CN110524889A

CN110524889A - A kind of positioning system of contactless smart card manufacturing equipment

Info

Publication number: CN110524889A
Application number: CN201910729904.0A
Authority: CN
Inventors: 王开来; 赖汉进; 卢国柱; 吴伟文; 郑鸿飞
Original assignee: Guangzhou Mingsen Hexing Technology Co Ltd
Current assignee: Guangzhou Mingsen Hexing Technology Co Ltd
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2019-12-03

Abstract

The invention discloses a kind of positioning systems of contactless smart card manufacturing equipment, including rack, plate mounting table, chip mounting table, locating platform, the first handling device and the second handling device；It is provided with multiple first positioning pins on the plate mounting table, is provided with location hole on the plate；The locating platform includes substrate, and multiple coiling detents are divided on the substrate, and the coiling clip unit on the coiling clip and plate corresponds；The chip storage groove for storing chip is provided in each coiling detent, the chip storage groove in the coiling detent and the chip placement locations in coiling clip unit correspond；The second positioning pin is provided on the substrate；First handling device includes the first rack, plate carrying mechanism and the first transversal driving mechanism；The accurate positioning of plate and chip in contactless smart card production process may be implemented in positioning system of the invention, to improve the quality of production and production efficiency of contactless smart card.

Description

A kind of positioning system of contactless smart card manufacturing equipment

Technical field

The present invention relates to a kind of smart card manufacturing equipments, and in particular to a kind of positioning system of contactless smart card manufacturing equipment System.

Background technique

In contactless smart card production process, needed under normal conditions by following manufacturing procedure: laser boring process, Coiling manufacturing procedure, chip welding sequence, ultrasonic wave composite welding process and processing of cutting process；By above-mentioned manufacturing procedure Afterwards, independent smart card plate unit is formed, provides semi-finished stock for other subsequent processing.

Existing smart card spooling equipment, such as the application for a patent for invention that application publication number is CN108000909A disclose " a kind of contactless smart card manufacturing line ", the contactless smart card manufacturing line include rack, the installation of PVC board material Frame, laser boring module, smart card coiling processing module, die-bonding device, surpasses the plate mounting rack of PVC cover plate material volume Sound wave composite welding module, traction module and collection module for drawing conveying PVC board material and PVC covering plate；Along The conveying direction of PVC board material, the laser boring module, smart card coiling processing module, die-bonding device, ultrasonic wave are compound Welding module, traction module, collection module are set gradually on the rack；The PVC board material mounting rack is arranged in laser boring mould The front of plate mounting rack is arranged in the rear of block, the plate mounting rack.The present invention can be by each non-contact intelligent blocking The processing module made links together, and PVC board material is delivered continuously in each processing module and is processed, and reduces pair The transport number of PVC board material, improves production efficiency and machining accuracy.

However there is also following deficiencies for above-mentioned contactless smart card manufacturing line:

(1) during producing non-contact energy smart card, PVC board material passes through the contactless smart card manufacturing line It is reached in coiling processing module after laser boring module, the coiling clip unit by coiling processing module in PVC board material carries out coiling. After the completion of coiling, then the PVC board material sent to die-bonding device, at this point, chip conveying device is defeated by chip to be welded It is sent to the chip place to be welded of each PVC coiling clip on PVC coiling clip unit, then, the die-bonding device will be to be welded Chip is connect to be welded on each PVC coiling clip；Then, PVC board material is sent to ultrasonic wave composite welding module have children outside the state plan it is compound, PVC board material after finally again will be compound carries out processing of cutting, so as to form independent smart card plate unit.In the process, Since PVC board material first passes through coiling processing, then chip to be welded is transported in the PVC coiling clip unit on PVC board material Each PVC coiling clip chip place to be welded, then the welding of chip Yu PVC coiling clip is carried out, therefore, when certain factor (examples Such as vibration, wind-force) cause chip to shift relative between the chip welding position in PVC board material, prevent chip is from essence It is placed at chip welding position quasi-ly, so that chip cannot be smoothly welded on PVC coiling clip by die-bonding device, It is easy to cause and occurs open circuit between the two, to influence the quality of production of non-contact energy smart card.

(2) production efficiency of the contactless smart card manufacturing line is lower, and production precision is not high.

Summary of the invention

It is an object of the invention to overcome the deficiencies of the prior art and provide a kind of determining for contactless smart card manufacturing equipment Position system, the positioning system of the contactless smart card manufacturing equipment may be implemented plate and chip and produce in contactless smart card Accurate positioning in the process, to improve the quality of production and production efficiency of contactless smart card.

The technical solution that the present invention solves above-mentioned technical problem is:

A kind of positioning system of contactless smart card manufacturing equipment, including rack, be arranged on the rack for storing board The plate mounting table of material, the chip mounting table for storing chip are put down for realizing the positioning positioned to plate and chip Platform, the first handling device for being transported to the plate in plate mounting table in locating platform and will be in chip mounting table Chip is transported to the second handling device in locating platform, wherein

Multiple first positioning pins are provided on the plate mounting table, the plate is in the correspondence position of first positioning pin The place of setting is provided with location hole；

The locating platform includes substrate, and multiple coiling detents, the multiple coiling detent are divided on the substrate It arranges on the substrate in matrix；Coiling clip unit on the coiling clip and plate corresponds；In each coiling detent It is provided with the chip storage groove for storing chip, the chip storage groove in the coiling detent and the core in coiling clip unit Piece placement location corresponds；The corresponding position of the location hole with the plate is provided with the second positioning on the substrate Pin；

First handling device includes the first rack, the plate carrying mechanism being arranged in the first rack and driving institute State the first transversal driving mechanism that plate carrying mechanism moves back and forth between station in station before the carrying of plate and after carrying；Its In, the plate carrying mechanism includes mounting rack, the Suction cup assembly being arranged on mounting rack, at least two groups positioning component and drive It moves the Suction cup assembly and the positioning component does the first vertical driving mechanism of vertical motion；The Suction cup assembly includes multiple For the sucker of plate to be sucked, the positioning component includes the locating piece positioned for the location hole position to plate；Institute It states locating piece and is equipped with the escape groove for being used for avoiding the first positioning pin or the second positioning pin, the bottom surface of the locating piece, which is additionally provided with, to be used for Adsorb the sucker at position around the location hole of plate.

The present invention have compared with prior art it is below the utility model has the advantages that

1, the locating platform in the present invention is provided with one in each coiling detent by the way that multiple coiling detents are arranged Chip storage groove, the coiling clip unit in the multiple coiling detent and plate corresponds, and the core in the coiling detent Piece storage groove is then corresponding with the chip placement locations on coiling clip unit；In this way, chip is carried by the first handling device Into the chip storage groove of locating platform, chip is limited using chip storage groove, prevents chip subsequent processed It shifts in journey, to guarantee that the conducting wire of chip and the coil in coiling clip unit can be welded on by die-bonding device Together, welding precision is improved, and then improves the quality of production of contactless smart card.

2, by the locating platform in the setting present invention, so that contactless smart card manufacturing equipment can be incited somebody to action before coiling Chip is placed in the chip storage groove of the locating platform, and is positioned by chip storage groove to chip, compared to biography Chip is transported at the chip placement locations of coiling clip unit by the contactless smart card manufacturing equipment of system one by one again after coiling Mode for, the locating platform in the present invention can save contactless smart card manufacturing equipment and carry what chip was spent back and forth Time improves the production efficiency of contactless smart card manufacturing equipment.

3, the first handling device in the present invention is during carrying plate, by utilizing the positioning being arranged on plate The second positioning pin on hole and the first positioning pin and locating platform that are arranged on plate mounting table, and with the location hole of the plate Guarantee that the position of the location hole of the plate remains unchanged, and promote the positioning on the plate in the handling process for accurate positioning The second detent fit on hole and locating platform, to realize precise positioning of the plate on locating platform, and then improves Finished product rate.

4, the present invention in the first handling device in be provided at least two locating pieces, it is corresponding, the locating platform and The quantity of the second positioning pin on plate mounting table and the location hole on the first positioning pin and plate also with the locating piece Quantity corresponds, and by realizing the first detent fit on the location hole and locating platform on plate, limits plate with this Offset in the horizontal direction, to further increase the positioning accuracy of plate.

5, plate is adsorbed using sucker and is carried by the first handling device in the present invention, ensure that in the handling process, plate Material is not damaged, and convenient in carrying.

Detailed description of the invention

Fig. 1-Fig. 3 is first specific embodiment of the positioning system of contactless smart card manufacturing equipment of the invention Structural schematic diagram, wherein Fig. 1-Fig. 3 is the schematic perspective view of three different perspectivess.

Fig. 4 is the schematic perspective view of plate mounting table.

Fig. 5-Fig. 7 is the structural schematic diagram of the first handling device in the present invention, wherein Fig. 5 is main view, and Fig. 6 is the right side View, Fig. 7 are perspective view.

Fig. 8 is the top view of the plate in the present invention.

Fig. 9 is the structure diagram of the plate mounting table and locating platform in the present invention.

Figure 10 is the cross-sectional view of the positioning component in the present invention.

Figure 11 is the schematic perspective view of the plate carrying mechanism in the present invention.

Figure 12 is the structure diagram of synchronous drive mechanism.

Figure 13 is the schematic perspective view of the first transversal driving mechanism in the present invention.

Figure 14 is the schematic perspective view of the fixation kit in the present invention.

Figure 15 is the partial enlarged view of the second photoelectric sensor and the second detection lug in the present invention.

Figure 16-Figure 18 is the structural schematic diagram of the second handling device in the present invention, wherein Figure 16 is main view, figure 17 be left view, and Figure 18 is perspective view.

Figure 19 is the perspective view of the explosion of a chip transfer module in Figure 18.

Figure 20 is the perspective view of the explosion of the multiple groups chip pick-up mechanism in second handling device.

Figure 21 is the part perspective view of the explosion of one group of chip pick-up mechanism in Figure 20.

Figure 22 is the portion of the second transversal driving mechanism and the second vertical driving mechanism in the second handling device of the invention Divide perspective view of the explosion.

Figure 23-Figure 26 is the structural schematic diagram of the chip position adjustment mechanism of the chip feeding device in the present invention, wherein Figure 23 and Figure 24 is the schematic perspective view of two different perspectivess, and Figure 25 main view, Figure 26 is top view.

Figure 27 is the schematic perspective view of the chip mounting table in the present invention.

Figure 28 is the schematic perspective view of the placement rack in the present invention.

Figure 29 is the schematic perspective view of two groups of amendment components in the present invention.

Figure 30 is the top view of two upper layer amendments in Figure 29.

Figure 31 is the top view of the Liang Ge lower layer amendment in Figure 29.

Figure 32 is the partial enlarged view of the amendment driving mechanism in the present invention.

Figure 33-Figure 35 is the structural representation of the third handling device and chip mounting table of the chip feeding device in the present invention Figure, wherein Figure 33 and Figure 34 is the schematic perspective view of two different perspectivess, and Figure 35 is side view (partial sectional view).

Figure 36 is the schematic perspective view of barrow, suction piece and rotary drive mechanism.

Figure 37 is the schematic perspective view of rotary drive mechanism and third testing agency.

Figure 38 is the structural schematic diagram of suction piece.

Figure 39 is the schematic perspective view of the locating platform in conveying device of the invention.

Figure 40 is the top view of the locating platform.

Figure 41 is the partial enlarged view in Figure 39 at A.

Figure 42 is the partial enlarged view in Figure 40 at B.

Figure 43 is the structural representation of the positioning component of the first handling device in second specific embodiment of the invention Figure.

Figure 44 is the structure of the vertical power mechanism of the first handling device in third specific embodiment of the invention Schematic diagram.

Figure 45 is the second transversal driving mechanism of the second handling device in the 4th specific embodiment of the invention Part perspective view of the explosion.

Specific embodiment

Present invention will now be described in further detail with reference to the embodiments and the accompanying drawings, but embodiments of the present invention are unlimited In this.

Embodiment 1

Referring to figures 1-4 2, the positioning system of contactless smart card manufacturing equipment of the invention includes rack I, is arranged in machine On frame I for storing the plate mounting table B of plate 7a, the chip mounting table G for storing chip, for realizing to plate 7a The locating platform C that is positioned with chip, first for being transported to the plate 7a in plate mounting table B in locating platform C Handling device A and the second handling device E being transported to the chip in chip mounting table G in locating platform C, wherein

The chip position for being modified to chip position between the chip mounting table G and the second handling device E Adjust the device F and third handling device H for the chip in chip mounting table G to be transported to chip position adjustment device F.

When work, the plate 7a in plate mounting table B is transported on locating platform C by the first handling device A, realizes plate The chip being stored on chip mounting table G is transported to by accurate positioning of the 7a on locating platform C, then, third handling device H Chip position adjusts in device F, is adjusted by chip position adjustment device F to the position of the chip, and then, second carries dress It sets E position chip adjusted is transported on locating platform C, realizes the positioning of chip.Then, conveying device D is flat by positioning Platform C and the plate 7a and chip being placed on locating platform C are transported in coiling station, are carried out by bobbin winder device to plate 7a Coiling, after the completion of coiling, locating platform C is transported at chip welding post by conveying device D, is realized by die-bonding device The welding of chip and coil, finally, by the 4th handling device by locating platform C plate 7a and chip be transported to it is subsequent plus Following process is carried out in construction equipment.

In above process, it since locating platform C is two, and is respectively driven by two groups of conveying device D, therefore, this Continuous sex work may be implemented in the positioning system of the contactless smart card manufacturing equipment of invention, and working efficiency is higher.

Individually below to plate mounting table B, the first handling device A, chip mounting table G, the second handling device E, chip position The specific structure and its working principle for setting adjustment device F, third handling device H and conveying device D are described respectively.

(1) plate mounting table B

Referring to fig. 4, the plate mounting table B is arranged on rack I, including plate body and be arranged on plate body for pair On the first positioning pin 1b, the plate 7a that the plate 7a being stored on the plate body is positioned with the first positioning pin 1b Corresponding position be provided with the first positioning pin 1b cooperation location hole 7-1a.It is put when plate 7a stacking is placed on the plate When setting on platform B, the first positioning pin 1b in the plate mounting table B passes through the location hole 7-1a in plate 7a, thus realization pair The positioning of plate 7a before carrying.

(2) first handling device A

Referring to Fig. 5-Figure 15, the first handling device A includes the first rack 1a, the plate that is arranged on the first rack 1a Carrying mechanism and the driving plate carrying mechanism are moved back and forth in station before the carrying of plate 7a and after carrying between station The first transversal driving mechanism 3a；Wherein, the plate carrying mechanism include mounting rack 2a, the sucker that is arranged on mounting rack 2a Component 4a, at least two groups positioning component 5a and the driving Suction cup assembly 4a and positioning component 5a do the of vertical motion One vertical driving mechanism 6a；The Suction cup assembly 4a includes multiple for the sucker 4-1a of plate 7a, the positioning component to be sucked 5a includes the locating piece 5-1a positioned for the position location hole 7-1a to plate 7a；The locating piece 5-1a, which is equipped with, to be used In evacuation plate mounting table B on across the location hole 7-1a the first positioning pin 1b escape groove 5-11a, locating piece 5-1a Bottom surface be additionally provided with the sucker 5-12a at position around the location hole 7-1a for adsorbing plate 7a.

Referring to Fig. 5-Figure 15, the sucker 5-12a is multiple, and is uniformly distributed along the axle center the escape groove 5-11a.Its Purpose is, fixed when vertical power mechanism drives Suction cup assembly 4a and Suction cup assembly 4a to do vertical motion to carry plate 7a The position bottom part 5-1a and the surface plate 7a be when contacting, sucker 5-12a along plate 7a location hole 7-1a peripheral part uniform adsorption, Be conducive to be located at the plate 7a in around sucker 5-12a under the suction of sucker 5-12a in tensioning state, so that the part plate Plastic deformation will not occur in the handling process for material 7a, while the location hole 7-1a in the plate 7a of the part also would not be because of plate Expect the plastic deformation of 7a and the change on position occurs, ensure that the accuracy of the position of location hole 7-1a.

Referring to Fig. 5-Figure 15, the multiple sucker 4-1a arranges on the mounting rack 2a in matrix, the mounting rack 2a Corresponding position with each sucker 4-1a is provided with regulating tank 2-1a, the regulating tank 2-1a is carried along the plate 7a Direction extend.Multiple sucker 4-1a and evenly distributed are set, adsorb plate 7a to be more advantageous to.Due to mounting rack 2a The corresponding position each sucker 4-1a is being provided with regulating tank 2-1a, the position of the adjacent sucker 4-1a of adjusting can be passed through in this way It sets, to adapt to the carrying of plate 7a of different specifications and sizes.

Referring to Fig. 5-Figure 15, the positioning component 5a is two groups, and every group of positioning component 5a further includes being arranged in mounting rack 2a On the vertical driving assembly for being used to support the locating piece 5-1a and doing vertical motion, wherein the vertical driving assembly includes Slide guide bar 5-2a, retention slides 5-3a and elastic element, wherein the retention slides 5-3a is connected to the locating piece The top of 5-1a；The upper end slide guide bar 5-2a is fixedly connected on the mounting rack 2a, and lower end extends across straight down It is equipped on the retention slides 5-3a, the retention slides 5-3a and the locating piece 5-1a and the slide guide bar 5-2a The slide guide hole 5-31a being mutually matched；Wherein, the slide guide hole 5-31a on the locating piece 5-1a is connected to the escape groove 5-11a And it is concentric, the diameter of the escape groove 5-11a is greater than the diameter of the slide guide hole 5-31a；The lower end of the slide guide bar 5-2a It is provided with the limiting section 5- for preventing slide guide bar 5-2a to be detached from the slide guide hole 5-31a with escape groove 5-11a cooperation 21a；The elastic element acts between the mounting rack 2a and the retention slides 5-3a, and the elastic force of the elastic element The limiting section 5-21a of the slide guide bar 5-2a is promoted to be pushed against the escape groove 5-11a in the locating piece 5-1a and slide guide hole 5- On the cascaded surface formed between 31a.By the way that above structure is arranged, locating piece 5-1a is not only contributed in plate 7a position fixing process Operation is more stable, and is conducive to be pushed against the bottom surface of locating piece 5-1a on plate 7a, to improve positioning accurate Degree, and elastic element can play buffer function during locating piece 5-1a and plate 7a is contacted, to prevent from positioning The pressure of part 5-1a is excessive and damages plate 7a by pressure.Wherein, sliding equipment also can be set between locating piece 5-1a and mounting rack 2a, It is oriented to for the vertical motion to locating piece 5-1a, the sliding equipment can be sliding block sliding track mechanism either slide bar Mechanism.

Referring to Fig. 5-Figure 15, the lower end slide guide bar 5-2a is equipped with for avoiding the second positioning pin 1- on locating platform C The avoid holes 5-22a of the first positioning pin 1b of 3c or plate mounting table B；The avoid holes 5-22a with described escape groove 5-11a In on same axis.It, can be to avoid slide guide bar 5-2a and the first positioning pin 1b and the second positioning pin by the way that avoid holes 5-22a is arranged 1-3c is interfered.

Referring to Fig. 5-Figure 15, the bottom surface of the locating piece 5-1a is lower than the bottom surface of the sucker 4-1a.Its role is to In By plate 7a from being removed in plate mounting table B during, since the positioning surface of locating piece 5-1a is lower than the sucker 4-1a Bottom surface, therefore, locating piece 5-1a can first be contacted with the surface plate 7a, and the sucker 5-12a of locating piece 5-1a will be in plate 7a Part plate 7a positioned at location hole 7-1a surrounding is adsorbed, so that is be adsorbed in plate 7a is partially in tensioning state, thus So that two accurate positionings (i.e. two location hole 7-1a) on plate 7a are in handling process later not because of plate 7a's Plastic deformation and and the movement on position occurs, to guarantee that the location hole 7-1a of plate 7a can pass through locating platform The second positioning pin 1-3c on C, and then realize the accurate positioning of plate 7a.And in the mistake that plate 7a is placed on to locating platform C Cheng Zhong, also due to the positioning surface of locating piece 5-1a be lower than the sucker 4-1a bottom surface, therefore, locating piece 5-1a can take the lead in The second positioning pin 1-3c contact in locating platform C, so that the second positioning pin 1-3c on the locating platform C passes through the plate Location hole 7-1a on 7a, so that the position of two location hole 7-1a on plate 7a is determined, in this way, entire plate 7a Position also determine that, posterior sucker 4-1a plate 7a is placed on locating platform C during, due on plate 7a Two accurate positionings have been carried out positioning, therefore, entire plate 7a would not shift again, to realize plate 7a fixed Accurate positioning on bit platform C.

Referring to Fig. 5-Figure 15, the elastic element is spring 5-4a, and the spring 5-4a is set on the guide rod, the bullet The one end spring 5-4a acts on the mounting rack 2a, and the other end acts on the retention slides 5-3a.Using above-mentioned spring 5- 4a can make locating piece 5-1a be in abutting state, be conducive to preferably be pushed against locating piece 5-1a in positioning handling process On plate 7a, positioning accuracy is improved, and be that the soft contact process of locating piece 5-1a and plate 7a works as a buffer, guarantees plate 7a It is not damaged.

Referring to Fig. 5-Figure 15, the first vertical driving mechanism 6a includes vertical fixing seat 6-2a, is arranged and is vertically fixing Vertical motor 6-1a, lead screw transmission mechanism and for the power of vertical motor 6-1a to be passed to the screw rod on seat 6-2a The synchronous drive mechanism of transmission mechanism, wherein the lead screw transmission mechanism is multiple groups, and the multiple groups lead screw transmission mechanism is distributed in The surrounding of the mounting rack 2a；Every group of lead screw transmission mechanism includes screw rod 6-3a and the screw rod spiral shell with screw rod 6-3a cooperation The one end female 6-4a, the screw rod 6-3a is fixed on mounting rack 2a, and the other end extends straight up；The feed screw nut 6-4a turns It is dynamic to be connected on the vertical fixing seat 6-2a；The synchronous drive mechanism include the first active drive wheel 6-5a and first from Dynamic driving wheel 6-6a and the first driving belt 6-7a, wherein the first active drive wheel 6-5a is arranged in vertical motor 6- On the main shaft of 1a, the first driven driving wheel 6-6a is multiple, and is separately positioned on the screw rod spiral shell of every group of lead screw transmission mechanism It on female 6-4a, and is rotated synchronously with the feed screw nut 6-4a, the first driving belt 6-7a is successively looped around described the On one active drive wheel 6-5a and multiple first driven driving wheel 6-6a.Using the above structure, the first vertical driving can be passed through The movement up and down of mechanism 6a realization Suction cup assembly 4a and positioning component 5a；Detailed process are as follows: firstly, vertical motor 6- 1a drives the first active drive wheel 6-5a rotation, drives the first driven driving wheel 6-6a to rotate by the first driving belt 6-7a, To drive feed screw nut 6-4a to rotate, and then vertical screw rod is driven to move in a straight line upward or downward, finally drives mounting rack Suction cup assembly 4a and positioning component 5a on 2a are moved in a straight line upward or downward.In addition, since vertical motor 6-1a drives the While one active drive wheel 6-5a is rotated, on the feed screw nut 6-4a of the lead screw transmission mechanism of mounting rack 2a surrounding the One driven driving wheel 6-6a is also rotated synchronously, and ensures that the lifting speed of each position on mounting rack 2a keeps one in this way It causes, so that the multiple sucker 4-1a being mounted on Suction cup assembly 4a can be contacted with plate 7a simultaneously, so that plate 7a carrying is more steady, precision is higher.

Referring to Fig. 5-Figure 15, the vertical fixing seat 6-2a includes vertical fixed plate 6-21a and limited block 6-22a, institute State limited block 6-22a be it is multiple, the surrounding of the vertical fixed plate 6-21a, the limit is arranged in the multiple limited block 6-22a Position block 6-22a is fixedly connected on the vertical fixed plate 6-21a by fixed link 6-2a3, and the screw rod 6-3a is rotatably connected on On the vertical fixed plate 6-21a and limited block 6-22a, the feed screw nut 6-4a, which is arranged, states vertical fixed plate 6- described Between 21a and limited block 6-22a.By above structure can be realized by driving feed screw nut 6-4a screw rod 6-3a upward and It moves downward, to realize the movement up and down of Suction cup assembly 4a and positioning component 5a.

Referring to Fig. 5-Figure 15, it is equipped with and uses between the first active drive wheel 6-5a and the first driven driving wheel 6-6a The vertical fixing seat 6-2a is connected in the tensioning wheel 6-8a, the tensioning wheel 6-8a for being tensioned the first driving belt 6-7a On.By designing tensioning wheel 6-8a, the transmission efficiency of the first driving belt 6-7a can be improved.

Referring to Fig. 5-Figure 15, the first transversal driving mechanism 3a includes that the wherein one end the first rack 1a is arranged in Cross motor 3-1a and transverse transmission mechanism, wherein the transverse transmission mechanism includes being arranged on the first rack 1a And connect with cross motor 3-1a the second active drive wheel 3-2a, the second driven of the first rack 1a other end is set Driving wheel 3-3a and be connected between the second active drive wheel 3-2a and the second driven driving wheel 3-3a second Driving belt 3-4a；The vertical fixing seat 6-2a is fixed by the wherein side of fixation kit and the second driving belt 3-4a. By cross motor 3-1a drive the second active drive wheel 3-2a rotation, thus driving the second active drive wheel 3-2a and second from The second driving belt 3-4a movement between dynamic driving wheel 3-3a, and then fixation kit movement is driven, so that vertical fixing seat 6- 2a carries out transverse shifting, realizes the transverse shifting of plate carrying mechanism.

Referring to Fig. 5-Figure 15, the first transversal driving mechanism 3a further include setting it is described state vertical fixing seat 6-2a with Laterally steering component is equipped between the first rack 1a, the laterally steering component includes that the first bottom rack 1a is arranged in Cross slide way 3-7a and the transverse direction stated and be mutually matched on vertical fixing seat 6-2a with the cross slide way 3-7a is set Sliding block 3-8a.By the way that laterally steering component is arranged, when so that transverse slider 3-8a is mobile relative to cross slide way 3-7a, Neng Goubao The stability of transverse slider 3-8a is held, while guaranteeing the stability of plate carrying mechanism operation, and improve the precision of positioning.Separately Outside, by the way that laterally steering component is arranged, it can be used for carrying the weight of plate carrying mechanism, so that the second driving belt 3-4a is only Plate carrying mechanism need to be driven to do transverse movement, and do not need the weight of carrying plate carrying mechanism, second can be extended in this way The service life of driving belt 3-4a.

Referring to Fig. 5-Figure 15, the laterally steering component is two groups, and is located at the second driving belt 3-4a's The two sides of conveying direction.

Referring to Fig. 5-Figure 15, the fixation kit includes the first clamping element 3- being arranged on the vertical fixing seat 6-2a 5a and the second driving belt 3-4a is clamped in the second clamping element 3-6a on the first clamping element 3-5a, wherein It is provided on the first clamping element 3-5a or the second clamping element 3-6a and cooperates with the synchronous gear of the second driving belt 3-4a Groove.It is fixedly clamped by fixation kit and the second driving belt 3-4a, it is vertical solid to realize that belt is driven by fixation kit The transverse movement of reservation 6-2a.

Referring to Fig. 5-Figure 15, the first detection lug 9a, the first rack 1a is additionally provided on the vertical fixing seat 6-2a On be provided with the first photoelectric sensor 10a, wherein the first photoelectric sensor 10a be two, be located at plate mounting table The top of B and the top of locating platform C；The first detection lug 9a does the movement rail of transverse movement with vertical fixing seat 6-2a Mark passes through the first photoelectric sensor 10a.It is intended that driving plate carrying mechanism to do in the first transversal driving mechanism 3a During transverse movement, when the first photoelectric sensor 10a on the first rack 1a detects on vertical fixing seat 6-2a After one detection lug 9a, control system controls the first transversal driving mechanism 3a and stops working, so that first transversal driving mechanism 3a can accurately drive plate carrying mechanism to move to the top of plate mounting table B and locating platform C, to improve carrying essence Degree.

Referring to Fig. 5-Figure 15, the second photoelectric sensor 12a, the mounting rack are additionally provided on the vertical fixing seat 6-2a It is two that the second detection lug 11a, the second photoelectric sensor 12a is provided on 2a, and is vertically arranged in the vertical fixation On seat 6-2a；The second detection lug 11a passes through second photoelectric sensing with the motion profile that mounting rack 2a does vertical motion Device 12a.

- Figure 15 referring to fig. 4, the working principle of plate feeding device in the present invention is:

In the handling process of plate 7a, plate 7a is stacked on plate mounting table B first, plate mounting table B is set The first positioning pin 1b on the lower section of plate carrying mechanism, plate mounting table B is set to be mounted on plate mounting table B and stretch out plate Expect the table top of mounting table B, wherein on the first positioning pin 1b on plate mounting table B and plate 7a between location hole 7-1a one by one It is corresponding, before plate 7a carrying, plate 7a is stacked on plate mounting table B first, and promote on plate mounting table B first Positioning pin 1b passes through the location hole 7-1a on plate 7a, to complete the accurate positioning before carried to plate 7a.Stacking plate During 7a, need to guarantee that the plate 7a height stacked is lower than the height of the first positioning pin 1b.After the completion of stacking, then, the One transversal driving mechanism 3a driving plate carrying mechanism is moved to position corresponding with plate 7a above plate mounting table B, at this point, The position of locating piece 5-1a on plate carrying mechanism is located at the positioning of the first positioning pin 1b and plate 7a on plate mounting table B The surface of hole 7-1a, and position corresponds to each other, under the driving of the first vertical driving mechanism 6a, Suction cup assembly 4a and positioning group Part 5a is moved down simultaneously, and is contacted with the surface plate 7a, on the escape groove 5-11a evacuation plate mounting table B of locating piece 5-1a The first positioning pin 1b, the bottom surface locating piece 5-1a pushes against location hole 7-1a peripheral part of plate 7a, and sucker 5-12a is by plate Peripheral part of location hole 7-1a on 7a adsorbs, and is tensioned location hole 7-1a peripheral part plate 7a, in two locating piece 5- Under the action of 1a, fix the position of plate 7a accurately, then sucker 4-1a adsorbs plate 7a, the first vertical driving mechanism 6a The sucker 4-1a and locating piece 5-1a that plate 7a is adsorbed in driving again are moved upwards, and pass through the first transversal driving mechanism 3a's It is laterally driven, plate 7a is carried on the locating platform C in conveying device, locating platform C be equipped with on plate 7a The corresponding second positioning pin 1-3c of location hole 7-1a, when plate 7a is moved to location hole 7-1a and locating platform on plate 7a When the corresponding position of the second positioning pin 1-3c of C, under the first vertical driving mechanism 6a driving, plate 7a is moved downward, sucker The plate 7a of 4-1a, locating piece 5-1a and absorption are moved downward simultaneously, in the case where locating piece 5-1a absorption is accurately positioned, so that plate The location hole 7-1a of material 7a is accurately matched with the second positioning pin 1-3c on locating platform C, so that on the locating platform C Second positioning pin 1-3c passes through the location hole 7-1a on plate 7a, and with working on for vertical power mechanism, the plate is removed Plate 7a is pushed against on locating platform C by fortune mechanism, and last sucker 4-1a and locating piece 5-1a discharge plate 7a simultaneously, thus real Plate 7a is accurately now carried to locating platform C, with the upper material process of this plate.

During plate 7a is carried, on the position and locating platform C of the first positioning pin 1b on plate mounting table B The position of second positioning pin 1-3c corresponds, by being provided with location hole 7-1a in plate 7a, so that of the invention first Handling device A is during carrying plate 7a, using the location hole 7-1a on the plate 7a as accurate positioning, is removed by guaranteeing The position of location hole 7-1a during fortune on plate 7a remains unchanged, enable location hole 7-1a on plate 7a with it is fixed The second positioning pin 1-3c cooperation on bit platform C, so that after being placed on locating platform C level cannot occur again for the plate 7a Displacement on direction, to realize precise positioning of the plate 7a on locating platform C.

(3) chip mounting table G

Referring to Figure 16-Figure 22, the chip mounting table G in the present embodiment is vibrator, will be stored by the vibration of vibrator In the blow tank 1g that the chip in the vibrator is transported to the vibrator one by one.

(4) second handling device E

Referring to Figure 16-Figure 22, the second handling device E includes the second rack 1e and at least two chip transfer modules； Wherein, each chip transfer module includes chip pick-up module and drives the chip pick-up module in the second rack 1e Upper the second transversal driving mechanism for carrying out transverse shifting；Wherein, the second rack 1e includes the crossbeam 1-1e being laterally arranged, institute It states chip transfer module to be horizontally arranged on crossbeam 1-1e, and is slidably connected between crossbeam 1-1e；The chip pick-up module Second of chip pick-up mechanism 2e and driving chip draw frame machine 2e vertical motion including multiple groups setting arranged in parallel is vertical Driving mechanism 3e；The chip pick-up mechanism 2e includes suction nozzle 2-1e for adsorbing chip and for installing suction nozzle 2-1e Mounting blocks 2-2e, the mounting blocks 2-2e are connect with the second vertical driving mechanism 3e.

Referring to Figure 16-Figure 22, the chip pick-up mechanism 2e further include setting the described second vertical driving mechanism 3e with Middle connecting plate 2-3e between the mounting blocks 2-2e；Before the middle connecting plate 2-3e with the chip pick-up mechanism The mounting blocks 2-2e on 2e is slidably connected, and connects behind middle connecting plate 2-3e with the described second vertical driving mechanism 3e It connects.By the way that above-mentioned middle connecting plate 2-3e is arranged, the second vertical driving mechanism 3e may be implemented while driving multiple groups chip pick-up Mechanism 2e work, reaches while carrying to multiple chips, improves working efficiency.

Referring to Figure 16-Figure 22, the chip pick-up mechanism 2e further includes that the top the middle connecting plate 2-3e is arranged in Fixing piece 2-4e, the vertical driving cylinder 2-5e being mounted vertically on the fixing piece 2-4e；The piston rod of the driving cylinder 2-5e1 is connect with the upper end the mounting blocks 2-2e.By the way that vertical driving cylinder 2-5e is arranged, it can be achieved that the two-stage of suction nozzle 2-1e is perpendicular To driving, when suction nozzle 2-1e absorption chip, which is moved to chip, places station, the second vertical driving mechanism 3e can drive simultaneously Multiple groups chip pick-up mechanism 2e is moved down simultaneously, and every group of chip pick-up mechanism 2e is individually equipped with vertical driving cylinder 2-5e, can Realize the independent control of each suction nozzle 2-1e, it can be by vertically driving cylinder 2-5e that will successively be adsorbed with the suction nozzle 2-1e of chip It is moved downward to corresponding position, chip is discharged, carries out lower step process, chip handling efficiency and flexibility is greatly improved.

Referring to Figure 16-Figure 22, drive rod 2-6e and buffer spring 2-7e is equipped with below the vertical driving cylinder 2-5e； The top the mounting blocks 2-2e is equipped with link slot 2-2e1；Wherein, the one end the drive rod 2-6e and the work taken offence on cylinder described in drive Stopper rod 2-5e1 connection, the other end are embedded on the link slot 2-2e1；The buffer spring 2-7e is set in the drive rod On 2-6e, the one end buffer spring 2-7e is acted on the piston rod 2-5e1, and one end acts on the mounting blocks 2-2e End.It, can be by vertically driving cylinder 2-5e that drive rod 2-6e is driven to move downward, in turn by the way that above-mentioned drive rod 2-6e is arranged Driving mounting blocks 2-2e is moved downward；By setting buffer spring 2-7e absorption or release core can be moved down in suction nozzle 2-1e Buffer function is played during piece, reduces impact when vertical driving cylinder 2-5e driving suction nozzle 2-1e is moved downward to chip Power, to play the role of protecting chip.

Referring to Figure 16-Figure 22, the chip pick-up mechanism 2e further includes being arranged in the mounting blocks 2-2e and the centre For guiding the mounting blocks 2-2e to move along vertical direction on the middle connecting plate 2-3e between connecting plate 2-3e Guidance set, the guidance set include being vertically arranged in guide rail 2-8e before the middle connecting plate 2-3e and setting exists Behind the mounting blocks 2-2e with the sliding block 2-9e of the guide rail.By the way that guide rail 2-8e and sliding block 2-9e is arranged, so that sliding When block is mobile relative to guide rail 2-8e, it is able to maintain the stability of sliding block 2-9e, while guaranteeing chip pick-up mechanism 2e operation Stablize and improve the precision of positioning.

Referring to Figure 16-Figure 22, each chip pick-up module further includes sliding laterally plate 4e, the described second vertical driving Mechanism 3e is arranged on sliding laterally plate 4e；It is described to slide laterally between plate 4e and the crossbeam 1-1e equipped with described for guiding Slide laterally the laterally steering component that plate 4e is moved on the crossbeam 1-1e along transverse direction, the laterally steering component packet It includes cross slide way 5e that two are arranged in parallel on the crossbeam 1-1e and two is separately positioned on and described slides laterally plate 4e The upper and matched transverse slider 6e of the cross slide way 5e.By the way that above structure is arranged, chip transfer module may be implemented in cross Stable operation on beam 1-1e.

Referring to Figure 16-Figure 22, the second vertical driving mechanism 3e includes vertical driving motor 3-1e, vertical screw rod 3- 2e, vertical sliding block 3-3e, the vertical chute 3-4e and slide vertically plate 3-5e；Wherein, the vertical driving motor 3-1e installation On motor mount 3-6e, motor mount 3-6e is connect with the upper end the vertical chute 3-4e, the vertical chute 3-4e It is slid laterally on plate 4e described in being fixedly mounted on, the vertical screw rod 3-2e is connected to the main shaft of the vertical driving motor 3-1e It above and with the vertical sliding block 3-3e connect, the vertical sliding block 3-3e is arranged in the vertical chute 3-4e, the vertical cunning Block 3-3e is fixedly connected with the plate 3-5e that slides vertically, and the plate 3-5e and middle connecting plate 2-3e that slides vertically connects It connects.Using the above structure, the second vertical driving mechanism 3e can be made by driving vertical screw rod 3-2e rotation, drive vertical sliding block 3-3e is moved up, and reaches moving up for driving chip draw frame machine 2e, the structure driven precision It is high, compact-sized and stable.

Referring to Figure 16-Figure 22, second transversal driving mechanism includes being arranged between two parallel transverse guide rail 5e The stator 7-1e of linear motor 7e, linear motor 7e are arranged on crossbeam 1-1e, and rotor 7-2e setting slides laterally described On plate 4e.By the way that linear motor is arranged, can be laterally moved on crossbeam 1-1e with driving chip transfer module, to realize core Piece transverse shifting on crossbeam 1-1e places the corresponding top of station so that chip is shifted exactly to microarray biochip, and should Structure occupies little space, high transmission accuracy.

Referring to Figure 16-Figure 22, the crossbeam 1-1e and described slide laterally are equipped with grating scale displacement sensing between plate 4e plate Device 8e, the grating reading head of grating rule displacement sensor 8e, which is mounted on, described slides laterally the top plate 4e, scale grating setting On the crossbeam 1-1e.By the way that grating rule displacement sensor 8e is arranged, the driving of the second transversal driving mechanism can be accurately detected The displacement of the transverse shifting of chip pick-up module.

Referring to Figure 16-Figure 22, the working principle of the second handling device E in the present invention is:

In chip feeding process, each chip transfer module independent control, firstly, in the drive of the second transversal driving mechanism Under dynamic, each chip pick-up module is laterally moved to above corresponding chip mounting table G, until every on chip pick-up mechanism 2e A suction nozzle 2-1e is corresponded to each other with the position of chip on chip mounting table G, then under the driving of the second vertical driving mechanism 3e, Chip pick-up mechanism 2e is moved downward, and suction nozzle 2-1e is slowly close to chip, until suction nozzle 2-1e is contacted with chip surface, suction nozzle 2- 1e adsorbs chip, then adsorbs the suction nozzle 2-1e of chip under the drive of the second vertical driving mechanism 3e, by chip with Chip mounting table G separation, finally, each chip pick-up module for adsorbing chip is under the driving of the second transversal driving mechanism, It is respectively moved to corresponding chip and places station, successively discharge the chip adsorbed on suction nozzle 2-1e to locating platform C's In chip storage groove 1-1c, a feeding process is completed, constantly repeat above-mentioned coring piece and trusts the process of piece, realizes continuous make Industry.

(5) chip position adjusts device F

3- Figure 32 referring to fig. 2, chip position adjustment device F include for chip placement chip apparatus for placing and Correcting device for the position correction to chip；The chip apparatus for placing includes placement rack 1 and for driving placement rack 1 The power mechanism of rotation, 1 top of placement rack, which is equipped with, is used for chip placement and chip slot 1-1 corresponding with chip form；Institute Stating correcting device includes that two groups of amendment components of two groups of amendment components and driving make close to each other and reciprocating motion that is being located remotely from each other Amendment driving mechanism；Wherein, every group of amendment component is arranged by upper layer and lower layer, including upper layer amendment 2 and lower layer's amendment Part 3；The opposite end of two upper layer amendments 2 in two groups of amendment components, which is equipped with, carries out position for the chip to first direction Set modified upper amendment mouth 2-1；The opposite end of Liang Ge lower layer amendment 3 in two groups of amendment components is equipped with for second The chip of direction carries out the lower amendment mouth 3-1 of position correction；When two upper amendment mouth 2-1 relative motion to correction positions, the The chip edge of one direction matches with two upper amendment mouth 2-1；When correcting mouth 3-1 relative motion under two to correction position When, the chip edge of second direction with two under amendment mouth 3-1 match；It is in described positioned at the chip of the correction position The top of chip slot 1-1.

3- Figure 32 referring to fig. 2 is equipped with and the chip of first direction on the opposite end of described two upper layer amendments 2 The upper correction portion 2-2 that adjacent both sides are mutually matched；It is equipped on the opposite end of described two lower layer's amendments 3 and second direction Chip the lower correction portion 3-2 that is mutually matched of adjacent both sides；Described two opposite upper correction portion 2-2 are formed by space structure At the upper amendment mouth 2-1；Described two opposite lower correction portion 3-2 are formed by space and constitute the lower amendment mouth 3-1, institute It states the amendment mouth 2-1 and lower amendment mouth 3-1 and is set as multiple and laterally arranged in a straight line.By being oppositely arranged upper correction portion 2- 2 and lower correction portion 3-2, may be implemented chip edge and correction portion and lower correction portion 3-2 precise contact squeezes, so that upper amendment mouth 2-1 and it is lower amendment mouth 3-1 with chip precise match, achieve the effect that position correction；Upper amendment mouth 2-1 and lower amendment mouth 3-1 It is set as multiple, working efficiency can be improved simultaneously to multiple chips while position correction.

3- Figure 32 referring to fig. 2, the chip apparatus for placing further include fixed plate 4, the mounting blocks that 4 top of fixed plate is arranged in 5；There is certain interval between the fixed plate 4 and the mounting blocks 5, passes through support between the fixed plate 4 and the mounting blocks 5 Component is fixedly connected；The placement rack 1 is set as that multiple and straight line is transversely arranged to be passed through the mounting blocks 5 and be rotatably connected on institute It states on mounting blocks 5.Using the above structure, so that chip apparatus for placing structure it is more stable and maintenance in be also convenient for dismantle and pacify Dress；Placement rack 1, which is set as multiple, can place multiple chips, improve the efficiency of feeding.

3- Figure 32 referring to fig. 2, the support component include supporting block 6 and support rod 7；The supporting block 6 is fixed on described 5 side of mounting blocks；Described 7 one end of support rod is fixedly connected on 6 lower end of supporting block, and the other end is fixedly connected in fixed plate 4.It is logical Crossing above structure is fixed on mounting blocks 5 preferably in fixed plate 4, and ensure that placement rack 1 and power mechanism in mounting blocks 5 With the activity space between fixed plate 4.

3- Figure 32 referring to fig. 2, the power mechanism include adjusting driving motor 8 and being arranged in the adjusting driving motor Transmission component between 8 and the placement rack 1；The adjusting driving motor 8 is fixedly connected on described solid by fixedly connected part 9 On fixed board 4；Wherein, the fixedly connected part 9 using stepped design, vertically fix by stepped one end of the fixedly connected part 9 In 4 side of fixed plate, the other end is fixedly connected with the adjusting driving motor 8.Fixedly connected part 9 is set using step type Meter makes fixed plate 4 be divided into vertical and horizontal power by power, disperses power suffered by fixing piece, improves the steady of power mechanism It is qualitative, meanwhile, rationally, structure is more compact for mechanism design；It adjusts driving motor 8 and placement rack 1 is driven by transmission component The function of chip position adjustment is realized in rotation.

3- Figure 32 referring to fig. 2, the transmission component include be arranged in it is described adjusting driving motor 8 on driving pulley 10, The driven pulley 11 of 1 lower end of placement rack is set and for connecting the driving pulley 10 and the driven pulley 11 Belt 12.By above structure, adjusts driving motor 8 and drive the wheel rotation of driving pulley 10, driving pulley 10 passes through 12 band of belt Dynamic driven pulley 11 rotates, so that placement rack 1 be driven to rotate, and then drives the rotation of chip slot 1-1 on placement rack 1, realizes position Set adjustment.

3- Figure 32 referring to fig. 2 is provided with adaptive mechanism between the driving pulley 10 and the driven pulley 11, described Adaptive mechanism includes adaptive directed component, link block 13, connecting shaft 14, adaptive belt wheel 15 and adaptive spring 16； Wherein, the adaptive directed component include be arranged in 5 side of mounting blocks adaptive guide rail 17 and with it is described adaptive Answer the matched adaptive sliding block 18 of guide rail 17；The link block 13 is connect with the adaptive sliding block 18, the connecting shaft 14 1 End connect with the link block 13, the other end and the adaptive belt wheel 15 rotation connection, the adaptive belt wheel 15 with it is described Belt 12 connects；16 one end of adaptive spring effect and link block 13, the other end act on the supporting block 6.Using upper Structure is stated, the elastic of belt 12 can be adjusted by the elastic force of adaptive spring 16 by being advantageous in that, adaptive when belt 12 is excessively loose Spring 16 is answered to push link block 13 under own resilient effect, it is close along adaptive guide rail 17 under the action of guidance set 12 direction of belt is mobile, and adaptive belt wheel 15 also and then moves, and constantly pushes against belt 12, so that belt 12 is in tensioning state, mention High transmission efficiency and transmission accuracy.

3- Figure 32 referring to fig. 2, the correcting device further include preceding correction block 19, with it is described it is preceding amendment be oppositely arranged fastly and with There are the rear correction blocks 20 in gap between the preceding correction block 19；The preceding correction block 19 and rear 20 both ends of correction block are sliding Dynamic to be connected on mounting blocks 5, described two lower layer's amendments 3 are opposite respectively to be mounted on the preceding correction block 19 and the rear amendment On block 20.Can be driven using the above structure by amendment driving mechanism preceding correction block 19 and rear correction block 20 be located remotely from each other or Movement close to each other, two groups of amendment components of drive are located remotely from each other or movement close to each other.

3- Figure 32 referring to fig. 2 is equipped between the preceding correction block 19, the rear correction block 20 and the mounting blocks 5 and is used for Guide the preceding correction block 19 and it is described after correction block 20 is close to each other on mounting blocks 5 or the amendment guiding group that is located remotely from each other Part, the amendment guidance set includes the two amendment guide rails 21 and two groups of difference for being arranged in parallel in 5 both ends of mounting blocks It is arranged in the preceding correction block 19 and the rear correction block 20 and is slided respectively with the matched amendment of two amendment guide rails 21 Block 22；The amendment guide rail 21 is angularly disposed on the mounting blocks 5, pair of the amendment guide rail 21 and the upper amendment mouth 2-1 Linea angulata is parallel.By the design of amendment guide rail 21 and amendment sliding block 22, so that amendment sliding block 22 is mobile relative to amendment guide rail 21 When, it is able to maintain the stable of amendment sliding block 22, while guaranteeing the stable of correcting device；Correct guide rail 21 and upper amendment Mouth 2-1 diagonal line is parallel, is advantageous in that amendment driving mechanism drives preceding correction block 19 with rear correction block 20 along upper amendment mouth 2-1 Diagonal is located remotely from each other or close to each other, so that two upper layer amendments 2, Liang Ge lower layer amendment 3 are also along upper Amendment mouth 2-1 diagonal is located remotely from each other or close to each other, in position correction, is conducive to upper correction portion 2-2 and lower amendment Portion 3-2 is preferably contacted with chip edge, is reduced and is squeezed chip transition, causes wafer damage.

3- Figure 32 referring to fig. 2, the amendment driving mechanism include driving the preceding correction block 19 and the rear correction block 20 The amendment cylinder 23 and the driving preceding correction block 19 and the rear correction block 20 being located remotely from each other amendment spring close to each other 24；The amendment cylinder 23 is connected by cylinder mounting plate 25 with described 5 one end of mounting blocks；It is provided on the amendment cylinder 23 Drive block 26 is corrected, described 26 one end of amendment drive block is equipped with mounting groove 26-1, and the both sides the mounting groove 26-1 are respectively equipped with Bearing 27；The preceding correction block 19 is respectively equipped with guide pad close to the same end of the amendment cylinder 23 with the rear correction block 20 28；Described two bearings 27 act on and described two guide pads 28 respectively.By above structure, corrects the driving amendment of cylinder 23 and drive Motion block 26 is mobile, so that bearing 27 also and then moves, when bearing 27 is contacted with guide pad 28, bearing 27 rotates, and pushes respectively Guide pad 28 drives preceding correction block 19 and rear correction block 20 drawing in amendment guide rail 21 so that guide pad 28 is displaced outwardly respectively Lead it is lower be mutually displaced outwardly, reserve the space of chip placement；It is mobile by 27 rotation forces guide pad 28 of bearing, so that bearing 27 Become soft between guide pad 28 to contact, play certain buffering effect, avoids the damage really up to the mark for contacting and causing contact surface, improve Mechanism service life.

The end of the preceding correction block 19 with the rear correction block 20 is arranged in 3- Figure 32 referring to fig. 2, the amendment spring 24 Between end, which is acted in the preceding correction block 19, and the other end acts in the rear correction block 20.It is logical Cross and above-mentioned amendment spring 24 be set, when correct the driving amendment of cylinder 23 it is dynamic before correction block 19 with after correction block 20 along amendment guide rail 21 are displaced outwardly respectively, and two groups of amendment components are also located remotely from each other movement under the drive of preceding correction block 19 and rear correction block 20, when When correcting component movement to certain distance, the chip that good position has been adjusted on chip slot 1-1 is then carried to two groups of amendment groups Among part, cylinder 23 is then corrected toward retraction, at this point, preceding correction block 19 and rear correction block 20 are in the pulling force effect for correcting spring 24 Under move respectively inwards, thus drive two groups of amendment components it is inwardly close, correct component on upper layer amendment 2 or lower layer amendment Part 3 is contacted with chip, and the position and angle of chip are adjusted, and after the completion of position is adjusted, amendment driving mechanism drives again Preceding correction block 19 is displaced outwardly with rear correction block 20, makes two groups of amendment components far from chip, chip is then carried to smart card On the setting position of plate 7a.

The chip position adjustment device F of 3- Figure 32 referring to fig. 2, the chip feeding device further include pedestal 29 and setting The transversal driving mechanism for being used to drive the chip apparatus for placing on the pedestal 29；The transversal driving mechanism includes setting Laterally steering component and setting between the pedestal 29 and the fixed plate 4 is set to be used in laterally steering component one end Drive the horizontal drive motor 30 of the guidance set movement；Wherein, the laterally steering component includes being mounted on pedestal 29 Sliding slot 31 and be arranged in the sliding slot 31 and the matched sliding block 32 of the sliding slot 31；The horizontal drive motor 30 and institute It states sliding block 32 to connect by screw rod 33, the sliding block 32 is equipped with and the matched threaded hole of the screw rod 33；The sliding block 32 with Middle connecting plate 35 is equipped between the fixed plate 4.Using the above structure, the transverse shifting of chip apparatus for placing may be implemented, Cooperated using sliding block 32 and screw rod 33, so that structure is simpler, convenient for manufacture, reduces cost.

The driven pulley 11 of 3- Figure 32 referring to fig. 2, described 5 one end of mounting blocks divide into position sensor 34.Pass through position Sensor 34 can identify the turned position of driven pulley 11, and then identify the turned position of placement rack 1, realize chip position essence True rotational positioning.

The working principle of 3- Figure 32 referring to fig. 2, the position adjusting mechanism of chip feeding device of the invention are:

When work, amendment driving mechanism drives two groups of amendment components to be located remotely from each other movement, and then drives two upper layer amendments Part 2 and Liang Ge lower layer amendment 3 are also located remotely from each other movement, until can have sufficient space by chip pass through upper amendment mouth 2-1 with Then lower amendment mouth 3-1 moves in chip to the chip slot 1-1 of placement rack 1 from chip mounting table G, chip is put from chip When setting platform G carrying, the direction of chip is one kind, can be adjusted to the direction of chip by chip slot 1-1, adjustment completion The amendment of chip position, detailed process are carried out afterwards are as follows:

When the chip of the smart card of production is the chip of first direction, if the chip carried from chip mounting table G Direction with first towards it is identical when, then the chip slot 1-1 of the placement rack 1 plays intermediate storage function, then the second carrying Chip on placement rack 1 is carried to the centre of two upper layer amendments 2 by device E, and amendment driving mechanism drives two groups of amendment groups Part mutually inwardly moves, and the upper amendment mouth 2-1 on two upper layer amendments 2 is mutually close to chip and squeezes chip, so that repairing Positive mouth 2-1 is mutually matched with chip edge, position correction is carried out to chip position, it is intended that removing in the second handling device E It is light-weight since chip volume is small when suction nozzle 2-1e and chip on the second handling device E are contacted during transporting chip, because The position of this chip is easy to happen offset, two groups of amendment component movements is driven by amendment driving mechanism, thus to chip Posture is further corrected, to improve the position precision of chip, allows the second handling device E successfully by chip It is placed in the chip storage groove 1-1c of locating platform C.After the completion of position correction, amendment driving mechanism drives two groups of amendment components It mutually moves out, the upper amendment mouth 2-1 on two upper layer amendments 2 is also relatively distant from chip motion, then completes amendment Chip afterwards is carried on the setting position of smart card plate, completes the chip feeding process of first direction.

When the chip of the smart card of production is the chip of second direction, due to the chip carried from chip mounting table G Direction with second direction it is not identical, when chip is carried to the chip slot 1-1 on placement rack 1 from chip mounting table G, in power Under the action of mechanism, driving placement rack 1 rotates, and drives the chip slot 1-1 rotation on placement rack 1, and then drive on chip slot 1-1 Chip rotation, when rotation to it is consistent with the chip position of second direction when, stop driving, then, chip is carried to two The centre of a lower layer's amendment 3, amendment driving mechanism drive two groups of amendment components mutually inwardly to move, Liang Ge lower layer amendment 3 On lower amendment mouth 3-1 it is mutually close to chip, to squeeze chip, lower amendment mouth 3-1 is mutually matched with chip edge, to core Piece position carries out position correction, and after the completion of position correction, amendment driving mechanism drives two groups of amendment components mutually to move out, and two Lower amendment mouth 3-1 on a lower layer's amendment 3 is also relatively distant from chip motion, and the chip after the completion of amendment is then carried to intelligence On the setting position of energy snap-gauge material, the chip feeding process of second direction is completed.

(6) third handling device H

Referring to Figure 33-Figure 38, the third handling device H includes the bracket 1h being arranged on rack I, is arranged in bracket 1h On barrow 2h, be arranged on barrow 2h suction piece 5h, for driving suction piece 5h to make rotating motion rotation driving Mechanism and the vertical driving mechanism of third for driving the suction piece 5h to do vertical motion, wherein the suction piece 5h is Four, and uniformly arrange along the circumferencial direction of barrow 2h；Each suction piece 5h includes suction nozzle fixing seat 5-1h, is arranged and is inhaling Suction nozzle 5-2h on mouth fixing seat 5-1h, wherein be provided on the barrow 2h with the corresponding position each suction piece 5h Fixed plate 2-1h, the suction nozzle fixing seat 5-1h is mounted on the fixed plate 2-1h by sliding connection structure 5-7h, described Sliding connection structure 5-7h is sliding block sliding track mechanism.

Referring to Figure 33-Figure 38, it is additionally provided with elastic buffer member between the suction nozzle fixing seat 5-1h and fixed plate 2-1h, The elastic buffer member includes the guide pad 5-6h that the lower end the fixed plate 2-1h is arranged in, is arranged in the guide pad 5-6h On guide rod 5-5h and spring 5-4h, wherein the guide rod 5-5h is vertically arranged, the suction nozzle fixing seat 5-1h with The corresponding position of the guide rod 5-5h is provided with the pilot hole with guide rod 5-5h cooperation, wherein the spring 5-4h It is set on the guide rod 5-5h, the upper end of spring 5-4h acts on the lower end of the suction nozzle fixing seat 5-1h, and lower end is made With on the guide pad 5-6h.

Referring to Figure 33-Figure 38, the vertical driving mechanism of third includes the cylinder fixed seat 3h being arranged on bracket 1h, sets It sets in the cylinder 4h on the cylinder fixed seat 3h and pressure block 5- on the suction nozzle fixing seat 5-1h that each suction piece 5h is arranged in 3h, wherein the cylinder 4h is two, and is located at upper end and the chip position of the blow tank 1g of the chip mounting table G The upper end for adjusting device F, during the cylinder 4h drives piston rod to move downward, the piston rod and suction nozzle of cylinder 4h Pressure block 5-3h contact on fixing seat 5-1h, and push suction nozzle fixing seat 5-1h and be arranged in the suction nozzle fixing seat 5-1h On suction nozzle 5-2h move downward, to realize absorption to the chip in the blow tank 1g of chip mounting table G.As suction nozzle 5-2h When absorption chip, the cylinder 4h drives piston rod to move upwards, and elastic force of the suction nozzle fixing seat 5-1h in spring 5-4h is made It is moved upwards under, to drive suction nozzle 5-2h and be moved upwards by the suction nozzle 5-2h chip adsorbed, to complete chip Feeding action.Similarly, the process for chip being placed on chip position adjustment device F is also consistent with reclaiming process.

Referring to Figure 33-Figure 38, the rotary drive mechanism includes the rotating electric machine fixing seat 7g being arranged on rack I, sets It sets in the rotating electric machine 6h on the rotating electric machine fixing seat 7g and rotation axis 5-10h being vertically arranged on the barrow 2h, Wherein, the main shaft of the rotating electric machine 6h is connect with one end of the rotation axis 5-10h, and the rotation axis 5-10h is mounted on institute It states on barrow 2h, the other end of rotation axis 5-10h is rotatably connected on bracket 1h.Rotation axis is driven by rotating electric machine 6h 5-10h rotation, to drive barrow 2h to rotate, so that chip is transported to chip position tune above chip mounting table G The top of whole F, and then complete the transfer work of chip.

Referring to Figure 33-Figure 38, the rotary drive mechanism further includes the third for detecting the rotational angle of barrow 2h Testing agency, the third testing agency include that the rotating disc 5-9h being arranged on the rotation axis 5-10h and setting are being revolved Third photoelectric sensor 5-8h, the rotating disc 5-9h on rotating motor fixing seat 7g are located at the third photoelectric sensor 5-8h Detection mouth between, be arranged on rotating disc 5-9h jagged.When 3rd sensor detects the notch on rotating disc 5-9h, It controls rotating electric machine 6h by control system to stop working, so that it is guaranteed that suction piece 5h moves to the blow tank of chip mounting table G The top of 1g or the top of chip position adjustment F, to realize the absorption and unloading of chip, and guarantee the handling precision of chip.

Corresponding, since the suction piece 5h in barrow 2h is four groups, the notch on the rotating disc 5-9h is also four, And the angle between two neighboring notch is 90 degree, and in this way during rotating disc 5-9h is rotated synchronously with barrow 2h, institute Every 90 degree of the rotation of barrow 2h is stated, the third photoelectric sensor 5-8h is detected by a notch, controls by control system Rotating electric machine 6h stops working, to be accurately controlled the rotation angle (the rotation angle is 90 degree) of barrow 2h, in turn Improve the precision that chip is carried.

Referring to Figure 33-Figure 38, the working principle of the third handling device H in the present invention is:

When work, chip is transported in the blow tank 1g in chip mounting table G by chip mounting table G, and then, rotation is driven Motivation structure drives barrow 2h rotation, so that suction piece 5h moves to the top of blow tank 1g, then, the vertical driving mechanism of third Suction piece 5h is driven to do vertical motion, thus by chip pick-up.Then, rotary drive mechanism drives suction piece 5h rotation, so that Suction piece 5h and the chip motion being adsorbed adjust the top of device F, the vertical driving mechanism driving of third to chip position Suction piece 5h vertical motion, thus in chip slot 1-1 chip being placed in the placement rack 1 of chip position adjustment device F, into And chip is completed in chip mounting table G and thinks the transfer between chip position adjustment device F.

(7) locating platform C

Referring to Figure 39-Figure 42, the locating platform C in the present invention includes substrate 1c, is divided on the substrate 1c multiple Coiling detent 2c, the multiple coiling detent 2c arrange on the substrate 1c in matrix, the coiling detent 2c and plate 7a On coiling clip unit correspond；The chip storage groove 1-1c for storing chip is provided in each coiling detent 2c, The chip placement locations one on the coiling clip unit in chip storage groove 1-1c and plate 7a in the coiling detent 2c are a pair of It answers.

Referring to Figure 39-Figure 42, the substrate 1c is provided with the first air inlet 1- in the lower end of the chip storage groove 1-1c 2c, the first air inlet 1-2c are connected to external negative pressure device.In this way, being vacuumized by negative pressure device, so that chip is inhaled It is attached in the chip storage groove 1-1c, prevents chip during following process because other factors (such as vibration) occur partially It moves, is always positioned at it in plate 7a at the chip placement locations of corresponding coiling clip unit, to improve chip welding Precision, and then guarantee contactless smart card the quality of production.

Referring to Figure 39-Figure 42, the second positioning pin 1- for being positioned to plate 7a is additionally provided on the substrate 1c 3c, the second positioning pin 1-3c be it is multiple, the plate 7a with the setting of the corresponding position of the second positioning pin 1-3c There is the location hole 7-1a with the second positioning pin 1-3c cooperation.It is intended that the locating platform C in the present invention not only can be right Chip realizes positioning, can also position to plate 7a, detailed process are as follows: firstly, the first handling device A carries plate 7a Onto locating platform C of the invention, and the location hole 7-1a on the plate 7a is promoted to pass through second on the locating platform C Positioning pin 1-3c, since the second positioning pin 1-3c has more, corresponding, the location hole 7-1a on the plate 7a also just has It is multiple, the displacement in plate 7a generation horizontal direction can be thus limited with multiple accurate positionings.Benefit using the above structure It is: (1) positioning of chip and plate 7a, by the locating platform C can be first realized, then again in the coiling clip of plate 7a Unit carries out coiling, finally carries out the welding between the conducting wire that the coil on chip and coiling clip unit is drawn.In this way, comparing For the processing method of traditional contact type intelligent card production line, aforesaid way due to before coiling just to plate 7a It is positioned with chip, can be shifted in winding process to avoid plate 7a in this way, so that the chip on plate 7a is placed Position and chip correspond, to improve the precision of chip welding, guarantee the quality of production of contactless smart card.(2), due to The plate 7a and chip just realize positioning before coiling on locating platform C, also ensure that chip and plate 7a in this way It will not shift in process later, to further increase the welding precision and contactless smart card of chip The quality of production.

The second positioning pin 1-3c in the present embodiment is two, and described two second positioning pin 1-3c are arranged in the substrate 1c ipsilateral both ends, accordingly, the location hole 7-1a of the plate 7a are also two.

Referring to Figure 39-Figure 42, the surrounding of the coiling detent 2c is provided with multiple second air inlet 2-1c, the multiple Second air inlet 2-1c is evenly distributed along the outer contour of the coiling detent 2c；Each second air inlet 2-1c and outside are negative Pressure device connection.In this way, vacuumizing by negative pressure device, to plate 7a is adsorbed on the surface of substrate 1c, plate is avoided 7a shifts in process.And since the surrounding of each coiling detent 2c on substrate 1c is provided with the second air inlet 2-1c, the second air inlet 2-1c are evenly distributed along the outer contour of the coiling detent 2c, ensure that base in this way Coiling clip unit on coiling detent 2c and plate 7a on plate 1c corresponds, while also implying that and being stored in locating platform C On chip and plate 7a on chip placement locations correspond, to further increase the positioning accuracy of plate 7a.

Referring to Figure 39-Figure 42, by the second air inlet 2-1c being arranged on substrate 1c, so that substrate 1c is divided into 25 A coiling detent 2c, and 25 coiling detent 2c arrange on substrate 1c in the matrix of 5x5.It is corresponding, on plate 7a around Line card unit is also 25, is equally also arranged on plate 7a in the matrix of 5x5.

Referring to Figure 39-Figure 42, the substrate 1c includes upper plate body 1-4c and lower body 1-5c, the upper plate body 1-4c and institute It states and is connected through a screw thread between lower body 1-5c, inner cavity, the inner cavity are provided between upper plate body 1-4c and lower body 1-5c It is connected to the first air inlet 1-2c and the second air inlet 2-1c.In this way, will be in the inner cavity of substrate 1c by negative pressure device Air detaches, so that the air pressure in the inner cavity is less than atmospheric pressure, therefore, chip and plate 7a positioned at the surface substrate 1c It will be pressed on the surface of the substrate 1c under atmospheric pressure, to prevent chip and plate 7a from sending out in process Raw offset.In addition, ensuring that first in this way since the first air inlet 1-2c and the second air inlet 2-1c are connected to inner cavity Air inlet 1-2c and the second air inlet 2-1c are identical to the adsorption capacity of chip with plate 7a.

Referring to Figure 39-Figure 42, the working principle of the locating platform C in the present invention is:

When work, the positioning to chip, detailed process is may be implemented in locating platform C through the invention are as follows: second carries Chip is successively transported in the chip storage groove 1-1c of each coiling detent 2c of the locating platform C by device E, then, plate Plate 7a is transported in locating platform C by material 7a handling device, is provided with multiple coiling clip units on plate 7a, it is described around Coiling detent 2c on line card unit and plate 7a is corresponded, and each coiling clip unit corresponding one non-to connect smart card.And by It is provided with chip storage groove 1-1c in each coiling detent 2c on locating platform C, the chip storage groove 1-1c and plate The chip placement locations of corresponding coiling clip unit are corresponding in 7a.After chip and plate 7a realize positioning on locating platform C, The locating platform C in the present invention is driven to move at coiling station by conveying device D, through bobbin winder device on plate 7a Coiling is carried out on each coiling clip unit, two conducting wires is finally drawn and is contacted with the solder joint on chip.Then, conveying device D after It is continuous that locating platform C is driven to move at chip welding post, conducting wire and the solder joint on chip are welded by die-bonding device It connects, finally, conveying device D continues to drive locating platform C and after the chip and plate 7a that are placed on locating platform C reach Continuous processing stations are to complete subsequent manufacturing procedure.

In above process, it is just realized and is accurately positioned on locating platform C before coiling due to chip and plate 7a, Therefore, ensure that chip and plate 7a will not shift in winding process in this way, thus after guaranteeing coiling each around The conducting wire drawn in coil in line card unit can be contacted with the solder joint of chip, enable die-bonding device successfully The solder joint of the chip and the conducting wire of extraction are welded, so that welding precision is improved, so as to improve the non-quality of production for connecing smart card. In addition, since chip is had been placed in front of coiling in the chip storage groove 1-1c of locating platform C, and traditional non-connect intelligence Card manufacturing line is then that the chip for the coiling clip unit being again transported to chip one by one after the completion of coiling on plate 7a is placed At position, therefore, for traditional chip mode of transport, locating platform C of the invention can save non-contact intelligent Blocking manufacturing apparatus carries chip the time it takes back and forth, improves the production efficiency of contactless smart card manufacturing equipment.

(8) conveying device D

Conveying device D in the present embodiment can be using existing structure for conveying on the market, such as can be motor and silk Perhaps mode of the motor in conjunction with synchronous belt drive mechanism be also or be motor and gear teeth for the mode that bar transmission mechanism combines The mode that strip transmission mechanism combines, and mode of the present embodiment using motor in conjunction with lead screw transmission mechanism.

Embodiment 2

Referring to fig. 43, this embodiment differs from embodiment 1 in that, in the first handling device A in the present embodiment The vertical driving assembly of positioning component 5a can also be another form, the vertical driving assembly include sliding block sliding track mechanism with And the spring 5-4a；Wherein the sliding block sliding track mechanism include positioning slide guide rail 5-5a and with the positioning slide guide rail 5-5a The positioning sliding block 5-6a being mutually matched；Slide guide rail upper end is connect with the mounting rack 2a, and the locating piece 5-1a passes through company Fitting 5-7a is fixed on the lower end of the positioning sliding block 5-6a, and the lower part positioning slide guide rail 5-5a also is provided with described for limiting The limiting section 5-21a of the position positioning sliding block 5-6a, the spring 5-4a setting is in the mounting rack 2a and the positioning sliding block 5- Between 6a, the effect of the one end spring 5-4a and the first rack 1a, one end acts on the positioning sliding block 5-6a.Pass through sliding block Sliding track mechanism also can guarantee locating piece 5-1a operation stability in position fixing process, and preferably by the bottom of locating piece 5-1a Face is pushed against on plate 7a, to improve positioning accuracy.

Embodiment 3

Referring to fig. 44, the present embodiment and embodiment 1 and embodiment 2 the difference is that, first in the present embodiment removes The first vertical driving mechanism 6a in shipping unit A can be another form, and the screw rod 6-3a transmission component is one group, institute The first driven driving wheel 6-6a is stated to be arranged on the vertical fixing seat 6-2a, the mounting rack 2a and vertical fixing seat 6-2a it Between be equipped with for guide mounting rack 2a move up and down guide post guide sleeve mechanism, wherein the guide post guide sleeve mechanism be multiple groups, it is described Multiple groups guide post guide sleeve mechanism is distributed in the surrounding of the mounting rack 2a；Every group of guide post guide sleeve mechanism include guide post 6-9a and with institute The one end guide sleeve 6-10a, the guide sleeve 6-10a for stating guide post 6-9a cooperation is fixed on the vertical fixing seat 6-2a, described to lead The one end column 6-9a is fixed on mounting rack 2a, and the other end extends straight up and passes through the guide sleeve 6-10a；The screw rod 6-3a The screw rod 6-3a of transmission component is connect with the described first driven driving wheel 6-6a, and the vertical motor 6-1a setting is described vertical On fixing seat 6-2a, the first active drive wheel 6-5a is arranged on the main shaft of vertical motor 6-1a, and described first actively drives Driving wheel 6-5a is connect with the described first driven driving wheel 6-6a by the first driving belt 6-7a, the feed screw nut 6-4a It is arranged on the mounting rack 2a, and cooperates with the screw rod 6-3a.By above structure, pass through vertical motor 6-1a Screw rod 6-3a rotation is driven, feed screw nut 6-4a has been driven to make vertical motion on screw rod 6-3a bar, to drive vertical fixed Seat 6-2a also makees vertical motion, and then mounting rack 2a is driven to make vertical motion, realizes that Suction cup assembly 4a's and positioning component 5a is perpendicular To movement；By the way that guide post guide sleeve mechanism is arranged, the steady of the vertical motion between vertical fixing seat 6-2a and mounting rack 2a ensure that It is qualitative, to guarantee Suction cup assembly 4a and positioning component 5a in the stability of vertical motion process.

Embodiment 4

Referring to fig. 45, this embodiment differs from embodiment 1 in that, in the second handling device E in the present embodiment Second transversal driving mechanism can also be horizontal drive motor 9e and screw rod transmission component, wherein the screw rod transmission component packet Include cross lead screw 11e, transverse slider 12e and horizontal concrete chute 10e；The horizontal drive motor 9e is mounted on cross motor peace It fills on seat 13e, which is fixedly connected with the one end horizontal concrete chute 10e, and horizontal concrete chute 10e is fixedly mounted On the crossbeam 1-1e, the cross lead screw 11e be connected on the main shaft of the horizontal drive motor 9e and with the transverse direction Sliding block 12e connection, the transverse slider 12e are connect with the plate 4e that slides laterally, and the transverse slider 12e is arranged in the cross Into sliding slot 10e.By setting horizontal drive motor 9e and screw rod runner assembly, it can be achieved that the lateral of chip pick-up module is transported It is dynamic, and structure is simple, transmission effect is good.

Above-mentioned is the preferable embodiment of the present invention, but embodiments of the present invention are not limited by the foregoing content, His any changes, modifications, substitutions, combinations, simplifications made without departing from the spirit and principles of the present invention, should be The substitute mode of effect, is included within the scope of the present invention.

Claims

1. a kind of positioning system of contactless smart card manufacturing equipment, including rack, be arranged on the rack for storing plate Plate mounting table, the chip mounting table for storing chip, for realizing the locating platform that plate and chip are positioned, The first handling device for being transported to the plate in plate mounting table in locating platform and by the core in chip mounting table Piece is transported to the second handling device in locating platform, which is characterized in that

Multiple first positioning pins are provided on the plate mounting table, the plate is in the corresponding position of first positioning pin It is provided with location hole；

The locating platform includes substrate, multiple coiling detents is divided on the substrate, the multiple coiling detent is in institute It states and arranges on substrate in matrix；Coiling clip unit in the coiling detent and plate corresponds；In each coiling detent It is provided with the chip storage groove for storing chip, the chip storage groove in the coiling detent and the chip in coiling clip unit Placement location corresponds；The corresponding position of the location hole with the plate is provided with the second positioning pin on the substrate；

First handling device includes the first rack, the plate carrying mechanism being arranged in the first rack and the driving plate The first transversal driving mechanism that material carrying mechanism moves back and forth between station in station before the carrying of plate and after carrying；Wherein, The plate carrying mechanism includes mounting rack, the Suction cup assembly being arranged on mounting rack, at least two groups positioning component and driving The Suction cup assembly and the positioning component do the first vertical driving mechanism of vertical motion；The Suction cup assembly includes multiple use In the sucker that plate is sucked, the positioning component includes the locating piece positioned for the location hole position to plate；It is described Locating piece is equipped with the escape groove for avoiding the first positioning pin or the second positioning pin, and the bottom surface of the locating piece is additionally provided with for inhaling The sucker at position around the location hole of attached plate material.

2. the positioning system of contactless smart card manufacturing equipment according to claim 1, which is characterized in that the substrate exists The lower end of the chip storage groove is provided with the first air inlet, and the surrounding of the coiling detent is provided with the second air inlet, Second air inlet be it is multiple, the multiple second air inlet along the coiling detent outer contour arrange；Described One air inlet and the second air inlet are connected to external negative pressure device.

3. the positioning system of contactless smart card manufacturing equipment according to claim 1, which is characterized in that the sucker is Multiple, the multiple sucker is uniformly distributed using the axle center of the escape groove as the center of circle along the circumferencial direction of the escape groove.

4. the positioning system of contactless smart card manufacturing equipment according to claim 3, which is characterized in that the positioning group Part is two groups, and every group of positioning component further includes that the locating piece that is used to support being arranged on mounting rack does the vertical of vertical motion Driving assembly, wherein the vertical driving assembly includes slide guide bar, retention slides and elastic element, wherein the positioning Sliding part is connected to the top of the locating piece；Slide guide bar upper end is fixedly connected on the mounting rack, lower end vertically to Under extend across the retention slides, be equipped on the retention slides and the locating piece mutual with the slide guide bar Matched slide guide hole；Wherein, the slide guide hole on the locating piece is connected to and concentric with the escape groove, the escape groove it is straight Diameter is greater than the diameter of the slide guide hole；The lower end of the slide guide bar is provided with escape groove cooperation for preventing slide guide bar It is detached from the limiting section of the slide guide hole；The elastic element acts between the mounting rack and the retention slides, and should The elastic force of elastic element promotes the limiting section of the slide guide bar to be pushed against the escape groove in the locating piece and shape between slide guide hole At cascaded surface on.

5. the positioning system of contactless smart card manufacturing equipment according to claim 4, which is characterized in that the slide guide bar Lower end is equipped with the avoid holes for avoiding the second positioning pin of locating platform or the first positioning pin of plate mounting table；The evacuation Hole and the escape groove are located on same axis.

6. the positioning system of contactless smart card manufacturing equipment according to claim 5, which is characterized in that the locating piece Bottom surface be lower than the sucker bottom surface.

7. the positioning system of contactless smart card manufacturing equipment according to claim 1, which is characterized in that described second removes Shipping unit includes the second rack and at least two chip transfer modules being arranged in the second rack；Wherein, each chip is removed Fortune module includes chip pick-up module and the chip pick-up module is driven to carry out the second of transverse shifting in the rack Transversal driving mechanism；Wherein, second rack includes the crossbeam being laterally arranged, and the chip transfer module is horizontally arranged in cross Liang Shang, and be slidably connected between crossbeam；The chip pick-up module includes the chip pick-up mechanism of multiple groups setting arranged in parallel And the second vertical driving mechanism of driving chip draw frame machine vertical motion；The chip pick-up mechanism includes being used for absorbent core The suction nozzle of piece and mounting blocks for installing suction nozzle, the mounting blocks are connect with the second vertical driving mechanism.

8. the positioning system of contactless smart card manufacturing equipment according to claim 1, which is characterized in that the chip is put The chip position for being modified chip position between platform and the second handling device is set to adjust device and be used for core Chip in piece mounting table is transported to the third handling device of chip position adjustment device, wherein

Chip position adjustment device include for chip placement chip apparatus for placing and for the position to chip into The modified correcting device of row, wherein

The chip apparatus for placing includes placement rack and the power mechanism for driving placement rack to rotate, the placement rack top Equipped with for chip placement and chip slot corresponding with chip form；

The correcting device includes that two groups of amendment components of two groups of amendment components and driving are made close to each other and are located remotely from each other past The amendment driving mechanism moved again；Wherein, every group of amendment component is arranged by upper layer and lower layer, including upper layer amendment and lower layer's amendment Part；The opposite end of two upper layer amendments in two groups of amendment components, which is equipped with, carries out position for the chip to first direction Modified upper amendment mouth；The opposite end of Liang Ge lower layer amendment in two groups of amendment components is equipped with for second direction The lower amendment mouth of chip progress position correction；When two upper amendment mouth relative motion to correction positions, the core of first direction Piece edge matches with two upper amendment mouths；When correcting mouth relative motion to correction position under two, the core of second direction Piece edge with two under amendment mouth match；The top of the chip slot is in positioned at the chip of the correction position.

9. the positioning system of contactless smart card manufacturing equipment according to claim 8, which is characterized in that the third is removed Shipping unit includes the bracket being arranged on the rack, the barrow being arranged on bracket, the suction piece being arranged on barrow, is used for The rotary drive mechanism that driving suction piece makes rotating motion and the third for driving the suction piece to do vertical motion are vertical Driving mechanism, wherein the suction piece is four, and is uniformly arranged along the circumferencial direction of barrow；Each suction piece includes Suction nozzle fixing seat, the suction nozzle being arranged in suction nozzle fixing seat, wherein in the corresponding position with each suction piece on the barrow Place is provided with fixed plate, and the suction nozzle fixing seat is mounted in the fixed plate by sliding connection structure.

10. the positioning system of contactless smart card manufacturing equipment according to claim 9, which is characterized in that the suction nozzle Elastic buffer member is additionally provided between fixing seat and fixed plate, the elastic buffer member includes being arranged under the fixed plate Guide pad, the guide rod and spring of setting on the guide pad at end, wherein the guide rod is vertically arranged, the suction Head fixing seat is provided with the pilot hole with guide rod cooperation in the corresponding position with the guide rod, wherein the spring It is set on the guide rod, the upper end of the spring acts on the lower end of the suction nozzle fixing seat, and lower end acts on the guiding On block.