CN210609082U - Loading and unloading equipment for wafer silver coating process - Google Patents
Loading and unloading equipment for wafer silver coating process Download PDFInfo
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- CN210609082U CN210609082U CN201921157056.2U CN201921157056U CN210609082U CN 210609082 U CN210609082 U CN 210609082U CN 201921157056 U CN201921157056 U CN 201921157056U CN 210609082 U CN210609082 U CN 210609082U
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Abstract
The utility model provides a handling equipment for wafer is by silver technology, include the frame and by silver sheet combination, include from last electrode piece that stacks in proper order down by silver sheet combination, the spacer, lower electrode piece and bottom plate, go up electrode piece, the spacer, lower electrode piece and bottom plate are square board, the locating plate is used for placing the wafer, be provided with the magnet vacancy on the bottom plate bottom surface, the magnet vacancy is the bar recess form, it carries the dish to be provided with magnet by silver sheet combination bottom, the plane is fixed with the magnet post with magnet vacancy assorted on the magnet carries the dish, the frame includes the stand of both sides, from the top down is provided with vacuum suction nozzle and removes the plane between the stand, by silver sheet fixed plane, magnet carries a dish uninstallation plane, three plane both sides all are connected on the stand of both sides through sliding sleeve. The utility model has the advantages of being simple in structure and convenient in operation work efficiency is high.
Description
Technical Field
The utility model relates to a frock tool that paster type crystal resonator production field used specifically indicates a handling equipment that is used for the wafer by silver technology.
Background
In general, in a silver plating process in the field of production of chip-type crystal resonators, a silver plated board includes a bottom plate for carrying a wafer, an upper electrode plate and a lower electrode plate, the upper and lower electrode plates need to be fixed above and below the bottom plate before silver plating, and a clamping device is needed to ensure smooth silver plating.
The patent publication of the Chinese utility model is: CN201860299U, entitled Notification date 2011.06.8 discloses a silver-coated clamp for tuning fork crystal, which is assembled by an upper mask frame, an upper mask sheet, a positioning sheet, a lower mask sheet and a lower mask frame; the upper mask frame is provided with an upper mask frame positioning pin hole, an upper mask frame silver coating material leading-in hole and an upper mask frame assembling hole; the upper mask is provided with an upper mask positioning hole and an upper mask assembling hole; the positioning sheet is provided with a positioning sheet positioning pin hole and a positioning sheet assembling hole; the lower mask sheet is provided with a lower mask sheet positioning hole and a lower mask sheet assembling hole; the lower mask frame is provided with a lower mask frame positioning pin, a lower mask frame assembling screw hole and a lower pickling frame silver coating material leading-in hole. Although the design provides a clamping device in the silver coating process, the structure is complex and the use is inconvenient. In addition, a magnetic fixing device is also adopted in the existing silver plating process, before silver plating, small magnets are manually placed into magnet vacant positions of the bottom plate one by means of tools, the upper electrode plate and the wafer on the bottom plate are manually positioned at high precision, the upper electrode plate and the lower electrode plate are fixed on the upper portion and the lower portion of the bottom plate by utilizing magnetism, after silver plating, the upper electrode plate and the wafer on the bottom plate are taken away, the bottom plate is cleaned, and the magnets are taken away one by one. The design is simple and practical, but the upper electrode plate is difficult to remove after silver plating due to the existence of magnetism, the quality of manual removal operation is low, and even a wafer can be damaged; in addition, it is also very inconvenient to take off magnet one by one, is not convenient for realize by the automated processing of silver technology.
Disclosure of Invention
The utility model aims at overcoming the above-mentioned problem that exists among the prior art in the wafer by silver process, provide a simple structure, convenient operation, work efficiency height be used for the wafer by the handling equipment of silver technology.
In order to achieve the above purpose, the technical solution of the utility model is that: a loading and unloading device for a silver coating process of a wafer comprises a rack and a silver coating combination, wherein the silver coating combination comprises an upper electrode plate, a positioning plate, a lower electrode plate and a bottom plate which are sequentially stacked from top to bottom, the upper electrode plate, the positioning plate, the lower electrode plate and the bottom plate are square plates, the positioning plate is used for placing the wafer, a magnet vacancy is arranged on the bottom surface of the bottom plate combined by the silver coating combination and is in a strip groove shape, a magnetic carrying disc is arranged at the bottom of the silver coating combination, a magnet column matched with the magnet vacancy is fixed on the upper plane of the magnetic carrying disc, the rack comprises stand columns at two sides, a vacuum suction nozzle moving plane, a silver coating fixing plane and a magnetic carrying disc unloading plane are arranged between the stand columns from top to bottom, two sides of the three planes are connected to the stand columns at two sides through sliding sleeves, a vacuum suction nozzle is arranged on the vacuum suction nozzle moving plane, and the silver coating, the magnetic carrying disc is characterized in that square notches are formed in four corners of the magnetic carrying disc, the silver plate fixing plane is in a square hollow shape, square baffles matched with the square notches in shape are arranged at the positions, corresponding to the square notches, of the silver plate fixing plane, and clamps used for clamping the magnetic carrying disc are arranged on the magnetic carrying disc unloading plane.
And the vacuum suction nozzle moving plane is also provided with a visual recognition device, and the visual recognition device comprises a lens, an image processor, an image acquisition card and a light source.
The rack is also provided with a control box.
The utility model has the advantages that:
1. this design includes vacuum suction nozzle removal plane, by silver sheet fixed plane, magnetism carries a set plane triplex of uninstalling, before silver-plating, the spacer that will fully load the wafer, lower electrode piece, the bottom plate, magnetism carries the dish to place on by silver sheet fixed plane from last to down in proper order, because magnetism carries to be fixed with the magnet post on the dish, on the magnet vacancy of magnet post embedding bottom plate bottom surface, whole by silver sheet combination dependence magnetism adsorb together each other, then utilize vacuum suction nozzle to absorb the upper electrode piece, the translation is close to and steadily laminates behind the spacer. After silver plating, the vacuum suction nozzle moving plane is pressed downwards to be combined by the silver plate, the magnetic carrying disc unloading plane moves upwards and horizontally to clamp the magnetic carrying disc by using a clamp on the magnetic carrying disc, square notches are arranged on four corners of the magnetic carrying disc, the silver plate fixing plane is in a square hollow shape, a square baffle matched with the square notch in shape is arranged at the position corresponding to the silver plate fixing plane and the square notch, only the magnetic carrying disc moves downwards along with the magnetic carrying disc in the process of moving downwards of the magnetic carrying disc unloading plane (the magnetic carrying disc is provided with the square notch matched with the square baffle in shape, so that the magnetic carrying disc moves downwards smoothly), the silver plate is combined, the magnetic between the positioning piece, the bottom plate and the upper electrode piece and the lower electrode piece disappears after the magnetic carrying disc is removed, the vacuum suction nozzle is used for absorbing the upper electrode piece and removing, the operation is convenient, and the wafer is not easy to damage, can realize the automatic loading and unloading of the silver-coated process.
2. In the design, a visual recognition device is further arranged on the plane of the vacuum suction nozzle and comprises a lens, an image processor, an image acquisition card and a light source, and the visual recognition device is connected with the control box and used for appearance detection before and after silver plating of the wafer and rejection of defective products, so that the efficiency of the whole process is improved.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is a schematic view of the silver plate combination and the magnetic carrier plate of the present invention;
FIG. 3 is a schematic structural view of a magnetic carrier plate according to the present invention;
fig. 4 is a schematic structural view of the plane fixed by the silver plate in the present invention.
In the figure: the device comprises a rack 1, a stand column 11, a silver plate combination 2, an upper electrode plate 21, a positioning piece 22, a lower electrode plate 23, a bottom plate 24, a magnet vacancy 25, a magnetic carrying disc 3, a magnet column 31, a square notch 32, a vacuum suction nozzle moving plane 4, a vacuum suction nozzle 41, a silver plate fixing plane 5, a square baffle 51, a magnetic carrying disc unloading plane 6, a fixture 61, a sliding sleeve 7, a visual recognition device 8 and a control box 9.
Detailed Description
The invention will be described in further detail with reference to the following description and embodiments, with reference to the accompanying drawings, in which:
referring to fig. 1 to 4, a handling device for a wafer silver coating process includes a rack 1 and a silver coated plate assembly 2, where the silver coated plate assembly 2 includes an upper electrode plate 21, a positioning plate 22, a lower electrode plate 23 and a bottom plate 24 stacked from top to bottom, the upper electrode plate 21, the positioning plate 22, the lower electrode plate 23 and the bottom plate are square plates, and the positioning plate 22 is used for placing a wafer, and is characterized in that: the bottom surface of a bottom plate 24 of the silver plate combination 2 is provided with a magnet vacancy 25, the magnet vacancy 25 is in a strip groove shape, the bottom of the silver plate combination 2 is provided with a magnetic carrying disc 3, the upper plane of the magnetic carrying disc 3 is fixed with a magnet column 31 matched with the magnet vacancy 25, the frame 1 comprises upright posts 11 at two sides, a vacuum suction nozzle moving plane 4, a silver plate fixed plane 5 and a magnetic carrying disc unloading plane 6 are arranged between the upright posts 11 from top to bottom, two sides of the three planes are connected on the upright posts 11 at two sides through sliding sleeves 7, a vacuum suction nozzle 41 is arranged on the vacuum suction nozzle moving plane 4, the silver plate fixed plane 5 is used for placing the silver plate combination 2 and the magnetic carrying disc 3, four corners of the magnetic carrying disc 3 are provided with square notches 32, the silver plate fixed plane 5 is in a square hollow shape, a square baffle 51 matched with the square notches 32 in shape is arranged at the corresponding positions of the silver plate fixed plane 5 and the square, the magnetic boat unloading plane 6 is provided with a chucking device 61 for chucking the magnetic boat 3.
The vacuum suction nozzle moving plane 4 is also provided with a visual recognition device 8, and the visual recognition device 8 comprises a lens, an image processor, an image acquisition card and a light source.
The frame 1 is also provided with a control box 9.
This design includes vacuum suction nozzle removal plane 4, by silver sheet fixed plane 5, magnetism year dish uninstallation plane 6 triplex, before silver-plating, the spacer 22 that will fully load the wafer, lower electrode piece 23, bottom plate 24, magnetism year dish 3 from last to placing in proper order down on by silver sheet fixed plane 5, because magnetism year dish 3 is last to be fixed with magnet post 31, on magnet post 31 imbeds the magnet vacancy 25 of bottom plate 24 bottom surface, whole by silver sheet combination 2 rely on magnetism to adsorb each other together, then utilize vacuum suction nozzle 41 to absorb upper electrode piece 21, the translation is close to and steadily laminates behind the spacer 22. After silver plating, the vacuum suction nozzle moving plane 4 presses the silver plate combination 2 downwards, the magnetic carrying disc unloading plane 6 moves upwards and horizontally and clamps the magnetic carrying disc 3 by using the clamp 61 on the magnetic carrying disc, because the four corners of the magnetic carrying disc 3 are provided with the square notches 32, the silver plate fixed plane 5 is in a square hollow shape, the square baffle 51 matched with the square notch 32 in shape is arranged at the position corresponding to the square notch 32 by the silver plate fixed plane 5, only the magnetic carrying disc 3 moves downwards along with the magnetic carrying disc 6 in the process of moving downwards (the square notch 32 matched with the square baffle 51 in shape is arranged on the magnetic carrying disc 3, just enables the magnetic carrying disc to move downwards smoothly), the silver plate combination 2 stops on the silver plate fixed plane 5 due to the square baffle 51, after the magnetic carrying disc 3 is taken down, the magnetism among the positioning sheet 22, the bottom plate 24, the upper electrode sheet 21 and the lower electrode sheet 23 disappears, the vacuum suction nozzle 41 is used for sucking the upper electrode plate 21 to be taken down, the operation is convenient, the wafer is not easy to damage, and the automatic loading and unloading of the silver process can be realized. In the design, a visual recognition device 8 is further arranged on the vacuum suction nozzle moving plane 4, the visual recognition device 8 comprises a lens, an image processor, an image acquisition card and a light source, and the visual recognition device 8 is connected with a control box 9 and used for appearance detection before and after wafer silvering, defective products are removed, and the efficiency of the whole process is improved. The utility model has the advantages of being simple in structure and convenient in operation, work efficiency is high.
Claims (3)
1. The utility model provides a handling equipment that is used for wafer by silver technology, includes frame (1) and by silver board combination (2), include from last electrode piece (21), spacer (22), lower electrode piece (23) and bottom plate (24) that stack according to this down by silver board combination (2), go up electrode piece (21), spacer (22), lower electrode piece (23) and bottom plate are square board, spacer (22) are used for placing the wafer, its characterized in that: a magnet vacancy (25) is arranged on the bottom surface of a bottom plate (24) of the silver plate combination (2), the magnet vacancy (25) is in a strip groove shape, a magnetic carrying disc (3) is arranged at the bottom of the silver plate combination (2), a magnet column (31) matched with the magnet vacancy (25) is fixed on the upper plane of the magnetic carrying disc (3), the rack (1) comprises upright columns (11) on two sides, a vacuum suction nozzle moving plane (4), a silver plate fixing plane (5) and a magnetic carrying disc unloading plane (6) are arranged between the upright columns (11) from top to bottom, two sides of the three planes are connected to the upright columns (11) on two sides through sliding sleeves (7), a vacuum suction nozzle (41) is arranged on the vacuum suction nozzle moving plane (4), the silver plate fixing plane (5) is used for placing the silver plate combination (2) and the magnetic carrying disc (3), and a square notch (32) is arranged on the magnetic carrying disc (3), the silver plate fixing plane (5) is square and hollowed, a square baffle (51) matched with the square notch (32) in shape is arranged at the position, corresponding to the square notch (32), of the silver plate fixing plane (5), and a clamp (61) used for clamping the magnetic carrying disc (3) is arranged on the magnetic carrying disc unloading plane (6).
2. A handling apparatus for a silvered wafer process according to claim 1, wherein: and a visual recognition device (8) is also arranged on the vacuum suction nozzle moving plane (4), and the visual recognition device (8) comprises a lens, an image processor, an image acquisition card and a light source.
3. A handling apparatus for a silvered wafer process according to claim 1, wherein: the rack (1) is also provided with a control box (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157056.2U CN210609082U (en) | 2019-07-23 | 2019-07-23 | Loading and unloading equipment for wafer silver coating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921157056.2U CN210609082U (en) | 2019-07-23 | 2019-07-23 | Loading and unloading equipment for wafer silver coating process |
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| Publication Number | Publication Date |
|---|---|
| CN210609082U true CN210609082U (en) | 2020-05-22 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921157056.2U Active CN210609082U (en) | 2019-07-23 | 2019-07-23 | Loading and unloading equipment for wafer silver coating process |
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| CN (1) | CN210609082U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417372A (en) * | 2019-07-23 | 2019-11-05 | 湖北泰晶电子科技股份有限公司 | It is a kind of for chip by the handling facilities of silver process |
| CN118322117A (en) * | 2024-04-12 | 2024-07-12 | 烟台明德亨电子科技有限公司 | Wafer clamp and automatic assembly and disassembly method thereof |
-
2019
- 2019-07-23 CN CN201921157056.2U patent/CN210609082U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110417372A (en) * | 2019-07-23 | 2019-11-05 | 湖北泰晶电子科技股份有限公司 | It is a kind of for chip by the handling facilities of silver process |
| CN118322117A (en) * | 2024-04-12 | 2024-07-12 | 烟台明德亨电子科技有限公司 | Wafer clamp and automatic assembly and disassembly method thereof |
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| GR01 | Patent grant | ||
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Address after: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee after: Taijing Technology Co., Ltd Address before: 441300 Zengdou Economic Development Zone, Hubei, Suizhou Patentee before: HUBEI TKD ELECTRONIC TECHNOLOGY Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder |