CN210518995U - Waterproof PCB circuit board - Google Patents
Waterproof PCB circuit board Download PDFInfo
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- CN210518995U CN210518995U CN201921200942.9U CN201921200942U CN210518995U CN 210518995 U CN210518995 U CN 210518995U CN 201921200942 U CN201921200942 U CN 201921200942U CN 210518995 U CN210518995 U CN 210518995U
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Abstract
The utility model discloses a waterproof PCB circuit board, including the circuit board body, the positive fixedly connected with electronic component of circuit board body, electronic component's surface is provided with the protective layer, protective layer inner chamber's bottom fixedly connected with insulating layer, and the inner chamber of protective layer and the top that is located the insulating layer are provided with the heat-resistant layer, and the inner chamber of protective layer and the top that is located the heat-resistant layer are provided with waterproof coating, and the supreme first resin waterproof layer and the second resin waterproof layer of having set gradually are followed to waterproof coating's inner chamber. The utility model discloses a setting up the cooperation of circuit board body, electronic component, protective layer, insulating layer, heat-resisting layer, waterproof coating, first resin waterproof layer and second resin waterproof layer, having solved traditional PCB circuit board, it is mostly relatively poor to be waterproof effect, when PCB circuit board place ambient humidity is great, its surface forms the water smoke easily, after water smoke is transformed into the drop of water, causes the damage to the circuit board easily to circuit board life's problem has been reduced.
Description
Technical Field
The utility model relates to a circuit board equipment technical field specifically is a waterproof PCB circuit board.
Background
The PCB is an important PCB in circuit boards, and is suitable for wide high-tech industries such as telecommunications, power supply, computers, industrial control, digital products, scientific and educational instruments, medical instruments, automobiles, aerospace defense and the like, and is suitable for the waterproof effect of most of the existing PCBs.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a waterproof PCB circuit board possesses the good advantage of water-proof effects, has solved traditional PCB circuit board, and most all water-proof effects are relatively poor, and when PCB circuit board place ambient humidity is great, its surface forms water smoke easily, after water smoke is transformed into the drop of water, causes the damage to the circuit board easily to circuit board life's problem has been reduced.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a waterproof PCB circuit board, includes the circuit board body, the positive fixedly connected with electronic component of circuit board body, electronic component's surface is provided with the protective layer, the bottom fixedly connected with insulating layer of protective layer inner chamber, the inner chamber of protective layer and the top that is located the insulating layer are provided with the heat-resistant layer, the inner chamber of protective layer and the top that is located the heat-resistant layer are provided with waterproof coating, supreme first resin waterproof layer and the second resin waterproof layer of having set gradually are followed to waterproof coating's inner chamber.
Preferably, the back of the circuit board body is fixedly connected with a first heat-conducting fin, a second heat-conducting fin and a third heat-conducting fin from top to bottom in sequence.
Preferably, the inner chamber of protective layer and the top that is located the insulating layer bond and have first adhesive linkage, the top of first adhesive linkage bonds and has the heat-resistant layer, the inner chamber of protective layer and the top that is located the heat-resistant layer bond and have the second adhesive linkage, the top of second adhesive linkage bonds and has waterproof coating, the material of first adhesive linkage and second adhesive linkage is the powerful glue.
Preferably, a vacuum layer is arranged in the inner cavity of the waterproof coating and on the top of the first resin waterproof layer.
Preferably, the first resin waterproof layer and the second resin waterproof layer have a thickness of 25 to 40 μm.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a setting up the cooperation of circuit board body, electronic component, protective layer, insulating layer, heat-resisting layer, waterproof coating, first resin waterproof layer and second resin waterproof layer, having solved traditional PCB circuit board, it is mostly relatively poor to be waterproof effect, when PCB circuit board place ambient humidity is great, its surface forms the water smoke easily, after water smoke is transformed into the drop of water, causes the damage to the circuit board easily to circuit board life's problem has been reduced.
2. The utility model discloses a first conducting strip has been set up, second conducting strip and third conducting strip, the effect of carrying out the heat dissipation has been played to circuit board body surface, avoid the circuit board body in long-time use, because of the radiating effect is relatively poor, thereby to the inside electronic component of circuit board body, cause the condition of serious damage, through first adhesive linkage and the second adhesive linkage that has set up the powerful glue material, the insulating layer has been strengthened, fastness between heat-resisting layer and the waterproof coating, the practicality of protective layer has been strengthened greatly, avoid the drop of water to cause the damage to this circuit board body, the life of circuit board body has been prolonged, the cost of maintenance in later stage has been reduced, its practicality has been strengthened.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a schematic back view of the present invention;
FIG. 3 is a schematic view of the inside of the protective layer of the present invention;
fig. 4 is an internal schematic view of the waterproof coating of the present invention.
In the figure: the circuit board comprises a circuit board body 1, electronic elements 2, a protective layer 3, a first heat conducting strip 4, a second heat conducting strip 5, a third heat conducting strip 6, an insulating layer 7, a first bonding layer 8, a heat-resistant layer 9, a second bonding layer 10, a waterproof coating 11, a first resin waterproof layer 12, a vacuum layer 13 and a second resin waterproof layer 14.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to be referred must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted", "provided", "connected", and the like are to be construed broadly, such as "connected", which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-4, a waterproof PCB comprises a PCB body 1, an electronic component 2 is fixedly connected to the front of the PCB body 1, a protective layer 3 is disposed on the surface of the electronic component 2, an insulating layer 7 is fixedly connected to the bottom of the inner cavity of the protective layer 3, a heat-resistant layer 9 is disposed in the inner cavity of the protective layer 3 and on the top of the insulating layer 7, a waterproof coating 11 is disposed in the inner cavity of the protective layer 3 and on the top of the heat-resistant layer 9, a first resin waterproof layer 12 and a second resin waterproof layer 14 are sequentially disposed in the inner cavity of the waterproof coating 11 from bottom to top, a first heat-conducting strip 4, a second heat-conducting strip 5 and a third heat-conducting strip 6 are sequentially and fixedly connected to the back of the PCB body 1 from top to bottom, a first adhesive layer 8 is bonded to the top of the insulating layer 7 in the inner cavity of the protective layer 3, a heat-resistant layer 9 is bonded to the top, the top of the second bonding layer 10 is bonded with a waterproof coating layer 11, the first bonding layer 8 and the second bonding layer 10 are both made of super glue, the inner cavity of the waterproof coating layer 11 and the top of the first resin waterproof layer 12 are provided with a vacuum layer 13, the thicknesses of the first resin waterproof layer 12 and the second resin waterproof layer 14 are both 25-40 μm, the first heat conducting fin 4, the second heat conducting fin 5 and the third heat conducting fin 6 are arranged, the effect of heat dissipation on the surface of the circuit board body 1 is achieved, the situation that electronic elements 2 in the circuit board body 1 are seriously damaged due to poor heat dissipation effect in the long-time use process of the circuit board body 1 is avoided, the firmness among the insulating layer 7, the heat-resistant layer 9 and the waterproof coating layer 11 is enhanced through the first bonding layer 8 and the second bonding layer 10 which are made of super glue, and the practicability of the protective layer 3 is greatly enhanced, avoid the drop of water to cause the damage to this circuit board body 1, prolonged circuit board body 1's life, reduced the cost of maintenance in later stage, strengthened its practicality.
During the use, through having set up protective layer 3, the effect of protecting electronic component 2 on the surface of circuit board body 1 has been strengthened, through having set up insulating layer 7, this circuit board body 1 has been strengthened, security when using, through having set up heat-resistant layer 9, the life of this circuit board body 1 under high temperature environment has been strengthened, avoid the high temperature, thereby cause the problem of damage to circuit board body 1, through having set up waterproof coating 11, first resin waterproof layer 12 and second resin waterproof layer 14, this circuit board body 1's water-proof effects has been strengthened greatly, its practicality has been strengthened.
In summary, the following steps: this waterproof PCB circuit board, through circuit board body 1, electronic component 2, protective layer 3, insulating layer 7, heat-resistant layer 9, water proof coating 11, the cooperation of first resin waterproof layer 12 and second resin waterproof layer 14, traditional PCB circuit board has been solved, mostly all the water-proof effects is relatively poor, when PCB circuit board place ambient humidity is great, its surface forms the water smoke easily, after water smoke turns into the drop of water, cause the damage to the circuit board easily, thereby circuit board life's problem has been reduced.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a waterproof PCB circuit board, includes circuit board body (1), its characterized in that: the circuit board comprises a circuit board body (1), wherein the front surface of the circuit board body is fixedly connected with an electronic element (2), the surface of the electronic element (2) is provided with a protective layer (3), the bottom fixedly connected with insulating layer (7) of the inner cavity of the protective layer (3) is provided with a heat-resistant layer (9), the top of the inner cavity of the protective layer (3) and the top of the inner cavity of the heat-resistant layer (7) are provided with a waterproof coating (11), and the inner cavity of the waterproof coating (11) is sequentially provided with a first resin waterproof layer (12) and a second resin waterproof layer (14) from bottom to top.
2. The waterproof PCB circuit board of claim 1, wherein: the back of the circuit board body (1) is fixedly connected with a first heat-conducting fin (4), a second heat-conducting fin (5) and a third heat-conducting fin (6) from top to bottom in sequence.
3. The waterproof PCB circuit board of claim 1, wherein: the inner chamber of protective layer (3) and the top that is located insulating layer (7) bond and have first adhesive linkage (8), the top of first adhesive linkage (8) bonds and has heat-resistant layer (9), the inner chamber of protective layer (3) and the top that is located heat-resistant layer (9) bond and have second adhesive linkage (10), the top of second adhesive linkage (10) bonds and has waterproof coating (11), the material of first adhesive linkage (8) and second adhesive linkage (10) is the super glue.
4. The waterproof PCB circuit board of claim 1, wherein: and a vacuum layer (13) is arranged in the inner cavity of the waterproof coating (11) and positioned at the top of the first resin waterproof layer (12).
5. The waterproof PCB circuit board of claim 1, wherein: the thickness of the first resin waterproof layer (12) and the thickness of the second resin waterproof layer (14) are both 25-40 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921200942.9U CN210518995U (en) | 2019-07-29 | 2019-07-29 | Waterproof PCB circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921200942.9U CN210518995U (en) | 2019-07-29 | 2019-07-29 | Waterproof PCB circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210518995U true CN210518995U (en) | 2020-05-12 |
Family
ID=70585860
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921200942.9U Active CN210518995U (en) | 2019-07-29 | 2019-07-29 | Waterproof PCB circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210518995U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114173487A (en) * | 2020-09-10 | 2022-03-11 | 耐世特汽车系统（苏州）有限公司 | Circuit board protection method and circuit board assembly |
-
2019
- 2019-07-29 CN CN201921200942.9U patent/CN210518995U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114173487A (en) * | 2020-09-10 | 2022-03-11 | 耐世特汽车系统（苏州）有限公司 | Circuit board protection method and circuit board assembly |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230823 Address after: No. 7 Renmin Road, Shangzhou District, Shangluo City, Shaanxi Province, 726000 Patentee after: Shangluo Traffic Automobile Operation Service Co.,Ltd. Address before: 362802 port No. 41, Lian Yan village, Feng Mei Town, Quangang District, Quanzhou, Fujian. Patentee before: Chen Songzong |