CN210651922U - Non-contact smart card manufacturing equipment - Google Patents

Abstract

The utility model discloses a non-contact smart card manufacturing device, which comprises a frame, a plate material feeding device, a chip feeding device, a winding device, a chip welding device and a conveying device, wherein the plate material feeding device, the chip feeding device, the winding device, the chip welding device and the conveying device are arranged on the frame; the conveying device comprises a positioning platform and a conveying mechanism, wherein the positioning platform comprises a substrate and a plurality of winding screens arranged on the substrate; the winding clamping positions correspond to the winding clamping units on the plate material one by one; each winding card position is provided with a chip storage groove, and the chip storage grooves correspond to the chip placement positions in the winding card units one by one; the sheet material feeding device comprises a sheet material placing table and a first carrying device; the chip feeding device comprises a chip placing table and a second carrying device. The utility model discloses a non-contact smart card manufacture equipment can realize the accurate positioning of sheet material and chip in non-contact smart card production process to improve non-contact smart card's production quality and production efficiency.

Description

Non-contact smart card manufacturing equipment

Technical Field

The utility model relates to a smart card manufacture equipment, concretely relates to non-contact smart card manufacture equipment.

Background

In the production process of the non-contact smart card, the following processing procedures are generally required: the method comprises the following steps of a laser punching process, a winding process, a chip welding process, an ultrasonic composite welding process and a cutting process; after the processing procedures, an independent intelligent card board material unit is formed, and semi-finished raw materials are provided for subsequent other processing.

The existing intelligent card winding equipment, for example, the invention patent application with application publication number CN108000909A, discloses a non-contact intelligent card manufacturing production line, which comprises a rack, a PVC plate mounting rack, a plate mounting rack of a PVC cover plate coil, a laser punching module, an intelligent card winding processing module, a chip welding device K, an ultrasonic composite welding module, a traction module for traction and conveying of PVC plates and PVC cover plates, and a collection module; the laser punching module, the intelligent card winding processing module, the chip welding device K, the ultrasonic composite welding module, the traction module and the collection module are sequentially arranged on the rack along the conveying direction of the PVC sheet; the PVC sheet mounting bracket is arranged behind the laser drilling module, and the sheet mounting bracket is arranged in front of the sheet mounting bracket. The invention can connect the processing modules manufactured by the non-contact smart cards together and continuously convey the PVC sheet material to the processing modules for processing, thereby reducing the transportation times of the PVC sheet material and improving the production efficiency and the processing precision.

However, in the non-contact smart card manufacturing line, in the process of producing the non-contact smart card, the PVC sheet passes through the laser punching module and then reaches the winding processing module, and the winding processing module winds the PVC sheet in the winding card unit. After the winding is finished, the PVC sheet is sent to a chip welding device K, at the moment, a chip conveying device conveys a chip to be welded to a position to be welded of a chip of each PVC winding card on a PVC winding card unit, and then the chip welding device K welds the chip to be welded to each PVC winding card; and then, conveying the PVC plate to an ultrasonic composite welding module for ultrasonic composite, and finally cutting and processing the composite PVC plate to form an independent intelligent card plate material unit. In the process, the PVC sheet is firstly processed by winding, then the chips to be welded are conveyed to the chip to be welded of each PVC winding card in the PVC winding card unit on the PVC sheet, and then the chips and the PVC winding cards are welded, so that the chips are deviated relative to the chip welding positions in the PVC sheet due to certain factors (such as vibration and wind power), the chips cannot be accurately placed at the chip welding positions, the chips cannot be smoothly welded on the PVC winding cards by the chip welding device K, the circuit break between the chips is easily caused, and the production quality of non-contact intelligent cards is influenced. In addition, the non-contact smart card manufacturing line has the defect of low working efficiency.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to overcome prior art's is not enough, provides a non-contact smart card manufacture equipment, non-contact smart card manufacture equipment can realize the accurate positioning of sheet material and chip in non-contact smart card production process to improve non-contact smart card's production quality and production efficiency.

The utility model provides a technical scheme of above-mentioned technical problem is:

a non-contact intelligent card manufacturing device comprises a frame, a sheet material feeding device, a chip feeding device, a winding device, a chip welding device and a conveying device, wherein the sheet material feeding device, the chip feeding device, the winding device and the chip welding device are arranged on the frame, the conveying device is used for conveying a sheet material in the sheet material feeding device and a chip in the chip feeding device to the winding device and the chip welding device in sequence,

the conveying device comprises a plurality of positioning platforms arranged on a rack and a conveying mechanism used for driving the positioning platforms to move independently, wherein the positioning platforms are arranged in parallel, each positioning platform comprises a substrate, the substrate is divided into a plurality of winding screens, and the winding screens are arranged on the substrate in a matrix manner; the winding clamping positions correspond to the winding clamping units on the plate material one by one; each winding card position is provided with a chip storage groove for storing a chip, and the chip storage grooves in the winding card positions correspond to the chip placement positions in the winding card units one by one;

the sheet material loading device comprises a sheet material placing table and a first carrying device for carrying the sheet material in the sheet material placing table to the positioning platform;

the chip feeding device comprises a chip placing table and a second carrying device used for carrying the chips in the chip placing table to the chip storage grooves in the positioning platform.

Compared with the prior art, the utility model following beneficial effect has:

1. the utility model discloses a set up a plurality of location platform among the non-contact smart card manufacture equipment, every location platform is through a set of conveying mechanism individual drive, makes the utility model discloses a non-contact smart card manufacture equipment can realize continuity work to improve work efficiency.

2. The positioning platform in the utility model is provided with a plurality of winding screens, each winding screen is provided with a chip storage groove, the winding screens correspond to the winding card units on the plate one by one, and the chip storage grooves on the winding screens correspond to the chip placement positions on the winding card units; like this, carry the chip to positioning platform's chip storage tank through first handling device in, utilize the chip storage tank to carry on spacingly to the chip, prevent that the chip from taking place the skew in subsequent course of working to guarantee that chip welding set can be in the same place the wire welding of the coil in chip and the wire winding card unit, improve the welding precision, and then improve the production quality of non-contact smart card.

3. Through setting up the utility model provides a positioning platform for non-contact smart card manufacture equipment just can place the chip before the wire winding in positioning platform's the chip storage tank to fix a position the chip through the chip storage tank, compare in traditional non-contact smart card manufacture equipment carry the chip one by one after the wire winding to the mode that the chip of wire winding card unit placed position department, the utility model provides a positioning platform can save the time that non-contact smart card manufacture equipment made a round trip to carry the chip and spend, improves the production efficiency of non-contact smart card manufacture equipment.

Drawings

Fig. 1 to fig. 3 are schematic structural diagrams of a first embodiment of a contactless smart card manufacturing apparatus according to the present invention, wherein fig. 1 to fig. 3 are schematic perspective structural diagrams of three different viewing angles.

Fig. 4 is a schematic perspective view of the slab placing table.

Fig. 5 to 7 are schematic structural views of the first conveying device of the present invention, wherein fig. 5 is a front view, fig. 6 is a right side view, and fig. 7 is a perspective view.

Fig. 8 is a top view of the panel veneer of the present invention.

Fig. 9 is a simplified structure diagram of the plate placing table and the positioning platform of the present invention.

Fig. 10 is a cross-sectional view of a positioning assembly in accordance with the present invention.

Fig. 11 is a schematic perspective view of the plate conveying mechanism of the present invention.

Fig. 12 is a schematic view of a synchronous drive mechanism.

Fig. 13 is a schematic perspective view of a first lateral driving mechanism according to the present invention.

Fig. 14 is a schematic perspective view of a fixing assembly according to the present invention.

Fig. 15 is a partial enlarged view of the second photoelectric sensor and the second detection piece according to the present invention.

Fig. 16 to 18 are schematic structural views of a second conveying device according to the present invention, in which fig. 16 is a front view, fig. 17 is a left side view, and fig. 18 is a perspective view.

Fig. 19 is an exploded view of one of the chip handling modules of fig. 18.

Fig. 20 is an exploded view of the multiple sets of chip suction mechanisms in the second handler.

Fig. 21 is a partially exploded view of the set of chip pick-up mechanisms of fig. 20.

Fig. 22 is a partially exploded schematic view of the second horizontal driving mechanism and the second vertical driving mechanism in the second transporter according to the present invention.

Fig. 23-26 are schematic structural views of a chip position adjusting mechanism of a chip loading device according to the present invention, in which fig. 23 and 24 are schematic three-dimensional structural views at two different viewing angles, fig. 25 is a front view, and fig. 26 is a top view.

Fig. 27 is a schematic perspective view of a chip placement table according to the present invention.

Fig. 28 is a schematic perspective view of the placement seat of the present invention.

Fig. 29 is a schematic perspective view of two sets of correction assemblies according to the present invention.

Fig. 30 is a top view of the two upper layer modifiers of fig. 29.

Fig. 31 is a top view of the two lower layer modifiers of fig. 29.

Fig. 32 is a partially enlarged view of the correction drive mechanism according to the present invention.

Fig. 33-35 are schematic structural views of a third handling device and a chip placement platform of the chip loading device according to the present invention, in which fig. 33 and 34 are schematic perspective structural views at two different viewing angles, and fig. 35 is a side view (partial cross-sectional view).

Fig. 36 is a schematic perspective view of the carrier, the suction member, and the rotation driving mechanism.

Fig. 37 is a perspective view of the rotation driving mechanism and the third detecting mechanism.

Fig. 38 is a schematic view of the configuration of the suction member.

Fig. 39 is a schematic perspective view of a positioning platform in the conveying device of the present invention.

FIG. 40 is a top view of the positioning stage.

Fig. 41 is a partial enlarged view of a portion a in fig. 39.

Fig. 42 is a partial enlarged view at B in fig. 40.

Fig. 43 is a schematic structural view of a positioning assembly of a first conveying device according to a second embodiment of the present invention.

Fig. 44 is a schematic structural view of a vertical power mechanism of the first conveying device according to the third embodiment of the present invention.

Fig. 45 is a partially exploded schematic view of a second lateral driving mechanism of a second conveyance device according to a fourth embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.

Example 1

Referring to fig. 1-42, the non-contact smart card manufacturing apparatus of the present invention comprises a frame I, a sheet material feeding device, a chip feeding device, a winding device J, a chip welding device K, and a conveying device for conveying a sheet material 7a in the sheet material feeding device and chips in the chip feeding device to the winding device J and the chip welding device K in sequence,

the conveying device comprises two positioning platforms C arranged on a rack I and used for accurately positioning the plate 7a and the chip and a conveying mechanism D used for driving the two positioning platforms C to move independently, wherein the two positioning platforms C are arranged in parallel, and each positioning platform C is driven by a single conveying mechanism D;

the chip feeding device comprises a chip placing table G and a second conveying device E used for conveying the chips in the chip placing table G to the chip storage grooves 1-1C in the positioning platform C, wherein a chip position adjusting device F used for adjusting the positions of the chips and a third conveying device H used for conveying the chips from the chip placing table G to the chip position adjusting device F are further arranged between the chip placing table G and the second conveying device E. The sheet material loading device comprises a sheet material placing platform B and a first carrying device A, wherein the sheet material placing platform B is used for storing the sheet material 7a and accurately positioning the sheet material 7a, and the first carrying device A is used for carrying the sheet material 7a in the sheet material placing platform B to the positioning platform C.

During operation, the first carrying device A carries the plate 7a in the plate placing platform B to the positioning platform C to realize accurate positioning of the plate 7a on the positioning platform C, then the third carrying device H carries the chip stored on the chip placing platform G to the chip position adjusting device F, the chip position adjusting device F adjusts the position of the chip, and then the second carrying device E carries the chip after position adjustment to the positioning platform C to realize positioning of the chip. Subsequently, the conveying mechanism D conveys the positioning platform C and the plate 7a and the chip placed on the positioning platform C to a winding station, the winding device J winds the plate 7a, after winding is completed, the conveying mechanism D conveys the positioning platform C to a chip welding station, welding of the chip and the coil is achieved through the chip welding device K, and finally, the plate 7a and the chip on the positioning platform C are conveyed to subsequent processing equipment through the fourth conveying device L to be processed subsequently.

The specific structures and the operating principles of the plate feeding device, the chip feeding device, the winding device J, the chip welding device K, and the conveying device are described below.

(1) Sheet material loading attachment

(1-1) plate Material placing platform B

Referring to fig. 4, the sheet material placing table B is disposed on the frame I, and includes a plate body and a first positioning pin 1B disposed on the plate body for positioning a sheet material 7a stored on the plate body, where a positioning hole 7-1a matched with the first positioning pin 1B is disposed on the sheet material 7a at a position corresponding to the first positioning pin 1B. When the sheet material 7a is stacked on the sheet material placing table B, the first positioning pin 1B in the sheet material placing table B penetrates through the positioning hole 7-1a in the sheet material 7a, so that the sheet material 7a before being conveyed is positioned.

(1-2) first transfer device A

Referring to fig. 5 to 15, the first carrying device a includes a first frame 1a, a sheet carrying mechanism disposed on the first frame 1a, and a first transverse driving mechanism 3a for driving the sheet carrying mechanism to reciprocate between a pre-carrying station and a post-carrying station of a sheet 7 a; the plate material carrying mechanism comprises an installation frame 2a, a sucker assembly 4a arranged on the installation frame 2a, at least two groups of positioning assemblies 5a and a first vertical driving mechanism 6a for driving the sucker assembly 4a and the positioning assemblies 5a to do vertical motion; the sucker assembly 4a comprises a plurality of suckers 4-1a for sucking the plate 7a, and the positioning assembly 5a comprises a positioning piece 5-1a for positioning the positioning hole 7-1a of the plate 7 a; the positioning piece 5-1a is provided with an avoiding groove 5-11a for avoiding a first positioning pin 1B penetrating through the positioning hole 7-1a on the plate placing platform B, and the bottom surface of the positioning piece 5-1a is also provided with a suction hole 5-12a for adsorbing the periphery of the positioning hole 7-1a of the plate 7 a.

Referring to fig. 5-15, the suction holes 5-12a are plural and uniformly distributed along the axial center of the avoiding groove 5-11 a. The suction cup component is characterized in that when the vertical power mechanism drives the suction cup component 4a and the suction cup component 4a to do vertical motion to carry the plate 7a, when the bottom of the positioning piece 5-1a is in contact with the surface of the plate 7a, the suction holes 5-12a are uniformly adsorbed along the periphery of the positioning hole 7-1a of the plate 7a, the plate 7a located in the periphery of the suction holes 5-12a is in a tensioning state under the suction force of the suction holes 5-12a, so that the part of the plate 7a cannot be flexibly deformed in the carrying process, meanwhile, the positioning hole 7-1a in the part of the plate 7a cannot be changed in position due to the flexible deformation of the plate 7a, and the accuracy of the position of the positioning hole 7-1a is guaranteed.

Referring to fig. 5-15, the plurality of suction cups 4-1a are arranged in a matrix on the mounting frame 2a, and the mounting frame 2a is provided with an adjusting groove 2-1a at a position corresponding to each suction cup 4-1a, and the adjusting groove 2-1a extends along the direction in which the sheet material 7a is conveyed. The plurality of suckers 4-1a are arranged and evenly arranged, so that the plate 7a can be sucked more conveniently. The adjusting grooves 2-1a are formed in the positions, corresponding to the suckers 4-1a, of the mounting frame 2a, so that the positions of the adjacent suckers 4-1a can be adjusted, and the carrying of the plate 7a with different specifications and sizes is adapted.

Referring to fig. 5-15, the positioning assemblies 5a are two groups, each group of positioning assemblies 5a further includes a vertical driving assembly arranged on the mounting frame 2a and used for supporting the positioning member 5-1a to make vertical movement, wherein the vertical driving assembly includes a guide rod 5-2a, a positioning slider 5-3a and an elastic element, and the positioning slider 5-3a is connected above the positioning member 5-1 a; the upper end of the guide sliding rod 5-2a is fixedly connected to the mounting frame 2a, the lower end of the guide sliding rod vertically extends downwards and penetrates through the positioning sliding piece 5-3a, and the positioning sliding piece 5-3a and the positioning piece 5-1a are provided with guide sliding holes 5-31a matched with the guide sliding rod 5-2 a; the guide sliding hole 5-31a on the positioning piece 5-1a is communicated with the avoidance groove 5-11a and has the same axle center, and the diameter of the avoidance groove 5-11a is larger than that of the guide sliding hole 5-31 a; the lower end of the guide sliding rod 5-2a is provided with a limiting part 5-21a which is matched with the avoidance groove 5-11a and is used for preventing the guide sliding rod 5-2a from being separated from the guide sliding hole 5-31 a; the elastic element acts between the mounting frame 2a and the positioning sliding piece 5-3a, and the elastic force of the elastic element enables the limiting part 5-21a of the guide sliding rod 5-2a to be abutted against a step surface formed between the avoiding groove 5-11a in the positioning piece 5-1a and the guide sliding hole 5-31 a. By the arrangement of the structure, the positioning piece 5-1a can run more stably in the positioning process of the plate 7a, the bottom surface of the positioning piece 5-1a can be better abutted against the plate 7a, the positioning precision is improved, and the elastic element can play a buffering role in the contact process of the positioning piece 5-1a and the plate 7a, so that the plate 7a is prevented from being crushed due to overlarge pressure of the positioning piece 5-1 a. A sliding mechanism can be arranged between the positioning piece 5-1a and the mounting frame 2a and used for guiding the vertical movement of the positioning piece 5-1a, and the sliding mechanism can be a sliding block and sliding rail mechanism or a sliding rod mechanism.

Referring to fig. 5-15, the lower end of the guide rod 5-2a is provided with an avoidance hole 5-22a for avoiding a second positioning pin 1-3C on the positioning platform C or a first positioning pin 1B of the sheet material placing platform B; the avoidance holes 5-22a and the avoidance grooves 5-11a are positioned on the same axis. The avoidance holes 5-22a are arranged, so that the guide slide rod 5-2a can be prevented from interfering with the first positioning pin 1b and the second positioning pin 1-3 c.

Referring to fig. 5-15, the bottom surface of the positioning member 5-1a is lower than the bottom surface of the suction cup 4-1 a. The positioning device has the advantages that in the process of lifting the plate 7a from the plate placing table B, as the positioning surface of the positioning piece 5-1a is lower than the bottom surface of the sucker 4-1a, the positioning piece 5-1a can be firstly contacted with the surface of the plate 7a, and the suction hole 5-12a of the positioning piece 5-1a sucks the part of the plate 7a, which is positioned around the positioning hole 7-1a, in the plate 7a, so that the sucked part of the plate 7a is in a tensioning state, two positioning precisions (namely two positioning holes 7-1a) on the plate 7a are enabled not to move in position due to flexible deformation of the plate 7a in the subsequent conveying process, and the positioning hole 7-1a of the plate 7a can smoothly pass through the second positioning pin 1-3C on the positioning platform C, thereby realizing the accurate positioning of the plate 7 a. In the process of placing the plate 7a on the positioning platform C, since the positioning surface of the positioning piece 5-1a is lower than the bottom surface of the suction cup 4-1a, therefore, the positioning member 5-1a will contact with the second positioning pin 1-3C of the positioning platform C first, so that the second positioning pins 1-3C on the positioning platform C pass through the positioning holes 7-1a on the plate material 7a, so that the positions of the two positioning holes 7-1a on the plate 7a are determined, and thus, the position of the whole plate 7a is determined, during the subsequent process of placing the sheet 7a on the positioning platform C by the suction cups 4-1a, since the positioning of the two positioning precisions on the sheet 7a has been achieved, therefore, the entire sheet 7a is not displaced any more, so that the sheet 7a is accurately positioned on the positioning platform C.

Referring to fig. 5-15, the elastic element is a spring 5-4a, the spring 5-4a is sleeved on the guide rod, one end of the spring 5-4a acts on the mounting frame 2a, and the other end acts on the positioning sliding member 5-3 a. By adopting the spring 5-4a, the positioning piece 5-1a can be in a tight state, the positioning piece 5-1a can be better abutted on the plate 7a in the positioning and carrying process, the positioning precision is improved, the buffering effect is realized in the soft contact process of the positioning piece 5-1a and the plate 7a, and the plate 7a is ensured not to be damaged.

Referring to fig. 5-15, the first vertical driving mechanism 6a includes a vertical fixing seat 6-2a, a vertical motor 6-1a disposed on the vertical fixing seat 6-2a, a screw rod transmission mechanism, and a synchronous transmission mechanism for transmitting power of the vertical motor 6-1a to the screw rod transmission mechanism, wherein the screw rod transmission mechanisms are in multiple groups, and the multiple groups of screw rod transmission mechanisms are distributed around the mounting frame 2 a; each group of screw rod transmission mechanisms comprises a screw rod 6-3a and a screw rod nut 6-4a matched with the screw rod 6-3a, one end of the screw rod 6-3a is fixed on the mounting frame 2a, and the other end of the screw rod extends vertically upwards; the feed screw nut 6-4a is rotatably connected to the vertical fixed seat 6-2 a; the synchronous transmission mechanism comprises a first driving wheel 6-5a, a first driven driving wheel 6-6a and a first transmission belt 6-7a, wherein the first driving wheel 6-5a is arranged on a main shaft of the vertical motor 6-1a, the first driven driving wheels 6-6a are multiple and are respectively arranged on a screw rod nut 6-4a of each group of screw rod transmission mechanism and synchronously rotate with the screw rod nuts 6-4a, and the first transmission belt 6-7a sequentially surrounds the first driving wheel 6-5a and the first driven driving wheels 6-6 a. With the structure, the sucker assembly 4a and the positioning assembly 5a can move upwards and downwards through the first vertical driving mechanism 6 a; the specific process is as follows: firstly, a vertical motor 6-1a drives a first driving wheel 6-5a to rotate, a first driven driving wheel 6-6a is driven to rotate through a first transmission belt 6-7a, so that a screw rod nut 6-4a is driven to rotate, a vertical screw rod is driven to move linearly upwards or downwards, and finally a sucker component 4a and a positioning component 5a on an installation frame 2a are driven to move linearly upwards or downwards. In addition, the vertical motor 6-1a drives the first driving wheel 6-5a to rotate, and meanwhile, the first driven driving wheel 6-6a on the screw rod nut 6-4a of the screw rod transmission mechanism positioned around the mounting frame 2a also synchronously rotates, so that the lifting speed of each position on the mounting frame 2a can be kept consistent, a plurality of suckers 4-1a arranged on the sucker component 4a can be simultaneously contacted with the plate material 7a, and the plate material 7a is more stably conveyed and has higher precision.

Referring to fig. 5-15, the vertical fixing seat 6-2a includes a plurality of vertical fixing plates 6-21a and limiting blocks 6-22a, the limiting blocks 6-22a are disposed around the vertical fixing plates 6-21a, the limiting blocks 6-22a are fixedly connected to the vertical fixing plates 6-21a through fixing rods 6-2a3, the lead screw 6-3a is rotatably connected to the vertical fixing plates 6-21a and the limiting blocks 6-22a, and the lead screw nut 6-4a is disposed between the vertical fixing plates 6-21a and the limiting blocks 6-22 a. By the structure, the screw rod 6-3a can move upwards and downwards by driving the screw rod nut 6-4a, so that the sucker assembly 4a and the positioning assembly 5a can move upwards and downwards.

Referring to fig. 5-15, a tension pulley 6-8a for tensioning the first transmission belt 6-7a is disposed between the first driving pulley 6-5a and the first driven driving pulley 6-6a, and the tension pulley 6-8a is connected to the vertical fixing seat 6-2 a. The transmission efficiency of the first transmission belt 6-7a can be improved by designing the tension pulley 6-8 a.

Referring to fig. 5 to 15, the first transverse driving mechanism 3a includes a transverse motor 3-1a disposed at one end of the first frame 1a, and a transverse transmission mechanism, wherein the transverse transmission mechanism includes a second driving wheel 3-2a disposed on the first frame 1a and connected to the transverse motor 3-1a, a second driven driving wheel 3-3a disposed at the other end of the first frame 1a, and a second transmission belt 3-4a connected between the second driving wheel 3-2a and the second driven driving wheel 3-3 a; the vertical fixed seat 6-2a is fixed with one side of the second transmission belt 3-4a through a fixing component. The transverse motor 3-1a drives the second driving wheel 3-2a to rotate, so that the second transmission belt 3-4a between the second driving wheel 3-2a and the second driven driving wheel 3-3a is driven to move, the fixing assembly is driven to move, the vertical fixing seat 6-2a moves transversely, and transverse movement of the plate material carrying mechanism is achieved.

Referring to fig. 5 to 15, the first horizontal driving mechanism 3a further includes a horizontal guiding assembly disposed between the vertical fixing seat 6-2a and the first frame 1a, and the horizontal guiding assembly includes a horizontal guiding rail 3-7a disposed at the bottom of the first frame 1a and a horizontal sliding block 3-8a disposed on the vertical fixing seat 6-2a and matched with the horizontal guiding rail 3-7 a. By arranging the transverse guide assembly, when the transverse sliding block 3-8a moves relative to the transverse guide rail 3-7a, the stability of the transverse sliding block 3-8a can be kept, meanwhile, the running stability of the plate material carrying mechanism is ensured, and the positioning precision is improved. In addition, the transverse guide assembly is arranged and can be used for bearing the weight of the plate material carrying mechanism, so that the second transmission belt 3-4a only needs to drive the plate material carrying mechanism to do transverse movement and does not need to bear the weight of the plate material carrying mechanism, and the service life of the second transmission belt 3-4a can be prolonged.

Referring to fig. 5-15, the two sets of transverse guiding components are respectively located at two sides of the conveying direction of the second transmission belt 3-4 a.

Referring to fig. 5-15, the fixing assembly includes a first clamping member 3-5a disposed on the vertical fixing seat 6-2a and a second clamping member 3-6a clamping the second driving belt 3-4a on the first clamping member 3-5a, wherein a groove matched with the synchronizing teeth of the second driving belt 3-4a is disposed on the first clamping member 3-5a or the second clamping member 3-6 a. The fixing component is clamped and fixed with the second transmission belt 3-4a, so that the belt drives the vertical fixing seat 6-2a to move transversely through the fixing component.

Referring to fig. 5 to 15, a first detection sheet 9a is further arranged on the vertical fixing seat 6-2a, and a first photoelectric sensor 10a is arranged on the first rack 1a, wherein two first photoelectric sensors 10a are respectively located above the sheet material placing table B and above the positioning platform C; the first detection sheet 9a moves along with the movement track of the vertical fixing seat 6-2a in the transverse motion and passes through the first photoelectric sensor 10 a. The sheet material carrying mechanism is driven by the first transverse driving mechanism 3a to move transversely, and when the first photoelectric sensor 10a on the first rack 1a detects the first detection piece 9a on the vertical fixing seat 6-2a, the control system controls the first transverse driving mechanism 3a to stop working, so that the first transverse driving mechanism 3a can accurately drive the sheet material carrying mechanism to move above the sheet material placing table B and the positioning platform C, and the carrying precision is improved.

Referring to fig. 5 to 15, a second photoelectric sensor 12a is further disposed on the vertical fixing seat 6-2a, a second detection piece 11a is disposed on the mounting frame 2a, and two second photoelectric sensors 12a are vertically disposed on the vertical fixing seat 6-2 a; the second detecting piece 11a moves along with the mounting frame 2a in a vertical motion track and passes through the second photoelectric sensor 12 a.

Referring to fig. 4-15, the working principle of the plate feeding device in the present invention is as follows:

in the carrying process of the plate 7a, firstly, the plate 7a is stacked on a plate placing table B, the plate placing table B is arranged below a plate carrying mechanism, first positioning pins 1B on the plate placing table B are installed on the plate placing table B and extend out of the table top of the plate placing table B, the first positioning pins 1B on the plate placing table B correspond to positioning holes 7-1a on the plate 7a one by one, before the plate 7a is carried, the plate 7a is firstly stacked on the plate placing table B, and the first positioning pins 1B on the plate placing table B are made to penetrate through the positioning holes 7-1a on the plate 7a, so that the accurate positioning of the plate 7a before carrying is completed. In the process of stacking the sheets 7a, it is required to ensure that the height of the stacked sheets 7a is lower than the height of the first positioning pin 1 b. After the stacking is finished, the first transverse driving mechanism 3a drives the plate material carrying mechanism to move to a position above the plate material placing platform B corresponding to a plate material 7a, at the moment, the position of a positioning piece 5-1a on the plate material carrying mechanism is positioned right above a first positioning pin 1B on the plate material placing platform B and a positioning hole 7-1a of the plate material 7a, and the positions are corresponding to each other, under the driving of a first vertical driving mechanism 6a, a sucker component 4a and a positioning component 5a simultaneously move downwards and are in contact with the surface of the plate material 7a, an avoiding groove 5-11a of the positioning piece 5-1a avoids the first positioning pin 1B on the plate material placing platform B, the bottom surface of the positioning piece 5-1a abuts against the surrounding part of the positioning hole 7-1a of the plate material 7a, and the suction hole 5-12a adsorbs the surrounding part of the positioning hole 7-1a on the plate material 7a, tensioning a part of a plate 7a around the positioning hole 7-1a, enabling the position of the plate 7a to be accurately fixed under the action of two positioning pieces 5-1a, enabling the plate 7a to be adsorbed by a sucker 4-1a, enabling the sucker 4-1a adsorbing the plate 7a and a positioning piece 5-1a to be driven to move upwards by a first vertical driving mechanism 6a again, carrying the plate 7a to a positioning platform C in a conveying device through the transverse driving of a first transverse driving mechanism 3a, enabling a second positioning pin 1-3C corresponding to the positioning hole 7-1a on the plate 7a to be arranged on the positioning platform C, and enabling the plate 7a to be driven by the first vertical driving mechanism 6a when the plate 7a moves to the corresponding position of the positioning hole 7-1a on the plate 7a and the second positioning pin 1-3C of the positioning platform C, the plate 7a moves downwards, the suction disc 4-1a, the positioning piece 5-1a and the adsorbed plate 7a move downwards at the same time, under the adsorption and accurate positioning of the positioning piece 5-1a, the positioning hole 7-1a of the plate 7a is accurately matched with the second positioning pin 1-3C on the positioning platform C, the second positioning pin 1-3C on the positioning platform C penetrates through the positioning hole 7-1a on the plate 7a, the plate 7a is tightly abutted on the positioning platform C by the plate carrying mechanism along with the continuous work of the vertical power mechanism, and finally the plate 7a is released by the suction disc 4-1a and the positioning piece 5-1a at the same time, so that the plate 7a is accurately carried to the positioning platform C, and the plate feeding process is achieved.

In the process of carrying the plate 7a, the positions of the first positioning pins 1B on the plate placing platform B correspond to the positions of the second positioning pins 1-3C on the positioning platform C one by one, the positioning holes 7-1a are arranged in the sheet material 7a, so that the positioning holes 7-1a on the sheet material 7a are used as positioning accuracy in the process of conveying the sheet material 7a by the first conveying device A of the utility model, by ensuring that the position of the positioning hole 7-1a on the plate 7a is kept unchanged during the carrying process, so that the positioning hole 7-1a on the plate 7a can be matched with the second positioning pin 1-3C on the positioning platform C, so that the sheet 7a can not be displaced in the horizontal direction after being placed on the positioning platform C, thereby realizing accurate positioning of the sheet 7a on the positioning platform C.

(2) Chip feeding device

(2-1) chip Placement Table G

Referring to fig. 16 to 22, the chip placement table G in the present embodiment is a vibrator, and chips stored in the vibrator are conveyed one by one into a discharge chute 1G of the vibrator by vibration of the vibrator.

(2-2) second conveyance device E

Referring to fig. 16 to 22, the second handling apparatus E includes a second rack 1E and at least two chip handling modules; each chip carrying module comprises a chip suction module and a second transverse driving mechanism for driving the chip suction module to transversely move on the second rack 1 e; the second rack 1e comprises transverse beams 1-1e, and the chip carrying modules are transversely arranged on the transverse beams 1-1e and are connected with the transverse beams 1-1e in a sliding manner; the chip suction module comprises a plurality of groups of chip suction mechanisms 2e arranged in parallel and a second vertical driving mechanism 3e for driving the chip suction mechanisms 2e to move vertically; the chip suction mechanism 2e comprises a suction head 2-1e for sucking the chip and a mounting block 2-2e for mounting the suction head 2-1e, and the mounting block 2-2e is connected with a second vertical driving mechanism 3 e.

Referring to fig. 16 to 22, the chip suction mechanism 2e further includes an intermediate connection plate 2-3e disposed between the second vertical driving mechanism 3e and the mounting block 2-2 e; the front surface of the middle connecting plate 2-3e is connected with the mounting block 2-2e on the chip suction mechanism 2e in a sliding manner, and the rear surface of the middle connecting plate 2-3e is connected with the second vertical driving mechanism 3 e. Through setting up above-mentioned intermediate junction board 2-3e, can realize that the vertical actuating mechanism 3e of second drives multiunit chip suction means 2e work simultaneously, reaches and carries a plurality of chips simultaneously, improves work efficiency.

Referring to fig. 16-22, the chip suction mechanism 2e further includes a fixing member 2-4e disposed on the upper portion of the intermediate connection plate 2-3e, and a vertical driving cylinder 2-5e vertically mounted on the fixing member 2-4 e; and a piston rod 2-5e1 of the driving cylinder is connected with the upper end of the mounting block 2-2 e. Through setting up vertical drive cylinder 2-5e, can realize the vertical drive of two-stage of suction head 2-1e, when suction head 2-1e adsorbs the chip and moves to the chip and places the station, the vertical actuating mechanism 3e of second can drive multiunit chip suction mechanism 2e and move down simultaneously, every group chip suction mechanism 2e is equipped with vertical drive cylinder 2-5e alone, can realize the independent control of every suction head 2-1e, can be through vertical drive cylinder 2-5e with suction head 2-1e that adsorbs the chip move down to corresponding position in proper order, release the chip, carry out next process, greatly improve chip handling efficiency and flexibility.

Referring to fig. 16-22, a driving rod 2-6e and a buffer spring 2-7e are arranged below the vertical driving cylinder 2-5 e; the upper part of the mounting block 2-2e is provided with a connecting groove 2-2e 1; one end of the driving rod 2-6e is connected with a piston rod 2-5e1 on the driving cylinder, and the other end of the driving rod is embedded in the connecting groove 2-2e 1; the buffer springs 2-7e are sleeved on the driving rods 2-6e, one ends of the buffer springs 2-7e act on the piston rods 2-5e1, and the other ends of the buffer springs act on the upper ends of the mounting blocks 2-2 e. By arranging the driving rods 2-6e, the driving rods 2-6e can be driven to move downwards by the vertical driving cylinders 2-5e, and then the mounting blocks 2-2e are driven to move downwards; the buffer springs 2-7e can play a role in buffering when the suction head 2-1e moves downwards to adsorb or release the chip, and the impact force on the chip when the suction head 2-1e is driven to move downwards by the vertical driving cylinder 2-5e is reduced, so that the chip is protected.

Referring to fig. 16 to 22, the chip suction mechanism 2e further includes a guide assembly disposed between the mounting block 2-2e and the intermediate connection plate 2-3e for guiding the mounting block 2-2e to move on the intermediate connection plate 2-3e in a vertical direction, the guide assembly including a guide rail 2-8e vertically disposed in front of the intermediate connection plate 2-3e and a slider 2-9e disposed behind the mounting block 2-2e to be matched with the guide rail. Through the arrangement of the guide rails 2-8e and the sliding blocks 2-9e, when the sliding blocks move relative to the guide rails 2-8e, the stability of the sliding blocks 2-9e can be kept, meanwhile, the running stability of the chip suction mechanism 2e is guaranteed, and the positioning precision is improved.

Referring to fig. 16-22, each of the chip suction modules further includes a transverse sliding plate 4e, and the second vertical driving mechanism 3e is disposed on the transverse sliding plate 4 e; and a transverse guiding assembly for guiding the transverse sliding plate 4e to move on the cross beam 1-1e along the transverse direction is arranged between the transverse sliding plate 4e and the cross beam 1-1e, and the transverse guiding assembly comprises two transverse guide rails 5e arranged on the cross beam 1-1e in parallel and two transverse sliding blocks 6e arranged on the transverse sliding plate 4e and matched with the transverse guide rails 5e respectively. By the arrangement of the structure, stable operation of the chip carrying module on the cross beams 1-1e can be realized.

Referring to fig. 16-22, the second vertical driving mechanism 3e includes a vertical driving motor 3-1e, a vertical screw rod 3-2e, a vertical slider 3-3e, a vertical chute 3-4e and a vertical sliding plate 3-5 e; the vertical driving motor 3-1e is mounted on a motor mounting seat 3-6e, the motor mounting seat 3-6e is connected with the upper end of the vertical sliding chute 3-4e, the vertical sliding chute 3-4e is fixedly mounted on the horizontal sliding plate 4e, the vertical screw rod 3-2e is connected on a main shaft of the vertical driving motor 3-1e and is connected with the vertical sliding block 3-3e, the vertical sliding block 3-3e is arranged in the vertical sliding chute 3-4e, the vertical sliding block 3-3e is fixedly connected with the vertical sliding plate 3-5e, and the vertical sliding plate 3-5e is connected with the middle connecting plate 2-3 e. By adopting the structure, the second vertical driving mechanism 3e can drive the vertical slide blocks 3-3e to move upwards or downwards by driving the vertical screw rods 3-2e to rotate, so that the chip suction mechanism 2e is driven to move upwards or downwards, and the structure has high transmission precision, compact structure and stable operation.

Referring to fig. 16-22, the second lateral driving mechanism comprises a linear motor 7e disposed between two parallel lateral guide rails 5e, the stator 7-1e of the linear motor 7e is disposed on the cross beam 1-1e, and the rotor 7-2e is disposed on the lateral sliding plate 4 e. Through setting up linear electric motor, can drive chip transport module and carry out lateral motion on crossbeam 1-1e to realize chip lateral shifting on crossbeam 1-1e, so that place the chip with the chip accurately and place the top that the station corresponds, and this structure occupation space is little, and transmission precision is high.

Referring to fig. 16-22, a grating scale displacement sensor 8e is arranged between the beam 1-1e and the transverse sliding plate 4e, a grating reading head of the grating scale displacement sensor 8e is mounted on the upper portion of the transverse sliding plate 4e, and a scale grating is arranged on the beam 1-1 e. Through setting up grating chi displacement sensor 8e, can accurate detection second horizontal drive mechanism drive chip absorb the displacement of the lateral shifting of module.

Referring to fig. 16 to 22, the working principle of the second handling device E in the present invention is:

in the chip loading process, each chip carrying module is independently controlled, firstly, each chip suction module transversely moves to the position above a corresponding chip placing platform G under the driving of a second transverse driving mechanism until each suction head 2-1e on the chip suction mechanism 2e corresponds to the position of a chip on the chip placing platform G, then the chip suction mechanism 2e moves downwards under the driving of a second vertical driving mechanism 3e, the suction heads 2-1e slowly approach the chip until the suction heads 2-1e are in contact with the surface of the chip, the suction heads 2-1e suck the chip, then the suction heads 2-1e suck the chip are driven by the second vertical driving mechanism 3e to separate the chip from the chip placing platform G, and finally, each chip suction module sucking the chip is driven by the second transverse driving mechanism, respectively moving to the corresponding chip placing stations, sequentially releasing the chips adsorbed on the suction heads 2-1e into the chip storage grooves 1-1C of the positioning platform C, completing a feeding process, and continuously repeating the chip taking and placing processes to realize continuous operation.

(2-3) chip position adjusting device F

Referring to fig. 23 to 32, the chip position adjusting device F includes a chip placing device for placing a chip and a correcting device for correcting the position of the chip; the chip placing device comprises a placing seat 1 and a power mechanism for driving the placing seat 1 to rotate, wherein a chip groove 1-1 which is used for placing a chip and corresponds to the shape of the chip is formed in the upper part of the placing seat 1; the correcting device comprises two groups of correcting components and a correcting driving mechanism for driving the two groups of correcting components to do reciprocating motion of mutual approaching and mutual departing; each group of correction assemblies is arranged in an upper layer and a lower layer and comprises an upper layer correction piece 2 and a lower layer correction piece 3; the opposite ends of two upper layer correcting pieces 2 in the two groups of correcting components are provided with upper correcting ports 2-1 for correcting the position of a chip in a first direction; the opposite ends of two lower layer correcting parts 3 in the two groups of correcting components are provided with lower correcting ports 3-1 for correcting the position of the chip in the second direction; when the two upper correction ports 2-1 move relatively to the correction position, the edge of the chip facing the first direction is matched with the two upper correction ports 2-1; when the two lower correction ports 3-1 relatively move to the correction position, the edge of the chip facing the second direction is matched with the two lower correction ports 3-1; the chip at the corrected position is positioned above the chip slot 1-1.

Referring to fig. 23-32, the opposite ends of the two upper layer modifiers 2 are respectively provided with an upper modifier 2-2 matched with the two adjacent edges of the first oriented chip; the opposite ends of the two lower layer correcting parts 3 are respectively provided with a lower correcting part 3-2 which is matched with the two adjacent sides of the second oriented chip; the space formed by the two opposite upper correcting parts 2-2 forms the upper correcting opening 2-1; the space formed by the two opposite lower correction parts 3-2 forms the lower correction port 3-1, and the upper correction port 2-1 and the lower correction port 3-1 are arranged in a plurality of horizontal straight lines. The upper correcting part 2-2 and the lower correcting part 3-2 are oppositely arranged, so that the edge of the chip can be accurately contacted and extruded with the correcting part and the lower correcting part 3-2, the upper correcting port 2-1 and the lower correcting port 3-1 are accurately matched with the chip, and the effect of position correction is achieved; the upper correction port 2-1 and the lower correction port 3-1 are arranged in a plurality of numbers, so that the positions of a plurality of chips can be corrected simultaneously, and the working efficiency is improved.

Referring to fig. 23-32, the chip placement apparatus further includes a fixing plate 4, a mounting block 5 disposed above the fixing plate 4; a certain gap is formed between the fixing plate 4 and the mounting block 5, and the fixing plate 4 and the mounting block 5 are fixedly connected through a supporting component; the placing seats 1 are arranged in a plurality of straight lines and transversely arranged to penetrate through the mounting blocks 5 and are rotatably connected to the mounting blocks 5. By adopting the structure, the chip placing device has more stable structure and is convenient to disassemble and assemble in maintenance; place seat 1 and set up to a plurality of chips that can place, improve the efficiency of material loading.

Referring to fig. 23-32, the support assembly includes a support block 6 and a support bar 7; the supporting block 6 is fixed on the side edge of the mounting block 5; one end of the support rod 7 is fixedly connected to the lower end of the support block 6, and the other end of the support rod is fixedly connected to the fixing plate 4. Through the structure, the mounting block 5 is better fixed on the fixing plate 4, and the movable space between the mounting block 5 and the fixing plate 4 of the placing seat 1 and the power mechanism is ensured.

Referring to fig. 23 to 32, the power mechanism includes an adjusting driving motor 8 and a transmission assembly disposed between the adjusting driving motor 8 and the placing base 1; the adjusting driving motor 8 is fixedly connected to the fixing plate 4 through a fixing connecting piece 9; wherein, fixed connector 9 adopts the notch cuttype design, and this fixed connector 9's notch cuttype one end vertical fixation is in fixed plate 4 sides, the other end with adjust driving motor 8 fixed connection. The fixed connecting piece 9 adopts a step-shaped design, so that the force applied to the fixed plate 4 is divided into vertical and horizontal force, the force applied to the fixed piece is dispersed, the stability of the power mechanism is improved, and meanwhile, the mechanism is reasonable in design and more compact in structure; the adjusting driving motor 8 drives the placing seat 1 to rotate through the transmission assembly, and the function of adjusting the position of the chip is achieved.

Referring to fig. 23 to 32, the driving assembly includes a driving pulley 10 provided on the adjusting driving motor 8, a driven pulley 11 provided at a lower end of the placing seat 1, and a belt 12 for connecting the driving pulley 10 and the driven pulley 11. Through the structure, the adjusting driving motor 8 drives the driving belt wheel 10 to rotate, the driving belt wheel 10 drives the driven belt wheel 11 to rotate through the belt 12, so that the placing seat 1 is driven to rotate, further, the chip groove 1-1 on the placing seat 1 is driven to rotate, and position adjustment is achieved.

Referring to fig. 23 to 32, an adaptive mechanism is disposed between the driving pulley 10 and the driven pulley 11, and the adaptive mechanism includes an adaptive guide assembly, a connecting block 13, a connecting shaft 14, an adaptive pulley 15, and an adaptive spring 16; wherein the adaptive guide component comprises an adaptive guide rail 17 arranged at the side of the mounting block 5 and an adaptive sliding block 18 matched with the adaptive guide rail 17; the connecting block 13 is connected with the self-adaptive sliding block 18, one end of the connecting shaft 14 is connected with the connecting block 13, the other end of the connecting shaft is rotatably connected with the self-adaptive belt wheel 15, and the self-adaptive belt wheel 15 is connected with the belt 12; one end of the adaptive spring 16 acts on the connecting block 13, and the other end acts on the supporting block 6. By adopting the structure, the self-adaptive belt wheel has the advantages that the tightness of the belt 12 can be adjusted through the elasticity of the self-adaptive spring 16, when the belt 12 is too loose, the self-adaptive spring 16 pushes the connecting block 13 under the action of the elasticity of the self-adaptive spring, and moves along the direction of the self-adaptive guide rail 17 close to the belt 12 under the action of the guide assembly, the self-adaptive belt wheel 15 also moves along with the self-adaptive guide rail, continuously abuts against the belt 12, so that the belt 12 is in a tensioning state, and the transmission efficiency and the transmission precision.

Referring to fig. 23-32, the correcting device further includes a front correcting block 19, and a rear correcting block 20 disposed opposite to the front correcting block and having a gap with the front correcting block 19; the front correction block 19 and the rear correction block 20 are connected to the mounting block 5 at two ends in a sliding manner, and the two lower-layer correction pieces 3 are respectively and oppositely mounted on the front correction block 19 and the rear correction block 20. By adopting the structure, the front correction block 19 and the rear correction block 20 can be driven to move away from or close to each other by the correction driving mechanism, and the two groups of correction components are driven to move away from or close to each other.

Referring to fig. 23 to 32, a correction guide assembly for guiding the front correction block 19 and the rear correction block 20 to approach or depart from each other on the mounting block 5 is disposed between the front correction block 19, the rear correction block 20 and the mounting block 5, and the correction guide assembly includes two correction guide rails 21 disposed in parallel at two ends of the mounting block 5 and two correction sliders 22 respectively disposed on the front correction block 19 and the rear correction block 20 and respectively matched with the two correction guide rails 21; the correcting guide rail 21 is obliquely arranged on the mounting block 5, and the correcting guide rail 21 is parallel to the diagonal line of the upper correcting opening 2-1. Through the design of the correcting guide rail 21 and the correcting slide block 22, when the correcting slide block 22 moves relative to the correcting guide rail 21, the operation stability of the correcting slide block 22 can be kept, and meanwhile, the operation stability of the correcting device is ensured; the correcting guide rail 21 is parallel to the diagonal line of the upper correcting opening 2-1, and the advantage is that the correcting driving mechanism drives the front correcting block 19 and the rear correcting block 20 to be away from or close to each other along the diagonal line direction of the upper correcting opening 2-1, so that the two upper layer correcting pieces 2 and the two lower layer correcting pieces 3 are also away from or close to each other along the diagonal line direction of the upper correcting opening 2-1, and when the position is corrected, the upper correcting portion 2-2 and the lower correcting portion 3-2 are favorably contacted with the edge of a chip, and excessive extrusion to the chip is reduced, so that the chip is damaged.

Referring to fig. 23 to 32, the correction drive mechanism includes a correction cylinder 23 that drives the front correction block 19 and the rear correction block 20 away from each other and a correction spring 24 that drives the front correction block 19 and the rear correction block 20 toward each other; the correction cylinder 23 is connected with one end of the mounting block 5 through a cylinder mounting plate 25; a correction driving block 26 is arranged on the correction cylinder 23, one end of the correction driving block 26 is provided with an installation groove 26-1, and two sides of the installation groove 26-1 are respectively provided with a bearing 27; the front correction block 19 and the rear correction block 20 are respectively provided with a guide block 28 at the same end close to the correction cylinder 23; the two bearings 27 respectively act on the two guide blocks 28. Through the structure, the correction cylinder 23 drives the correction driving block 26 to move, so that the bearing 27 also moves along with the correction driving block, when the bearing 27 is in contact with the guide block 28, the bearing 27 rotates to respectively push the guide blocks 28, so that the guide blocks 28 respectively move outwards, and the front correction block 19 and the rear correction block 20 are driven to mutually move outwards under the guidance of the correction guide rail 21, and a space for placing a chip is reserved; the guide block 28 is rotationally pushed to move through the bearing 27, so that the bearing 27 and the guide block 28 are in soft contact, a certain buffering effect is achieved, the damage to a contact surface caused by hard contact is avoided, and the service life of the mechanism is prolonged.

Referring to fig. 23 to 32, the correcting spring 24 is disposed between the front correcting block 19 and the end of the rear correcting block 20, and one end of the correcting spring 24 acts on the front correcting block 19 and the other end acts on the rear correcting block 20. By arranging the correction spring 24, when the correction cylinder 23 drives the correction movable front correction block 19 and the correction movable rear correction block 20 to respectively move outwards along the correction guide rail 21, the two groups of correction components also move away from each other under the driving of the front correction block 19 and the correction movable rear correction block 20, when the correction components move to a certain distance, the chip with the adjusted position on the chip groove 1-1 is conveyed to the middle of the two groups of correction components, then the correction cylinder 23 retracts, at the moment, the front correction block 19 and the correction movable rear correction block 20 respectively move inwards under the tension of the correction spring 24, so that the two groups of correction components are driven to move inwards, the upper layer correction piece 2 or the lower layer correction piece 3 on the correction components are contacted with the chip to adjust the position and the angle of the chip, and after the position adjustment is finished, the correction driving mechanism drives the front correction block 19 and the correction movable rear correction block 20 to move outwards again, and (4) keeping the two groups of correction assemblies away from the chip, and then carrying the chip to the set position of the smart card plate 7 a.

Referring to fig. 23 to 32, the chip position adjusting device F of the chip feeding device further includes a base 29 and a transverse driving mechanism disposed on the base 29 for driving the chip placement device; the transverse driving mechanism comprises a transverse guiding component arranged between the base 29 and the fixing plate 4 and a transverse driving motor 30 arranged at one end of the transverse guiding component and used for driving the guiding component to move; wherein, the transverse guiding component comprises a sliding chute 31 arranged on the base 29 and a sliding block 32 arranged in the sliding chute 31 and matched with the sliding chute 31; the transverse driving motor 30 is connected with the sliding block 32 through a screw rod 33, and a threaded hole matched with the screw rod 33 is formed in the sliding block 32; an intermediate connecting plate 35 is arranged between the sliding block 32 and the fixed plate 4. By adopting the structure, the transverse movement of the chip placing device can be realized, and the slide block 32 is matched with the screw rod 33, so that the structure is simpler, the manufacture is convenient, and the cost is reduced.

Referring to fig. 23-32, a position sensor 34 is provided under the driven pulley 11 at one end of the mounting block 5. The rotation position of the driven pulley 11 can be identified through the position sensor 34, and then the rotation position of the placing seat 1 is identified, and the accurate rotation positioning of the chip position is realized.

Referring to fig. 23-32, the working principle of the position adjusting mechanism of the chip feeding device of the present invention is as follows:

during operation, two groups of correction assemblies are driven by the correction driving mechanism to move away from each other, and then two upper correction assemblies 2 and two lower correction assemblies 3 are driven to move away from each other until enough space is available for a chip to pass through an upper correction port 2-1 and a lower correction port 3-1, then the chip is moved into a chip groove 1-1 of a placing seat 1 from a chip placing platform G, when the chip is carried from the chip placing platform G, the direction of the chip is one, the orientation of the chip can be adjusted through the chip groove 1-1, the position of the chip is corrected after the adjustment is completed, the specific process is as follows:

when the chip of the produced smart card is the chip with the first orientation, if the orientation of the chip carried from the chip placing table G is the same as the first orientation, the chip slot 1-1 of the placing base 1 plays the function of intermediate storage, then the second carrying device E carries the chip on the placing base 1 to the middle of the two upper-layer correcting members 2, the correcting driving mechanism drives the two groups of correcting components to move inwards, the upper correcting ports 2-1 on the two upper-layer correcting members 2 approach to the chip and press the chip, so that the correcting ports 2-1 are matched with the edge of the chip, and the position of the chip is corrected, and the aim is that when the suction head 2-1E on the second carrying device E is contacted with the chip in the process of carrying the chip by the second carrying device E, the position of the chip is easy to deviate due to the small volume and light weight of the chip, the two groups of correction assemblies are driven to move by the correction driving mechanism, so that the posture of the chip is further corrected, the position precision of the chip is improved, and the chip can be smoothly placed in the chip storage groove 1-1C of the positioning platform C by the second carrying device E. After the position correction is completed, the correction driving mechanism drives the two groups of correction assemblies to move outwards, the upper correction ports 2-1 on the two upper correction pieces 2 also move away from the chip relatively, and then the chip after the correction is completed is carried to the set position of the intelligent card plate material, so that the chip feeding process in the first direction is completed.

When the chip of the produced smart card is a chip with a second orientation, because the orientation of the chip carried from the chip placing table G is different from the second orientation, when the chip is carried from the chip placing table G to the chip groove 1-1 on the placing seat 1, the placing seat 1 is driven to rotate under the action of the power mechanism, the chip groove 1-1 on the placing seat 1 is driven to rotate, the chip on the chip groove 1-1 is driven to rotate, when the chip rotates to the position consistent with the position of the chip with the second orientation, the driving is stopped, then the chip is carried to the middle of two lower layer correcting pieces 3, the correcting driving mechanism drives the two groups of correcting pieces to move inwards, the lower correcting ports 3-1 on the two lower layer correcting pieces 3 are close to the chip, so as to press the chip, the lower correcting ports 3-1 are matched with the edge of the chip, and the position of the chip is corrected, after the position correction is completed, the correction driving mechanism drives the two groups of correction assemblies to move outwards, the lower correction ports 3-1 on the two lower layer correction members 3 also move away from the chip relatively, and then the chip after the correction is completed is carried to the set position of the intelligent card plate material, so that the chip feeding process in the second direction is completed.

(2-4) third conveyance device H

Referring to fig. 33 to 38, the third carrying device H includes a support 1H disposed on the rack I, a carrying rack 2H disposed on the support 1H, a suction member 5H disposed on the carrying rack 2H, a rotation driving mechanism for driving the suction member 5H to rotate, and a third vertical driving mechanism for driving the suction member 5H to vertically move, where the number of the suction members 5H is four, and the suction members are uniformly arranged along the circumferential direction of the carrying rack 2H; each suction piece 5h comprises a suction nozzle fixing seat 5-1h and a suction nozzle 5-2h arranged on the suction nozzle fixing seat 5-1h, wherein a fixing plate 2-1h is arranged on the conveying frame 2h at a position corresponding to each suction piece 5h, the suction nozzle fixing seat 5-1h is arranged on the fixing plate 2-1h through a sliding connection structure 5-7h, and the sliding connection structure 5-7h is a sliding block and sliding rail mechanism.

Referring to fig. 33-38, an elastic buffer assembly is further disposed between the suction head fixing seat 5-1h and the fixing plate 2-1h, the elastic buffer component comprises guide blocks 5-6h arranged at the lower end of the fixing plate 2-1h, guide rods 5-5h arranged on the guide blocks 5-6h and springs 5-4h, wherein the guide rod 5-5h is vertically arranged, the suction head fixing seat 5-1h is provided with a guide hole matched with the guide rod 5-5h at the position corresponding to the guide rod 5-5h, the spring 5-4h is sleeved on the guide rod 5-5h, the upper end of the spring 5-4h acts on the lower end of the suction head fixing seat 5-1h, and the lower end of the spring acts on the guide block 5-6 h.

Referring to fig. 33-38, the third vertical driving mechanism includes a cylinder fixing seat 3h disposed on the support 1h, a cylinder 4h disposed on the cylinder fixing seat 3h, and a pressure block 5-3h disposed on the suction head fixing seat 5-1h of each suction member 5h, wherein, the number of the cylinders 4h is two, and the two cylinders are respectively positioned at the upper end of the discharge chute 1G of the chip placing platform G and the upper end of the chip position adjusting device F, when the cylinder 4h drives the piston rod to move downwards, the piston rod of the cylinder 4h is contacted with the bearing block 5-3h on the suction head fixing seat 5-1h, and pushing the suction head fixing seat 5-1h and the suction nozzle 5-2h arranged on the suction head fixing seat 5-1h to move downwards, thereby realizing the suction of the chip in the discharge chute 1G of the chip placing table G. When the suction nozzle 5-2h sucks the chip, the cylinder 4h drives the piston rod to move upwards, the suction head fixing seat 5-1h moves upwards under the action of the elastic force of the spring 5-4h, and therefore the suction nozzle 5-2h and the chip sucked by the suction nozzle 5-2h are driven to move upwards, and the chip taking action is completed. Similarly, the process of placing the chip on the chip position adjusting device F is consistent with the material taking process.

Referring to fig. 33-38, the rotary driving mechanism includes a rotary motor fixing seat 7g disposed on the rack I, a rotary motor 6h disposed on the rotary motor fixing seat 7g, and a rotating shaft 5-10h vertically disposed on the carrier 2h, wherein a main shaft of the rotary motor 6h is connected to one end of the rotating shaft 5-10h, the rotating shaft 5-10h is mounted on the carrier 2h, and the other end of the rotating shaft 5-10h is rotatably connected to the bracket 1 h. The rotating shaft is driven to rotate for 5-10h through the rotating motor 6h, so that the conveying frame is driven to rotate for 2h, the chip is conveyed to the position above the chip position adjusting F from the position above the chip placing table G, and the chip is transferred.

Referring to fig. 33-38, the rotary driving mechanism further includes a third detecting mechanism for detecting a rotation angle of the carrier 2h, the third detecting mechanism includes rotating discs 5-9h disposed on the rotating shafts 5-10h and third photoelectric sensors 5-8h disposed on the rotating motor fixing base 7g, the rotating discs 5-9h are located between detection ports of the third photoelectric sensors 5-8h, and notches are disposed on the rotating discs 5-9 h. When the third sensor detects a gap on the rotating disc 5-9h, the control system controls the rotating motor 6h to stop working, so that the suction piece 5h is ensured to move to the position above the discharge chute 1G of the chip placing table G or the position of the chip F, the chip is sucked and unloaded, and the chip conveying precision is ensured.

Correspondingly, as the suction pieces 5h in the conveying frame 2h are four groups, the notches on the rotating discs 5-9h are four, and the included angle between every two adjacent notches is 90 degrees, in the process that the rotating discs 5-9h synchronously rotate along with the conveying frame 2h, every time the conveying frame 2h rotates by 90 degrees, the third photoelectric sensor 5-8h detects one notch, and the rotating motor 6h is controlled to stop working through the control system, so that the rotating angle (the rotating angle is 90 degrees) of the conveying frame 2h is accurately controlled, and the chip conveying precision is improved.

Referring to fig. 33 to 38, the third carrying device H of the present invention has the following working principle:

during the during operation, the chip is placed platform G and is carried the chip to this chip and place the blown down tank 1G in the platform G, and then, rotary driving mechanism drives the transport frame 2h and rotates for the top of blown down tank 1G is moved to the piece of gettering 5h, and then, the vertical motion is done to the piece 5h of the drive of third vertical driving mechanism, thereby absorbs the chip. Then, the rotary driving mechanism drives the suction piece 5h to rotate, so that the suction piece 5h and the adsorbed chip move to the position above the chip position adjusting device F, the third vertical driving mechanism drives the suction piece 5h to vertically move, so that the chip is placed in the chip groove 1-1 in the placing seat 1 of the chip position adjusting device F, and the chip is transferred between the chip placing table G and the chip position adjusting device F.

(3) Conveying device

(3-1) positioning platform C

Referring to fig. 39-42, a positioning platform C of the present invention includes a substrate 1C, the substrate 1C is divided into a plurality of winding positions 2C, the winding positions 2C are arranged in a matrix on the substrate 1C, and the winding positions 2C correspond to the winding units on the sheet material 7a one-to-one; each winding card position 2c is provided with a chip storage groove 1-1c for storing a chip, and the chip storage grooves 1-1c in the winding card position 2c correspond to the chip placement positions on the winding card units in the plate material 7a one by one.

Referring to fig. 39 to 42, the base plate 1c is provided with a first suction port 1-2c at a lower end of the chip storage groove 1-1c, and the first suction port 1-2c is communicated with an external negative pressure device. Therefore, the chips are adsorbed in the chip storage grooves 1-1c through vacuum pumping of the negative pressure device, so that the chips are prevented from being deviated due to other factors (such as vibration) in the subsequent processing process and are always positioned at the chip placement positions of the corresponding winding card units in the plate 7a, the chip welding precision is improved, and the production quality of the non-contact smart card is ensured.

Referring to fig. 39-42, the base plate 1c is further provided with a plurality of second positioning pins 1-3c for positioning the sheet material 7a, and the sheet material 7a is provided with positioning holes 7-1a matched with the second positioning pins 1-3c at positions corresponding to the second positioning pins 1-3 c. Its aim at, the utility model provides a location platform C not only can realize fixing a position the chip, can also fix a position sheet material 7a, and concrete process is: firstly, first handling device A carries sheet material 7a to the utility model discloses a location platform C on, and make locating hole 7-1a on the sheet material 7a pass second locating pin 1-3C on the location platform C, because second locating pin 1-3C have many, corresponding, locating hole 7-1a on the sheet material 7a also has a plurality ofly, just so can the accurate displacement that takes place the horizontal direction of restriction sheet material 7a in a plurality of location. The advantage of adopting above-mentioned structure lies in: (1) the positioning of the chip and the plate 7a can be realized firstly through the positioning platform C, then the winding card unit of the plate 7a is wound, and finally the chip and the lead led out by the coil on the winding card unit are welded. Therefore, compared with the traditional processing mode of a non-contact smart card production line, the mode has the advantages that the plate 7a and the chips are positioned before winding, so that the plate 7a can be prevented from being deviated in the winding process, the chip placing positions on the plate 7a correspond to the chips one to one, the chip welding precision is improved, and the production quality of the non-contact smart card is ensured. (2) Because the plate 7a and the chip are positioned on the positioning platform C before winding, the chip and the plate 7a are prevented from shifting in the subsequent processing process, and the welding precision of the chip and the production quality of the non-contact smart card are further improved.

In this embodiment, two second positioning pins 1 to 3c are provided, the two second positioning pins 1 to 3c are disposed at two ends of the substrate 1c on the same side, and correspondingly, two positioning holes 7 to 1a of the plate material 7a are also provided.

Referring to fig. 39-42, a plurality of second air suction openings 2-1c are formed around the bobbin clip 2c, and the second air suction openings 2-1c are uniformly arranged along the outer contour line of the bobbin clip 2 c; each second air suction opening 2-1c is communicated with an external negative pressure device. Therefore, the plate 7a is adsorbed on the surface of the substrate 1c by vacuumizing through the negative pressure device, and the plate 7a is prevented from being deviated in the processing process. And because every wire winding screens 2C on the base plate 1C are all provided with the second inlet scoop 2-1C all around, the second inlet scoop 2-1C is along the outer contour line uniform arrangement of wire winding screens 2C, just so can guarantee wire winding screens 2C on the base plate 1C and the wire winding card unit on the sheet material 7a one-to-one correspondence, also mean to leave the chip on the locating platform C and the chip on the sheet material 7a places the position one-to-one correspondence at the same time, thereby further improve the positioning accuracy of sheet material 7 a.

Referring to fig. 39-42, the substrate 1c is divided into 25 wire winding position clips 2c by the second air suction openings 2-1c disposed on the substrate 1c, and the 25 wire winding position clips 2c are arranged on the substrate 1c in a matrix of 5 × 5. Correspondingly, the number of the winding card units on the plate 7a is also 25, and the winding card units are also arranged on the plate 7a in a matrix of 5x 5.

Referring to fig. 39 to 42, the base plate 1c includes an upper plate 1-4c and a lower plate 1-5c, the upper plate 1-4c is connected to the lower plate 1-5c by a screw thread, an inner cavity is disposed between the upper plate 1-4c and the lower plate 1-5c, and the inner cavity is communicated with the first air suction port 1-2c and the second air suction port 2-1 c. Therefore, air in the inner cavity of the substrate 1c is pumped out through the negative pressure device, so that the air pressure in the inner cavity is smaller than the atmospheric pressure, and therefore, the chip and the plate 7a on the surface of the substrate 1c are pressed on the surface of the substrate 1c under the action of the atmospheric pressure, and the chip and the plate 7a are prevented from being deviated in the processing process. In addition, the first air suction openings 1-2c and the second air suction openings 2-1c are communicated with the inner cavity, so that the same adsorption force of the first air suction openings 1-2c and the second air suction openings 2-1c on the chip and the plate 7a can be ensured.

Referring to fig. 39-42, the working principle of the positioning platform C of the present invention is:

during operation, through the utility model discloses a location platform C can realize the location to the chip, and concrete process is: the second carrying device E carries the chips into the chip storage grooves 1-1C of the winding clamping positions 2C of the positioning platform C in sequence, then the sheet material 7a carrying device carries the sheet material 7a into the positioning platform C, a plurality of winding card units are arranged on the sheet material 7a, the winding card units correspond to the winding clamping positions 2C on the sheet material 7a one by one, and each winding card unit corresponds to one non-contact intelligent card. And because each winding card position 2C on the positioning platform C is provided with a chip storage groove 1-1C, the chip storage groove 1-1C corresponds to the chip placement position of the corresponding winding card unit in the plate material 7 a. After chip and sheet material 7a realized the location on positioning platform C, drive through conveying mechanism D the utility model provides a positioning platform C moves wire winding station department, winds on each wire winding card unit on sheet material 7a through winding device J, draws forth the solder joint contact on two wires and the chip at last. And then, the conveying mechanism D continues to drive the positioning platform C to move to a chip welding station, the chip welding device K welds the wire with a welding spot on the chip, and finally, the conveying mechanism D continues to drive the positioning platform C, the chip placed on the positioning platform C and the plate 7a to reach a subsequent processing station so as to complete a subsequent processing procedure.

In the process, the chip and the plate 7a are accurately positioned on the positioning platform C before winding, so that the chip and the plate 7a cannot deviate in the winding process, the lead led out from the coil in each winding card unit can be in contact with the welding point of the chip after winding, the welding point of the chip can be smoothly welded with the lead led out by the chip welding device K, the welding precision is improved, and the production quality of the non-contact intelligent card is improved. In addition, because the chip all has been placed in positioning platform C's chip storage tank 1-1C before the wire winding, and traditional non-connects smart card manufacturing line and then places position department with the chip of carrying the wire winding card unit on sheet material 7a one by one after the wire winding is accomplished, consequently, compare in traditional chip transport mode, the utility model discloses a positioning platform C can save the time that non-contact smart card manufacturing equipment made a round trip to carry the chip and spent, improves the production efficiency of non-contact smart card manufacturing equipment.

(3-2) conveying mechanism D

The conveying mechanism D in this embodiment may adopt an existing conveying structure on the market, for example, a mode in which a motor is combined with a screw rod transmission mechanism, or a mode in which a motor is combined with a synchronous belt transmission mechanism, or a mode in which a motor is combined with a rack-and-pinion transmission mechanism, and a mode in which a motor is combined with a screw rod transmission mechanism is adopted in this embodiment.

(4) Winding device J

The specific structure of the winding device J in this embodiment can be implemented by referring to the winding device J in the "a non-contact smart card manufacturing line" disclosed in the invention patent application with application publication No. CN 108000909A.

(5) Chip welding device K

The specific structure of the die bonding apparatus K in this embodiment can be implemented by referring to the winding apparatus J in the "one kind of non-contact smart card manufacturing line" disclosed in the invention patent application with application publication No. CN 108000909A.

Example 2

Referring to fig. 43, the present embodiment is different from embodiment 1 in that the vertical driving assembly of the positioning assembly 5a in the first handling device a in the present embodiment may be in another form, and the vertical driving assembly includes a slider-slide mechanism and the spring 5-4 a; the sliding block and sliding rail mechanism comprises a positioning guide sliding rail 5-5a and a positioning sliding block 5-6a matched with the positioning guide sliding rail 5-5 a; the upper end of the guide sliding rail is connected with the mounting frame 2a, the positioning piece 5-1a is fixed at the lower end of the positioning sliding block 5-6a through a connecting piece 5-7a, the lower portion of the positioning guide sliding rail 5-5a is also provided with a limiting portion 5-21a used for limiting the position of the positioning sliding block 5-6a, the spring 5-4a is arranged between the mounting frame 2a and the positioning sliding block 5-6a, one end of the spring 5-4a acts on the first rack 1a, and the other end of the spring acts on the positioning sliding block 5-6 a. The slide block and slide rail mechanism can also ensure the running stability of the positioning piece 5-1a in the positioning process, and the bottom surface of the positioning piece 5-1a is better abutted against the plate 7a, thereby improving the positioning precision.

Example 3

Referring to fig. 44, the difference between this embodiment and embodiments 1 and 2 is that the first vertical driving mechanism 6a in the first carrying device a in this embodiment may be another form, the transmission assemblies of the lead screws 6-3a are a set, the first driven driving wheel 6-6a is disposed on the vertical fixing seat 6-2a, and a guide pillar and guide bush mechanism for guiding the mounting frame 2a to move up and down is disposed between the mounting frame 2a and the vertical fixing seat 6-2a, where the guide pillar and guide bush mechanism is a plurality of sets, and the plurality of sets of guide pillar and guide bush mechanisms are distributed around the mounting frame 2 a; each group of guide post and guide sleeve mechanism comprises a guide post 6-9a and a guide sleeve 6-10a matched with the guide post 6-9a, one end of the guide sleeve 6-10a is fixed on the vertical fixed seat 6-2a, one end of the guide post 6-9a is fixed on the mounting frame 2a, and the other end of the guide post extends vertically upwards and penetrates through the guide sleeve 6-10 a; the screw rod 6-3a of the screw rod 6-3a transmission assembly is connected with the first driven driving wheel 6-6a, the vertical motor 6-1a is arranged on the vertical fixed seat 6-2a, the first driving wheel 6-5a is arranged on a main shaft of the vertical motor 6-1a, the first driving wheel 6-5a is connected with the first driven driving wheel 6-6a through the first transmission belt 6-7a, and the screw rod nut 6-4a is arranged on the mounting frame 2a and is matched with the screw rod 6-3 a. Through the structure, the vertical motor 6-1a drives the screw rod 6-3a to rotate, so that the screw rod nut 6-4a is driven to vertically move on the screw rod 6-3a, the vertical fixed seat 6-2a is driven to vertically move, the mounting frame 2a is driven to vertically move, and the sucker component 4a and the positioning component 5a vertically move; through the arrangement of the guide pillar and guide sleeve mechanism, the stability of vertical motion between the vertical fixed seat 6-2a and the mounting frame 2a is guaranteed, and therefore the stability of the sucker assembly 4a and the positioning assembly 5a in the vertical motion process is guaranteed.

Example 4

Referring to fig. 45, the present embodiment is different from embodiment 1 in that the second transverse driving mechanism in the second carrying device E in the present embodiment may also be a transverse driving motor 9E and a screw transmission assembly, where the screw transmission assembly includes a transverse screw 11E, a transverse slider 12E, and a transverse chute 10E; the transverse driving motor 9e is mounted on a transverse motor mounting seat 13e, the transverse motor mounting seat 13e is fixedly connected with one end of a transverse sliding groove 10e, the transverse sliding groove 10e is fixedly mounted on the cross beam 1-1e, the transverse screw rod 11e is connected to a main shaft of the transverse driving motor 9e and is connected with a transverse sliding block 12e, the transverse sliding block 12e is connected with the transverse sliding plate 4e, and the transverse sliding block 12e is arranged in the transverse sliding groove 10 e. Through setting up horizontal driving motor 9e and lead screw runner assembly, can realize the chip and absorb the transverse motion of module, and simple structure, the transmission is effectual.

The above is the preferred embodiment of the present invention, but the embodiment of the present invention is not limited by the above, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be equivalent replacement modes, and all are included in the scope of the present invention.

Claims (10)

1. A non-contact intelligent card manufacturing device comprises a frame, a sheet material feeding device, a chip feeding device, a winding device, a chip welding device and a conveying device, wherein the sheet material feeding device, the chip feeding device, the winding device and the chip welding device are arranged on the frame, the conveying device is used for conveying a sheet material in the sheet material feeding device and a chip in the chip feeding device to the winding device and the chip welding device in sequence,

the conveying device comprises a plurality of positioning platforms arranged on a rack and a conveying mechanism used for driving the positioning platforms to move independently, wherein the positioning platforms are arranged in parallel, each positioning platform comprises a substrate, the substrate is divided into a plurality of winding screens, and the winding screens are arranged on the substrate in a matrix manner; the winding clamping positions correspond to the winding clamping units on the plate material one by one; each winding card position is provided with a chip storage groove for storing a chip, and the chip storage grooves in the winding card positions correspond to the chip placement positions in the winding card units one by one;

the sheet material loading device comprises a sheet material placing table and a first carrying device for carrying the sheet material in the sheet material placing table to the positioning platform;

the chip feeding device comprises a chip placing table and a second carrying device used for carrying the chips in the chip placing table to the chip storage grooves in the positioning platform.

2. The contactless smart card manufacturing apparatus according to claim 1, wherein a plurality of first positioning pins are provided on the sheet placing table, and the sheet is provided with positioning holes at corresponding positions of the first positioning pins; and a second positioning pin is arranged on the substrate at a position corresponding to the positioning hole of the plate.

3. The apparatus for manufacturing a contactless smart card according to claim 2, wherein the substrate is provided with a first air suction opening at a lower end of the chip storage slot, and a plurality of second air suction openings are provided around the bobbin clamps, and the plurality of second air suction openings are arranged along an outer contour line of the bobbin clamps; and the first air suction opening and the second air suction opening are communicated with an external negative pressure device.

4. The contactless smart card manufacturing apparatus according to claim 3, wherein the first carrying device includes a first frame, a sheet carrying mechanism provided on the first frame, and a first lateral driving mechanism that drives the sheet carrying mechanism to reciprocate between a pre-carrying station and a post-carrying station of a sheet; the plate material carrying mechanism comprises a mounting frame, a sucker assembly arranged on the mounting frame, at least two groups of positioning assemblies and a first vertical driving mechanism for driving the sucker assembly and the positioning assemblies to do vertical motion; the sucker assembly comprises a plurality of suckers for sucking the sheet material, and the positioning assembly comprises a positioning piece for positioning the positioning hole part of the sheet material; the positioning piece is provided with an avoiding groove for avoiding the first positioning pin or the second positioning pin, and the bottom surface of the positioning piece is also provided with a suction hole for adsorbing the surrounding part of the positioning hole of the plate.

5. The apparatus of claim 4, wherein the number of the suction holes is plural, and the plural suction holes are centered on the axis of the avoiding groove and are uniformly distributed along the circumferential direction of the avoiding groove.

6. The contactless smart card manufacturing apparatus according to claim 5, wherein a bottom surface of the positioning member is lower than a bottom surface of the suction cup.

7. The contactless smart card manufacturing apparatus according to claim 3, wherein the second handling device includes a second rack and at least two chip handling modules provided on the second rack; each chip carrying module comprises a chip suction module and a second transverse driving mechanism for driving the chip suction module to transversely move on the rack; the second rack comprises a transverse beam, and the chip carrying modules are transversely arranged on the transverse beam and are in sliding connection with the transverse beam; the chip suction module comprises a plurality of groups of chip suction mechanisms which are arranged in parallel and a second vertical driving mechanism for driving the chip suction mechanisms to move vertically; the chip suction mechanism comprises a suction head for sucking the chip and a mounting block for mounting the suction head, and the mounting block is connected with the second vertical driving mechanism.

8. The contactless smart card manufacturing apparatus according to claim 1, wherein the chip feeding device further includes a chip position adjusting device for correcting a chip position provided between the chip placing table and the second carrying device, and a third carrying device for carrying the chip in the chip placing table to the chip position adjusting device, wherein,

the chip position adjusting device comprises a chip placing device for placing a chip and a correcting device for correcting the position of the chip, wherein,

the chip placing device comprises a placing seat and a power mechanism for driving the placing seat to rotate, and a chip groove which is used for placing a chip and corresponds to the chip in shape is formed in the upper part of the placing seat;

the correcting device comprises two groups of correcting components and a correcting driving mechanism for driving the two groups of correcting components to do reciprocating motion of mutual approaching and mutual departing; each group of correction assemblies is arranged in an upper layer and a lower layer and comprises an upper layer correction piece and a lower layer correction piece; the opposite ends of two upper layer correcting pieces in the two groups of correcting components are provided with upper correcting openings for correcting the position of the chip in the first direction; the opposite ends of two lower layer correcting parts in the two groups of correcting components are provided with lower correcting ports for correcting the position of the chip in the second direction; when the two upper correction ports move to the correction positions relatively, the edge of the chip facing the first direction is matched with the two upper correction ports; when the two lower correction ports move to the correction positions relatively, the edge of the chip facing the second direction is matched with the two lower correction ports; the chip at the corrected position is positioned above the chip groove.

9. The contactless smart card manufacturing apparatus according to claim 8, wherein the third handling device includes a support frame provided on the rack, a handling frame provided on the support frame, suction members provided on the handling frame, a rotation driving mechanism for driving the suction members to rotate, and a third vertical driving mechanism for driving the suction members to vertically move, wherein the number of the suction members is four, and the suction members are uniformly arranged along a circumferential direction of the handling frame; each suction piece comprises a suction nozzle fixing seat and a suction nozzle arranged on the suction nozzle fixing seat, wherein a fixing plate is arranged on the conveying frame at a position corresponding to each suction piece, and the suction nozzle fixing seats are arranged on the fixing plates through sliding connection structures.

10. The apparatus for manufacturing a contactless smart card according to claim 9, wherein an elastic buffer assembly is further disposed between the nozzle holder and the fixing plate, the elastic buffer assembly includes a guide block disposed at a lower end of the fixing plate, a guide rod disposed on the guide block, and a spring, wherein the guide rod is disposed vertically, the suction head holder is provided with a guide hole engaged with the guide rod at a position corresponding to the guide rod, wherein the spring is sleeved on the guide rod, an upper end of the spring acts on a lower end of the nozzle holder, and a lower end of the spring acts on the guide block.

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