CN210469852U - Ceramic-based circuit board with heat dissipation air duct - Google Patents
Ceramic-based circuit board with heat dissipation air duct Download PDFInfo
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- CN210469852U CN210469852U CN201921056427.8U CN201921056427U CN210469852U CN 210469852 U CN210469852 U CN 210469852U CN 201921056427 U CN201921056427 U CN 201921056427U CN 210469852 U CN210469852 U CN 210469852U
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Abstract
The utility model discloses a ceramic base circuit board with heat dissipation ventiduct, including the ceramic base circuit board, ceramic base circuit board top fixedly connected with bottom covers has the heat dissipation ventilating board on heat conduction silicone grease layer, the heat dissipation ventilating board sets up to the cavity, the air intake has been seted up to heat dissipation ventilating board one side, a plurality of top radiating blocks of heat dissipation ventilating board top fixedly connected with, the venthole has been seted up at top radiating block top, the top radiating block sets up to the cavity, top radiating block intercommunication heat dissipation ventilating board, top radiating block perpendicular to heat dissipation ventilating board has solved ceramic base circuit board and can only dispel the heat by oneself, does not possess the heat dissipation ventiduct, and the radiating effect is poor, and the easy conflagration that produces is dangerous, also influences the component life-span.
Description
Technical Field
The utility model relates to a ceramic base circuit board technical field specifically is a ceramic base circuit board with heat dissipation air channel.
Background
With the gradual deepening of electronic technology in each application field, the high integration of circuit boards becomes a necessary trend, the high integration packaging module requires a good heat dissipation bearing system, and the disadvantages of the traditional circuit boards FR-4 and CEM-3 in TC (thermal conductivity coefficient) become a bottleneck restricting the development of electronic technology. In recent years, the LED industry has been developed rapidly, and higher requirements are also put on the TC index of the circuit board. In the field of high-power LED illumination, materials with good heat dissipation performance such as metal and ceramic are often adopted to prepare a circuit substrate, the heat conductivity coefficient of the existing high-heat-conductivity aluminum substrate is generally 1-4W/M.K, and the heat conductivity coefficient of the ceramic substrate can reach about 220W/M.K according to different preparation methods and material formulas. The preparation methods of the traditional ceramic substrate can be divided into four categories of HTCC (high temperature co-fired ceramic), LTCC (high temperature co-fired ceramic), DBC (direct fired ceramic) and DPC (low temperature co-fired ceramic), wherein the preparation method of the HTCC (high temperature co-fired ceramic) needs a temperature of more than 1300 ℃, but is influenced by electrode selection, the preparation cost is quite high, the preparation method of the LTCC (low temperature co-fired ceramic) needs a calcination process of about 850 ℃, but the prepared circuit precision is poor, the heat conductivity coefficient of a finished product is low, the preparation method of the DBC requires that an alloy is formed between a copper foil and ceramic, and the calcination temperature needs to be strictly controlled within a temperature range.
In the prior art, the ceramic-based circuit board can only dissipate heat by itself.
Therefore, the ceramic-based circuit board still has the following obvious defects in the use process, the ceramic-based circuit board can only automatically dissipate heat, does not have a heat dissipation ventilation duct, has poor heat dissipation effect, is easy to generate fire hazard, influences the service life of elements and is very inconvenient.
Therefore, the utility model provides a ceramic base circuit board with heat dissipation air channel.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a ceramic base circuit board with heat dissipation air channel to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a ceramic base circuit board with heat dissipation air channel, includes ceramic base circuit board, ceramic base circuit board top fixedly connected with bottom covers has the heat dissipation air flap of heat conduction silicone grease layer, the heat dissipation air flap sets up to the cavity, the air intake has been seted up to heat dissipation air flap one side, a plurality of top radiating blocks of heat dissipation air flap top fixedly connected with, the venthole has been seted up at top radiating block top, the top radiating block sets up to the cavity, top radiating block intercommunication heat dissipation air flap, top radiating block perpendicular to heat dissipation air flap.
Through adopting above-mentioned technical scheme, in the use, the hot-air in the heat dissipation ventilating board can rise by oneself, and the air passes through in the air intake gets into the heat dissipation ventilating board around the while, forms the wind channel, has solved ceramic substrate circuit board and can only dispel the heat by oneself, does not possess the heat dissipation ventilating duct, and the radiating effect is poor, easily produces the conflagration danger, also influences the component life-span, very inconvenient problem.
Preferably, ceramic base circuit board top threaded connection has the fitting bolt, the fitting bolt lateral wall rotates and is connected with the mounting panel that pushes down, the fitting bolt runs through the mounting panel that pushes down, push down mounting panel bottom and heat dissipation ventilation board top swing joint, the heat dissipation ventilation board is only fixed on the ceramic base circuit board through the mounting panel that pushes down.
Through adopting above-mentioned technical scheme, through setting up the ventilation board that dispels the heat into can dismantling for it changes the maintenance more.
Preferably, one side of the air inlet, which is far away from the heat dissipation ventilating plate, is fixedly connected with a filter screen, and the filter screen is parallel to the heat dissipation ventilating plate.
Through adopting above-mentioned technical scheme, through setting up the filter screen, prevent to advance soil in the heat dissipation ventilating board.
Compared with the prior art, the beneficial effects of the utility model are that: in the use, the hot-air in the heat dissipation ventilating board can rise by oneself, simultaneously the air passes through in the air intake gets into the heat dissipation ventilating board on every side, form the wind channel, it can only dispel the heat by oneself to have solved ceramic base circuit board, do not possess the heat dissipation ventilating duct, the radiating effect is poor, easily produce the conflagration danger, also influence the component life-span, very inconvenient problem, through setting up the heat dissipation ventilating board to dismantle, make it change the maintenance, through setting up the filter screen, prevent to advance soil in the heat dissipation ventilating board, the practicality is very strong, be worth very promoting.
Drawings
Fig. 1 is a schematic external structural view of the present invention;
fig. 2 is a schematic side structure diagram of the present invention.
In the figure: 1. a ceramic-based circuit board; 2. a heat dissipating and ventilating plate; 3. pressing down the mounting plate; 4. installing a bolt; 5. a filter screen; 6. an air inlet; 7. a top heat sink; 8. and an air outlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1 to 2, the present invention provides a technical solution:
the utility model provides a ceramic base circuit board with heat dissipation air channel, including ceramic base circuit board 1, 1 top fixedly connected with bottom of ceramic base circuit board covers has heat dissipation ventilating board 2 of heat conduction silicone grease layer, heat dissipation ventilating board 2 sets up to the cavity, air intake 6 has been seted up to 2 one sides of heat dissipation ventilating board, 2 a plurality of top radiating block 7 of top fixedly connected with of heat dissipation ventilating board, venthole 8 has been seted up at 7 tops of top radiating block, top radiating block 7 sets up to the cavity, 7 intercommunication heat dissipation ventilating boards 2 of top radiating block, 7 perpendicular to heat dissipation ventilating boards 2 of top radiating block.
1 top threaded connection of ceramic base circuit board has the erection bolt 4, 4 lateral walls of erection bolt rotate and are connected with mounting panel 3 that pushes down, 4 of erection bolt run through mounting panel 3 that pushes down, 3 bottoms of mounting panel and the 2 top swing joint of heat dissipation ventilating board push down, through setting up heat dissipation ventilating board 2 into dismantling, make it change the maintenance more, heat dissipation ventilating board 2 only fixes on ceramic base circuit board 1 through mounting panel 3 that pushes down, air intake 6 is kept away from 2 one side fixedly connected with filter screen 5 of heat dissipation ventilating board, through setting up filter screen 5, prevent to advance soil in the heat dissipation ventilating board 2, filter screen 5 is on a parallel with heat dissipation ventilating board 2.
The working principle is as follows: in use, the hot-air in the heat dissipation ventilating board 2 can rise by oneself, simultaneously the air passes through in the air intake 6 gets into heat dissipation ventilating board 2 on every side, form the wind channel, it can only dispel the heat by oneself to have solved the ceramic base circuit board, do not possess the heat dissipation ventilating board, the radiating effect is poor, easily produce the conflagration danger, also influence the component life-span, very inconvenient problem, through setting up heat dissipation ventilating board 2 to dismantling, make it change the maintenance, through setting up filter screen 5, prevent to advance soil in the heat dissipation ventilating board 2, the practicality is very strong, be worth promoting very much.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (3)
1. The utility model provides a ceramic base circuit board with heat dissipation air duct, includes ceramic base circuit board (1), its characterized in that: ceramic base circuit board (1) top fixedly connected with bottom covers has heat dissipation ventilating board (2) of heat conduction silicone grease layer, heat dissipation ventilating board (2) set up to the cavity, air intake (6) have been seted up to heat dissipation ventilating board (2) one side, a plurality of top radiating block (7) of heat dissipation ventilating board (2) top fixedly connected with, venthole (8) have been seted up at top radiating block (7) top, top radiating block (7) set up to the cavity, top radiating block (7) intercommunication heat dissipation ventilating board (2), top radiating block (7) perpendicular to heat dissipation ventilating board (2).
2. The ceramic-based circuit board with the heat dissipation air duct of claim 1, wherein: ceramic matrix circuit board (1) top threaded connection has mounting bolt (4), mounting bolt (4) lateral wall rotates and is connected with mounting panel (3) that pushes down, mounting bolt (4) run through mounting panel (3) that pushes down, mounting panel (3) bottom and heat dissipation ventilating board (2) top swing joint push down, heat dissipation ventilating board (2) are only fixed on ceramic matrix circuit board (1) through mounting panel (3) that pushes down.
3. The ceramic-based circuit board with the heat dissipation air duct of claim 1, wherein: air intake (6) keep away from heat dissipation ventilating board (2) one side fixedly connected with filter screen (5), filter screen (5) are on a parallel with heat dissipation ventilating board (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921056427.8U CN210469852U (en) | 2019-07-08 | 2019-07-08 | Ceramic-based circuit board with heat dissipation air duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921056427.8U CN210469852U (en) | 2019-07-08 | 2019-07-08 | Ceramic-based circuit board with heat dissipation air duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210469852U true CN210469852U (en) | 2020-05-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201921056427.8U Active CN210469852U (en) | 2019-07-08 | 2019-07-08 | Ceramic-based circuit board with heat dissipation air duct |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
-
2019
- 2019-07-08 CN CN201921056427.8U patent/CN210469852U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112074178A (en) * | 2020-09-29 | 2020-12-11 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
| CN112074178B (en) * | 2020-09-29 | 2022-07-12 | 绍兴上虞锴达电子有限公司 | Durable type heat dissipation circuit board |
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