KR101341399B1 - A turret picker device - Google Patents
A turret picker device Download PDFInfo
- Publication number
- KR101341399B1 KR101341399B1 KR1020130098355A KR20130098355A KR101341399B1 KR 101341399 B1 KR101341399 B1 KR 101341399B1 KR 1020130098355 A KR1020130098355 A KR 1020130098355A KR 20130098355 A KR20130098355 A KR 20130098355A KR 101341399 B1 KR101341399 B1 KR 101341399B1
- Authority
- KR
- South Korea
- Prior art keywords
- shaft
- adsorption
- coupled
- fixed
- hole
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
- G01R31/2603—Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
Abstract
Description
The present invention relates to a turret picker device, and more specifically, it is possible to quickly and accurately achieve the adsorption fixation and rotational movement arrangement of the material, as well as the front, rear, right, left and right correction through the first, second and third eccentric control. Regardless of the size of the material can be easily moved and disposed, it relates to a turret picker device that can easily perform maintenance according to failure and damage.
In general, in order to make a semiconductor chip with an integrated circuit, a number of processes and complicated and complicated processes are required. When strips of a predetermined size are stacked in a magazine and supplied to a sawing unit one by one, as shown in FIG. The cutting is cut by size by the well-known technique.
Then, the cut materials are removed by the spraying method of air and water in the washing unit, foreign matters of the cutting unit are removed, and if the inspection unit is checked for defects and the data is stored in the computer, it is sent to the turntable and sent to the transfer unit by the robot.
At this time, the materials transferred to the conveying unit are classified into good or bad according to the data of whether the defect is included in the inspection unit, and a certain number is placed on the tray illustrated in FIG. 2. The tray feed drawer, which is replaced with a tray, goes to the next process.
Therefore, a means for transferring the materials classified as defective or non-defective goods to the tray supply drawer must be provided, and the prior art for the material classification transfer means for picking up a predetermined size of materials by using a vacuum hose using a negative pressure one by one Next, the robot is moved to a tray using a robot. When a certain number is collected on the tray, a means for transferring the tray to the next process has been applied.
Here, the important thing in the semiconductor chip manufacturing process is that there should be no defective products, and the production speed should be very fast to meet the production cost of many small sized materials and increase the work efficiency. Since the means of picking up and transporting to the next process have been limited, the production speed is limited, and because of this, there is a problem that the production efficiency is low compared to the work, and the cost is increased in the maintenance of the equipment.
On the other hand, as in the Republic of Korea Patent Application Publication No. 10-2012-0103818 has developed the LED package inspection and classification device for the inspection and classification of the LED package, it was also possible to sequentially transfer the LED package through the transfer device .
However, the above-described conventional LED package inspection and sorting apparatus includes one first picker for moving the LED package to the fixed block of the rotating table, and dropping the completed LED package into the LED insertion hole by being moved through the first picker. It was composed of one second picker, that is, two pickers to inspect and retrieve the LED package, making it impossible to move the LED package and the material at high speed.
Accordingly, the present applicant has a turret picker device comprising a plurality of rotational adsorption means and a lifting and lowering operation part disposed at upper portions of the adsorption means to elevate the adsorption means so as to speed up inspection and recovery due to rapid movement of materials. Was developed.
The turret picker device of the present invention can easily achieve the adsorption fixation of materials by lowering the adsorption means through the pressure member of the elevating operation portion which is lifted and operated by the eccentric rotating body, as well as by the lifting spring configured in the adsorption means. The object of the present invention is to achieve the upward movement, and to move the upwardly moved material by the adsorption means rotating around the rotating body, so that the material for the vision inspection can be quickly moved and placed.
In addition, the present invention can be installed on the pressure member to prevent the shock applied to the material when the adsorption means is lowered by the shock absorbing spring, and the lifting height limiting portion is configured by the material lifting adsorption adsorption unit is always placed quickly to the same position It is an object to provide a turret picker device that can be prevented from malfunction due to material movement arrangement.
In addition, the present invention can achieve the front, rear, left and right movement correction of the suction means through the first, second eccentric control, and at the same time the lifting movement correction of the pressure protrusion can be achieved through the third eccentric control of the material to be moved It is an object of the present invention to provide a turret picker device that can be easily moved regardless of size and is easy to maintain.
The present invention for achieving the above object is fixed to the rotating body is coupled to the rotating rotating plate, and the suction fixed conveying unit is composed of a plurality of adsorption means coupled to the rotating plate at a predetermined angle intervals and the lifting spring is installed; Located in the upper portion of the adsorption means through the mounting bracket, coupled to the eccentric rotation body eccentric rotation by the drive motor, the lifting operation unit for lifting up and down vertically; consisting of, the adsorption means of the adsorption fixed transport portion Silver, the first installation bar is fixed to the rotating plate, the second installation bar is fixed to the first installation bar, the first through-hole is formed, and the protrusion is formed on the outer periphery is seated on the second installation bar, the lower first A hollow guide portion protruding to be fitted into the through hole, the hollow guide portion protruding from the first guide, a fastening member fixed to the second installation bar to secure the hollow guide portion, and the hollow guide portion The material lifting adsorption part inserted into the lifting device and forming an adsorption hole for material adsorption, and is fixed to the upper end of the material lifting adsorption part, and is connected to the adsorption hole). Provided is a turret picker device characterized in that the air intake operation unit is configured with a configuration, and the lifting spring is installed in close contact between the fastening member and the intake operation unit in a state of being fitted to the first guide of the hollow guide portion.
The present invention can easily achieve the adsorption fixation of the material by lowering the adsorption means through the pressure member of the elevating operation unit lifting up and down by the eccentric rotating body, as well as to achieve the upward movement of the material through the lifting spring configured in the adsorption means And it can be rotated to move the material moved up by the suction means rotates around the rotating body has the advantage that can quickly move the material to achieve the vision inspection.
In addition, the present invention can be installed on the pressure member to prevent the shock applied to the material when the adsorption means is lowered by the shock absorbing spring, and the lifting height limiting portion is configured by the material lifting adsorption adsorption unit is always placed quickly to the same position As it can be done, there is an advantage that the malfunction due to the movement of the material is prevented.
In addition, the present invention can achieve the front, rear, left and right movement correction of the suction means through the first, second eccentric control, and at the same time the lifting movement correction of the pressure protrusion can be achieved through the third eccentric control of the material to be moved It is a useful invention that can be easily moved regardless of size and is easy to maintain.
1 is a flow chart showing the overall process of a conventional semiconductor equipment.
2 is an exemplary view of a tray in which materials to be a conventional semiconductor chip are placed.
Figure 3 is a perspective view showing a vision inspection system installed turret picker device of the present invention.
Figure 4 is a partially enlarged view showing the main portion of the turret picker device of the present invention.
Figure 5 is an exploded perspective view of the rotating motor and the rotating body and the rotating plate and the adsorption fixed feed portion and the installation bracket of the present invention.
Figure 6 is a perspective view showing a partially exploded adsorption fixed feed portion of the present invention.
7 is a perspective view showing the adsorption means of the present invention.
8 is a cross-sectional view showing an adsorption fixed feed unit of the present invention.
9 is a perspective view showing the lifting operation unit of the present invention.
10 is a cross-sectional view showing the lifting operation unit of the present invention.
11 is an operation sectional view showing a state in which the vertical movable body of the present invention is moved upward.
12 is an operation sectional view showing a state in which the vertical movable body of the present invention is moved downward.
Hereinafter, the structure of the present invention will be described.
3 to 4, the material is coupled to the rotating
First, the adsorption fixed
In addition, the suction
In addition, each of the adsorption means 100 is the
First, the
Therefore, it is preferable that a
Second, the
Third, the
In addition, the
Fourth, the
Therefore, when the fastening
Here, the fixed coupling of the
Fifth, the material elevating
To this end, the material lifting and
In addition, the
Sixth, the
Here, the fastening and fixing of the
To explain this in more detail, a hole (not shown) is formed in the
Seventh, the lifting
In addition, a groove in which the upper portion of the elevating
In addition, in the present invention, the lifting
Here, the fixing
In addition, the
Here, the adjusting
In addition, the
On the other hand, in the present invention, it is preferable to further include a configuration to achieve a correction by fine-adjusting the adsorption means 100 in front, rear, left and right, which is the
In more detail, the first
In addition, a rectangular
Here, the
Accordingly, when the first
In addition, the second
In addition, a rectangular
Therefore, when the second
In addition, the
In addition, the lifting operation unit is located in the upper portion of the adsorption means 100 through the
First, the
Second, the
Third, the eccentric
Fourth, the vertical
Here, the
Fifth, the
Accordingly, when the
Sixth, the pressing
First, the
In addition, a
In addition, the
In addition, the
In addition, the
Therefore, according to the
On the other hand, in the present invention, it is preferable to further include a configuration to achieve a correction by fine-adjusting the
First, the third eccentric control opening 410 is composed of a
In addition, in order to couple the third
In addition, the stepped
Therefore, when the third
In addition, coupling the
In addition, the lower portion of the
In addition, the elevating
Hereinafter will be described the operation according to the preferred embodiment of the present invention as described above.
First, when the driving
Therefore, the pressing
When the
After the above operation is performed, the eccentric
Accordingly, since the force for pressing the material
Thereafter, the
Therefore, the drive of the above-described
DESCRIPTION OF
10, 20: 1st, 2nd installation bar 11: 2nd groove 21: 1st through hole 23: insertion hole
30: hollow guide portion 31: fitting hole 33: protrusion 35: first guider
40: fastening member
50: material lifting adsorption part 51: adsorption hole 53: lifting shaft 55: fastener 57: lifting fastening part 59: adsorption part
60: intake operation unit 61: intake connector 63: fastening pin
70: lifting
81, 91: 1st, 2nd axis 82, 92: 1st, 2nd eccentric cam
100: adsorption means
110: fixing part 111: second through hole 120: adjustment protrusion 130: guide rod
200: adsorption fixed transfer part 300: lifting operation part
310: bonding bracket
311: mounting bracket 313: coupling hole 315: support member
320: drive motor 321: drive shaft 330: eccentric rotating body
331: insertion groove 333: bearing 335: eccentric shaft
340: vertical moving body 341: linear bearing 343: coupling shaft 345: insert
350: connection link
360: Pressing part 361: Spring receiving 363: Center hole 365: Pressing shaft 367: Bolt assembly
370: pressure protrusion 371: groove 373: moving hole 375: stepped groove
380: buffer spring
390: buffer guide portion 393: second guider 395: fixed jaw
400: pressure member 410: third eccentric control
411: third axis 412: third eccentric cam 413: ring member
500: turret picker device 1000: vision inspection system
Claims (8)
Adsorption fixation consisting of a plurality of adsorption means (100) coupled to the rotating body (5) is fixed to the rotating plate and rotates, and coupled to the rotating plate (9) at predetermined angle intervals and the lifting spring (70) is installed. Transfer unit 200;
Located in the upper portion of the adsorption means 100 through the installation bracket 311, is coupled to the connection link 350 to the eccentric rotation body 330 eccentrically rotated by the drive motor 320 ascending and lifting vertically Actuator 300; consisting of,
Adsorption means 100 of the adsorption fixed transport unit 200,
The first installation bar 10 is fixed to the rotating plate 9,
A second installation bar 20 fixed to the first installation bar 10 and having a first through-hole 21 formed therein;
The protrusion 33 is formed on the outer circumference thereof, and is seated on the second installation bar 20. The lower portion protrudes the fitting hole 31 fitted into the first through hole 21, and the first guide 35 is formed on the upper portion thereof. Hollow guide portion 30 is formed to protrude,
A fastening member 40 fixedly coupled to the second installation bar 20 to fix the hollow guide part 30;
Inserted into the hollow guide portion 30 and the lifting operation, the material lifting adsorption unit 50 and the adsorption hole 51 for the material adsorption, and
An intake operation part 60 which is fastened and fixed to an upper end portion of the material lifting adsorption part 50, and is formed with an intake connector 61 connected to the adsorption hole 51;
Consisting of the lifting spring 70 is installed between the fastening member 40 and the intake operation unit 60 in a state of being fitted to the first guide 35 of the hollow guide portion 30,
During the lowering operation of the elevating operation unit 300, the elevating operation unit 300 is lowered by the adsorption means 100 is fixed to the adsorption of the material is made, the elevating spring (70) during the ascending operation of the elevating operation unit 300 Adsorption means 100 is fixed to the adsorption means 100 is fixed to the original position by the elastic return force of the), and the rotational movement of the material fixed to the adsorption means 100 in accordance with the drive of the rotary motor (1) Turret picker device.
An elevating shaft 57 including an elevating shaft 53 formed in the adsorption hole 51 to be inserted into the first through hole 21 and a fastener 55 formed at the lower portion of the elevating shaft 53;
Adsorption unit 59 is fixedly coupled to the fasteners 55 of the lifting and fastening portion 57 to fix the adsorption fixed material;
The material elevating adsorption part 50 forms a second through hole 111 into which the elevating shaft 53 is inserted, and is fixed to the upper surface of the fastener 55, and the fixing part 110 and the fixing part 110. Protruding to the upper portion of the) and the control protrusion 120 is in close contact with the lower surface of the second installation bar 20 by the elastic force of the elevating spring (70), and protruding to the upper portion of the fixing portion 110, the second installation Turret picker device characterized in that it further comprises a lifting height limiting portion 140 consisting of a guide rod 130 that is coupled to the bar (20).
The second installation bar 20, which is coupled to the first installation bar 10, includes a second shaft 91 and a second eccentric cam 92, and the second shaft 91 is a second installation bar. The second eccentric control unit 90 is coupled to the 20 and the second eccentric cam 92 is fitted to the first installation bar 10 is configured to further include,
Turret picker device characterized in that the position of the second installation bar 20 in front, rear, left and right according to the control of the first, second eccentric control (80, 90).
A coupling bracket 310 fixedly coupled to the installation bracket 311 and having a coupling hole 313 penetrated therein;
A driving motor 320 fixed to one surface of the coupling bracket 310 and having a driving shaft 321 positioned in the coupling hole 313;
An eccentric rotating body 330 which forms an insertion groove 331 into which the driving shaft 321 of the driving motor 320 is fitted, the bearing 333 is coupled to the coupling hole 313, and forms an eccentric shaft 335;
A vertical moving body 340 coupled to the other surface of the coupling bracket 310 by a linear bearing 341 to move up and down, and having a coupling shaft 343 formed thereon;
One side is coupled to the eccentric shaft 335 of the eccentric rotating body 330, the other side is coupled to the coupling shaft 343 of the vertical movable body 340 to lift the rotational force of the eccentric rotating body 330 of the vertical movable body 340 Connection link 350 to convert to motion;
Turret picker device characterized in that consisting of; pressing member 400 is coupled to the lower portion of the vertical movable body (340).
The pressing shaft 365 is slide-bonded to the lower portion of the vertical movable body 340 and formed to protrude downward and the spring shaft 361 is formed, and the pressing shaft 365 is coupled to the upper portion of the pressing shaft 365. A pressure fastening part 360 formed of a bolt coupling body 367 connected to the vertical movable body 340;
A pressing protrusion 370 which is fixed to the lower portion of the pressing shaft 365 by forming a groove 371 into which the lower end of the pressing shaft 365 is fitted;
A shock absorbing spring 380 installed in close contact with the spring support 361 so that the pressing shaft 365 is inserted therein;
The pressing shaft 365 is inserted into the inner circumference and the second guider 393 in which the shock absorbing spring 380 is inserted is formed on the outer circumference, and is fixed to the shock absorbing spring 380 on the outer circumference of the second guider 393. Turret picker device characterized in that consisting of; the jaw (395) constitutes a shock absorbing guide portion 390 is installed in close contact between the vertical movable body 340 and the buffer spring (380).
The pressing shaft 365 is configured to further include a center hole 363 into which the third shaft 411 is inserted.
The pressing protrusion 370 is formed to correspond to the center hole 363, the movement hole 373 is inserted into the third shaft 411, and is formed to extend from the movement hole 373, the third eccentric cam 412 Is inserted and is configured to further include a stepped groove 375 is formed left and right,
Installation height of the pressing protrusion 370 by the third eccentric cam 412 rotates eccentrically with respect to the third shaft 411 coupled to the center hole 363 according to the control of the third eccentric control 410. Turret picker device characterized by adjustable.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130098355A KR101341399B1 (en) | 2013-08-20 | 2013-08-20 | A turret picker device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020130098355A KR101341399B1 (en) | 2013-08-20 | 2013-08-20 | A turret picker device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR101341399B1 true KR101341399B1 (en) | 2013-12-13 |
Family
ID=49988276
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020130098355A KR101341399B1 (en) | 2013-08-20 | 2013-08-20 | A turret picker device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR101341399B1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108946157A (en) * | 2018-08-15 | 2018-12-07 | 苏州富强科技有限公司 | Multistation cam carrying mechanism |
CN109625961A (en) * | 2019-01-25 | 2019-04-16 | 江苏信息职业技术学院 | Rotating disc type IC chip handling device vacuum distribution module and handling device |
CN109794427A (en) * | 2019-02-03 | 2019-05-24 | 东莞市粤蒙电子科技有限公司 | A kind of screening installation |
CN113246091A (en) * | 2021-06-07 | 2021-08-13 | 浙江工业大学 | Manipulator device |
CN115196347A (en) * | 2022-05-23 | 2022-10-18 | 广州诺顶智能科技有限公司 | Turret device |
WO2023038572A1 (en) * | 2021-09-10 | 2023-03-16 | Mit Semiconductor Pte Ltd | System and process for sorting die from wafer using angled wafer table and angled turret |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200333546Y1 (en) * | 2003-09-05 | 2003-11-15 | (주)에이에스티 | The semiconductor package transper apparatus with rotary head module |
KR20100130395A (en) * | 2009-06-03 | 2010-12-13 | 세크론 주식회사 | Pick-up apparatus for semiconductor device |
KR101032442B1 (en) * | 2010-12-09 | 2011-05-03 | 주식회사 이노비즈 | Picker unit for led chip |
KR101043846B1 (en) * | 2010-04-16 | 2011-06-22 | 김대준 | Apparatus and method for picking up of semiconductor chip, apparatus and method for testing/sorting of semiconductor chip using the same |
-
2013
- 2013-08-20 KR KR1020130098355A patent/KR101341399B1/en active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200333546Y1 (en) * | 2003-09-05 | 2003-11-15 | (주)에이에스티 | The semiconductor package transper apparatus with rotary head module |
KR20100130395A (en) * | 2009-06-03 | 2010-12-13 | 세크론 주식회사 | Pick-up apparatus for semiconductor device |
KR101043846B1 (en) * | 2010-04-16 | 2011-06-22 | 김대준 | Apparatus and method for picking up of semiconductor chip, apparatus and method for testing/sorting of semiconductor chip using the same |
KR101032442B1 (en) * | 2010-12-09 | 2011-05-03 | 주식회사 이노비즈 | Picker unit for led chip |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108946157A (en) * | 2018-08-15 | 2018-12-07 | 苏州富强科技有限公司 | Multistation cam carrying mechanism |
CN108946157B (en) * | 2018-08-15 | 2024-04-02 | 苏州富强科技有限公司 | Multi-station cam carrying mechanism |
CN109625961A (en) * | 2019-01-25 | 2019-04-16 | 江苏信息职业技术学院 | Rotating disc type IC chip handling device vacuum distribution module and handling device |
CN109794427A (en) * | 2019-02-03 | 2019-05-24 | 东莞市粤蒙电子科技有限公司 | A kind of screening installation |
CN109794427B (en) * | 2019-02-03 | 2024-06-04 | 东莞市粤蒙电子科技有限公司 | Sorting equipment |
CN113246091A (en) * | 2021-06-07 | 2021-08-13 | 浙江工业大学 | Manipulator device |
CN113246091B (en) * | 2021-06-07 | 2024-05-14 | 浙江工业大学 | Manipulator device |
WO2023038572A1 (en) * | 2021-09-10 | 2023-03-16 | Mit Semiconductor Pte Ltd | System and process for sorting die from wafer using angled wafer table and angled turret |
CN115196347A (en) * | 2022-05-23 | 2022-10-18 | 广州诺顶智能科技有限公司 | Turret device |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR101341399B1 (en) | A turret picker device | |
KR101010024B1 (en) | Semiconductor chip sorter | |
CN102472790B (en) | Pickup apparatus and LED chip classification apparatus including same | |
KR100822995B1 (en) | Pick and place unit in singulation handler | |
CN108971955B (en) | Jacking type nut screwing machine and screwing method thereof | |
CN115351327A (en) | Wind power generation blade core material drilling equipment and method | |
JP2001048350A (en) | Transfer error preventing device for work | |
KR101216365B1 (en) | Apparatus for handling device and device transferring method | |
KR100995845B1 (en) | Vacuum adhesion transfer apparatus for semiconductor chip sorter | |
KR101189176B1 (en) | Handler for inspecting LED device | |
KR100992176B1 (en) | Cam up/down apparatus and semiconductor chip sorter having the same | |
KR100988520B1 (en) | Expanding apparatus and semiconductor chip sorter having the same | |
CN114918157B (en) | Blue film separator and separation method | |
KR101754958B1 (en) | Multi chip picker | |
CN114188244B (en) | Automatic code printing and inserting machine | |
KR20130062320A (en) | Apparatus for sorting led device | |
KR101189179B1 (en) | Device Alignment apparatus and apparatus for inspecting LED device having the same | |
KR101315200B1 (en) | Transferring tool for device | |
CN105491869B (en) | Full-automatic multichannel paster feedway in bulk | |
KR102127695B1 (en) | Semiconductor die detachment apparatus | |
CN112387920A (en) | Full-automatic riveting equipment of circuit breaker | |
CN210651921U (en) | Positioning system of non-contact smart card manufacturing equipment | |
CN211348531U (en) | Feeding and conveying device of semiconductor chip sorting and testing device | |
CN110666473B (en) | Automatic spring mounting device of disc spring group | |
KR101020669B1 (en) | Apparatus for picking and placing of semiconductor chip |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
A302 | Request for accelerated examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20180119 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20190117 Year of fee payment: 6 |