KR101341399B1 - A turret picker device - Google Patents

A turret picker device Download PDF

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Publication number
KR101341399B1
KR101341399B1 KR1020130098355A KR20130098355A KR101341399B1 KR 101341399 B1 KR101341399 B1 KR 101341399B1 KR 1020130098355 A KR1020130098355 A KR 1020130098355A KR 20130098355 A KR20130098355 A KR 20130098355A KR 101341399 B1 KR101341399 B1 KR 101341399B1
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KR
South Korea
Prior art keywords
shaft
adsorption
coupled
fixed
hole
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KR1020130098355A
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Korean (ko)
Inventor
한복우
백정민
이승현
Original Assignee
제너셈(주)
이승현
한복우
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Priority to KR1020130098355A priority Critical patent/KR101341399B1/en
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Publication of KR101341399B1 publication Critical patent/KR101341399B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • B65G47/911Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • G01R31/2601Apparatus or methods therefor
    • G01R31/2603Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67144Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manipulator (AREA)

Abstract

The present invention relates to a turret picker device which is combined with a rotary body continuously rotating at fixed angle intervals according to the operation of a rotary motor, in order to move a material. The turret picker device comprises a suction transfer unit which includes a rotary plate, rotating by being combined and fixed to the rotary body, and multiple suction tools, combined to the rotary plate at fixed angle intervals and having an elevation spring; and an elevation operating unit which is located in the upper part of the suction tools and is combined through a link to an eccentric rotary body eccentrically rotating by a driving motor in order to be elevated vertically. The suction tool of the suction transfer unit comprises a first installation bar which is combined and fixed to the rotary plate; a second installation bar which is combined and fixed to the first installation bar and has a first through hole; a hollow guide unit which is seated on the second installation bar by forming protrusions on the outer circumference thereof, has an inserted projection to be inserted into the first through hole in the lower part thereof, and has a first guider protruding from the upper part thereof; a coupling member which is combined and fixed to the second installation bar in order to fix and install the hollow guide unit; a material elevating suction unit which is inserted into the hollow guide unit in order to be elevated and has a suction hole in order to suck a material; an air intake operating unit which is coupled and fixed to the top end of the material elevating suction unit and has an air intake connection opening to be connected to the suction hole; and the elevation spring which is closely installed in between the coupling member and the air intake operating unit while being inserted into the first guider of the hollow guide unit.

Description

Turret picker device

The present invention relates to a turret picker device, and more specifically, it is possible to quickly and accurately achieve the adsorption fixation and rotational movement arrangement of the material, as well as the front, rear, right, left and right correction through the first, second and third eccentric control. Regardless of the size of the material can be easily moved and disposed, it relates to a turret picker device that can easily perform maintenance according to failure and damage.

In general, in order to make a semiconductor chip with an integrated circuit, a number of processes and complicated and complicated processes are required. When strips of a predetermined size are stacked in a magazine and supplied to a sawing unit one by one, as shown in FIG. The cutting is cut by size by the well-known technique.

Then, the cut materials are removed by the spraying method of air and water in the washing unit, foreign matters of the cutting unit are removed, and if the inspection unit is checked for defects and the data is stored in the computer, it is sent to the turntable and sent to the transfer unit by the robot.

At this time, the materials transferred to the conveying unit are classified into good or bad according to the data of whether the defect is included in the inspection unit, and a certain number is placed on the tray illustrated in FIG. 2. The tray feed drawer, which is replaced with a tray, goes to the next process.

Therefore, a means for transferring the materials classified as defective or non-defective goods to the tray supply drawer must be provided, and the prior art for the material classification transfer means for picking up a predetermined size of materials by using a vacuum hose using a negative pressure one by one Next, the robot is moved to a tray using a robot. When a certain number is collected on the tray, a means for transferring the tray to the next process has been applied.

Here, the important thing in the semiconductor chip manufacturing process is that there should be no defective products, and the production speed should be very fast to meet the production cost of many small sized materials and increase the work efficiency. Since the means of picking up and transporting to the next process have been limited, the production speed is limited, and because of this, there is a problem that the production efficiency is low compared to the work, and the cost is increased in the maintenance of the equipment.

On the other hand, as in the Republic of Korea Patent Application Publication No. 10-2012-0103818 has developed the LED package inspection and classification device for the inspection and classification of the LED package, it was also possible to sequentially transfer the LED package through the transfer device .

However, the above-described conventional LED package inspection and sorting apparatus includes one first picker for moving the LED package to the fixed block of the rotating table, and dropping the completed LED package into the LED insertion hole by being moved through the first picker. It was composed of one second picker, that is, two pickers to inspect and retrieve the LED package, making it impossible to move the LED package and the material at high speed.

Accordingly, the present applicant has a turret picker device comprising a plurality of rotational adsorption means and a lifting and lowering operation part disposed at upper portions of the adsorption means to elevate the adsorption means so as to speed up inspection and recovery due to rapid movement of materials. Was developed.

The turret picker device of the present invention can easily achieve the adsorption fixation of materials by lowering the adsorption means through the pressure member of the elevating operation portion which is lifted and operated by the eccentric rotating body, as well as by the lifting spring configured in the adsorption means. The object of the present invention is to achieve the upward movement, and to move the upwardly moved material by the adsorption means rotating around the rotating body, so that the material for the vision inspection can be quickly moved and placed.

In addition, the present invention can be installed on the pressure member to prevent the shock applied to the material when the adsorption means is lowered by the shock absorbing spring, and the lifting height limiting portion is configured by the material lifting adsorption adsorption unit is always placed quickly to the same position It is an object to provide a turret picker device that can be prevented from malfunction due to material movement arrangement.

In addition, the present invention can achieve the front, rear, left and right movement correction of the suction means through the first, second eccentric control, and at the same time the lifting movement correction of the pressure protrusion can be achieved through the third eccentric control of the material to be moved It is an object of the present invention to provide a turret picker device that can be easily moved regardless of size and is easy to maintain.

The present invention for achieving the above object is fixed to the rotating body is coupled to the rotating rotating plate, and the suction fixed conveying unit is composed of a plurality of adsorption means coupled to the rotating plate at a predetermined angle intervals and the lifting spring is installed; Located in the upper portion of the adsorption means through the mounting bracket, coupled to the eccentric rotation body eccentric rotation by the drive motor, the lifting operation unit for lifting up and down vertically; consisting of, the adsorption means of the adsorption fixed transport portion Silver, the first installation bar is fixed to the rotating plate, the second installation bar is fixed to the first installation bar, the first through-hole is formed, and the protrusion is formed on the outer periphery is seated on the second installation bar, the lower first A hollow guide portion protruding to be fitted into the through hole, the hollow guide portion protruding from the first guide, a fastening member fixed to the second installation bar to secure the hollow guide portion, and the hollow guide portion The material lifting adsorption part inserted into the lifting device and forming an adsorption hole for material adsorption, and is fixed to the upper end of the material lifting adsorption part, and is connected to the adsorption hole). Provided is a turret picker device characterized in that the air intake operation unit is configured with a configuration, and the lifting spring is installed in close contact between the fastening member and the intake operation unit in a state of being fitted to the first guide of the hollow guide portion.

The present invention can easily achieve the adsorption fixation of the material by lowering the adsorption means through the pressure member of the elevating operation unit lifting up and down by the eccentric rotating body, as well as to achieve the upward movement of the material through the lifting spring configured in the adsorption means And it can be rotated to move the material moved up by the suction means rotates around the rotating body has the advantage that can quickly move the material to achieve the vision inspection.

In addition, the present invention can be installed on the pressure member to prevent the shock applied to the material when the adsorption means is lowered by the shock absorbing spring, and the lifting height limiting portion is configured by the material lifting adsorption adsorption unit is always placed quickly to the same position As it can be done, there is an advantage that the malfunction due to the movement of the material is prevented.

In addition, the present invention can achieve the front, rear, left and right movement correction of the suction means through the first, second eccentric control, and at the same time the lifting movement correction of the pressure protrusion can be achieved through the third eccentric control of the material to be moved It is a useful invention that can be easily moved regardless of size and is easy to maintain.

1 is a flow chart showing the overall process of a conventional semiconductor equipment.
2 is an exemplary view of a tray in which materials to be a conventional semiconductor chip are placed.
Figure 3 is a perspective view showing a vision inspection system installed turret picker device of the present invention.
Figure 4 is a partially enlarged view showing the main portion of the turret picker device of the present invention.
Figure 5 is an exploded perspective view of the rotating motor and the rotating body and the rotating plate and the adsorption fixed feed portion and the installation bracket of the present invention.
Figure 6 is a perspective view showing a partially exploded adsorption fixed feed portion of the present invention.
7 is a perspective view showing the adsorption means of the present invention.
8 is a cross-sectional view showing an adsorption fixed feed unit of the present invention.
9 is a perspective view showing the lifting operation unit of the present invention.
10 is a cross-sectional view showing the lifting operation unit of the present invention.
11 is an operation sectional view showing a state in which the vertical movable body of the present invention is moved upward.
12 is an operation sectional view showing a state in which the vertical movable body of the present invention is moved downward.

Hereinafter, the structure of the present invention will be described.

3 to 4, the material is coupled to the rotating body 5 which is continuously rotated at a predetermined angle according to the driving of the rotating motor 1 and is supplied through the material movement arrangement device 600. Regarding the turret picker device 500 for moving the, comprises a rotating motor (1) fixedly installed through the fixing bracket (3) to the installation plate (2) installed in the vision inspection system (1000), It consists of a sending part 200 and the lifting operation part 300.

First, the adsorption fixed transport unit 200 is coupled to the rotating body (5) that rotates in accordance with the driving of the rotary motor (1) as shown in Figures 4 to 8 rotating plate to rotate operation Configure

In addition, the suction fixing transfer unit 200 is radially coupled to the rotating plate 9 at predetermined angle intervals and includes a plurality of suction means 100 provided with a lifting spring 70.

In addition, each of the adsorption means 100 is the first installation bar 10, the second installation bar 20, the hollow guide portion 30, the fastening member 40, the material lifting adsorption portion 50 ), The intake operation unit 60, and the lifting spring 70, it is preferable, but will be described in more detail for the preferred configuration for the adsorption means (100).

First, the first installation bar 10 of the adsorption means 100 is fixed to the rotation plate 9 by a conventional coupling method such as a bolt, so as to install the adsorption means 100 on the rotation plate 9 to be.

Therefore, it is preferable that a seating groove 9a is formed in the rotating plate 9 so that the first mounting bar 10 can be easily fixed.

Second, the second installation bar 20 is configured to be fixed to the first installation bar 10 through a conventional bolt coupling, the installation of the hollow guide portion 30 and the lifting material adsorption adsorption portion 50 is elevated The first through hole 21 is formed to penetrate up and down to be moved.

Third, the hollow guide portion 30 is installed in the second through-hole 21 of the second installation bar 20 as described above, the outer circumference to be seated in the second installation bar 20 The protrusion 33 is formed.

In addition, the fitting hole 31 is protruded from the lower portion of the hollow guide part 30 so that the fitting hole 31 is fitted into the first through-hole 21, and the lifting spring 70 is provided at the upper portion thereof. Protruding the first guider 35 for guiding the elastic action.

Fourth, the fastening member 40 is configured to be fixed to the upper surface of the second installation bar 20 by penetrating the hole through which the hollow guide portion 30 is inserted up and down, the hollow guide portion ( Steps to be in close contact with the protrusions 33 of 30) are formed.

Therefore, when the fastening member 40 is fixedly coupled to the second installation bar 20 so that the hollow guide part 30 is fitted into the hole, the protrusion 33 is in close contact with the stepped hollow guide part 30. Fixed installation of the will be made.

Here, the fixed coupling of the fastening member 40 and the second installation bar 20 will be easily achieved through a conventional bolt fastening.

Fifth, the material elevating adsorption portion 50 is inserted into the hollow guide portion 30 is formed long in the vertical direction to operate the lifting operation, and forms an adsorption hole 51 for adsorbing the material.

To this end, the material lifting and adsorption part 50 includes an elevator fastening part 57 and an adsorption part 59. The elevator fastening part 57 forms an adsorption hole 51 to form a first through hole 21. The lifting shaft 53 is inserted into the lifting shaft 53, and the fastener 55 is formed in the lower portion.

In addition, the adsorption part 59 is fixedly coupled to the fastener 55 of the elevating fastening part 57 to fix and fix the material, and communicates with the adsorption hole 51 of the elevating fastening part 57. Through-holes are formed.

Sixth, the intake operation unit 60 is fastened to the upper end portion of the lifting fastening portion 57 configured in the material lifting and suction unit 50, the suction hole 51 of the material lifting and suction unit (50). Intake connector 61 is connected to the configuration. In addition, a vacuum suction device (not shown) is connected to the intake connector 61 through a normal connection line (not shown).

Here, the fastening and fixing of the intake operation unit 60 may be variously achieved through a conventional fastening method. Fastening to the elevating fastening portion 57 of the embodiment was taken as an example.

To explain this in more detail, a hole (not shown) is formed in the intake operation part 60 to penetrate up and down so that the upper end portion of the lifting fastening part 57 passes through the intake operation part 60. Lifting and adsorption of materials through the fastening pins 63 fitted through the fastening grooves (not shown) in the upper part of the lifting fastening portion 57 protruding upward through the holes of the intake operation part 60. Fastening of the unit 50 and the intake operation unit 60 can be made, and through such a configuration, not only a solid fastening can be made, but also can easily achieve separation and disassembly and recombination according to maintenance It has an effect.

Seventh, the lifting spring 70 is configured to be in close contact between the fastening member 40 and the intake operation part 60 in a state of being fitted to the first guide 35 of the hollow guide portion 30, lifting operation part In accordance with the operation of the 70 acts to apply an elastic force in the vertical upward direction to the material lifting adsorption portion 50 of the intake means 100 is moved downwards, through which the material lifting adsorption portion 50 is moved up to its original position Will be returned.

In addition, a groove in which the upper portion of the elevating spring 70 is fitted is formed at the lower portion of the intake operation unit 60 for the stable installation of the elevating spring 70.

In addition, in the present invention, the lifting height limiting part 140 is further included to limit the lifting height of the material lifting adsorption part 50 moving up and down, so that it is desirable to achieve fast and accurate material adsorption fixing. The same lifting height limiting part 140 may be composed of a fixing part 110, an adjusting protrusion 120, and a guide rod 130.

Here, the fixing part 110 forms a second through hole 111 into which the lifting shaft 53 formed at the lifting fastening portion 57 of the material lifting adsorption part 50 is inserted into the upper surface of the fastener 55. In a fixed configuration, through the usual fastening bolts will be able to securely install the fixed portion 110 seated in the fastener 55 to the lifting shaft (53).

In addition, the adjustment protrusion 120 is formed to protrude to the upper portion of the fixing portion 110 is in close contact with the bottom surface of the second installation bar 20 by the elastic return force of the lifting spring 70, the fixing portion ( By adjusting the height at which the 110 rises, the adsorption part 59 configured in the material lifting adsorption part 50 is always elevated to the same height.

Here, the adjusting protrusion 120 may be formed integrally with the fixing part 110, but is preferably bolted to the fixing part 110 to achieve height adjustment.

In addition, the guide rod 130 is formed to protrude to the upper portion of the fixing portion 110 is coupled to the second installation bar 20, the lifting height limit even in the repeated lifting operation of the material lifting and adsorption portion 50 A function of preventing the portion 140 from twisting is performed, and for this purpose, an insertion hole 23 into which the guide rod 130 is inserted is formed in the second installation bar 20.

On the other hand, in the present invention, it is preferable to further include a configuration to achieve a correction by fine-adjusting the adsorption means 100 in front, rear, left and right, which is the first installation bar 10 to form a coupling with the rotating plate (9) At the same time to configure the first eccentric control (80), the second eccentric control (90) in the second installation bar 20 to form a coupling with the first installation bar 10 can be achieved. have.

In more detail, the first eccentric control device 80 is composed of a first shaft 81 and the first eccentric cam 82 is formed eccentrically from the first shaft, wherein the first shaft 81 Is fitted to the first installation bar 10, the first eccentric cam 82 is made of a configuration that is fitted to the rotary plate (9).

In addition, a rectangular first groove 9b is formed in the seating groove 9a of the rotating plate 9 into which the first eccentric cam 82 of the first eccentric control device 80 is fitted. 82 is located in the first groove 9b, where one side width of the first groove 9b, that is, one side width formed in the radial direction of the rotation plate 9 is defined by the first eccentric cam 82. It is formed in the same size as the outer diameter, the width of the direction orthogonal to the radial width of the first groove (9b) is formed to the same size as the rotation radius of the first eccentric cam (82).

Here, the first groove 9b formed in the rotating plate 9 may be formed integrally with the rotating plate 9, but a conventional member having a rectangular first groove 9b is formed in the rotating plate (9). 9) can also be achieved by fastening.

Accordingly, when the first eccentric control mechanism 80 is rotated, the first eccentric cam 82 rotates in the rectangular first groove 9b so that the first shaft 81 of the rotary plate 9 rotates. Since it moves in the radial direction, the first installation bar 10 is moved in the radial direction of the rotary plate 9, through which the material lifting adsorption portion 50 configured in the adsorption means 100 of the rotary plate 9 It is possible to fine tune in the radial direction.

In addition, the second eccentric control device 90 is composed of a second shaft 91 and the second eccentric cam 92 is formed eccentrically on the second shaft 91, wherein, the second shaft 91 Is inclined and coupled to the second installation bar 20, the second eccentric cam 92 is configured to be fitted to the first installation bar 10.

In addition, a rectangular second groove 11 is formed in the first installation bar 10 in which the second eccentric cam 92 of the second eccentric control device 90 is fitted, so that the second eccentric cam 92 is formed. Located in the second groove 11, wherein the second groove 11 has a shape in which the width of the first groove 9b formed in the rotating plate 9 is opposite to that of the first groove 9b. It is formed in the state rotated 90 degrees.

Therefore, when the second eccentric adjustment mechanism 90 is rotated, the second eccentric cam 92 is rotated in the rectangular second groove 11 so that the second installation bar 20 is the first installation bar ( 10) because it moves in both directions, it is possible to fine-adjust the material lifting adsorption portion 50 in the direction orthogonal to the fine control direction by the first eccentric control device (80), the first and second eccentric control device ( 80, 90) it is possible to fine-adjust the material lifting adsorption portion 50 to the desired position.

In addition, the rotation plate 9 and the first installation bar 10 and the first and second so that the fine adjustment of the adsorption means 100 by the first, second eccentric control (80, 90) is easily made. The coupling of the installation bars 10 and 20 should be slide-coupled in the direction in which the adjustment is to be made, and the guide rods are formed in the grooves and the second installation bars 20 of the portion forming the bolt coupling with the rotating plate 9. The insertion hole 23 into which the 130 is inserted should be formed as a long groove formed in the direction in which the adjustment is made.

In addition, the lifting operation unit is located in the upper portion of the adsorption means 100 through the conventional mounting bracket 311, as shown in Figure 4 or 9 to 12, the eccentric rotation by the drive motor 320 Is coupled to the eccentric rotation body 330 by a link link 350 is configured to move up and down vertically, the coupling bracket 310, the drive motor 320, the eccentric rotation body 330, the vertical movable body 340 ), A connecting link 350, and the pressing member 400.

First, the coupling bracket 310 of the lifting operation unit 300 is configured to install the lifting operation unit 300 is fixedly coupled to the installation bracket 311, the drive motor 320 and the eccentric rotating body 330 therein The coupling hole 313 for coupling and installing the connection is formed through.

Second, the drive motor 320 is a conventional motor fixedly coupled to one surface of the coupling bracket 310, and forms a drive shaft 321 located in the coupling hole 313.

Third, the eccentric rotating body 330 is configured to be coupled to the coupling hole 313 formed in the coupling bracket 310 as a bearing 333, the insertion groove into which the drive shaft 321 of the drive motor 320 is fitted on one side. A 331 is formed so that the eccentric rotating body 330 rotates according to the driving of the driving motor 320, and an eccentric shaft 335 is formed at the other side of the eccentric rotating body 330.

Fourth, the vertical movable body 340 is coupled to the other surface of the coupling bracket 310 by a linear bearing 341 to move up and down, the coupling shaft 343 is formed on the upper.

Here, the coupling shaft 343 is formed to be integrally formed in the vertical movable body 340, and separated to be coupled to form an insertion part 345 having an insertion hole (not shown) formed at one side of the vertical movable body 340. In this case, a hole (not shown) for bolting is further included in one side of the insertion part 345 in which the insertion hole is formed for firm installation of the coupling shaft 343. It is preferable that a cross section (not shown) is formed in the coupling shaft 343 to be positioned so that the bolt can be firmly adhered through the hole.

Fifth, the connection link 350 is coupled to the eccentric shaft 335 of the eccentric rotating body 330, one side is coupled to the coupling shaft 343 of the vertical movable body 340, the eccentric rotating body 330 In the configuration for converting the rotational force to the lifting movement of the vertical movable body 340, it is preferable to be coupled to the eccentric shaft and the coupling shaft through the conventional bearing, respectively.

Accordingly, when the eccentric shaft 335 configured in the eccentric rotating body 330 rotates eccentrically according to the driving of the driving motor 320, the connection link 350 links between the eccentric shaft 335 and the coupling shaft 343. Since the operation, the vertical movable body 340 coupled to the link link 350 is moved up and down in the vertical direction along the linear bearing 341 coupled to the coupling bracket 310 is continuously repeated.

Sixth, the pressing member 400 is fixedly coupled to the lower portion of the vertical movable body 340 to press the material lifting adsorption portion 50 of the adsorption means 100 in accordance with the lowering operation of the vertical movable body 340. In this configuration, the pressure fastening portion 360, the pressure protrusion 370, the buffer spring 380, and the buffer guide portion 390 can be made, hereinafter the pressing member 400 will be described in more detail do.

First, the pressing fastening portion 360 of the pressing member 400 is configured to protrude downwardly by being coupled to the lower portion of the vertical movable body 340, and is formed to slide to the lower portion of the vertical movable body 340 to protrude downward. And, it constitutes a pressing shaft 365 formed with a spring support 361 on which the shock absorbing spring 380 is seated.

In addition, a bolt coupling body 367 is coupled to an upper portion of the pressing shaft 365 formed in the pressing coupling part 360, and the bolt coupling body 367 penetrates a lower portion of the vertical moving body 340. By being fastened to the upper portion of the pressing shaft 365 is configured to be connected to the vertical movable body 340.

In addition, the pressing protrusion 370 of the pressing member 400 forms a groove 371 into which the lower end portion of the pressing shaft 365 is fitted, thereby being fixedly coupled to the lower portion of the pressing shaft 365, thereby allowing the vertical movable body 340 to be moved. According to the lowering operation of the material lifting adsorption unit 100 of the adsorption means 100 is configured to act to the lower side, is fixed to the pressing shaft 365 through a conventional bolt (B) coupling, pressurized The lower end of the pressing shaft 365, which is inserted into the groove 371 of the protrusion 370 to which the bolt B is coupled, is preferably formed such that an end portion in which the bolt B is in close contact is formed.

In addition, the shock absorbing spring 380 is configured to be in close contact with the spring support 361 so that the pressing shaft 365 is inserted, the pressure shaft 365 to mitigate the impact when pressing the material lifting adsorption portion 50 to the lower side This prevents damage to the material when the material is fixed to adsorption.

In addition, the buffer guide part 390 forms a hole (not shown) in which the pressing shaft 365 is inserted in the inner circumference and is closely installed between the vertical movable body 340 and the shock absorbing spring 380. A second guider 393 into which the 380 is inserted is configured, and a fixed jaw 395 is mounted on the outer circumference of the second guider 393 to be seated on the shock absorbing spring 380. It is installed in close contact with the lower surface of the vertical movable body 340.

Therefore, according to the buffer guide part 390, since the elasticity of the shock absorbing spring 380 is smoothly guided when the pressure tightening part 360 is automatically lifted, when the material is fixed by the material lifting adsorption part 50, The impact on the material can be minimized.

On the other hand, in the present invention, it is preferable to further include a configuration to achieve a correction by fine-adjusting the pressing protrusion 370 configured in the pressing member 400 in the vertical direction, which is combined with the pressing shaft 365 It can be achieved through the coupling installation of the third eccentric control 410 to the pressure protrusion 370 to form a, it will be described in more detail as follows.

First, the third eccentric control opening 410 is composed of a third shaft 411 and the third eccentric cam 412 is formed eccentrically from the third shaft 411 the third shaft 411 is pressed The shaft 365 is coupled to the fitted pressing protrusion 370.

In addition, in order to couple the third eccentric control 410, the pressing shaft 365 is configured to further include a center hole 363 into which the third shaft 411 is inserted, and the pressing protrusion 370 A moving hole 373 is formed to correspond to the center hole 363 of the pressing shaft 365 to insert the third shaft 411. The pressing protrusion 370 extends from the moving hole 373. A stepped groove 375 into which the third eccentric cam 412 is inserted is formed.

In addition, the stepped groove 375 has an outer diameter of the third eccentric cam of the third eccentric control port 410 so that the upper and lower widths can only be moved up and down when the third eccentric control device 410 is operated. It is preferably formed with the same diameter, and the left and right of the stepped groove 375 is preferably formed to be open.

Therefore, when the third eccentric control port 410 is adjusted, the pressing protrusion 470 by the third eccentric cam 412 rotates eccentrically based on the third shaft 411 coupled to the center hole 363. Since the lifting operation, it is possible to adjust the installation height of the pressing protrusion 470.

In addition, coupling the eccentric control 410 to the pressure protrusion 470, after forming a groove in the end portion of the third shaft 411 configured in the eccentric control 410, and the snap ring in the groove By engaging the same ring member 413 to achieve the coupling to rotate the eccentric adjustment mechanism 410, the bolt (B) through the end while the pressing shaft 460 is fitted to the pressing protrusion 470 (B) The combination is made of a solid installation, it is possible to achieve a stable coupling just by hanging the eccentric control 410 through the ring member 413.

In addition, the lower portion of the coupling bracket 310 described above is preferably configured to further include a support member 315 for limiting the downward movement of the linear bearing 341, according to such a support member 315, the present invention During maintenance, even if the coupling shaft 343 of the vertical movable body 340 is separated from the connection link 350, since the downward movement of the vertical movable body 340 is limited, the breakage of the present invention can be prevented.

In addition, the elevating operation unit 300 may be installed in a plurality of mounting brackets 311, such as the elevating operation unit 311 is a part receiving the material from the vision inspection system 1000, or to inspect the material By installing in parts, etc., it is possible to move material to the required part more quickly and accurately.

Hereinafter will be described the operation according to the preferred embodiment of the present invention as described above.

First, when the driving motor 320 configured in the lifting operation unit 300 is driven, the eccentric rotating body 330 coupled to the driving shaft 321 of the driving motor 320 is rotated, the eccentric rotating body ( When the 330 rotates, the vertical movable body 340 coupled to the eccentric shaft 335 of the eccentric rotating body 330 by the connecting link 350 is vertically lowered along the linear bearing 341.

Therefore, the pressing member 400 coupled to the vertical movable body 340 acts to lower and lower the pressure protrusion 370 of the pressing member 400 to press the material lifting adsorption part 50 of the intake means 100. Through this, the material lifting and adsorption unit 50 is lowered while compressing the lifting spring 70 to fix the material adsorption.

When the pressing member 400 pressurizes the material lifting and adsorption unit 50 as described above, a force applied to the pressing member 400 is applied to the pressing member 400, so that the shock absorbing spring 380 configured in the pressing member 400 is compressed. While the pressure tightening unit 360 is operated to increase, thereby the impact applied to the material is alleviated.

After the above operation is performed, the eccentric rotating body 330 rotates in response to the continuous rotation of the driving motor 320, and the vertical moving body connected to the eccentric rotating body 330 through the connection link 350 ( An operation in which the 340 rises vertically along the linear bearing 341 is performed.

Accordingly, since the force for pressing the material lifting adsorption part 50 is removed, the material lifting adsorption part 50 is operated by the elastic return force of the lifting spring 70 to return to the initial position. The pressing member 400 is returned to the initial position by the elastic return force of the buffer spring 380.

Thereafter, the rotary body 5 and the rotating plate 9 are rotated at the same angle according to the driving of the rotary motor 1, so that the adsorption means 100 having the material adsorbed and fixed is rotated to the next step. At the same time as the movement arrangement, the other adsorption means 100 which is installed adjacent to the adsorption means 100 that is fixed to the adsorption fixed material in accordance with such an angular rotation of the rotary plate 9 is the lifting operation unit 300 It is located at the bottom of the present invention will be arranged in the same state as the initial state.

Therefore, the drive of the above-described drive motor 320 and the drive of the rotary motor 1 is made to be constant, it is possible to perform the above-mentioned operation repeatedly repeatedly to achieve a quick and accurate rotational movement arrangement of the material This enables rapid vision inspection of the material.

DESCRIPTION OF SYMBOLS 1 Rotary motor 2 Mounting plate 3 Fixing bracket 5 Rotating body 9 Rotating plate 9a Seating groove 9b First groove
10, 20: 1st, 2nd installation bar 11: 2nd groove 21: 1st through hole 23: insertion hole
30: hollow guide portion 31: fitting hole 33: protrusion 35: first guider
40: fastening member
50: material lifting adsorption part 51: adsorption hole 53: lifting shaft 55: fastener 57: lifting fastening part 59: adsorption part
60: intake operation unit 61: intake connector 63: fastening pin
70: lifting spring 80, 90: the first and second eccentric control
81, 91: 1st, 2nd axis 82, 92: 1st, 2nd eccentric cam
100: adsorption means
110: fixing part 111: second through hole 120: adjustment protrusion 130: guide rod
200: adsorption fixed transfer part 300: lifting operation part
310: bonding bracket
311: mounting bracket 313: coupling hole 315: support member
320: drive motor 321: drive shaft 330: eccentric rotating body
331: insertion groove 333: bearing 335: eccentric shaft
340: vertical moving body 341: linear bearing 343: coupling shaft 345: insert
350: connection link
360: Pressing part 361: Spring receiving 363: Center hole 365: Pressing shaft 367: Bolt assembly
370: pressure protrusion 371: groove 373: moving hole 375: stepped groove
380: buffer spring
390: buffer guide portion 393: second guider 395: fixed jaw
400: pressure member 410: third eccentric control
411: third axis 412: third eccentric cam 413: ring member
500: turret picker device 1000: vision inspection system

Claims (8)

In the turret picker device coupled to the rotating body (5) for continuous rotation operation at predetermined angle intervals in accordance with the drive of the rotary motor (1),
Adsorption fixation consisting of a plurality of adsorption means (100) coupled to the rotating body (5) is fixed to the rotating plate and rotates, and coupled to the rotating plate (9) at predetermined angle intervals and the lifting spring (70) is installed. Transfer unit 200;
Located in the upper portion of the adsorption means 100 through the installation bracket 311, is coupled to the connection link 350 to the eccentric rotation body 330 eccentrically rotated by the drive motor 320 ascending and lifting vertically Actuator 300; consisting of,
Adsorption means 100 of the adsorption fixed transport unit 200,
The first installation bar 10 is fixed to the rotating plate 9,
A second installation bar 20 fixed to the first installation bar 10 and having a first through-hole 21 formed therein;
The protrusion 33 is formed on the outer circumference thereof, and is seated on the second installation bar 20. The lower portion protrudes the fitting hole 31 fitted into the first through hole 21, and the first guide 35 is formed on the upper portion thereof. Hollow guide portion 30 is formed to protrude,
A fastening member 40 fixedly coupled to the second installation bar 20 to fix the hollow guide part 30;
Inserted into the hollow guide portion 30 and the lifting operation, the material lifting adsorption unit 50 and the adsorption hole 51 for the material adsorption, and
An intake operation part 60 which is fastened and fixed to an upper end portion of the material lifting adsorption part 50, and is formed with an intake connector 61 connected to the adsorption hole 51;
Consisting of the lifting spring 70 is installed between the fastening member 40 and the intake operation unit 60 in a state of being fitted to the first guide 35 of the hollow guide portion 30,
During the lowering operation of the elevating operation unit 300, the elevating operation unit 300 is lowered by the adsorption means 100 is fixed to the adsorption of the material is made, the elevating spring (70) during the ascending operation of the elevating operation unit 300 Adsorption means 100 is fixed to the adsorption means 100 is fixed to the original position by the elastic return force of the), and the rotational movement of the material fixed to the adsorption means 100 in accordance with the drive of the rotary motor (1) Turret picker device.
delete According to claim 1, The material lifting adsorption portion 50,
An elevating shaft 57 including an elevating shaft 53 formed in the adsorption hole 51 to be inserted into the first through hole 21 and a fastener 55 formed at the lower portion of the elevating shaft 53;
Adsorption unit 59 is fixedly coupled to the fasteners 55 of the lifting and fastening portion 57 to fix the adsorption fixed material;
The material elevating adsorption part 50 forms a second through hole 111 into which the elevating shaft 53 is inserted, and is fixed to the upper surface of the fastener 55, and the fixing part 110 and the fixing part 110. Protruding to the upper portion of the) and the control protrusion 120 is in close contact with the lower surface of the second installation bar 20 by the elastic force of the elevating spring (70), and protruding to the upper portion of the fixing portion 110, the second installation Turret picker device characterized in that it further comprises a lifting height limiting portion 140 consisting of a guide rod 130 that is coupled to the bar (20).
The method of claim 1, wherein the first mounting bar 10 which is coupled to the rotating plate 9, the first shaft 81 and the first eccentric cam 82, the first shaft 81 is The first eccentric control unit 80 is coupled to the first installation bar 10 and the first eccentric cam 82 is fitted to the rotary plate 9 is configured to further include,
The second installation bar 20, which is coupled to the first installation bar 10, includes a second shaft 91 and a second eccentric cam 92, and the second shaft 91 is a second installation bar. The second eccentric control unit 90 is coupled to the 20 and the second eccentric cam 92 is fitted to the first installation bar 10 is configured to further include,
Turret picker device characterized in that the position of the second installation bar 20 in front, rear, left and right according to the control of the first, second eccentric control (80, 90).
According to claim 1, The lifting operation unit 300,
A coupling bracket 310 fixedly coupled to the installation bracket 311 and having a coupling hole 313 penetrated therein;
A driving motor 320 fixed to one surface of the coupling bracket 310 and having a driving shaft 321 positioned in the coupling hole 313;
An eccentric rotating body 330 which forms an insertion groove 331 into which the driving shaft 321 of the driving motor 320 is fitted, the bearing 333 is coupled to the coupling hole 313, and forms an eccentric shaft 335;
A vertical moving body 340 coupled to the other surface of the coupling bracket 310 by a linear bearing 341 to move up and down, and having a coupling shaft 343 formed thereon;
One side is coupled to the eccentric shaft 335 of the eccentric rotating body 330, the other side is coupled to the coupling shaft 343 of the vertical movable body 340 to lift the rotational force of the eccentric rotating body 330 of the vertical movable body 340 Connection link 350 to convert to motion;
Turret picker device characterized in that consisting of; pressing member 400 is coupled to the lower portion of the vertical movable body (340).
The method of claim 5, wherein the pressing member 400,
The pressing shaft 365 is slide-bonded to the lower portion of the vertical movable body 340 and formed to protrude downward and the spring shaft 361 is formed, and the pressing shaft 365 is coupled to the upper portion of the pressing shaft 365. A pressure fastening part 360 formed of a bolt coupling body 367 connected to the vertical movable body 340;
A pressing protrusion 370 which is fixed to the lower portion of the pressing shaft 365 by forming a groove 371 into which the lower end of the pressing shaft 365 is fitted;
A shock absorbing spring 380 installed in close contact with the spring support 361 so that the pressing shaft 365 is inserted therein;
The pressing shaft 365 is inserted into the inner circumference and the second guider 393 in which the shock absorbing spring 380 is inserted is formed on the outer circumference, and is fixed to the shock absorbing spring 380 on the outer circumference of the second guider 393. Turret picker device characterized in that consisting of; the jaw (395) constitutes a shock absorbing guide portion 390 is installed in close contact between the vertical movable body 340 and the buffer spring (380).
The method of claim 6, wherein the pressing protrusion 370 is coupled to the pressing shaft 365 further comprises a third eccentric control 410 consisting of a third shaft 411 and the third eccentric cam 412 Composed,
The pressing shaft 365 is configured to further include a center hole 363 into which the third shaft 411 is inserted.
The pressing protrusion 370 is formed to correspond to the center hole 363, the movement hole 373 is inserted into the third shaft 411, and is formed to extend from the movement hole 373, the third eccentric cam 412 Is inserted and is configured to further include a stepped groove 375 is formed left and right,
Installation height of the pressing protrusion 370 by the third eccentric cam 412 rotates eccentrically with respect to the third shaft 411 coupled to the center hole 363 according to the control of the third eccentric control 410. Turret picker device characterized by adjustable.
The turret picker device of claim 1, wherein the lifting operation unit is provided in plurality.
KR1020130098355A 2013-08-20 2013-08-20 A turret picker device KR101341399B1 (en)

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CN108946157A (en) * 2018-08-15 2018-12-07 苏州富强科技有限公司 Multistation cam carrying mechanism
CN109625961A (en) * 2019-01-25 2019-04-16 江苏信息职业技术学院 Rotating disc type IC chip handling device vacuum distribution module and handling device
CN109794427A (en) * 2019-02-03 2019-05-24 东莞市粤蒙电子科技有限公司 A kind of screening installation
CN113246091A (en) * 2021-06-07 2021-08-13 浙江工业大学 Manipulator device
CN115196347A (en) * 2022-05-23 2022-10-18 广州诺顶智能科技有限公司 Turret device
WO2023038572A1 (en) * 2021-09-10 2023-03-16 Mit Semiconductor Pte Ltd System and process for sorting die from wafer using angled wafer table and angled turret

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KR101043846B1 (en) * 2010-04-16 2011-06-22 김대준 Apparatus and method for picking up of semiconductor chip, apparatus and method for testing/sorting of semiconductor chip using the same

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KR200333546Y1 (en) * 2003-09-05 2003-11-15 (주)에이에스티 The semiconductor package transper apparatus with rotary head module
KR20100130395A (en) * 2009-06-03 2010-12-13 세크론 주식회사 Pick-up apparatus for semiconductor device
KR101043846B1 (en) * 2010-04-16 2011-06-22 김대준 Apparatus and method for picking up of semiconductor chip, apparatus and method for testing/sorting of semiconductor chip using the same
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Publication number Priority date Publication date Assignee Title
CN108946157A (en) * 2018-08-15 2018-12-07 苏州富强科技有限公司 Multistation cam carrying mechanism
CN108946157B (en) * 2018-08-15 2024-04-02 苏州富强科技有限公司 Multi-station cam carrying mechanism
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CN109794427B (en) * 2019-02-03 2024-06-04 东莞市粤蒙电子科技有限公司 Sorting equipment
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CN113246091B (en) * 2021-06-07 2024-05-14 浙江工业大学 Manipulator device
WO2023038572A1 (en) * 2021-09-10 2023-03-16 Mit Semiconductor Pte Ltd System and process for sorting die from wafer using angled wafer table and angled turret
CN115196347A (en) * 2022-05-23 2022-10-18 广州诺顶智能科技有限公司 Turret device

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