CN110576612B

CN110576612B - Positioning method and production method for manufacturing non-contact smart card

Info

Publication number: CN110576612B
Application number: CN201910730293.1A
Authority: CN
Inventors: 王开来; 赖汉进; 卢国柱; 吴伟文; 黄文豪
Original assignee: Guangzhou Mingsen Hexing Tech Co ltd
Current assignee: Guangzhou Mingsen Hexing Tech Co ltd
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2021-06-18
Anticipated expiration: 2039-08-08
Also published as: CN110576612A

Abstract

The invention discloses a positioning method and a production method for manufacturing a non-contact smart card, wherein the positioning method comprises the following steps: (1) placing the plate on a plate placing table, and enabling a first positioning pin on the plate placing table to penetrate through a positioning hole in the plate; (2) the first carrying device carries the plate material on the uppermost layer stored in the plate material placing table onto the positioning platform, and enables the positioning hole in the plate material to penetrate through the second positioning pin on the positioning platform; (3) the second carrying device carries the chips to each chip storage groove of the positioning platform; (4) the negative pressure device works, and the chip and the plate are adsorbed on the surface of the positioning platform through the first air suction opening arranged in the chip storage groove and the second air suction opening arranged on the positioning platform, so that the chip and the plate are positioned. The positioning method can realize the accurate positioning of the plate and the chip, thereby improving the production quality and the production efficiency of the non-contact intelligent card.

Description

Positioning method and production method for manufacturing non-contact smart card

Technical Field

The invention relates to a method for manufacturing a smart card, in particular to a positioning method and a production method for manufacturing a non-contact smart card.

Background

In the production process of the non-contact smart card, the following processing procedures are generally required: the method comprises the following steps of a laser punching process, a winding process, a chip welding process, an ultrasonic composite welding process and a cutting process; after the processing procedures, an independent intelligent card board material unit is formed, and semi-finished raw materials are provided for subsequent other processing.

The existing intelligent card winding equipment, for example, the invention patent application with application publication number CN108000909A, discloses a non-contact intelligent card manufacturing production line, which can connect processing modules manufactured by non-contact intelligent cards together and continuously convey PVC plates to the processing modules for processing, thereby reducing the transportation times of the PVC plates and improving the production efficiency and the processing precision.

However, in the process of producing the non-contact smart card, because the winding module firstly winds the PVC plate, then the chip to be welded is transported to the to-be-welded position of the chip of each PVC winding card in the PVC winding card unit on the PVC plate by the chip transport module, and then the chip and the PVC winding card are welded, if one of the PVC plate and the chip moves, the to-be-welded position of the chip of the PVC winding card is easily caused to be not corresponding to the chip in the process of transporting the chip to-be-welded position of the chip of the PVC winding card by the chip transport module, so that the chip welding module cannot smoothly weld the welding point on the chip with the coil in the PVC winding card, thereby affecting the quality of the non-contact smart card.

Disclosure of Invention

The invention aims to overcome the defects of the prior art and provide a positioning method for manufacturing a non-contact smart card, which can realize the accurate positioning of a plate and a chip in the production process of the non-contact smart card, thereby improving the production quality and the production efficiency of the non-contact smart card.

Another object of the present invention is to provide a method for manufacturing a contactless smart card by using the above positioning method.

The technical scheme for solving the technical problems is as follows:

a method of locating a contactless smart card manufacture, comprising the steps of:

(1) placing the plate on a plate placing table, and enabling a first positioning pin on the plate placing table to penetrate through a positioning hole in the plate;

(2) the first carrying device carries the uppermost plate stored in the plate placing table to the positioning platform, and enables the positioning hole in the plate to penetrate through the second positioning pin on the positioning platform, and a plurality of winding card units for arranging chips and windings are arranged on the plate;

(3) the second carrying device carries the chips into each chip storage groove of the positioning platform, each chip storage groove corresponds to one winding position clamp, and the winding position clamps correspond to the positions of the winding card units one by one;

(4) the negative pressure device works, the chip and the plate are adsorbed on the surface of the positioning platform through the first air suction opening arranged in the chip storage groove and the second air suction opening arranged on the positioning platform, the chip and the plate are positioned, and the chip in each winding clamping position is accurately matched with the part, used for containing the chip, in each winding clamping unit.

A method of manufacturing a contactless smart card, comprising the steps of:

(1) positioning of the plate and the chip is realized on the positioning platform;

(2) the conveying mechanism drives the positioning platform to move to a winding station, a winding device winds a sheet material, and two leads are led out to be in contact with welding points on the chip;

(3) after the winding is finished, the conveying mechanism continues to drive the positioning platform to move to a chip welding station, and the lead-out wire is welded on a welding spot of the chip by the chip welding device;

(4) and after welding, the conveying mechanism drives the plate and the chip to reach a subsequent processing module for subsequent plate compounding and cutting to finally form the intelligent clamping plate material unit.

Compared with the prior art, the invention has the following beneficial effects:

1. the positioning method for manufacturing the non-contact intelligent card can realize the accurate positioning of the plate and the chip in the production process of the non-contact intelligent card, thereby improving the production quality and the production efficiency of the non-contact intelligent card.

2. The positioning method for manufacturing the non-contact smart card can position the chip and the plate material before carrying, thereby saving the time spent on carrying the chip back and forth in the chip welding process and improving the production efficiency of the non-contact smart card.

3. According to the positioning method for manufacturing the non-contact smart card, the chip is conveyed into the chip storage groove of the positioning platform through the second conveying device, the chip is limited by the chip storage groove, and the chip is prevented from being deviated in the subsequent processing process, so that the chip welding device can be ensured to weld the chip and the lead of the coil in the wire winding card unit together, the welding precision is improved, and the production quality of the non-contact smart card is improved.

Drawings

Fig. 1 to 3 are schematic structural diagrams of a first embodiment of a contactless smart card manufacturing apparatus to which a positioning method and a production method for manufacturing a contactless smart card according to the present invention are applied, wherein fig. 1 to 3 are schematic three-dimensional structural diagrams with different viewing angles.

Fig. 4 is a schematic perspective view of the slab placing table.

Fig. 5 to 7 are schematic structural views of the first handling device in the present invention, wherein fig. 5 is a front view, fig. 6 is a right side view, and fig. 7 is a perspective view.

Figure 8 is a top view of the slab of the present invention.

Fig. 9 is a schematic structural view of the slab placing table and the positioning platform in the present invention.

Fig. 10 is a cross-sectional view of a positioning assembly of the present invention.

Fig. 11 is a schematic perspective view of a sheet handling mechanism according to the present invention.

Fig. 12 is a schematic view of a synchronous drive mechanism.

Fig. 13 is a schematic perspective view of the first lateral driving mechanism according to the present invention.

Fig. 14 is a perspective view of the fixing member of the present invention.

Fig. 15 is a partially enlarged view of a second photosensor and a second detection piece in the present invention.

Fig. 16 to 18 are schematic structural views of a second handling device in the present invention, in which fig. 16 is a front view, fig. 17 is a left view, and fig. 18 is a perspective view.

Fig. 19 is an exploded view of one of the chip handling modules of fig. 18.

Fig. 20 is an exploded view of the multiple sets of chip suction mechanisms in the second handler.

Fig. 21 is a partially exploded view of the set of chip pick-up mechanisms of fig. 20.

Fig. 22 is a partially exploded schematic view of the second lateral driving mechanism and the second vertical driving mechanism in the second transporter of the present invention.

Fig. 23 to 26 are schematic structural views of a chip position adjusting mechanism of a chip feeding device in the present invention, wherein fig. 23 and 24 are schematic perspective structural views from two different viewing angles, fig. 25 is a front view, and fig. 26 is a top view.

Fig. 27 is a schematic perspective view of the chip placement stage according to the present invention.

Fig. 28 is a perspective view of the placement base according to the present invention.

Fig. 29 is a schematic perspective view of two sets of correction assemblies according to the present invention.

Fig. 30 is a top view of the two upper layer modifiers of fig. 29.

Fig. 31 is a top view of the two lower layer modifiers of fig. 29.

Fig. 32 is a partially enlarged view of the correction drive mechanism in the present invention.

Fig. 33 to 35 are schematic structural views of a third handling device and a chip placement stage of the chip loading device according to the present invention, in which fig. 33 and 34 are schematic perspective structural views from two different viewing angles, and fig. 35 is a side view (partial sectional view).

Fig. 36 is a schematic perspective view of the carrier, the suction member, and the rotation driving mechanism.

Fig. 37 is a perspective view of the rotation driving mechanism and the third detecting mechanism.

Fig. 38 is a schematic view of the configuration of the suction member.

Fig. 39 is a schematic perspective view of a positioning platform in the conveying device of the present invention.

FIG. 40 is a top view of the positioning stage.

Fig. 41 is a partial enlarged view of a portion a in fig. 39.

Fig. 42 is a partial enlarged view at B in fig. 40.

Fig. 43 is a schematic structural diagram of a positioning assembly of a first conveying device according to a second embodiment of the present invention.

Fig. 44 is a schematic structural view of a vertical power mechanism of the first conveying device according to the third embodiment of the present invention.

Fig. 45 is a partially exploded view of the second lateral driving mechanism of the second carrier device according to the fourth embodiment of the present invention.

Detailed Description

The present invention will be described in further detail with reference to examples and drawings, but the present invention is not limited thereto.

Referring to fig. 1 to 45, the positioning method for manufacturing the contactless smart card of the present invention comprises the following steps:

(1) placing the plate 7a on a plate placing table B, and enabling a first positioning pin 1B on the plate placing table B to penetrate through a positioning hole 7-1a in the plate 7 a;

(2) the first carrying device A carries the uppermost plate 7a stored in the plate placing platform B onto the positioning platform C, and enables a positioning hole 7-1a in the plate 7a to penetrate through a second positioning pin 1-3C on the positioning platform C, and a plurality of winding card units for arranging chips and winding wires are arranged on the plate 7 a;

(3) the second carrying device E carries the chips into the chip storage grooves 1-1C of the positioning platform C, each chip storage groove 1-1C corresponds to one winding clamping position 2C, and the winding clamping positions 2C correspond to the positions of the winding clamping units one by one;

(4) the negative pressure device works, and the chip and the plate 7a are adsorbed on the surface of the positioning platform C through a first air suction opening 1-2C arranged in the chip storage groove 1-1C and a second air suction opening 2-1C arranged on the positioning platform C, so that the chip and the plate 7a are positioned; the chip on each winding card position 2c is exactly matched with the position for containing the chip in the winding card unit.

In the step (2), the first transverse driving mechanism 3a drives the plate material carrying mechanism to transversely move to the position above the plate material placing table B, then, the first vertical driving mechanism 6a in the plate material carrying mechanism drives the mounting frame 2a and the sucker assembly 4a and the positioning assembly 5a arranged on the mounting frame 2a to downwardly move, the positioning piece 5-1a in the positioning assembly 5a is firstly contacted with the plate material 7a, the suction hole 5-12a in the positioning piece 5-1a adsorbs the part, located around the positioning hole 7-1a, of the plate material 7a, and then, the plurality of suckers 4-1a of the sucker assembly 4a are contacted with the plate material 7 a; finally, the first vertical driving mechanism 6a drives the mounting frame 2a, the sucker assembly 4a and the positioning assembly 5a which are arranged on the mounting frame 2a and the carried plate 7a to vertically move, and the material taking action is completed.

In the step (2), the first transverse driving mechanism 3a drives the plate material carrying mechanism and the carried plate material 7a to move to the position above the positioning platform C, the first vertical driving mechanism 6a drives the mounting frame 2a and the sucker assembly 4a, the positioning assembly 5a and the plate material 7a arranged on the mounting frame 2a to move downwards, the positioning piece 5-1a in the positioning assembly 5a drives a part of the plate material 7a around the positioning hole 7-1a of the plate material 7a to move downwards first, and the positioning hole 7-1a in the plate material 7a is made to penetrate through the second positioning pin 1-3C on the positioning platform C; subsequently, the plurality of suction cups 4-1a of the suction cup assembly 4a place the rest of the sheet 7a on the positioning platform C, and finally, the suction cup assembly 4a and the positioning assembly 5a release the sheet 7a and return to the initial position under the driving of the first transverse driving mechanism 3a and the first vertical driving mechanism 6a, ready for the handling of the next sheet 7 a.

In the step (2), when the plate 7a is taken, the suction holes 5-12a in the positioning piece 5-1a firstly suck a part of the plate 7a around the positioning hole 7-1a in the plate 7 a.

In the step (3), the process of conveying the chips by the second conveying device E includes the following steps:

(3-1) the chip placing table G conveys the chips stored in the chip placing table G to a discharge chute 1G of the chip placing table G one by one;

(3-2) the third carrying device H transfers the chips positioned in the discharge chute 1G of the chip placing table G to the chip chute 1-1 of the placing seat 1 of the chip position adjusting device F;

(3-3) the position of the chip is adjusted by the chip position adjusting device F, and the second conveying device E conveys the chip with the adjusted position posture in the chip position adjusting device F into the chip storage groove 1-1C of the positioning platform C.

In the step (3-3), the adjustment of the position posture of the chip by the chip position adjusting device F comprises the following steps;

(3-31) the correction driving mechanism drives the two groups of correction components to move reversely, and then drives the two upper layer correction pieces 2 and the two lower layer correction pieces 3 to move reversely; the third conveying device H conveys the chips in the discharge chute 1G of the chip placing table G into the chip chute 1-1 of the placing seat 1 one by one;

(3-32) the power mechanism drives the placing seat 1 and the chip placed in the chip groove 1-1 in the placing seat 1 to rotate, so as to adjust the specific orientation of the chip;

(3-33) the second transfer device E transfers the chips in the chip slot 1-1 of the placing base 1 to the chip storage slot 1-1C of the positioning platform C.

In the step (3-33), the suction head 2-1E in the second carrying device E sucks the chip and drives the chip to vertically move to a position between the two upper layer correction pieces 2 or the lower layer correction piece 3, then, the correction driving mechanism drives the two groups of correction components to move in opposite directions, and further drives the two upper layer correction pieces 2 and the two lower layer correction pieces 3 to move in opposite directions, so that the upper layer correction ports 2-1 of the two upper layer correction pieces 2 or the lower layer correction ports 3-1 of the two lower layer correction pieces 3 are matched with the chip, and the position posture of the chip is further corrected.

In the step (3-33), the plurality of suction heads 2-1E in the second transfer device E are independently operated and simultaneously suck the plurality of chips in the chip position adjusting device F.

Referring to fig. 1-45, the method for manufacturing a contactless smart card of the present invention comprises the following steps:

(1) positioning of the plate 7a and the chip is realized on the positioning platform C;

(2) the conveying mechanism D drives the positioning platform C to move to a winding station, a winding device J winds the plate 7a, and two leads are led out to be in contact with welding points on the chip;

(3) after the winding is finished, the conveying mechanism D continues to drive the positioning platform C to move to a chip welding station, and the lead-out wire is welded on a welding spot of the chip by the chip welding device K;

(4) and after welding, the conveying mechanism D drives the plate 7a and the chip to reach a subsequent processing module to perform subsequent compounding and cutting of the plate 7a, and finally an intelligent clamping plate material unit is formed.

In the step (2), there are two positioning platforms C, and the two positioning platforms C are arranged in parallel and are driven by the two conveying mechanisms D respectively.

The following is a specific embodiment of a contactless smart card manufacturing apparatus to which the positioning method and the production method for contactless smart card manufacturing of the present invention are applied.

Example 1

Referring to fig. 1 to 42, the non-contact smart card manufacturing apparatus includes a frame I, a sheet material feeding device, a chip feeding device, a winding device J, a chip welding device K, and a conveying device for sequentially conveying a sheet material 7a in the sheet material feeding device and chips in the chip feeding device to the winding device J and the chip welding device K,

the conveying device comprises two positioning platforms C arranged on a rack I and used for accurately positioning the plate 7a and the chip and a conveying mechanism D used for driving the two positioning platforms C to move independently, wherein the two positioning platforms C are arranged in parallel, and each positioning platform C is driven by a single conveying mechanism D;

the chip feeding device comprises a chip placing table G and a second conveying device E used for conveying the chips in the chip placing table G to the chip storage grooves 1-1C in the positioning platform C, wherein a chip position adjusting device F used for adjusting the positions of the chips and a third conveying device H used for conveying the chips from the chip placing table G to the chip position adjusting device F are further arranged between the chip placing table G and the second conveying device E.

The sheet material loading device comprises a sheet material placing platform B and a first carrying device A, wherein the sheet material placing platform B is used for storing the sheet material 7a and accurately positioning the sheet material 7a, and the first carrying device A is used for carrying the sheet material 7a in the sheet material placing platform B to the positioning platform C.

During operation, the first carrying device A carries the plate 7a in the plate placing platform B to the positioning platform C to realize accurate positioning of the plate 7a on the positioning platform C, then the third carrying device H carries the chip stored on the chip placing platform G to the chip position adjusting device F, the chip position adjusting device F adjusts the position of the chip, and then the second carrying device E carries the chip after position adjustment to the positioning platform C to realize positioning of the chip. Subsequently, the conveying mechanism D conveys the positioning platform C and the plate 7a and the chip placed on the positioning platform C to a winding station, the winding device J winds the plate 7a, after winding is completed, the conveying mechanism D conveys the positioning platform C to a chip welding station, welding of the chip and the coil is achieved through the chip welding device K, and finally, the plate 7a and the chip on the positioning platform C are conveyed to subsequent processing equipment through the fourth conveying device L to be processed subsequently.

In the process, the two positioning platforms C are respectively driven by the two groups of conveying mechanisms D, so that the non-contact intelligent card manufacturing equipment can realize continuous work and has higher working efficiency.

The specific structures and the operating principles of the plate feeding device, the chip feeding device, the winding device J, the chip welding device K, and the conveying device are described below.

(1) Sheet material loading attachment

(1-1) plate Material placing platform B

Referring to fig. 4, the sheet material placing table B is disposed on the frame I, and includes a plate body and a first positioning pin 1B disposed on the plate body for positioning a sheet material 7a stored on the plate body, where a positioning hole 7-1a matched with the first positioning pin 1B is disposed on the sheet material 7a at a position corresponding to the first positioning pin 1B. When the sheet material 7a is stacked on the sheet material placing table B, the first positioning pin 1B in the sheet material placing table B penetrates through the positioning hole 7-1a in the sheet material 7a, so that the sheet material 7a before being conveyed is positioned.

(1-2) first transfer device A

Referring to fig. 5 to 15, the first carrying device a includes a first frame 1a, a sheet carrying mechanism disposed on the first frame 1a, and a first transverse driving mechanism 3a for driving the sheet carrying mechanism to reciprocate between a pre-carrying station and a post-carrying station of a sheet 7 a; the plate material carrying mechanism comprises an installation frame 2a, a sucker assembly 4a arranged on the installation frame 2a, at least two groups of positioning assemblies 5a and a first vertical driving mechanism 6a for driving the sucker assembly 4a and the positioning assemblies 5a to do vertical motion; the sucker assembly 4a comprises a plurality of suckers 4-1a for sucking the plate 7a, and the positioning assembly 5a comprises a positioning piece 5-1a for positioning the positioning hole 7-1a of the plate 7 a; the positioning piece 5-1a is provided with an avoiding groove 5-11a for avoiding a first positioning pin 1B penetrating through the positioning hole 7-1a on the plate placing platform B, and the bottom surface of the positioning piece 5-1a is also provided with a suction hole 5-12a for adsorbing the periphery of the positioning hole 7-1a of the plate 7 a.

Referring to fig. 5-15, the suction holes 5-12a are plural and uniformly distributed along the axial center of the avoiding groove 5-11 a. The suction cup component is characterized in that when the vertical power mechanism drives the suction cup component 4a and the suction cup component 4a to do vertical motion to carry the plate 7a, when the bottom of the positioning piece 5-1a is in contact with the surface of the plate 7a, the suction holes 5-12a are uniformly adsorbed along the periphery of the positioning hole 7-1a of the plate 7a, the plate 7a located in the periphery of the suction holes 5-12a is in a tensioning state under the suction force of the suction holes 5-12a, so that the part of the plate 7a cannot be flexibly deformed in the carrying process, meanwhile, the positioning hole 7-1a in the part of the plate 7a cannot be changed in position due to the flexible deformation of the plate 7a, and the accuracy of the position of the positioning hole 7-1a is guaranteed.

Referring to fig. 5-15, the plurality of suction cups 4-1a are arranged in a matrix on the mounting frame 2a, and the mounting frame 2a is provided with an adjusting groove 2-1a at a position corresponding to each suction cup 4-1a, and the adjusting groove 2-1a extends along the direction in which the sheet material 7a is conveyed. The plurality of suckers 4-1a are arranged and evenly arranged, so that the plate 7a can be sucked more conveniently. The adjusting grooves 2-1a are formed in the positions, corresponding to the suckers 4-1a, of the mounting frame 2a, so that the positions of the adjacent suckers 4-1a can be adjusted, and the carrying of the plate 7a with different specifications and sizes is adapted.

Referring to fig. 5-15, the positioning assemblies 5a are two groups, each group of positioning assemblies 5a further includes a vertical driving assembly arranged on the mounting frame 2a and used for supporting the positioning member 5-1a to make vertical movement, wherein the vertical driving assembly includes a guide rod 5-2a, a positioning slider 5-3a and an elastic element, and the positioning slider 5-3a is connected above the positioning member 5-1 a; the upper end of the guide sliding rod 5-2a is fixedly connected to the mounting frame 2a, the lower end of the guide sliding rod vertically extends downwards and penetrates through the positioning sliding piece 5-3a, and the positioning sliding piece 5-3a and the positioning piece 5-1a are provided with guide sliding holes 5-31a matched with the guide sliding rod 5-2 a; the guide sliding hole 5-31a on the positioning piece 5-1a is communicated with the avoidance groove 5-11a and has the same axle center, and the diameter of the avoidance groove 5-11a is larger than that of the guide sliding hole 5-31 a; the lower end of the guide sliding rod 5-2a is provided with a limiting part 5-21a which is matched with the avoidance groove 5-11a and is used for preventing the guide sliding rod 5-2a from being separated from the guide sliding hole 5-31 a; the elastic element acts between the mounting frame 2a and the positioning sliding piece 5-3a, and the elastic force of the elastic element enables the limiting part 5-21a of the guide sliding rod 5-2a to be abutted against a step surface formed between the avoiding groove 5-11a in the positioning piece 5-1a and the guide sliding hole 5-31 a. By the arrangement of the structure, the positioning piece 5-1a can run more stably in the positioning process of the plate 7a, the bottom surface of the positioning piece 5-1a can be better abutted against the plate 7a, the positioning precision is improved, and the elastic element can play a buffering role in the contact process of the positioning piece 5-1a and the plate 7a, so that the plate 7a is prevented from being crushed due to overlarge pressure of the positioning piece 5-1 a. A sliding mechanism can be arranged between the positioning piece 5-1a and the mounting frame 2a and used for guiding the vertical movement of the positioning piece 5-1a, and the sliding mechanism can be a sliding block and sliding rail mechanism or a sliding rod mechanism.

Referring to fig. 5-15, the lower end of the guide rod 5-2a is provided with an avoidance hole 5-22a for avoiding a second positioning pin 1-3C on the positioning platform C or a first positioning pin 1B of the sheet material placing platform B; the avoidance holes 5-22a and the avoidance grooves 5-11a are positioned on the same axis. The avoidance holes 5-22a are arranged, so that the guide slide rod 5-2a can be prevented from interfering with the first positioning pin 1b and the second positioning pin 1-3 c.

Referring to fig. 5-15, the bottom surface of the positioning member 5-1a is lower than the bottom surface of the suction cup 4-1 a. The positioning device has the advantages that in the process of lifting the plate 7a from the plate placing table B, as the positioning surface of the positioning piece 5-1a is lower than the bottom surface of the sucker 4-1a, the positioning piece 5-1a can be firstly contacted with the surface of the plate 7a, and the suction hole 5-12a of the positioning piece 5-1a sucks the part of the plate 7a, which is positioned around the positioning hole 7-1a, in the plate 7a, so that the sucked part of the plate 7a is in a tensioning state, two positioning precisions (namely two positioning holes 7-1a) on the plate 7a are enabled not to move in position due to flexible deformation of the plate 7a in the subsequent conveying process, and the positioning hole 7-1a of the plate 7a can smoothly pass through the second positioning pin 1-3C on the positioning platform C, thereby realizing the accurate positioning of the plate 7 a. In the process of placing the plate 7a on the positioning platform C, since the positioning surface of the positioning piece 5-1a is lower than the bottom surface of the suction cup 4-1a, therefore, the positioning member 5-1a will contact with the second positioning pin 1-3C of the positioning platform C first, so that the second positioning pins 1-3C on the positioning platform C pass through the positioning holes 7-1a on the plate material 7a, so that the positions of the two positioning holes 7-1a on the plate 7a are determined, and thus, the position of the whole plate 7a is determined, during the subsequent process of placing the sheet 7a on the positioning platform C by the suction cups 4-1a, since the positioning of the two positioning precisions on the sheet 7a has been achieved, therefore, the entire sheet 7a is not displaced any more, so that the sheet 7a is accurately positioned on the positioning platform C.

Referring to fig. 5-15, the elastic element is a spring 5-4a, the spring 5-4a is sleeved on the guide rod, one end of the spring 5-4a acts on the mounting frame 2a, and the other end acts on the positioning sliding member 5-3 a. By adopting the spring 5-4a, the positioning piece 5-1a can be in a tight state, the positioning piece 5-1a can be better abutted on the plate 7a in the positioning and carrying process, the positioning precision is improved, the buffering effect is realized in the soft contact process of the positioning piece 5-1a and the plate 7a, and the plate 7a is ensured not to be damaged.

Referring to fig. 5-15, the first vertical driving mechanism 6a includes a vertical fixing seat 6-2a, a vertical motor 6-1a disposed on the vertical fixing seat 6-2a, a screw rod transmission mechanism, and a synchronous transmission mechanism for transmitting power of the vertical motor 6-1a to the screw rod transmission mechanism, wherein the screw rod transmission mechanisms are in multiple groups, and the multiple groups of screw rod transmission mechanisms are distributed around the mounting frame 2 a; each group of screw rod transmission mechanisms comprises a screw rod 6-3a and a screw rod nut 6-4a matched with the screw rod 6-3a, one end of the screw rod 6-3a is fixed on the mounting frame 2a, and the other end of the screw rod extends vertically upwards; the feed screw nut 6-4a is rotatably connected to the vertical fixed seat 6-2 a; the synchronous transmission mechanism comprises a first driving wheel 6-5a, a first driven driving wheel 6-6a and a first transmission belt 6-7a, wherein the first driving wheel 6-5a is arranged on a main shaft of the vertical motor 6-1a, the first driven driving wheels 6-6a are multiple and are respectively arranged on a screw rod nut 6-4a of each group of screw rod transmission mechanism and synchronously rotate with the screw rod nuts 6-4a, and the first transmission belt 6-7a sequentially surrounds the first driving wheel 6-5a and the first driven driving wheels 6-6 a. With the structure, the sucker assembly 4a and the positioning assembly 5a can move upwards and downwards through the first vertical driving mechanism 6 a; the specific process is as follows: firstly, a vertical motor 6-1a drives a first driving wheel 6-5a to rotate, a first driven driving wheel 6-6a is driven to rotate through a first transmission belt 6-7a, so that a screw rod nut 6-4a is driven to rotate, a vertical screw rod is driven to move linearly upwards or downwards, and finally a sucker component 4a and a positioning component 5a on an installation frame 2a are driven to move linearly upwards or downwards. In addition, the vertical motor 6-1a drives the first driving wheel 6-5a to rotate, and meanwhile, the first driven driving wheel 6-6a on the screw rod nut 6-4a of the screw rod transmission mechanism positioned around the mounting frame 2a also synchronously rotates, so that the lifting speed of each position on the mounting frame 2a can be kept consistent, a plurality of suckers 4-1a arranged on the sucker component 4a can be simultaneously contacted with the plate material 7a, and the plate material 7a is more stably conveyed and has higher precision.

Referring to fig. 5-15, the vertical fixing seat 6-2a includes a plurality of vertical fixing plates 6-21a and limiting blocks 6-22a, the limiting blocks 6-22a are disposed around the vertical fixing plates 6-21a, the limiting blocks 6-22a are fixedly connected to the vertical fixing plates 6-21a through fixing rods 6-2a3, the lead screw 6-3a is rotatably connected to the vertical fixing plates 6-21a and the limiting blocks 6-22a, and the lead screw nut 6-4a is disposed between the vertical fixing plates 6-21a and the limiting blocks 6-22 a. By the structure, the screw rod 6-3a can move upwards and downwards by driving the screw rod nut 6-4a, so that the sucker assembly 4a and the positioning assembly 5a can move upwards and downwards.

Referring to fig. 5-15, a tension pulley 6-8a for tensioning the first transmission belt 6-7a is disposed between the first driving pulley 6-5a and the first driven driving pulley 6-6a, and the tension pulley 6-8a is connected to the vertical fixing seat 6-2 a. The transmission efficiency of the first transmission belt 6-7a can be improved by designing the tension pulley 6-8 a.

Referring to fig. 5 to 15, the first transverse driving mechanism 3a includes a transverse motor 3-1a disposed at one end of the first frame 1a, and a transverse transmission mechanism, wherein the transverse transmission mechanism includes a second driving wheel 3-2a disposed on the first frame 1a and connected to the transverse motor 3-1a, a second driven driving wheel 3-3a disposed at the other end of the first frame 1a, and a second transmission belt 3-4a connected between the second driving wheel 3-2a and the second driven driving wheel 3-3 a; the vertical fixed seat 6-2a is fixed with one side of the second transmission belt 3-4a through a fixing component. The transverse motor 3-1a drives the second driving wheel 3-2a to rotate, so that the second transmission belt 3-4a between the second driving wheel 3-2a and the second driven driving wheel 3-3a is driven to move, the fixing assembly is driven to move, the vertical fixing seat 6-2a moves transversely, and transverse movement of the plate material carrying mechanism is achieved.

Referring to fig. 5 to 15, the first horizontal driving mechanism 3a further includes a horizontal guiding assembly disposed between the vertical fixing seat 6-2a and the first frame 1a, and the horizontal guiding assembly includes a horizontal guiding rail 3-7a disposed at the bottom of the first frame 1a and a horizontal sliding block 3-8a disposed on the vertical fixing seat 6-2a and matched with the horizontal guiding rail 3-7 a. By arranging the transverse guide assembly, when the transverse sliding block 3-8a moves relative to the transverse guide rail 3-7a, the stability of the transverse sliding block 3-8a can be kept, meanwhile, the running stability of the plate material carrying mechanism is ensured, and the positioning precision is improved. In addition, the transverse guide assembly is arranged and can be used for bearing the weight of the plate material carrying mechanism, so that the second transmission belt 3-4a only needs to drive the plate material carrying mechanism to do transverse movement and does not need to bear the weight of the plate material carrying mechanism, and the service life of the second transmission belt 3-4a can be prolonged.

Referring to fig. 5-15, the two sets of transverse guiding components are respectively located at two sides of the conveying direction of the second transmission belt 3-4 a.

Referring to fig. 5-15, the fixing assembly includes a first clamping member 3-5a disposed on the vertical fixing seat 6-2a and a second clamping member 3-6a clamping the second driving belt 3-4a on the first clamping member 3-5a, wherein a groove matched with the synchronizing teeth of the second driving belt 3-4a is disposed on the first clamping member 3-5a or the second clamping member 3-6 a. The fixing component is clamped and fixed with the second transmission belt 3-4a, so that the belt drives the vertical fixing seat 6-2a to move transversely through the fixing component.

Referring to fig. 5 to 15, a first detection sheet 9a is further arranged on the vertical fixing seat 6-2a, and a first photoelectric sensor 10a is arranged on the first rack 1a, wherein two first photoelectric sensors 10a are respectively located above the sheet material placing table B and above the positioning platform C; the first detection sheet 9a moves along with the movement track of the vertical fixing seat 6-2a in the transverse motion and passes through the first photoelectric sensor 10 a. The sheet material carrying mechanism is driven by the first transverse driving mechanism 3a to move transversely, and when the first photoelectric sensor 10a on the first rack 1a detects the first detection piece 9a on the vertical fixing seat 6-2a, the control system controls the first transverse driving mechanism 3a to stop working, so that the first transverse driving mechanism 3a can accurately drive the sheet material carrying mechanism to move above the sheet material placing table B and the positioning platform C, and the carrying precision is improved.

Referring to fig. 5 to 15, a second photoelectric sensor 12a is further disposed on the vertical fixing seat 6-2a, a second detection piece 11a is disposed on the mounting frame 2a, and two second photoelectric sensors 12a are vertically disposed on the vertical fixing seat 6-2 a; the second detecting piece 11a moves along with the mounting frame 2a in a vertical motion track and passes through the second photoelectric sensor 12 a.

Referring to fig. 4-15, the working principle of the plate feeding device in the present invention is as follows:

in the carrying process of the plate 7a, firstly, the plate 7a is stacked on a plate placing table B, the plate placing table B is arranged below a plate carrying mechanism, first positioning pins 1B on the plate placing table B are installed on the plate placing table B and extend out of the table top of the plate placing table B, the first positioning pins 1B on the plate placing table B correspond to positioning holes 7-1a on the plate 7a one by one, before the plate 7a is carried, the plate 7a is firstly stacked on the plate placing table B, and the first positioning pins 1B on the plate placing table B are made to penetrate through the positioning holes 7-1a on the plate 7a, so that the accurate positioning of the plate 7a before carrying is completed. In the process of stacking the sheets 7a, it is required to ensure that the height of the stacked sheets 7a is lower than the height of the first positioning pin 1 b. After the stacking is finished, the first transverse driving mechanism 3a drives the plate material carrying mechanism to move to a position above the plate material placing platform B corresponding to a plate material 7a, at the moment, the position of a positioning piece 5-1a on the plate material carrying mechanism is positioned right above a first positioning pin 1B on the plate material placing platform B and a positioning hole 7-1a of the plate material 7a, and the positions are corresponding to each other, under the driving of a first vertical driving mechanism 6a, a sucker component 4a and a positioning component 5a simultaneously move downwards and are in contact with the surface of the plate material 7a, an avoiding groove 5-11a of the positioning piece 5-1a avoids the first positioning pin 1B on the plate material placing platform B, the bottom surface of the positioning piece 5-1a abuts against the surrounding part of the positioning hole 7-1a of the plate material 7a, and the suction hole 5-12a adsorbs the surrounding part of the positioning hole 7-1a on the plate material 7a, tensioning a part of a plate 7a around the positioning hole 7-1a, enabling the position of the plate 7a to be accurately fixed under the action of two positioning pieces 5-1a, enabling the plate 7a to be adsorbed by a sucker 4-1a, enabling the sucker 4-1a adsorbing the plate 7a and a positioning piece 5-1a to be driven to move upwards by a first vertical driving mechanism 6a again, carrying the plate 7a to a positioning platform C in a conveying device through the transverse driving of a first transverse driving mechanism 3a, enabling a second positioning pin 1-3C corresponding to the positioning hole 7-1a on the plate 7a to be arranged on the positioning platform C, and enabling the plate 7a to be driven by the first vertical driving mechanism 6a when the plate 7a moves to the corresponding position of the positioning hole 7-1a on the plate 7a and the second positioning pin 1-3C of the positioning platform C, the plate 7a moves downwards, the suction disc 4-1a, the positioning piece 5-1a and the adsorbed plate 7a move downwards at the same time, under the adsorption and accurate positioning of the positioning piece 5-1a, the positioning hole 7-1a of the plate 7a is accurately matched with the second positioning pin 1-3C on the positioning platform C, the second positioning pin 1-3C on the positioning platform C penetrates through the positioning hole 7-1a on the plate 7a, the plate 7a is tightly abutted on the positioning platform C by the plate carrying mechanism along with the continuous work of the vertical power mechanism, and finally the plate 7a is released by the suction disc 4-1a and the positioning piece 5-1a at the same time, so that the plate 7a is accurately carried to the positioning platform C, and the plate feeding process is achieved.

In the process of carrying the plate 7a, the positions of the first positioning pins 1B on the plate placing table B correspond to the positions of the second positioning pins 1-3C on the positioning platform C one by one, and the positioning holes 7-1a are formed in the plate 7a, so that the positioning holes 7-1a on the plate 7a are used as accurate positioning in the process of carrying the plate 7a by the first carrying device A, and the positioning holes 7-1a on the plate 7a can be matched with the second positioning pins 1-3C on the positioning platform C by ensuring that the positions of the positioning holes 7-1a on the plate 7a are unchanged in the carrying process, so that the plate 7a cannot displace in the horizontal direction after being placed on the positioning platform C, and the accurate positioning of the plate 7a on the positioning platform C is realized.

(2) Chip feeding device

(2-1) chip Placement Table G

Referring to fig. 16 to 22, the chip placement table G in the present embodiment is a vibrator, and chips stored in the vibrator are conveyed one by one into a discharge chute 1G of the vibrator by vibration of the vibrator.

(2-2) second conveyance device E

Referring to fig. 16 to 22, the second handling apparatus E includes a second rack 1E and at least two chip handling modules; each chip carrying module comprises a chip suction module and a second transverse driving mechanism for driving the chip suction module to transversely move on the second rack 1 e; the second rack 1e comprises transverse beams 1-1e, and the chip carrying modules are transversely arranged on the transverse beams 1-1e and are connected with the transverse beams 1-1e in a sliding manner; the chip suction module comprises a plurality of groups of chip suction mechanisms 2e arranged in parallel and a second vertical driving mechanism 3e for driving the chip suction mechanisms 2e to move vertically; the chip suction mechanism 2e comprises a suction head 2-1e for sucking the chip and a mounting block 2-2e for mounting the suction head 2-1e, and the mounting block 2-2e is connected with a second vertical driving mechanism 3 e.

Referring to fig. 16 to 22, the chip suction mechanism 2e further includes an intermediate connection plate 2-3e disposed between the second vertical driving mechanism 3e and the mounting block 2-2 e; the front surface of the middle connecting plate 2-3e is connected with the mounting block 2-2e on the chip suction mechanism 2e in a sliding manner, and the rear surface of the middle connecting plate 2-3e is connected with the second vertical driving mechanism 3 e. Through setting up above-mentioned intermediate junction board 2-3e, can realize that the vertical actuating mechanism 3e of second drives multiunit chip suction means 2e work simultaneously, reaches and carries a plurality of chips simultaneously, improves work efficiency.

Referring to fig. 16-22, the chip suction mechanism 2e further includes a fixing member 2-4e disposed on the upper portion of the intermediate connection plate 2-3e, and a vertical driving cylinder 2-5e vertically mounted on the fixing member 2-4 e; and a piston rod 2-5e1 of the driving cylinder is connected with the upper end of the mounting block 2-2 e. Through setting up vertical drive cylinder 2-5e, can realize the vertical drive of two-stage of suction head 2-1e, when suction head 2-1e adsorbs the chip and moves to the chip and places the station, the vertical actuating mechanism 3e of second can drive multiunit chip suction mechanism 2e and move down simultaneously, every group chip suction mechanism 2e is equipped with vertical drive cylinder 2-5e alone, can realize the independent control of every suction head 2-1e, can be through vertical drive cylinder 2-5e with suction head 2-1e that adsorbs the chip move down to corresponding position in proper order, release the chip, carry out next process, greatly improve chip handling efficiency and flexibility.

Referring to fig. 16-22, a driving rod 2-6e and a buffer spring 2-7e are arranged below the vertical driving cylinder 2-5 e; the upper part of the mounting block 2-2e is provided with a connecting groove 2-2e 1; one end of the driving rod 2-6e is connected with a piston rod 2-5e1 on the driving cylinder, and the other end of the driving rod is embedded in the connecting groove 2-2e 1; the buffer springs 2-7e are sleeved on the driving rods 2-6e, one ends of the buffer springs 2-7e act on the piston rods 2-5e1, and the other ends of the buffer springs act on the upper ends of the mounting blocks 2-2 e. By arranging the driving rods 2-6e, the driving rods 2-6e can be driven to move downwards by the vertical driving cylinders 2-5e, and then the mounting blocks 2-2e are driven to move downwards; the buffer springs 2-7e can play a role in buffering when the suction head 2-1e moves downwards to adsorb or release the chip, and the impact force on the chip when the suction head 2-1e is driven to move downwards by the vertical driving cylinder 2-5e is reduced, so that the chip is protected.

Referring to fig. 16 to 22, the chip suction mechanism 2e further includes a guide assembly disposed between the mounting block 2-2e and the intermediate connection plate 2-3e for guiding the mounting block 2-2e to move on the intermediate connection plate 2-3e in a vertical direction, the guide assembly including a guide rail 2-8e vertically disposed in front of the intermediate connection plate 2-3e and a slider 2-9e disposed behind the mounting block 2-2e to be matched with the guide rail. Through the arrangement of the guide rails 2-8e and the sliding blocks 2-9e, when the sliding blocks move relative to the guide rails 2-8e, the stability of the sliding blocks 2-9e can be kept, meanwhile, the running stability of the chip suction mechanism 2e is guaranteed, and the positioning precision is improved.

Referring to fig. 16-22, each of the chip suction modules further includes a transverse sliding plate 4e, and the second vertical driving mechanism 3e is disposed on the transverse sliding plate 4 e; and a transverse guiding assembly for guiding the transverse sliding plate 4e to move on the cross beam 1-1e along the transverse direction is arranged between the transverse sliding plate 4e and the cross beam 1-1e, and the transverse guiding assembly comprises two transverse guide rails 5e arranged on the cross beam 1-1e in parallel and two transverse sliding blocks 6e arranged on the transverse sliding plate 4e and matched with the transverse guide rails 5e respectively. By the arrangement of the structure, stable operation of the chip carrying module on the cross beams 1-1e can be realized.

Referring to fig. 16-22, the second vertical driving mechanism 3e includes a vertical driving motor 3-1e, a vertical screw rod 3-2e, a vertical slider 3-3e, a vertical chute 3-4e and a vertical sliding plate 3-5 e; the vertical driving motor 3-1e is mounted on a motor mounting seat 3-6e, the motor mounting seat 3-6e is connected with the upper end of the vertical sliding chute 3-4e, the vertical sliding chute 3-4e is fixedly mounted on the horizontal sliding plate 4e, the vertical screw rod 3-2e is connected on a main shaft of the vertical driving motor 3-1e and is connected with the vertical sliding block 3-3e, the vertical sliding block 3-3e is arranged in the vertical sliding chute 3-4e, the vertical sliding block 3-3e is fixedly connected with the vertical sliding plate 3-5e, and the vertical sliding plate 3-5e is connected with the middle connecting plate 2-3 e. By adopting the structure, the second vertical driving mechanism 3e can drive the vertical slide blocks 3-3e to move upwards or downwards by driving the vertical screw rods 3-2e to rotate, so that the chip suction mechanism 2e is driven to move upwards or downwards, and the structure has high transmission precision, compact structure and stable operation.

Referring to fig. 16-22, the second lateral driving mechanism comprises a linear motor 7e disposed between two parallel lateral guide rails 5e, the stator 7-1e of the linear motor 7e is disposed on the cross beam 1-1e, and the rotor 7-2e is disposed on the lateral sliding plate 4 e. Through setting up linear electric motor, can drive chip transport module and carry out lateral motion on crossbeam 1-1e to realize chip lateral shifting on crossbeam 1-1e, so that place the chip with the chip accurately and place the top that the station corresponds, and this structure occupation space is little, and transmission precision is high.

Referring to fig. 16-22, a grating scale displacement sensor 8e is arranged between the beam 1-1e and the transverse sliding plate 4e, a grating reading head of the grating scale displacement sensor 8e is mounted on the upper portion of the transverse sliding plate 4e, and a scale grating is arranged on the beam 1-1 e. Through setting up grating chi displacement sensor 8e, can accurate detection second horizontal drive mechanism drive chip absorb the displacement of the lateral shifting of module.

Referring to fig. 16 to 22, the second handling device E of the present invention operates on the following principle:

in the chip loading process, each chip carrying module is independently controlled, firstly, each chip suction module transversely moves to the position above a corresponding chip placing platform G under the driving of a second transverse driving mechanism until each suction head 2-1e on the chip suction mechanism 2e corresponds to the position of a chip on the chip placing platform G, then the chip suction mechanism 2e moves downwards under the driving of a second vertical driving mechanism 3e, the suction heads 2-1e slowly approach the chip until the suction heads 2-1e are in contact with the surface of the chip, the suction heads 2-1e suck the chip, then the suction heads 2-1e suck the chip are driven by the second vertical driving mechanism 3e to separate the chip from the chip placing platform G, and finally, each chip suction module sucking the chip is driven by the second transverse driving mechanism, respectively moving to the corresponding chip placing stations, sequentially releasing the chips adsorbed on the suction heads 2-1e into the chip storage grooves 1-1C of the positioning platform C, completing a feeding process, and continuously repeating the chip taking and placing processes to realize continuous operation.

(2-3) chip position adjusting device F

Referring to fig. 23 to 32, the chip position adjusting device F includes a chip placing device for placing a chip and a correcting device for correcting the position of the chip; the chip placing device comprises a placing seat 1 and a power mechanism for driving the placing seat 1 to rotate, wherein a chip groove 1-1 which is used for placing a chip and corresponds to the shape of the chip is formed in the upper part of the placing seat 1; the correcting device comprises two groups of correcting components and a correcting driving mechanism for driving the two groups of correcting components to do reciprocating motion of mutual approaching and mutual departing; each group of correction assemblies is arranged in an upper layer and a lower layer and comprises an upper layer correction piece 2 and a lower layer correction piece 3; the opposite ends of two upper layer correcting pieces 2 in the two groups of correcting components are provided with upper correcting ports 2-1 for correcting the position of a chip in a first direction; the opposite ends of two lower layer correcting parts 3 in the two groups of correcting components are provided with lower correcting ports 3-1 for correcting the position of the chip in the second direction; when the two upper correction ports 2-1 move relatively to the correction position, the edge of the chip facing the first direction is matched with the two upper correction ports 2-1; when the two lower correction ports 3-1 relatively move to the correction position, the edge of the chip facing the second direction is matched with the two lower correction ports 3-1; the chip at the corrected position is positioned above the chip slot 1-1.

Referring to fig. 23-32, the opposite ends of the two upper layer modifiers 2 are respectively provided with an upper modifier 2-2 matched with the two adjacent edges of the first oriented chip; the opposite ends of the two lower layer correcting parts 3 are respectively provided with a lower correcting part 3-2 which is matched with the two adjacent sides of the second oriented chip; the space formed by the two opposite upper correcting parts 2-2 forms the upper correcting opening 2-1; the space formed by the two opposite lower correction parts 3-2 forms the lower correction port 3-1, and the upper correction port 2-1 and the lower correction port 3-1 are arranged in a plurality of horizontal straight lines. The upper correcting part 2-2 and the lower correcting part 3-2 are oppositely arranged, so that the edge of the chip can be accurately contacted and extruded with the correcting part and the lower correcting part 3-2, the upper correcting port 2-1 and the lower correcting port 3-1 are accurately matched with the chip, and the effect of position correction is achieved; the upper correction port 2-1 and the lower correction port 3-1 are arranged in a plurality of numbers, so that the positions of a plurality of chips can be corrected simultaneously, and the working efficiency is improved.

Referring to fig. 23-32, the chip placement apparatus further includes a fixing plate 4, a mounting block 5 disposed above the fixing plate 4; a certain gap is formed between the fixing plate 4 and the mounting block 5, and the fixing plate 4 and the mounting block 5 are fixedly connected through a supporting component; the placing seats 1 are arranged in a plurality of straight lines and transversely arranged to penetrate through the mounting blocks 5 and are rotatably connected to the mounting blocks 5. By adopting the structure, the chip placing device has more stable structure and is convenient to disassemble and assemble in maintenance; place seat 1 and set up to a plurality of chips that can place, improve the efficiency of material loading.

Referring to fig. 23-32, the support assembly includes a support block 6 and a support bar 7; the supporting block 6 is fixed on the side edge of the mounting block 5; one end of the support rod 7 is fixedly connected to the lower end of the support block 6, and the other end of the support rod is fixedly connected to the fixing plate 4. Through the structure, the mounting block 5 is better fixed on the fixing plate 4, and the movable space between the mounting block 5 and the fixing plate 4 of the placing seat 1 and the power mechanism is ensured.

Referring to fig. 23 to 32, the power mechanism includes an adjusting driving motor 8 and a transmission assembly disposed between the adjusting driving motor 8 and the placing base 1; the adjusting driving motor 8 is fixedly connected to the fixing plate 4 through a fixing connecting piece 9; wherein, fixed connector 9 adopts the notch cuttype design, and this fixed connector 9's notch cuttype one end vertical fixation is in fixed plate 4 sides, the other end with adjust driving motor 8 fixed connection. The fixed connecting piece 9 adopts a step-shaped design, so that the force applied to the fixed plate 4 is divided into vertical and horizontal force, the force applied to the fixed piece is dispersed, the stability of the power mechanism is improved, and meanwhile, the mechanism is reasonable in design and more compact in structure; the adjusting driving motor 8 drives the placing seat 1 to rotate through the transmission assembly, and the function of adjusting the position of the chip is achieved.

Referring to fig. 23 to 32, the driving assembly includes a driving pulley 10 provided on the adjusting driving motor 8, a driven pulley 11 provided at a lower end of the placing seat 1, and a belt 12 for connecting the driving pulley 10 and the driven pulley 11. Through the structure, the adjusting driving motor 8 drives the driving belt wheel 10 to rotate, the driving belt wheel 10 drives the driven belt wheel 11 to rotate through the belt 12, so that the placing seat 1 is driven to rotate, further, the chip groove 1-1 on the placing seat 1 is driven to rotate, and position adjustment is achieved.

Referring to fig. 23 to 32, an adaptive mechanism is disposed between the driving pulley 10 and the driven pulley 11, and the adaptive mechanism includes an adaptive guide assembly, a connecting block 13, a connecting shaft 14, an adaptive pulley 15, and an adaptive spring 16; wherein the adaptive guide component comprises an adaptive guide rail 17 arranged at the side of the mounting block 5 and an adaptive sliding block 18 matched with the adaptive guide rail 17; the connecting block 13 is connected with the self-adaptive sliding block 18, one end of the connecting shaft 14 is connected with the connecting block 13, the other end of the connecting shaft is rotatably connected with the self-adaptive belt wheel 15, and the self-adaptive belt wheel 15 is connected with the belt 12; one end of the adaptive spring 16 acts on the connecting block 13, and the other end acts on the supporting block 6. By adopting the structure, the self-adaptive belt wheel has the advantages that the tightness of the belt 12 can be adjusted through the elasticity of the self-adaptive spring 16, when the belt 12 is too loose, the self-adaptive spring 16 pushes the connecting block 13 under the action of the elasticity of the self-adaptive spring, and moves along the direction of the self-adaptive guide rail 17 close to the belt 12 under the action of the guide assembly, the self-adaptive belt wheel 15 also moves along with the self-adaptive guide rail, continuously abuts against the belt 12, so that the belt 12 is in a tensioning state, and the transmission efficiency and the transmission precision.

Referring to fig. 23-32, the correcting device further includes a front correcting block 19, and a rear correcting block 20 disposed opposite to the front correcting block and having a gap with the front correcting block 19; the front correction block 19 and the rear correction block 20 are connected to the mounting block 5 at two ends in a sliding manner, and the two lower-layer correction pieces 3 are respectively and oppositely mounted on the front correction block 19 and the rear correction block 20. By adopting the structure, the front correction block 19 and the rear correction block 20 can be driven to move away from or close to each other by the correction driving mechanism, and the two groups of correction components are driven to move away from or close to each other.

Referring to fig. 23 to 32, a correction guide assembly for guiding the front correction block 19 and the rear correction block 20 to approach or depart from each other on the mounting block 5 is disposed between the front correction block 19, the rear correction block 20 and the mounting block 5, and the correction guide assembly includes two correction guide rails 21 disposed in parallel at two ends of the mounting block 5 and two correction sliders 22 respectively disposed on the front correction block 19 and the rear correction block 20 and respectively matched with the two correction guide rails 21; the correcting guide rail 21 is obliquely arranged on the mounting block 5, and the correcting guide rail 21 is parallel to the diagonal line of the upper correcting opening 2-1. Through the design of the correcting guide rail 21 and the correcting slide block 22, when the correcting slide block 22 moves relative to the correcting guide rail 21, the operation stability of the correcting slide block 22 can be kept, and meanwhile, the operation stability of the correcting device is ensured; the correcting guide rail 21 is parallel to the diagonal line of the upper correcting opening 2-1, and the advantage is that the correcting driving mechanism drives the front correcting block 19 and the rear correcting block 20 to be away from or close to each other along the diagonal line direction of the upper correcting opening 2-1, so that the two upper layer correcting pieces 2 and the two lower layer correcting pieces 3 are also away from or close to each other along the diagonal line direction of the upper correcting opening 2-1, and when the position is corrected, the upper correcting portion 2-2 and the lower correcting portion 3-2 are favorably contacted with the edge of a chip, and excessive extrusion to the chip is reduced, so that the chip is damaged.

Referring to fig. 23 to 32, the correction drive mechanism includes a correction cylinder 23 that drives the front correction block 19 and the rear correction block 20 away from each other and a correction spring 24 that drives the front correction block 19 and the rear correction block 20 toward each other; the correction cylinder 23 is connected with one end of the mounting block 5 through a cylinder mounting plate 25; a correction driving block 26 is arranged on the correction cylinder 23, one end of the correction driving block 26 is provided with an installation groove 26-1, and two sides of the installation groove 26-1 are respectively provided with a bearing 27; the front correction block 19 and the rear correction block 20 are respectively provided with a guide block 28 at the same end close to the correction cylinder 23; the two bearings 27 respectively act on the two guide blocks 28. Through the structure, the correction cylinder 23 drives the correction driving block 26 to move, so that the bearing 27 also moves along with the correction driving block, when the bearing 27 is in contact with the guide block 28, the bearing 27 rotates to respectively push the guide blocks 28, so that the guide blocks 28 respectively move outwards, and the front correction block 19 and the rear correction block 20 are driven to mutually move outwards under the guidance of the correction guide rail 21, and a space for placing a chip is reserved; the guide block 28 is rotationally pushed to move through the bearing 27, so that the bearing 27 and the guide block 28 are in soft contact, a certain buffering effect is achieved, the damage to a contact surface caused by hard contact is avoided, and the service life of the mechanism is prolonged.

Referring to fig. 23 to 32, the correcting spring 24 is disposed between the front correcting block 19 and the end of the rear correcting block 20, and one end of the correcting spring 24 acts on the front correcting block 19 and the other end acts on the rear correcting block 20. By arranging the correction spring 24, when the correction cylinder 23 drives the correction movable front correction block 19 and the correction movable rear correction block 20 to respectively move outwards along the correction guide rail 21, the two groups of correction components also move away from each other under the driving of the front correction block 19 and the correction movable rear correction block 20, when the correction components move to a certain distance, the chip with the adjusted position on the chip groove 1-1 is conveyed to the middle of the two groups of correction components, then the correction cylinder 23 retracts, at the moment, the front correction block 19 and the correction movable rear correction block 20 respectively move inwards under the tension of the correction spring 24, so that the two groups of correction components are driven to move inwards, the upper layer correction piece 2 or the lower layer correction piece 3 on the correction components are contacted with the chip to adjust the position and the angle of the chip, and after the position adjustment is finished, the correction driving mechanism drives the front correction block 19 and the correction movable rear correction block 20 to move outwards again, and (4) keeping the two groups of correction assemblies away from the chip, and then carrying the chip to the set position of the smart card plate 7 a.

Referring to fig. 23 to 32, the chip position adjusting device F of the chip feeding device further includes a base 29 and a transverse driving mechanism disposed on the base 29 for driving the chip placement device; the transverse driving mechanism comprises a transverse guiding component arranged between the base 29 and the fixing plate 4 and a transverse driving motor 30 arranged at one end of the transverse guiding component and used for driving the guiding component to move; wherein, the transverse guiding component comprises a sliding chute 31 arranged on the base 29 and a sliding block 32 arranged in the sliding chute 31 and matched with the sliding chute 31; the transverse driving motor 30 is connected with the sliding block 32 through a screw rod 33, and a threaded hole matched with the screw rod 33 is formed in the sliding block 32; an intermediate connecting plate 35 is arranged between the sliding block 32 and the fixed plate 4. By adopting the structure, the transverse movement of the chip placing device can be realized, and the slide block 32 is matched with the screw rod 33, so that the structure is simpler, the manufacture is convenient, and the cost is reduced.

Referring to fig. 23-32, a position sensor 34 is provided under the driven pulley 11 at one end of the mounting block 5. The rotation position of the driven pulley 11 can be identified through the position sensor 34, and then the rotation position of the placing seat 1 is identified, and the accurate rotation positioning of the chip position is realized.

Referring to fig. 23 to 32, the working principle of the position adjusting mechanism of the chip loading device of the present invention is as follows:

during operation, two groups of correction assemblies are driven by the correction driving mechanism to move away from each other, and then two upper correction assemblies 2 and two lower correction assemblies 3 are driven to move away from each other until enough space is available for a chip to pass through an upper correction port 2-1 and a lower correction port 3-1, then the chip is moved into a chip groove 1-1 of a placing seat 1 from a chip placing platform G, when the chip is carried from the chip placing platform G, the direction of the chip is one, the orientation of the chip can be adjusted through the chip groove 1-1, the position of the chip is corrected after the adjustment is completed, the specific process is as follows:

when the chip of the produced smart card is the chip with the first orientation, if the orientation of the chip carried from the chip placing table G is the same as the first orientation, the chip slot 1-1 of the placing base 1 plays the function of intermediate storage, then the second carrying device E carries the chip on the placing base 1 to the middle of the two upper-layer correcting members 2, the correcting driving mechanism drives the two groups of correcting components to move inwards, the upper correcting ports 2-1 on the two upper-layer correcting members 2 approach to the chip and press the chip, so that the correcting ports 2-1 are matched with the edge of the chip, and the position of the chip is corrected, and the aim is that when the suction head 2-1E on the second carrying device E is contacted with the chip in the process of carrying the chip by the second carrying device E, the position of the chip is easy to deviate due to the small volume and light weight of the chip, the two groups of correction assemblies are driven to move by the correction driving mechanism, so that the posture of the chip is further corrected, the position precision of the chip is improved, and the chip can be smoothly placed in the chip storage groove 1-1C of the positioning platform C by the second carrying device E. After the position correction is completed, the correction driving mechanism drives the two groups of correction assemblies to move outwards, the upper correction ports 2-1 on the two upper correction pieces 2 also move away from the chip relatively, and then the chip after the correction is completed is carried to the set position of the intelligent card plate material, so that the chip feeding process in the first direction is completed.

When the chip of the produced smart card is a chip with a second orientation, because the orientation of the chip carried from the chip placing table G is different from the second orientation, when the chip is carried from the chip placing table G to the chip groove 1-1 on the placing seat 1, the placing seat 1 is driven to rotate under the action of the power mechanism, the chip groove 1-1 on the placing seat 1 is driven to rotate, the chip on the chip groove 1-1 is driven to rotate, when the chip rotates to the position consistent with the position of the chip with the second orientation, the driving is stopped, then the chip is carried to the middle of two lower layer correcting pieces 3, the correcting driving mechanism drives the two groups of correcting pieces to move inwards, the lower correcting ports 3-1 on the two lower layer correcting pieces 3 are close to the chip, so as to press the chip, the lower correcting ports 3-1 are matched with the edge of the chip, and the position of the chip is corrected, after the position correction is completed, the correction driving mechanism drives the two groups of correction assemblies to move outwards, the lower correction ports 3-1 on the two lower layer correction members 3 also move away from the chip relatively, and then the chip after the correction is completed is carried to the set position of the intelligent card plate material, so that the chip feeding process in the second direction is completed.

(2-4) third conveyance device H

Referring to fig. 33 to 38, the third carrying device H includes a support 1H disposed on the rack I, a carrying rack 2H disposed on the support 1H, a suction member 5H disposed on the carrying rack 2H, a rotation driving mechanism for driving the suction member 5H to rotate, and a third vertical driving mechanism for driving the suction member 5H to vertically move, where the number of the suction members 5H is four, and the suction members are uniformly arranged along the circumferential direction of the carrying rack 2H; each suction piece 5h comprises a suction nozzle fixing seat 5-1h and a suction nozzle 5-2h arranged on the suction nozzle fixing seat 5-1h, wherein a fixing plate 2-1h is arranged on the conveying frame 2h at a position corresponding to each suction piece 5h, the suction nozzle fixing seat 5-1h is arranged on the fixing plate 2-1h through a sliding connection structure 5-7h, and the sliding connection structure 5-7h is a sliding block and sliding rail mechanism.

Referring to fig. 33-38, an elastic buffer assembly is further disposed between the suction head fixing seat 5-1h and the fixing plate 2-1h, the elastic buffer component comprises guide blocks 5-6h arranged at the lower end of the fixing plate 2-1h, guide rods 5-5h arranged on the guide blocks 5-6h and springs 5-4h, wherein the guide rod 5-5h is vertically arranged, the suction head fixing seat 5-1h is provided with a guide hole matched with the guide rod 5-5h at the position corresponding to the guide rod 5-5h, the spring 5-4h is sleeved on the guide rod 5-5h, the upper end of the spring 5-4h acts on the lower end of the suction head fixing seat 5-1h, and the lower end of the spring acts on the guide block 5-6 h.

Referring to fig. 33-38, the third vertical driving mechanism includes a cylinder fixing seat 3h disposed on the support 1h, a cylinder 4h disposed on the cylinder fixing seat 3h, and a pressure block 5-3h disposed on the suction head fixing seat 5-1h of each suction member 5h, wherein, the number of the cylinders 4h is two, and the two cylinders are respectively positioned at the upper end of the discharge chute 1G of the chip placing platform G and the upper end of the chip position adjusting device F, when the cylinder 4h drives the piston rod to move downwards, the piston rod of the cylinder 4h is contacted with the bearing block 5-3h on the suction head fixing seat 5-1h, and pushing the suction head fixing seat 5-1h and the suction nozzle 5-2h arranged on the suction head fixing seat 5-1h to move downwards, thereby realizing the suction of the chip in the discharge chute 1G of the chip placing table G. When the suction nozzle 5-2h sucks the chip, the cylinder 4h drives the piston rod to move upwards, the suction head fixing seat 5-1h moves upwards under the action of the elastic force of the spring 5-4h, and therefore the suction nozzle 5-2h and the chip sucked by the suction nozzle 5-2h are driven to move upwards, and the chip taking action is completed. Similarly, the process of placing the chip on the chip position adjusting device F is consistent with the material taking process.

Referring to fig. 33-38, the rotary driving mechanism includes a rotary motor fixing seat 7g disposed on the rack I, a rotary motor 6h disposed on the rotary motor fixing seat 7g, and a rotating shaft 5-10h vertically disposed on the carrier 2h, wherein a main shaft of the rotary motor 6h is connected to one end of the rotating shaft 5-10h, the rotating shaft 5-10h is mounted on the carrier 2h, and the other end of the rotating shaft 5-10h is rotatably connected to the bracket 1 h. The rotating shaft is driven to rotate for 5-10h through the rotating motor 6h, so that the conveying frame is driven to rotate for 2h, the chip is conveyed to the position above the chip position adjusting F from the position above the chip placing table G, and the chip is transferred.

Referring to fig. 33-38, the rotary driving mechanism further includes a third detecting mechanism for detecting a rotation angle of the carrier 2h, the third detecting mechanism includes rotating discs 5-9h disposed on the rotating shafts 5-10h and third photoelectric sensors 5-8h disposed on the rotating motor fixing base 7g, the rotating discs 5-9h are located between detection ports of the third photoelectric sensors 5-8h, and notches are disposed on the rotating discs 5-9 h. When the third sensor detects a gap on the rotating disc 5-9h, the control system controls the rotating motor 6h to stop working, so that the suction piece 5h is ensured to move to the position above the discharge chute 1G of the chip placing table G or the position of the chip F, the chip is sucked and unloaded, and the chip conveying precision is ensured.

Correspondingly, as the suction pieces 5h in the conveying frame 2h are four groups, the notches on the rotating discs 5-9h are four, and the included angle between every two adjacent notches is 90 degrees, in the process that the rotating discs 5-9h synchronously rotate along with the conveying frame 2h, every time the conveying frame 2h rotates by 90 degrees, the third photoelectric sensor 5-8h detects one notch, and the rotating motor 6h is controlled to stop working through the control system, so that the rotating angle (the rotating angle is 90 degrees) of the conveying frame 2h is accurately controlled, and the chip conveying precision is improved.

Referring to fig. 33 to 38, the third handling device H of the present invention operates on the following principle:

during the during operation, the chip is placed platform G and is carried the chip to this chip and place the blown down tank 1G in the platform G, and then, rotary driving mechanism drives the transport frame 2h and rotates for the top of blown down tank 1G is moved to the piece of gettering 5h, and then, the vertical motion is done to the piece 5h of the drive of third vertical driving mechanism, thereby absorbs the chip. Then, the rotary driving mechanism drives the suction piece 5h to rotate, so that the suction piece 5h and the adsorbed chip move to the position above the chip position adjusting device F, the third vertical driving mechanism drives the suction piece 5h to vertically move, so that the chip is placed in the chip groove 1-1 in the placing seat 1 of the chip position adjusting device F, and the chip is transferred between the chip placing table G and the chip position adjusting device F.

(3) Conveying device

(3-1) positioning platform C

Referring to fig. 39-42, the positioning platform C of the present invention includes a substrate 1C, the substrate 1C is divided into a plurality of winding blocks 2C, the winding blocks 2C are arranged in a matrix on the substrate 1C, and the winding blocks 2C correspond to the winding block units on the sheet material 7a one-to-one; each winding card position 2c is provided with a chip storage groove 1-1c for storing a chip, and the chip storage grooves 1-1c in the winding card position 2c correspond to the chip placement positions on the winding card units in the plate material 7a one by one.

Referring to fig. 39 to 42, the base plate 1c is provided with a first suction port 1-2c at a lower end of the chip storage groove 1-1c, and the first suction port 1-2c is communicated with an external negative pressure device. Therefore, the chips are adsorbed in the chip storage grooves 1-1c through vacuum pumping of the negative pressure device, so that the chips are prevented from being deviated due to other factors (such as vibration) in the subsequent processing process and are always positioned at the chip placement positions of the corresponding winding card units in the plate 7a, the chip welding precision is improved, and the production quality of the non-contact smart card is ensured.

Referring to fig. 39-42, the base plate 1c is further provided with a plurality of second positioning pins 1-3c for positioning the sheet material 7a, and the sheet material 7a is provided with positioning holes 7-1a matched with the second positioning pins 1-3c at positions corresponding to the second positioning pins 1-3 c. The positioning platform C can position the chip and the plate 7a, and the specific process is as follows: firstly, a first carrying device A carries a sheet material 7a to a positioning platform C of the invention, and causes a positioning hole 7-1a on the sheet material 7a to penetrate through a second positioning pin 1-3C on the positioning platform C, and as a plurality of second positioning pins 1-3C are provided, correspondingly, a plurality of positioning holes 7-1a on the sheet material 7a are provided, thus a plurality of positioning devices can accurately limit the sheet material 7a to generate displacement in the horizontal direction. The advantage of adopting above-mentioned structure lies in: (1) the positioning of the chip and the plate 7a can be realized firstly through the positioning platform C, then the winding card unit of the plate 7a is wound, and finally the chip and the lead led out by the coil on the winding card unit are welded. Therefore, compared with the traditional processing mode of a non-contact smart card production line, the mode has the advantages that the plate 7a and the chips are positioned before winding, so that the plate 7a can be prevented from being deviated in the winding process, the chip placing positions on the plate 7a correspond to the chips one to one, the chip welding precision is improved, and the production quality of the non-contact smart card is ensured. (2) Because the plate 7a and the chip are positioned on the positioning platform C before winding, the chip and the plate 7a are prevented from shifting in the subsequent processing process, and the welding precision of the chip and the production quality of the non-contact smart card are further improved.

In this embodiment, two second positioning pins 1 to 3c are provided, the two second positioning pins 1 to 3c are disposed at two ends of the substrate 1c on the same side, and correspondingly, two positioning holes 7 to 1a of the plate material 7a are also provided.

Referring to fig. 39-42, a plurality of second air suction openings 2-1c are formed around the bobbin clip 2c, and the second air suction openings 2-1c are uniformly arranged along the outer contour line of the bobbin clip 2 c; each second air suction opening 2-1c is communicated with an external negative pressure device. Therefore, the plate 7a is adsorbed on the surface of the substrate 1c by vacuumizing through the negative pressure device, and the plate 7a is prevented from being deviated in the processing process. And because every wire winding screens 2C on the base plate 1C are all provided with the second inlet scoop 2-1C all around, the second inlet scoop 2-1C is along the outer contour line uniform arrangement of wire winding screens 2C, just so can guarantee wire winding screens 2C on the base plate 1C and the wire winding card unit on the sheet material 7a one-to-one correspondence, also mean to leave the chip on the locating platform C and the chip on the sheet material 7a places the position one-to-one correspondence at the same time, thereby further improve the positioning accuracy of sheet material 7 a.

Referring to fig. 39-42, the substrate 1c is divided into 25 wire winding position clips 2c by the second air suction openings 2-1c disposed on the substrate 1c, and the 25 wire winding position clips 2c are arranged on the substrate 1c in a matrix of 5 × 5. Correspondingly, the number of the winding card units on the plate 7a is also 25, and the winding card units are also arranged on the plate 7a in a matrix of 5x 5.

Referring to fig. 39 to 42, the base plate 1c includes an upper plate 1-4c and a lower plate 1-5c, the upper plate 1-4c is connected to the lower plate 1-5c by a screw thread, an inner cavity is disposed between the upper plate 1-4c and the lower plate 1-5c, and the inner cavity is communicated with the first air suction port 1-2c and the second air suction port 2-1 c. Therefore, air in the inner cavity of the substrate 1c is pumped out through the negative pressure device, so that the air pressure in the inner cavity is smaller than the atmospheric pressure, and therefore, the chip and the plate 7a on the surface of the substrate 1c are pressed on the surface of the substrate 1c under the action of the atmospheric pressure, and the chip and the plate 7a are prevented from being deviated in the processing process. In addition, the first air suction openings 1-2c and the second air suction openings 2-1c are communicated with the inner cavity, so that the same adsorption force of the first air suction openings 1-2c and the second air suction openings 2-1c on the chip and the plate 7a can be ensured.

Referring to fig. 39-42, the working principle of the positioning platform C of the present invention is:

when the positioning platform C works, the positioning of the chip can be realized through the positioning platform C, and the specific process comprises the following steps: the second carrying device E carries the chips into the chip storage grooves 1-1C of the winding clamping positions 2C of the positioning platform C in sequence, then the sheet material 7a carrying device carries the sheet material 7a into the positioning platform C, a plurality of winding card units are arranged on the sheet material 7a, the winding card units correspond to the winding clamping positions 2C on the sheet material 7a one by one, and each winding card unit corresponds to one non-contact intelligent card. And because each winding card position 2C on the positioning platform C is provided with a chip storage groove 1-1C, the chip storage groove 1-1C corresponds to the chip placement position of the corresponding winding card unit in the plate material 7 a. After the chip and the sheet material 7a are positioned on the positioning platform C, the positioning platform C is driven to move to a winding station through the conveying mechanism D, winding is carried out on each winding card unit on the sheet material 7a through the winding device J, and finally two wires are led out to be in contact with welding spots on the chip. And then, the conveying mechanism D continues to drive the positioning platform C to move to a chip welding station, the chip welding device K welds the wire with a welding spot on the chip, and finally, the conveying mechanism D continues to drive the positioning platform C, the chip placed on the positioning platform C and the plate 7a to reach a subsequent processing station so as to complete a subsequent processing procedure.

In the process, the chip and the plate 7a are accurately positioned on the positioning platform C before winding, so that the chip and the plate 7a cannot deviate in the winding process, the lead led out from the coil in each winding card unit can be in contact with the welding point of the chip after winding, the welding point of the chip can be smoothly welded with the lead led out by the chip welding device K, the welding precision is improved, and the production quality of the non-contact intelligent card is improved. In addition, the chips are already placed in the chip storage grooves 1-1C of the positioning platform C before winding, and the chips are conveyed to the chip placement positions of the winding card units on the sheet material 7a one by one in the traditional non-contact smart card manufacturing production line after the winding is finished, so that compared with the traditional chip conveying mode, the positioning platform C can save the time spent by the non-contact smart card manufacturing equipment for conveying the chips back and forth, and improve the production efficiency of the non-contact smart card manufacturing equipment.

(3-2) conveying mechanism D

The conveying mechanism D in this embodiment may adopt an existing conveying structure on the market, for example, a mode in which a motor is combined with a screw rod transmission mechanism, or a mode in which a motor is combined with a synchronous belt transmission mechanism, or a mode in which a motor is combined with a rack-and-pinion transmission mechanism, and a mode in which a motor is combined with a screw rod transmission mechanism is adopted in this embodiment.

(4) Winding device J

The specific structure of the winding device J in this embodiment can be implemented by referring to the winding device J in the "a non-contact smart card manufacturing line" disclosed in the invention patent application with application publication No. CN 108000909A.

(5) Chip welding device K

The specific structure of the die bonding apparatus K in this embodiment can be implemented by referring to the winding apparatus J in the "one kind of non-contact smart card manufacturing line" disclosed in the invention patent application with application publication No. CN 108000909A.

Example 2

Referring to fig. 43, the present embodiment is different from embodiment 1 in that the vertical driving assembly of the positioning assembly 5a in the first handling device a in the present embodiment may be in another form, and the vertical driving assembly includes a slider-slide mechanism and the spring 5-4 a; the sliding block and sliding rail mechanism comprises a positioning guide sliding rail 5-5a and a positioning sliding block 5-6a matched with the positioning guide sliding rail 5-5 a; the upper end of the guide sliding rail is connected with the mounting frame 2a, the positioning piece 5-1a is fixed at the lower end of the positioning sliding block 5-6a through a connecting piece 5-7a, the lower portion of the positioning guide sliding rail 5-5a is also provided with a limiting portion 5-21a used for limiting the position of the positioning sliding block 5-6a, the spring 5-4a is arranged between the mounting frame 2a and the positioning sliding block 5-6a, one end of the spring 5-4a acts on the first rack 1a, and the other end of the spring acts on the positioning sliding block 5-6 a. The slide block and slide rail mechanism can also ensure the running stability of the positioning piece 5-1a in the positioning process, and the bottom surface of the positioning piece 5-1a is better abutted against the plate 7a, thereby improving the positioning precision.

Example 3

Referring to fig. 44, the difference between this embodiment and embodiments 1 and 2 is that the first vertical driving mechanism 6a in the first carrying device a in this embodiment may be another form, the transmission assemblies of the lead screws 6-3a are a set, the first driven driving wheel 6-6a is disposed on the vertical fixing seat 6-2a, and a guide pillar and guide bush mechanism for guiding the mounting frame 2a to move up and down is disposed between the mounting frame 2a and the vertical fixing seat 6-2a, where the guide pillar and guide bush mechanism is a plurality of sets, and the plurality of sets of guide pillar and guide bush mechanisms are distributed around the mounting frame 2 a; each group of guide post and guide sleeve mechanism comprises a guide post 6-9a and a guide sleeve 6-10a matched with the guide post 6-9a, one end of the guide sleeve 6-10a is fixed on the vertical fixed seat 6-2a, one end of the guide post 6-9a is fixed on the mounting frame 2a, and the other end of the guide post extends vertically upwards and penetrates through the guide sleeve 6-10 a; the screw rod 6-3a of the screw rod 6-3a transmission assembly is connected with the first driven driving wheel 6-6a, the vertical motor 6-1a is arranged on the vertical fixed seat 6-2a, the first driving wheel 6-5a is arranged on a main shaft of the vertical motor 6-1a, the first driving wheel 6-5a is connected with the first driven driving wheel 6-6a through the first transmission belt 6-7a, and the screw rod nut 6-4a is arranged on the mounting frame 2a and is matched with the screw rod 6-3 a. Through the structure, the vertical motor 6-1a drives the screw rod 6-3a to rotate, so that the screw rod nut 6-4a is driven to vertically move on the screw rod 6-3a, the vertical fixed seat 6-2a is driven to vertically move, the mounting frame 2a is driven to vertically move, and the sucker component 4a and the positioning component 5a vertically move; through the arrangement of the guide pillar and guide sleeve mechanism, the stability of vertical motion between the vertical fixed seat 6-2a and the mounting frame 2a is guaranteed, and therefore the stability of the sucker assembly 4a and the positioning assembly 5a in the vertical motion process is guaranteed.

Example 4

Referring to fig. 45, the present embodiment is different from embodiment 1 in that the second transverse driving mechanism in the second carrying device E in the present embodiment may also be a transverse driving motor 9E and a screw transmission assembly, where the screw transmission assembly includes a transverse screw 11E, a transverse slider 12E, and a transverse chute 10E; the transverse driving motor 9e is mounted on a transverse motor mounting seat 13e, the transverse motor mounting seat 13e is fixedly connected with one end of a transverse sliding groove 10e, the transverse sliding groove 10e is fixedly mounted on the cross beam 1-1e, the transverse screw rod 11e is connected to a main shaft of the transverse driving motor 9e and is connected with a transverse sliding block 12e, the transverse sliding block 12e is connected with the transverse sliding plate 4e, and the transverse sliding block 12e is arranged in the transverse sliding groove 10 e. Through setting up horizontal driving motor 9e and lead screw runner assembly, can realize the chip and absorb the transverse motion of module, and simple structure, the transmission is effectual.

The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents and are included in the scope of the present invention.

Claims

1. A positioning method for manufacturing a non-contact smart card is characterized by comprising the following steps:

(2) the first carrying device carries the uppermost plate stored in the plate placing table to the positioning platform, and enables the positioning hole in the plate to penetrate through the second positioning pin on the positioning platform, and a plurality of winding card units for arranging chips and windings are arranged on the plate; the first transverse driving mechanism drives the plate material carrying mechanism to transversely move to the position above the plate material placing platform, then, the first vertical driving mechanism in the plate material carrying mechanism drives the mounting frame and the sucking disc assembly and the positioning assembly which are arranged on the mounting frame to move downwards, a positioning piece in the positioning assembly is firstly contacted with the plate material, a sucking hole in the positioning piece adsorbs a part, located around the positioning hole, of the plate material, and then, a plurality of new plates of the sucking disc assembly are contacted with the plate material; finally, the first vertical driving mechanism drives the mounting frame, the sucker assembly and the positioning assembly arranged on the mounting frame and the conveyed plate to vertically move to finish the material taking action;

2. The method according to claim 1, wherein in step (2), the first transverse driving mechanism drives the sheet material carrying mechanism and the carried sheet material to move above the positioning platform, the first vertical driving mechanism drives the mounting frame and the suction disc assembly, the positioning assembly and the sheet material arranged on the mounting frame to move downwards, and the positioning member in the positioning assembly drives a part of the sheet material around the positioning hole of the sheet material to move downwards first and makes the positioning hole of the sheet material pass through the second positioning pin on the positioning platform; and finally, the suction disc assembly and the positioning assembly loosen the plate, and the plate returns to the initial position under the driving of the first transverse driving mechanism and the first vertical driving mechanism to prepare for carrying the next plate.

3. The method according to claim 2, wherein in step (2), when the sheet material is taken, the suction holes in the positioning members firstly suck the portion of the sheet material around the positioning holes.

4. The positioning method for manufacturing the contactless smart card according to claim 1, wherein in the step (3), the process of the second handling device handling the chip comprises the following steps:

(3-1) the chip placing table conveys the chips stored in the chip placing table to a discharge chute of the chip placing table one by one;

(3-2) transferring the chips positioned in the discharge chute of the chip placing table to the chip groove of the placing seat of the chip position adjusting device by using a third carrying device;

and (3-3) adjusting the position of the chip by the chip position adjusting device, and conveying the chip with the adjusted position posture in the chip position adjusting device to a chip storage groove of the positioning platform by the second conveying device.

5. The positioning method for manufacturing the contactless smart card according to claim 4, wherein in the step (3-3), the adjustment of the position posture of the chip by the chip position adjusting means is comprised of the steps of;

(3-31) the correction driving mechanism drives the two groups of correction assemblies to move reversely, so that the two upper layer correction pieces and the two lower layer correction pieces are driven to move reversely; the third carrying device carries the chips in the discharge chute of the chip placing table into the chip grooves of the placing seat one by one;

(3-32) the power mechanism drives the placing seat and the chip placed in the chip groove of the placing seat to rotate, so that the chip is adjusted to a specific orientation;

(3-33) the second carrying device carries the chip in the chip slot of the placing seat to the chip storage slot of the positioning platform.

6. The positioning method for manufacturing the contactless smart card according to claim 5, wherein in the step (3-33), the suction head of the second handling device sucks the chip and drives the chip to move vertically between the two upper layer modifiers or the lower layer modifiers, and then the modification driving mechanism drives the two sets of modifiers to move in opposite directions, so as to drive the two upper layer modifiers and the two lower layer modifiers to move in opposite directions, so that the upper layer modifiers of the two upper layer modifiers or the lower layer modifiers of the two lower layer modifiers are matched with the chip, thereby further correcting the position and posture of the chip.

7. The method for positioning in the manufacture of a contactless smart card according to claim 6, wherein in the step (3-33), the plurality of suction heads in the second carrying means are independently operated and the plurality of chips in the chip position adjusting means are simultaneously sucked.

8. A method for producing a contactless smart card using the positioning method of claim 1, comprising the steps of:

(1) the method according to claim 1 realizes the positioning of the plate and the chip on the positioning platform;

9. The method for producing a contactless smart card according to claim 8, wherein in the step (2), there are two positioning stages, and the two positioning stages are juxtaposed and driven by two conveying mechanisms respectively.