CN210490085U

CN210490085U - Semiconductor laser device

Info

Publication number: CN210490085U
Application number: CN201921577959.6U
Authority: CN
Inventors: 周少丰; 刘鹏; 陈丕新
Original assignee: Shenzhen Xinghan Laser Technology Co Ltd
Current assignee: Shenzhen Xinghan Laser Technology Co Ltd
Priority date: 2019-09-18
Filing date: 2019-09-18
Publication date: 2020-05-08
Anticipated expiration: 2029-09-18

Abstract

An embodiment of the utility model provides a semiconductor laser belongs to laser technical field. The semiconductor laser includes: the optical beam coupling structure comprises a phase retarder and a polarization coupler, the polarization coupler comprises a first incidence direction and a second incidence direction, and the phase retarder is positioned in the first incidence direction; the light emitting units comprise laser chips, fast axis collimating lenses and slow axis collimating lenses, and emergent light beams of the laser chips sequentially pass through the fast axis collimating lenses and the slow axis collimating lenses and are incident to the light beam coupling structure. The emergent light beams of the light-emitting units are respectively subjected to beam shaping treatment in the fast axis direction and the slow axis direction, and at least two light-emitting units are respectively incident to the polarization coupler along the first incident direction and the second incident direction, so that the quality of the emergent light beams of the polarization coupler is improved.

Description

Semiconductor laser device

Technical Field

The embodiment of the utility model provides a relate to laser technical field, specifically, relate to a semiconductor laser.

Background

With the progress of science and technology, the market has higher and higher requirements on the power, the beam quality and the brightness of the optical fiber coupling semiconductor laser. At present, the technical purpose of improving the beam brightness of the semiconductor laser can be achieved by coupling a plurality of laser sources.

However, coupling a plurality of laser sources increases the volume of the whole device, and the coupling arrangement of the laser sources is not reasonable, which results in poor quality of the outgoing beam, large spot area, low energy density of the spot, and the like.

SUMMERY OF THE UTILITY MODEL

The embodiment of the utility model provides a aim at providing a semiconductor laser, can solve among the prior art the coupling of a plurality of light sources and arrange unreasonablely, lead to the poor technical problem of outgoing beam quality.

The embodiment of the utility model provides an adopt following technical scheme:

a semiconductor laser comprising:

a beam coupling structure comprising a phase retarder and a polarization coupler, the polarization coupler comprising a first incident direction and a second incident direction, the phase retarder being located in the first incident direction;

at least two light-emitting units, the light-emitting unit includes laser chip, fast axis collimating lens and slow axis collimating lens, the emergent beam of laser chip passes through in proper order fast axis collimating lens with slow axis collimating lens, and incide to the beam coupling structure, wherein, partly emergent beam of light-emitting unit is through behind the phase delay piece, along first incident direction incides to polarization coupler, another part emergent beam of light-emitting unit is along second incident direction incides to polarization coupler.

Optionally, the first incident direction and the second incident direction are respectively and correspondingly provided with the same number of emergent light beams of the light emergent unit.

Optionally, the semiconductor laser further includes a first reflector, and the light beam emitted by the laser chip sequentially passes through the fast axis collimating lens and the slow axis collimating lens and is incident to the first reflector, and is incident to the light beam coupling structure after the direction of the light path is changed.

Optionally, the light emitting unit includes a beam combining reflector, a plurality of laser chips, and a plurality of fast axis collimating lenses, a plurality of slow axis collimating lenses, and a plurality of first reflectors corresponding to the plurality of laser chips one to one, respectively, and a light beam of each of the laser chips sequentially passes through one of the fast axis collimating lenses, one of the slow axis collimating lenses, and one of the first reflectors and is incident on the beam combining reflector, where the light beams of the plurality of laser chips are combined on the beam combining reflector, and are incident on the beam coupling structure after changing a direction of a light path.

Optionally, the semiconductor laser further includes an output optical fiber, and the beam coupling structure further includes a focusing lens, where the outgoing beam of the polarization coupler is focused by the focusing lens and coupled to enter the input end of the output optical fiber.

Optionally, the semiconductor laser further includes a package substrate, and the package substrate fixedly couples and packages the beam coupling structure, the at least two light emitting units, and the input end of the output optical fiber into a whole to form a package structure.

Optionally, the package base includes a substrate and a plurality of bosses disposed on the base, where each of the first mirrors is disposed on one of the bosses.

Optionally, a plurality of the bosses are distributed in a step shape.

Optionally, one of the bosses is provided with one of the laser chips, one of the fast axis collimating lenses, one of the slow axis collimating lenses, and one of the first reflecting mirrors.

Optionally, the positions of the fast axis collimating lens and the slow axis collimating lens are mutually adjustable.

Compared with the prior art, in the semiconductor laser of this embodiment, the polarization coupler includes a first incident direction and a second incident direction, the phase retarder is located in the first incident direction, a part of the outgoing light beam of the light-emitting unit passes through the phase retarder and then enters the polarization coupler along the first incident direction, and another part of the outgoing light beam of the light-emitting unit enters the polarization coupler along the second incident direction. The emergent light beams of the emergent light units are subjected to light beam shaping treatment in the fast axis direction and the slow axis direction respectively so that the emergent light beams of the emergent light units are arranged closely, at least two emergent light beams of the emergent light units are incident to the polarization coupler in the first incident direction and the second incident direction respectively, the light beams are further subjected to polarization coupling, the quality of the emergent light beams of the polarization coupler is improved, the energy density of emergent light spots is high, and the emergent light effect is good.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.

Fig. 1 is a schematic structural diagram of a semiconductor laser according to an embodiment of the present invention;

fig. 2 is a schematic view of a light emitting unit according to another embodiment of the present invention;

FIG. 3 is a perspective view of the light extraction unit shown in FIG. 1;

FIG. 4 is a perspective view of the beam coupling structure shown in FIG. 1;

fig. 5 is a light emitting effect diagram shown in fig. 1.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described in more detail with reference to the accompanying drawings and specific embodiments. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", and the like as used herein are used in the description to indicate orientations and positional relationships based on the orientations and positional relationships shown in the drawings, and are used only for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1, an embodiment of the present invention provides a semiconductor laser 100, where the semiconductor laser 100 includes at least two light emitting units 10, a beam coupling structure 20, and an output optical fiber 30. The light emitting unit 10 is configured to emit a light beam, the light beam coupling structure 20 is configured to couple the light beam and emit the light beam into the input end of the output optical fiber 30, and the output optical fiber 30 is configured to guide and emit the light beam and apply the light beam to a target object. In this embodiment, the semiconductor laser 100 further includes a package substrate 40, and the package substrate 40 fixedly couples and packages the input ends of the at least two light emitting units 10, the beam coupling structure 20, and the output optical fiber 30 into a whole to form a package structure.

The at least two light emitting units 10 are arranged in an array, and emergent light between the at least two light emitting units 10 is not mutually interfered. For example, the same number of outgoing light beams of the light-emitting unit 10 are respectively arranged in two different incident directions of the light beam coupling structure 20. In this embodiment, taking four light emitting units 10 as an example, two light emitting units 10 are respectively disposed in two different incident directions of the light beam coupling structure 20, and two light emitting units 10 located in the same incident direction of the light beam coupling structure 20 are disposed in parallel and transversely, and the emitted light between the two light emitting units 10 is not mutually coherent. Optionally, in the spatial layout, two light emitting units 10 are respectively disposed on two opposite sides of the light beam coupling structure 20, and two light emitting units 10 located on the same side of the light beam coupling structure 20 are arranged in parallel and transversely, that is, four light emitting units 10 are distributed in a rectangular shape.

Referring to fig. 2, in other embodiments, three light emitting units 10 are disposed in the same incident direction of the beam-coupling structure 20. It is understood that, based on practical requirements, one skilled in the art can arrange the light emitting unit 10 in a plurality, and not limited to the number shown in fig. 1 and fig. 2.

Referring to fig. 1 and 3, the light emitting unit 10 includes a laser chip 11, a fast axis collimating lens 12 and a slow axis collimating lens 13. The laser chip 11 is used for being excited to emit laser beams when in a power-on state. The light beam emitted from the laser chip 11 sequentially passes through the fast axis collimating lens 12 and the slow axis collimating lens 13 and is incident on the light beam coupling structure 20. It is understood that the positions of the fast axis collimating lens 12 and the slow axis collimating lens 13 are interchangeable, for example, the light beam emitted from the laser chip 11 passes through the slow axis collimating lens 13 and the fast axis collimating lens 12 in sequence and is incident on the beam coupling structure 20. In this embodiment, the outgoing light beam of the laser chip 11 is respectively subjected to beam shaping processing by the fast axis collimating lens 12 and the slow axis collimating lens 13, a part of the light energy in the light beam is concentrated in the fast axis direction under the action of the fast axis collimating lens 12, and another part of the light energy in the light beam is concentrated in the slow axis direction under the action of the slow axis collimating lens 13, so that the energy of the light beam is closer in spatial layout.

Specifically, the light exit unit 10 further includes a first reflector 14. In this embodiment, the light beam emitted by the laser chip 11 sequentially passes through the fast axis collimating lens 12 and the slow axis collimating lens 13, and is incident to the first reflecting mirror 14, and under the action of the first reflecting mirror 14, the light path direction is changed and is incident to the light beam coupling structure 20.

In this embodiment, the light emitting unit 10 includes a beam combining reflector 15, a plurality of laser chips 11, and a plurality of fast axis collimating lenses corresponding to the laser chips 11 one by one respectively

12. A plurality of slow axis collimating lenses 13 and a plurality of first reflecting mirrors 14, that is, each laser chip 11 corresponds to one of the fast axis collimating lenses 12, one of the slow axis collimating lenses 13 and one of the first reflecting mirrors 14, and forms an optical path structure, and the emission beam of each laser chip 11 passes through one of the fast axis collimating lenses 12, one of the slow axis collimating lenses 13 and one of the first reflecting mirrors 14 in sequence and is incident on the beam combining reflecting mirror 15. Wherein the emission beams of a plurality of the laser chips 11 are combined at the beam combining mirror 15, and the optical path direction is changed to be incident to the beam coupling structure 20.

It can be understood that, according to actual needs, a person skilled in the art can set a fixed number of the laser chips 11 in the light exit unit 10, and light beams emitted by the fixed number of the laser chips 11 are used as light sources and enter the light beam coupling structure 20.

As shown in fig. 3, the package base 40 includes a substrate 42 and a plurality of bosses 41, the plurality of bosses 41 are disposed on the substrate 42, and the plurality of bosses 41 are distributed in a step shape, wherein the substrate 42 is used for supporting and fixing the plurality of bosses 41. Optionally, a plurality of the bosses 41 are arranged along a straight line and distributed in a step shape; the plurality of bosses 41 are integrally formed with the base 42. The beam combining reflector 15 is disposed on the base, and is configured to receive and reflect the plurality of light beams reflected by the plurality of first reflectors 14. Each of the first reflectors 14 is correspondingly disposed on one of the bosses 41, so that the light beams reflected by the first reflectors 14 do not interfere with each other, and the light beams are incident to the beam combining reflector 15 after the light path direction is changed. Optionally, one of the bosses 41 is provided with one of the laser chips 11, one of the fast axis collimating lenses 12, one of the slow axis collimating lenses 13, and one of the first reflecting mirrors 14.

Referring to fig. 1 and 4, the beam coupling structure 20 includes a polarization coupler 21, a phase retarder 22, a second reflector 23, and a focusing lens 24, the polarization coupler 21 includes a first incident direction 211 and a second incident direction 212, wherein the first incident direction 211 and the second incident direction 212 are different. The retardation plate 22 is located in the first incident direction 211, the second mirror 23 is located in the second incident direction 212, and the focusing lens 24 is located in the exit direction of the polarization coupler 21. Optionally, the phase retarder 22 is a half-wave plate.

At least two outgoing light beams of the light-emitting unit 10 are incident on the light beam coupling structure 20, wherein a part of the outgoing light beams of the light-emitting unit 10 is incident on the polarization coupler 21 along the first incident direction 211 after being incident on the phase retarder 22, and another part of the outgoing light beams of the light-emitting unit 10 is incident on the polarization coupler 21 along the second incident direction 212 after the optical path direction of the outgoing light beams is changed by the second reflector 23. The light beam is coupled and incident to the focusing lens 24 under the polarization coupling effect of the polarization coupler 21, and the light beam focused by the focusing lens 24 is coupled and incident to the input end of the output optical fiber 30, thereby forming a finished optical path system.

In this embodiment, the outgoing light beams of two of the light-emitting units 10 enter the phase retardation plate 22 and then enter the polarization coupler 21 along the first incident direction 211, and the outgoing light beams of the other two of the light-emitting units 10 enter the polarization coupler 21 along the second incident direction 212 after the optical path direction of the outgoing light beams is changed by the second reflecting mirror 23. Referring to fig. 5, fig. 5 is a diagram of the light output effect of the semiconductor laser 100, wherein the light spot 50 emitted through the focusing lens 24 is shown. The light spot 50 is correspondingly divided into a first area 51 and a second area 52, wherein the first area 51 and the second area 52 respectively correspond to light beams in two different incident directions of the polarization coupler 21, that is: taking the first area 51 as an example, the outgoing light beams of the two light outgoing units 10 enter the phase retardation plate 22, then enter the polarization coupler 21 along the first incident direction 211, and then are focused by the focusing lens after being coupled by the polarization coupler 21, so as to form a polarized light beam 511 in the diagram of the light spot 50.

In this embodiment, the same number of light emitting units 10 are respectively disposed in two different incident directions (the first incident direction 211 and the second incident direction 212) of the polarization coupler 21, light beams emitted by the light emitting units 10 are incident on the polarization coupler 21 under the beam shaping process of the fast axis collimating lens 12 and the slow axis collimating lens 13, and are polarization-coupled to emit polarized light beams 511 under the action of the polarization coupler 21, and the energy of the light beams is distributed more tightly in the fast axis direction and the slow axis direction, that is, the emitted light of the plurality of laser chips 11 is arranged tightly, so that the technical effect of tightly arranging the polarized light beams 511 in the area of the light spots 50 is achieved, and the energy density of the light spots 50 is high.

In summary, the technical solution of the present application includes, but is not limited to, the following advantages:

in the semiconductor laser 100 of this embodiment, the polarization coupler 21 includes a first incident direction 211 and a second incident direction 212, the phase retarder 22 is located in the first incident direction 211, a part of the outgoing light beam of the light-emitting unit 10 passes through the phase retarder 22 and then enters the polarization coupler 21 along the first incident direction 211, and another part of the outgoing light beam of the light-emitting unit 10 enters the polarization coupler 21 along the second incident direction 212. That is, the emergent light beams of the light-emitting unit 10 are respectively subjected to beam shaping in the fast axis direction and the slow axis direction to enable the emergent light beams of the light-emitting unit 10 to be closely arranged, and the emergent light beams of at least two light-emitting units are respectively incident to the polarization coupler 21 along the first incident direction 211 and the second incident direction 212, and are further subjected to polarization coupling, so that the quality of the emergent light beams of the polarization coupler 21 is improved, and the emergent light spots 50 have high energy density and good light-emitting effect.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments can be combined, steps can be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.

Claims

1. A semiconductor laser, comprising:

2. The semiconductor laser according to claim 1, wherein the first incident direction and the second incident direction are respectively provided with the same number of the outgoing beams of the light outgoing unit.

3. The semiconductor laser as claimed in claim 1, further comprising a first reflector, wherein the light beam emitted from the laser chip sequentially passes through the fast axis collimating lens and the slow axis collimating lens, and is incident on the first reflector, and after the light path direction is changed, the light beam is incident on the beam coupling structure.

4. The semiconductor laser as claimed in claim 3, wherein the light-emitting unit comprises a beam combining reflector, a plurality of the laser chips, and a plurality of the fast axis collimating lenses, a plurality of the slow axis collimating lenses and a plurality of the first reflectors corresponding to the plurality of the laser chips, respectively, and the emission beam of each of the laser chips passes through one of the fast axis collimating lenses, one of the slow axis collimating lenses and one of the first reflectors in sequence and is incident on the beam combining reflector, wherein the emission beams of the plurality of the laser chips are combined on the beam combining reflector and are incident on the beam coupling structure after the direction of the light path is changed.

5. The semiconductor laser of claim 4, wherein the semiconductor laser further comprises an output fiber, and wherein the beam coupling structure further comprises a focusing lens, and wherein the output beam of the polarization coupler is focused by the focusing lens and coupled into the input end of the output fiber.

6. The semiconductor laser as claimed in claim 5 further comprising a packaging substrate, wherein the packaging substrate fixedly couples and packages the beam coupling structure, the at least two light output units and the input end of the output optical fiber together to form a package structure.

7. A semiconductor laser as claimed in claim 6 wherein the package body comprises a substrate and a plurality of bosses disposed on the substrate, wherein each of the first mirrors is disposed on a corresponding one of the bosses.

8. A semiconductor laser as claimed in claim 7 wherein a plurality of said mesas are stepped.

9. A semiconductor laser as claimed in claim 7 wherein one of said mesas is provided with one of said laser chip, a fast axis collimating lens, a slow axis collimating lens and a first mirror.

10. A semiconductor laser as claimed in claim 1 wherein the position between the fast axis collimating lens and the slow axis collimating lens is adjustable relative to each other.