CN210535656U - Integrated circuit heat dissipation type pin structure - Google Patents

Integrated circuit heat dissipation type pin structure Download PDF

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Publication number
CN210535656U
CN210535656U CN201921190905.4U CN201921190905U CN210535656U CN 210535656 U CN210535656 U CN 210535656U CN 201921190905 U CN201921190905 U CN 201921190905U CN 210535656 U CN210535656 U CN 210535656U
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CN
China
Prior art keywords
pin body
heel
pin
arc groove
integrated circuit
Prior art date
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Active
Application number
CN201921190905.4U
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Chinese (zh)
Inventor
杨国江
陈益忠
夏昊天
陈炜
杨烨
于世珩
毛嘉云
刘健
汤振凯
徐伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu Changjing Technology Co.,Ltd.
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Jiangsu Changjing Technology Co Ltd
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Priority to CN201921190905.4U priority Critical patent/CN210535656U/en
Application granted granted Critical
Publication of CN210535656U publication Critical patent/CN210535656U/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model relates to an integrated circuit heat dissipation type pin structure, including the pin body, the pin body includes heel, foot side and toe, the L type structure at access end for deepening the encapsulation shell top of heel, the heel exposes all to be equipped with the arc groove in the both sides of external part and foot side, the pin body passes through aluminium strip and chip fixed connection. The utility model discloses a length of the heel extension pin body of L type structure increases its and external area of contact, through set up the arc groove in the both sides of pin, increases its and external area of contact, improves the thermal diffusivity of pin body rectangular cross section, reduces whole integrated circuit board's high temperature effect.

Description

Integrated circuit heat dissipation type pin structure
Technical Field
The utility model relates to an electronic packaging technology field especially relates to an integrated circuit heat dissipation type pin structure.
Background
The chip can generate heat when working, if the heat can not be dissipated in time, the chip can not work normally or even can be burnt out, and an important function of packaging is to provide a heat conduction way. Based on the requirement of heat dissipation, the thinner the package is better, and when the chip power consumption is larger than 2W, the heat dissipation structure, such as a heat sink or forced cooling means, must be considered on the package.
The Pin is called as the base Pin, and English is called as Pin. The wiring is led out from the internal circuit of the integrated circuit (chip) and connected with the peripheral circuit, and all pins form the interface of the chip. And a section of the tail end of the aluminum strip is soldered to form a welding point together with the welding pad on the printed board. The legs can be divided into heel, toe, foot side, etc.
The existing pins are only used for wiring interfaces of chips in the electronic packaging process, although part of heat can be led out from the inside of an integrated circuit to cool the chips, the heat dissipation of the rectangular cross section of the pins is general, and the heat conducted to the pins can be transferred to adjacent pins and even peripheral circuit wiring, so that the high-temperature effect of the whole integrated circuit board is caused.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an integrated circuit heat dissipation type pin structure to solve the problem that meets in the above-mentioned background art.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
the utility model provides an integrated circuit heat dissipation type pin structure, includes the pin body, the pin body includes heel, foot side and toe, the incoming end of heel is for deepening the L type structure at encapsulation shell top, the heel exposes all to be equipped with the arc groove in the both sides of external part and foot side.
In the above scheme, the arc grooves comprise a first arc groove and a second arc groove, the first arc groove and the second arc groove are uniformly distributed on the same side of the heel and the foot, and the groove bottoms of the first arc groove and the second arc groove are arranged in a staggered mode.
In the above scheme, the pin body is fixedly connected with the chip through the aluminum strip.
In the above scheme, the pin body is of an airfoil structure.
In the above scheme, the pin body is of a J-shaped structure.
Compared with the prior art, the beneficial effects of the utility model are that:
1. after the heat that is produced by the chip transmits to the pin body, expose the arc groove that all is equipped with in the both sides of the part in the external world and the foot side through the heel, increase the surface area of pin body both sides, the heat dissipation of being convenient for. The access end of the heel is of an L-shaped structure extending into the top of the packaging shell, and the heel is packaged from the top of the packaging shell into the packaging shell, so that the length of the pin body is increased, and the heat dissipation area of the pin body is increased. By increasing the surface area of the pin body, the heat dissipation performance of the rectangular section of the pin body is improved, and the high-temperature effect of the whole integrated circuit board is reduced.
2. The pin body is fixed with the chip in a welding mode through the aluminum strip, the aluminum strip has excellent conductive performance, the unit area has extremely small contact resistance, the heat conduction efficiency of the pin body can be improved, and therefore the heat dissipation performance of the pin is improved. The aluminum tape is adopted to replace a common copper wire lead, and certainly, the aluminum wire lead or a gold wire lead in packaging can be replaced, so that a welding point is firmer, the anti-vibration capability of a welding part of the pin is improved, and the electric conductivity and the heat dissipation performance of the pin body are also improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the cross-sectional structure A-A of FIG. 1;
FIG. 3 is a side view of the structure of the present invention;
FIG. 4 is a schematic perspective view of the present invention;
fig. 5 is a schematic structural diagram of another embodiment of the present invention.
Reference numbers in the figures: 1-a pin body; 11-heel; 12-foot side; 13-toe; 2-packaging the shell; 21-a substrate; 22-a chip; 23-aluminium strip.
Detailed Description
The technical solution of the present invention will be further described in detail with reference to the accompanying drawings and embodiments.
Embodiment 1, as shown in fig. 1 to 4, an integrated circuit heat dissipation type pin structure includes a pin body 1, the pin body 1 is an airfoil structure, and the airfoil structure is commonly found in an integrated circuit package. The pin body 1 comprises a heel 11, a foot side 12 and a toe 13, wherein the access end of the heel 11 is of an L-shaped structure which is deep into the top of the packaging shell 2, and arc grooves are formed in two sides of the part, exposed outside, of the heel 11 and two sides of the foot side 12. Referring to fig. 2, which is a schematic cross-sectional view of the pin, the arc grooves include a first arc groove 121 uniformly distributed on the same side of the heel 11 and the foot side 12 and a second arc groove 122 uniformly distributed on the other side, the groove bottoms of the first arc groove 121 and the second arc groove 122 are staggered, and it can also be seen that the first arc groove 121 and the second arc groove 122 are both arranged along the extending direction of the pin 1.
Embodiment 2, as shown in fig. 5, a heat dissipation type pin structure for an integrated circuit includes a pin body 1, in this embodiment, the pin body 1 is a J-shaped structure, and the J-shaped structure is widely applied in an integrated circuit package, and mainly functions to save an electronic package area and improve an electronic package density. The pin body 1 comprises a heel 11, a foot side 12 and a toe 13, wherein the access end of the heel 11 is of an L-shaped structure which is deep into the top of the packaging shell 2, and arc grooves are formed in two sides of the part, exposed outside, of the heel 11 and two sides of the foot side 12. Referring to fig. 2, which is a schematic cross-sectional view of the pin, the arc grooves include a first arc groove 121 uniformly distributed on the same side of the heel 11 and the foot side 12 and a second arc groove 122 uniformly distributed on the other side, the groove bottoms of the first arc groove 121 and the second arc groove 122 are staggered, and it can also be seen that the first arc groove 121 and the second arc groove 122 are both arranged along the extending direction of the pin 1.
In implementation, the substrate 21 is added in the package housing 2, the chip 22 is fixed on the top of the substrate 21 through an adhesive material, one end of the aluminum strip 23 is soldered on the chip 22 to form a bump, and the other end of the aluminum strip is soldered on the heel 11 of the pin body 1 to form a bump. The heat generated by the chip 22 during normal operation can be transferred to the heel 11 through the aluminum strip 23, and the package housing 2 can also transfer the received heat to the heel 11. The pin body 1 is fixed with the chip 22 through the aluminum strip 23 in a welding mode, the aluminum strip 23 has excellent conductivity, the unit area has extremely small contact resistance, the heat conduction efficiency of the pin body 1 can be improved, and therefore the heat dissipation performance of the pin is improved. The package housing 2 is generally made of plastic, the pins for packaging are generally made of copper, a layer of tin is coated on the outer surface of the pins, copper oxidation resistance can be achieved, welding of the two ends of the pin body 1 can be facilitated, an aluminum tape 23 is adopted to replace a general copper wire lead in the embodiment, and an aluminum wire lead or a gold wire lead in packaging can be replaced, so that a welding point is firmer, anti-vibration capability of a pin welding position is improved, and wire performance and heat dissipation performance of the pin body 1 are also improved.
After the heat generated by the chip 22 is transferred to the pin body 1, the arc grooves are formed on both sides of the portion exposed outside through the heel 11 and both sides of the foot side 12, so that the surface areas of both sides of the pin body 1 are increased, and heat dissipation is facilitated. The access end of the heel 11 is an L-shaped structure extending into the top of the package housing 2, and the heel 11 extends into the package housing 2 from the top of the package housing 2 for packaging, so that the length of the pin body 1 is increased, and the heat dissipation area of the pin body is increased. By increasing the surface area of the pin body 1, the heat dissipation performance of the rectangular section of the pin body 1 is improved, and the high-temperature effect of the whole integrated circuit board is reduced.
The above-mentioned embodiments further explain in detail the objects, technical solutions and advantages of the present invention, and it should be understood that the above-mentioned embodiments are only the embodiments of the present invention, and are not intended to limit the scope of the present invention, any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the scope of the present invention.

Claims (5)

1. An integrated circuit heat dissipation type pin structure, includes pin body (1), pin body (1) includes heel (11), foot side (12) and toe (13), its characterized in that: the connecting end of the heel (11) is of an L-shaped structure which is deep into the top of the packaging shell (2), and arc grooves are formed in the two sides of the part, exposed outside, of the heel (11) and the two sides of the foot side (12).
2. The heat-dissipating pin structure of claim 1, wherein: the arc grooves comprise a first arc groove (121) and a second arc groove (122), wherein the first arc groove (121) and the second arc groove (122) are uniformly distributed on the same side of the heel (11) and the foot side (12), the other side of the first arc groove (121) and the other side of the second arc groove (122) are uniformly distributed, and the groove bottoms of the first arc groove (121) and the second arc groove (122) are arranged in a staggered mode.
3. The heat-dissipating pin structure of claim 1, wherein: the pin body (1) is fixedly connected with the chip (22) through an aluminum strip (23).
4. The heat-dissipating pin structure of claim 1, wherein: the pin body (1) is of an airfoil structure.
5. The heat-dissipating pin structure of claim 1, wherein: the pin body (1) is of a J-shaped structure.
CN201921190905.4U 2019-07-26 2019-07-26 Integrated circuit heat dissipation type pin structure Active CN210535656U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201921190905.4U CN210535656U (en) 2019-07-26 2019-07-26 Integrated circuit heat dissipation type pin structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201921190905.4U CN210535656U (en) 2019-07-26 2019-07-26 Integrated circuit heat dissipation type pin structure

Publications (1)

Publication Number Publication Date
CN210535656U true CN210535656U (en) 2020-05-15

Family

ID=70599262

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201921190905.4U Active CN210535656U (en) 2019-07-26 2019-07-26 Integrated circuit heat dissipation type pin structure

Country Status (1)

Country Link
CN (1) CN210535656U (en)

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Address after: 210000 floor 13, tower C, Tengfei building, research and Innovation Park, Nanjing area, China (Jiangsu) pilot Free Trade Zone, Nanjing, Jiangsu

Patentee after: Jiangsu Changjing Technology Co.,Ltd.

Address before: 210000 room 1087, hatch Eagle building, No. 99, Tuanjie Road, yanchuang Park, Jiangbei new area, Nanjing, Jiangsu Province

Patentee before: Jiangsu Changjing Technology Co.,Ltd.