formed in the female connector and the male connector to dissipate the heat generated from the female connector and the male connector to the outside, thereby protecting the circuit board and the electronic components pushed to the circuit board from heat.

도 1은 본 고안에 따른 복층 회로기판의 연결구조를 보인 사시도.
도 2는 본 고안에 의해 복층 회로기판이 결합되기 전 상태를 보인 측면도.
도 3은 본 고안에 의해 복층 회로기판이 결합된 상태를 보인 측면도. 1 is a perspective view showing a connection structure of a multi-layer circuit board according to the present invention.
Fig. 2 is a side view showing a state before the multi-layer circuit board is joined by the present invention. Fig.
3 is a side view showing a state in which a multilayer circuit board is coupled by the present invention.

이하, 첨부된 도면을 참조하여 본 고안에 따른 복층 회로기판의 연결구조를 자세히 설명한다. Hereinafter, the connection structure of the multilayer circuit board according to the present invention will be described in detail with reference to the accompanying drawings.

도 1 및 도 2에 도시된 바와 같이, 본 고안의 복층 회로기판의 연결구조는 전기회로패턴(11)이 각기 편성된 상부회로기판(10)과 하부회로기판(10')으로 이루어진 회로기판과, 상부회로기판(10)과 하부회로기판(10') 중 어느 하나에 전기적으로 연결되면서 고정되는 암형커넥터(20) 및 암형커넥터(20)에 연결되도록 상부회로기판(10)과 하부회로기판(10') 중 다른 하나에 전기적으로 연결되면서 고정되는 수형커넥터(30)를 포함한다. 따라서, 암형커넥터(20)와 수형커넥터(30)의 결합에 의해 상부회로기판(10)과 하부회로기판(10')이 전기적으로 연결될 수 있다. As shown in Figs. 1 and 2, the connection structure of the multi-layer circuit board of the present invention includes a circuit board composed of an upper circuit board 10 and a lower circuit board 10 ' A female connector 20 which is electrically connected to one of the upper circuit board 10 and the lower circuit board 10 'and a female connector 20 which is fixed to the upper circuit board 10 and the lower circuit board 10' 10 ') that are electrically connected to one another. Therefore, the upper circuit board 10 and the lower circuit board 10 'can be electrically connected by the engagement of the female connector 20 and the male connector 30.

암형커넥터(20)는 전기회로패턴(11)에 접속된 상태로 상부 또는 하부회로기판(10,10')에 고정되고, 다수의 암형홀(22)이 일측면으로 각기 노출된다. The female connector 20 is fixed to the upper or lower circuit board 10, 10 'while being connected to the electric circuit pattern 11, and a plurality of the arm holes 22 are exposed to one side.

또한, 수형커넥터(30)는 암형홀(22)에 대응되도록 일측에 형성되는 다수의 삽입홀(33) 및 삽입홀(33)에 착탈식으로 삽입되면서 고정된 상태로 암형홀(22)에 접속되는 수형핀(32)을 포함한다. 이때, 수형커넥터(30)의 삽입홀(33)은 상부 또는 하부회로기판(10,10')의 전기회로패턴(11)에 접속된다.The male connector 30 has a plurality of insertion holes 33 formed at one side thereof corresponding to the female type holes 22 and connected to the female type holes 22 while being fixedly inserted while being removably inserted into the insertion holes 33 And includes a male pin 32. At this time, the insertion hole 33 of the male connector 30 is connected to the electric circuit pattern 11 of the upper or lower circuit board 10, 10 '.

이러한, 수형핀(32)은 원기둥이나 사각기둥의 형태로 형성되어, 일단이 삽입홀(33)에 삽입되고, 타단이 암형커넥터(20)의 암형홀(22)에 체결되도록 노출된다. 이에 따라 수형핀(32)이 암형홀(22)에 체결되면 상부회로기판(10)과 하부회로기판(10')의 전기회로패턴(11)에 서로 연결되게 된다.The male pin 32 is formed in the shape of a cylinder or a square pillar so that one end is inserted into the insertion hole 33 and the other end is exposed to be fastened to the female hole 22 of the female connector 20. The male pins 32 are connected to the electric circuit patterns 11 of the upper circuit board 10 and the lower circuit board 10 '

또한, 수형핀(32)은 삽입홀(33)에 억지끼움으로 삽입되어서 고정되도록 양측으로 돌출 형성되는 돌기(34)를 더 포함한다. 따라서, 도 1에서 좌측에 확대 도시된 바와 같이 수형핀(32)을 삽입홀(33)에 억지끼움식으로 착탈가능하게 고정시킬 때에 돌기(34)가 삽입홀(33)의 내주면에 지지되어 고정된 상태가 견고하게 유지될 수 있다. 또한, 수형핀(32)을 착탈식을 고정할 수 있기 때문에 사용자는 전기적으로 연결되는 삽입홀(33)에만 수형핀(32)을 선택적으로 삽입시켜서 고정할 수 있다. 예를 들어, 삽입홀(33)이 16개로 형성되는 경우 수형핀(32)을 16개를 모두 고정하거나 8개만 선택적으로 고정시킬 수 있게 된다. The male pin 32 further includes protrusions 34 protruding from both sides so as to be inserted and fixedly inserted into the insertion hole 33. 1, when the male pin 32 is detachably fixed to the insertion hole 33 in a detachable manner, the protrusion 34 is supported by the inner peripheral surface of the insertion hole 33 and fixed The state can be maintained firmly. In addition, since the male type pin 32 can be fixed to the detachable type, the user can selectively insert and fix the male type pin 32 only in the insertion hole 33 that is electrically connected. For example, if the number of the insertion holes 33 is sixteen, the number of the male pins 32 may be fixed or eight may be selectively fixed.

한편, 본 고안의 암형커넥터(20)는 일측에서 타측으로 관통되는 암형방열홀(21)이 형성되고, 수형커넥터(30)는 일측에서 타측으로 관통되는 수형방열홀(31)이 형성된다. 암형커넥터(20)과 수형커넥터(30)는 암형방열홀(21)과 수형방열홀(31)을 통해 외부에 노출되므로 수형핀(32)이 접속된 암형홀(22)에서 발생되는 열을 외부로 방출될 수 있다. The female type connector 20 of the present invention has a female type heat dissipating hole 21 penetrating from one side to the other side and a male type radiating hole 31 through which the male type connector 30 is passed from one side to the other side is formed. Since the female connector 20 and the male connector 30 are exposed to the outside through the female type heat dissipating hole 21 and the male type heat dissipating hole 31, heat generated in the female type hole 22 to which the female type pin 32 is connected, Lt; / RTI >

한편, 본 고안은 상부 또는 하부회로기판(10,10')의 전기회로패턴에서 발생되는 열을 방열시키는 방열부재(50)를 더 포함한다. 이러한, 방열부재(50)는 전기회로패턴(11)을 관통하여서 상부 또는 하부회로기판(10,10')에 고정되는 고정핀(51) 및 고정핀(51)에 일체적으로 연결되어 전기회로패턴에서 상기 고정핀(51)으로 전달되는 열을 외부로 방열하는 방열체(52)를 포함한다. 따라서, 도 1에서 우측에 확대 도시된 바와 같이 고정핀(51)을 전기회로패턴(11)에 관통하도록 상부 또는 하부회로기판(10,10')에 고정시키면 전기회로패턴(11)에서 발생되는 열이 고정핀(51)을 통해 방열체(52)에 전달되어서 외부로 방출될 수 있다. 즉, 전기회로패턴(11)은 열이 방출되므로 열에 의한 손상이 방지될 수 있다. The present invention further includes a heat dissipating member 50 for dissipating heat generated in the electric circuit pattern of the upper or lower circuit board 10, 10 '. The heat dissipating member 50 is integrally connected to the fixing pin 51 and the fixing pin 51 penetrating the electric circuit pattern 11 and fixed to the upper or lower circuit boards 10 and 10 ' And a heat sink 52 for dissipating the heat transferred from the pattern to the fixing pin 51 to the outside. Therefore, when the fixing pin 51 is fixed to the upper or lower circuit board 10 or 10 'so as to penetrate the electric circuit pattern 11 as shown in the enlarged right side of FIG. 1, Heat can be transferred to the heat sink 52 through the fixing pin 51 and released to the outside. That is, the electric circuit pattern 11 is prevented from being damaged by heat since heat is released.

그리고, 방열체(52)는 0.8~1.2mm의 두께로 구성될 수 있어서, 얇은 두께에 의해 공랭식으로 전기회로패턴(11)을 신속하게 냉각시킬 수 있다. The heat dissipating member 52 can be formed to have a thickness of 0.8 to 1.2 mm, so that the electric circuit pattern 11 can be quickly cooled in an air-cooled manner by a thin thickness.

또한, 방열체(52)는 암형커넥터(20)나 수형커넥터(30)의 높이보다 크고, 결합되어서 서로 적층된 암형커넥터(20)와 수형커넥터(30)의 높이보다 작은 높이로 형성될 수 있다. 따라서, 암형커넥터(20)와 수형커넥터(30)가 접속되어 상부회로기판(10)과 하부회로기판(10')이 적층되는 경우, 방열체(52)가 결합된 암형커넥터(20)와 수형커넥터(30)의 전체높이보다 작은 높이이므로, 마주되는 상부회로기판(10)과 하부회로기판(10')의 표면에 접촉되지 않아서 구부려지거나 파손되지 않으면서 상부 또는 하부회로기판(10,10')을 손상시키지 않게 된다. The heat dissipator 52 may be formed to have a height that is greater than the height of the female connector 20 or the male connector 30 and smaller than the height of the female connector 20 and the male connector 30 which are stacked together . Accordingly, when the female connector 20 and the male connector 30 are connected to each other and the upper circuit board 10 and the lower circuit board 10 'are stacked, the female connector 20, to which the heat discharger 52 is coupled, The upper and lower circuit boards 10 and 10 'are not in contact with the surfaces of the upper circuit board 10 and the lower circuit board 10 facing each other and are not bent or broken, ).

또한, 방열체(52)는 암형커넥터(20)나 수형커넥터(30)의 높이보다 작은 높이로 형성될 수도 있다. 따라서, 방열체(52)는 마주되는 상부회로기판(10)과 하부회로기판(10')에 탑재된 전자부품들과 간섭되지 않아서 구부려지거나 파손되지 않으면서 전자부품을 손상시키지 않게 된다. The heat discharging body 52 may be formed to have a height smaller than the height of the female connector 20 or the male connector 30. Accordingly, the heat discharging body 52 does not interfere with the electronic parts mounted on the upper circuit board 10 and the lower circuit board 10 'facing each other, so that they are not bent or damaged and do not damage the electronic parts.

이와 같이, 본 고안은 2개 이상의 회로기판을 이격상태로 복층으로 고정하면서 수형핀(32)으로 선택적으로 연결할 수 있으며, 암형커넥터(20)와 수형커넥터(30)에서 발생되는 열을 외부로 방출시켜서 암형커넥터(20)와 수형커넥터(30)가 열에 의해 손상되는 것을 방지할 수 있다.
As described above, in the present invention, two or more circuit boards can be selectively connected to the male pins 32 while being secured in a multi-layer state in a spaced apart state, and heat generated in the female connector 20 and the male connector 30 can be discharged It is possible to prevent the female connector 20 and the male connector 30 from being damaged by heat.

본 고안이 속하는 기술분야의 당업자는 본 고안이 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시예는 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 고안의 범위는 상세한 설명보다는 후술하는 청구범위에 의하여 나타내어지며, 청구범위의 의미 및 범위 그리고 그 등가개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 고안의 범위에 포함되는 것으로 해석되어야 한다.It will be understood by those skilled in the art that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. It is to be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, and the meaning and scope of the claims and their equivalents And all changes or modifications that come within the scope of the appended claims are to be interpreted as being included within the scope of the present invention.

10 : 상부회로기판 10' : 하부회로기판
11 : 전기회로패턴 20 : 암형커넥터
21 : 암형방열홀 22 : 암형홀
30 : 수형커넥터 31 : 수형방열홀
32 : 수형핀 33 : 삽입홀
34 : 돌기 50 : 방열부재
51 : 고정핀 52 : 방열체10: upper circuit board 10 ': lower circuit board
11: electric circuit pattern 20: female connector
21: female type heat dissipating hole 22:
30: male connector 31: male type heat dissipation hole
32: Male pin 33: Insertion hole
34: projection 50: heat dissipating member
51: fixing pin 52: heat sink

Claims (7)

전기회로패턴이 각기 편성된 상부회로기판과 하부회로기판;
상기 상부회로기판과 하부회로기판 중 어느 하나에 전기적으로 연결되면서 고정되며 암형홀이 형성되는 암형커넥터; 및
상기 상부회로기판과 하부회로기판 중 다른 하나에 전기적으로 연결되면서 고정되며 상기 암형홀에 대응되도록 일측에 형성되는 다수의 삽입홀 및 상기 삽입홀에 착탈식으로 삽입되어서 암형홀에 접속되는 수형핀을 포함하는 수형커넥터를 포함하며,
상기 전기회로패턴을 관통하여서 회로기판에 고정되는 고정핀과, 상기 고정핀에 일체적으로 연결되어 전기회로패턴에서 상기 고정핀으로 전달되는 열을 외부로 방열하는 방열체로 이루어진 방열부재를 포함하는 것을 특징으로 하는 복층 회로기판의 연결구조.An upper circuit board and a lower circuit board on which electric circuit patterns are knitted;
A female connector having a female connector and a male connector, the female connector being fixed to one of the upper circuit board and the lower circuit board while being electrically connected thereto; And
A plurality of insertion holes formed on one side of the upper circuit board and the lower circuit board while being electrically connected to the other one of the upper circuit board and the lower circuit board to correspond to the female holes and a male pin removably inserted into the insertion holes to be connected to the female holes A male connector,
A heat dissipation member formed of a heat dissipation member that is integrally connected to the fixing pin and dissipates heat transmitted to the fixing pin from the electric circuit pattern to the outside, A connecting structure of a multi-layer circuit board. 청구항 1에 있어서,
상기 암형커넥터는 일측에서 타측으로 관통되는 암형방열홀이 형성되고,
상기 수형커넥터는 일측에서 타측으로 관통되는 수형방열홀이 형성되는 것을 특징으로 하는 복층 회로기판의 연결구조.The method according to claim 1,
The female type connector has a female type heat dissipating hole penetrating from one side to the other side,
Wherein the male connector is formed with a male type heat dissipating hole penetrating from one side to the other side. 청구항 1에 있어서, 상기 수형핀은 원기둥이나 사각기둥의 형태로 형성되는 것을 특징으로 하는 복층 회로기판의 연결구조.The connection structure of a multi-layered circuit board according to claim 1, wherein the male pins are formed in the shape of a cylinder or a square column. 청구항 1 또는 청구항 3에 있어서, 상기 수형핀은 삽입홀에 억지끼움으로 삽입되어서 고정되도록 양측으로 돌출된 형성되는 돌기를 더 포함하는 것을 특징으로 하는 복층 회로기판의 연결구조.The connection structure of a multi-layer circuit board according to claim 1 or 3, wherein the male pin further comprises protrusions protruding to both sides so as to be inserted and fixedly inserted into the insertion holes. 삭제delete 청구항 1에 있어서, 상기 방열체는 0.8~1.2mm의 두께인 것을 특징으로 하는 복층 회로기판의 연결구조.The connection structure of a multilayer circuit board according to claim 1, wherein the heat discharger has a thickness of 0.8 to 1.2 mm. 청구항 1 또는 청구항 6에 있어서, 상기 방열체는 암형커넥터 또는 수형커넥터의 높이보다 크고, 결합되어서 서로 적층된 암형커넥터와 수형커넥터의 전체 높이보다 작은 높이로 형성되는 것을 특징으로 하는 복층 회로기판의 연결구조.The connector according to claim 1 or 6, wherein the heat discharging body is formed to have a height larger than the height of the female connector or the male connector and a height smaller than the total height of the female connector and the male connector, rescue.
KR2020130000101U 2013-01-04 2013-01-04 Linkage structure of multi pcb KR200484643Y1 (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322557A (en) * 2004-05-11 2005-11-17 Yazaki Corp Joint connector and its assembly method therefor
JP2006164569A (en) 2004-12-02 2006-06-22 Sony Corp Substrate connection structure and substrate connection tool
JP2008300331A (en) 2007-06-04 2008-12-11 Sumitomo Wiring Syst Ltd Connector for board
WO2011049610A1 (en) * 2009-10-19 2011-04-28 Tyco Electronic Corporation Housing base for an electrical connector

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005322557A (en) * 2004-05-11 2005-11-17 Yazaki Corp Joint connector and its assembly method therefor
JP2006164569A (en) 2004-12-02 2006-06-22 Sony Corp Substrate connection structure and substrate connection tool
JP2008300331A (en) 2007-06-04 2008-12-11 Sumitomo Wiring Syst Ltd Connector for board
WO2011049610A1 (en) * 2009-10-19 2011-04-28 Tyco Electronic Corporation Housing base for an electrical connector

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