CN210575833U

CN210575833U - Anti-adhesive sectional type chip press-fit mold

Info

Publication number: CN210575833U
Application number: CN201921832100.5U
Authority: CN
Inventors: 徐帅; 马军; 李峰; 张光明
Original assignee: Taiji Semiconductor Suzhou Co ltd
Current assignee: Taiji Semiconductor Suzhou Co ltd
Priority date: 2019-10-29
Filing date: 2019-10-29
Publication date: 2020-05-19
Anticipated expiration: 2029-10-29

Abstract

The utility model relates to an anti-adhesive sectional chip press-fit mold, which comprises an upper mold and a lower mold, wherein the upper surface of the lower mold is provided with a plurality of press tables, and the upper surfaces of all the press tables are flat and flush with each other; the pressing tables are used for pressing the chips on the substrate, each pressing table corresponds to one chip, and the contact range of each pressing table and the corresponding chip does not exceed the edge of the chip; this scheme is provided with a plurality of pressure platforms through the upper surface at the lower mould, changes the pressfitting mode of chip into the sectional type, can effectively improve the accurate nature of pressfitting chip, improves the stability of excessive glue, prevents unusual emergence, guarantees the quality.

Description

Anti-adhesive sectional type chip press-fit mold

Technical Field

The utility model relates to an antiseized gluey sectional type chip compression moulding utensil belongs to WBGA product flip chip operation technical field.

Background

Present WBGA product flip chip all adopts the mode of whole pressfitting when the pressfitting, at the in-process with

chip

4 and 5 pressfittings of base plate, and glue film 6 receives the extrusion can overflow to glue around chip 4, and overflow and glue the part and probably adhere to the pressfitting surface of lower mould, under this condition, can lead to overflowing to glue inhomogeneous, in addition in separation die pressing mould, the excessive position of gluing of adhesion mould and chip leads to the chip impaired easily simultaneously.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a prevent sectional type chip compression fittings mould of viscose in order to overcome prior art not enough.

In order to achieve the above purpose, the utility model adopts the technical scheme that: the sectional type chip laminating die for preventing adhesive from being adhered comprises an upper die and a lower die, wherein a plurality of pressing tables are arranged on the upper surface of the lower die, and the upper surfaces of all the pressing tables are flat and flush with each other; the pressing tables are used for pressing the chips on the substrate, each pressing table corresponds to one chip, and the contact range of each pressing table and the corresponding chip does not exceed the edge of the chip.

Preferably, the lower surface of the upper die is a plane, the upper die and the lower die are metal dies, and the upper side of the lower die is subjected to washing and cutting processing to form a plurality of pressing tables.

Preferably, the pressing table and the chip are both of rectangular structures, and the periphery of the pressing table is equidistant to the periphery of the chip.

Preferably, the edge of the pressing table is chamfered, and the upper surface of the pressing table is subjected to surface treatment to form a smooth plane.

Preferably, the plurality of pressing tables are arranged side by side and are evenly spaced.

Preferably, the lower die is further provided with a mounting hole and a positioning hole, the lower die is fixedly mounted through the mounting hole, and the upper die is matched and positioned with the lower die through the positioning hole.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses the sectional type chip press fitting die of viscose of preventing of scheme is provided with a plurality of pressure platforms through the upper surface at the lower mould, changes the pressfitting mode of chip into the sectional type, can effectively improve the accurate nature of pressfitting chip, improves the stability of excessive glue, prevents abnormal occurrence, guarantees the quality.

Drawings

The technical scheme of the utility model is further explained by combining the attached drawings as follows:

fig. 1 is a schematic view of a sectional chip pressing mold for preventing adhesive from adhering according to the present invention;

fig. 2 is a schematic top view of the lower mold of the present invention.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

As shown in fig. 1-2, the sectional die for chip lamination according to the present invention comprises an upper die 1 and a lower die 2; the lower surface of the upper die 1 is a plane, the lower die 2 is also provided with a mounting hole 7 and a positioning hole 8, the lower die 2 is fixedly mounted through the mounting hole 7, and the upper die 1 is matched and positioned with the lower die 2 through the positioning hole 8; the upper die 1 and the lower die 2 are both metal dies, the upper side of the lower die 2 is subjected to washing and cutting processing to form a plurality of pressing platforms 3, and the pressing platforms 3 are arranged side by side and are uniformly spaced; the upper surfaces of all the pressing tables 3 are flat and flush with each other, the edges of the pressing tables 3 are chamfered, and the upper surfaces of the pressing tables 3 are subjected to surface treatment to form smooth planes; the pressing table 3 is used for pressing the chip 4 on the substrate 5, a glue layer 6 is arranged between the chip 4 and the substrate 5, each pressing table 3 corresponds to one chip 4, the pressing table 3 and the chip 4 are both of a rectangular structure, the contact range of each pressing table 3 and the corresponding chip 4 is not more than the edge of the chip 4, and the periphery of the pressing table 3 and the periphery of the chip 4 are equidistant.

The size design of the sectional type pressing mold contact chip achieves accurate correspondence of the mold and the chip according to the size design of the chip, and the periphery of the chip is enabled to overflow glue more uniformly.

Sectional type compression mold contact chip's size is less than the chip, can prevent sticky to the mould on, has avoided the contact of chip periphery and mould, prevents unusual emergence such as chip chipping/crack.

The part of sectional type compression mold contact chip has chamfer and special treatment all around, can reduce the edges and corners impact in the twinkling of an eye during the contact, prevents that crack from taking place.

The sectional distance of the pressing table of the sectional type pressing die is designed according to the distance between the chip and the base plate, so that the stress generated by heating and extruding the base plate is perfectly released when the base plate is pressed in a single-row integrated manner, the force applied to a single chip is relatively uniform, and the glue overflow is stable.

And the sectional type pressing mold can be used for different types of flip-chip packaging machines.

The above is only a specific application example of the present invention, and does not constitute any limitation to the protection scope of the present invention. All the technical solutions formed by equivalent transformation or equivalent replacement fall within the protection scope of the present invention.

Claims

1. The utility model provides an antiseized gluey sectional type chip compression moulding utensil, contains mould (1) and lower mould (2), its characterized in that: the upper surface of the lower die (2) is provided with a plurality of pressing tables (3), and the upper surfaces of all the pressing tables (3) are flat and flush with each other; the pressing table (3) is used for pressing the chips (4) on the substrate (5), each pressing table (3) corresponds to one chip (4), and the contact range of each pressing table (3) and the corresponding chip (4) does not exceed the edge of the chip (4).

2. The anti-adhesive segmented chip bonding die of claim 1, wherein: the lower surface of the upper die (1) is a plane, the upper die (1) and the lower die (2) are metal dies, and the upper side of the lower die (2) is subjected to washing and cutting processing to form a plurality of pressing platforms (3).

3. The anti-adhesive segmented chip bonding die of claim 1, wherein: the pressing table (3) and the chip (4) are both of rectangular structures, and the periphery of the pressing table (3) is equidistant to the periphery of the chip (4).

4. The anti-adhesive segmented chip bonding die of claim 1, wherein: the edge of the pressing table (3) is chamfered, and the upper surface of the pressing table (3) is subjected to surface treatment to form a smooth plane.

5. The anti-adhesive segmented chip bonding die of claim 1, wherein: the plurality of pressing platforms (3) are arranged side by side and are evenly spaced.

6. The anti-adhesive segmented chip bonding die of claim 1, wherein: still be provided with mounting hole (7) and locating hole (8) on lower mould (2), lower mould (2) are fixed through mounting hole (7) installation, go up mould (1) and match the location through locating hole (8) and lower mould (2).