CN215222577U

CN215222577U - Circuit board with heat radiation structure

Info

Publication number: CN215222577U
Application number: CN202120421475.3U
Authority: CN
Inventors: 蔡凯健
Original assignee: Guizhou Feinuo Electronic Technology Co ltd
Current assignee: Guizhou Feinuo Electronic Technology Co ltd
Priority date: 2021-02-25
Filing date: 2021-02-25
Publication date: 2021-12-17
Anticipated expiration: 2031-02-25

Abstract

The utility model discloses a circuit board that possesses heat radiation structure, concretely relates to circuit board technical field, comprising a base plate, the both sides fixedly connected with pillar at bottom plate top, the top fixedly connected with circuit board of pillar, just the top of circuit board is equipped with a plurality of electronic components, the inside joint of bottom plate has kelly and pothook, just the top fixed connection of pothook is in the bottom of kelly. The utility model discloses because of self characteristic, realize the heat dissipation by oneself, need not the manual work and open or close, labour saving and time saving, the heat is through heat conduction transmission layer upon layer, greatly increased the heat loss and run off, improved the effect and the efficiency of heat dissipation cooling, reduced because of the influence that the temperature risees and cause the circuit board, the circuit board long-time work of being convenient for, when satisfying the heat dissipation, still conveniently dismantle and maintain, flexibility and practicality are stronger, have strengthened circulation of air and heat exchange, have improved the radiating effect.

Description

Circuit board with heat radiation structure

Technical Field

The utility model relates to a circuit board technical field, more specifically say, the utility model relates to a circuit board that possesses heat radiation structure.

Background

In recent years, as electronic products are miniaturized and digitalized, circuit boards are also high in density and precision, and heat dissipation is particularly important.

But when in actual use, electronic components can produce a large amount of heats at the during operation, because the high integration and the miniaturization of circuit board, the radiating effect of most circuit boards is general, and radiating rate and efficiency are general, cause the damage to components and parts etc. easily, and often need artifical external intervention to cool down, can not carry out the heat dissipation by oneself well, waste time and energy, be not convenient for maintenance and change, and work for a long time, the heat dissipation untimely leads to easily because of the temperature risees the influence that causes the circuit board, influence work efficiency, reduce the life of circuit board.

SUMMERY OF THE UTILITY MODEL

In order to overcome the above-mentioned defects in the prior art, the embodiments of the present invention provide a circuit board with a heat dissipation structure to solve the problems in the prior art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a circuit board that possesses heat radiation structure, includes the bottom plate, the both sides fixedly connected with pillar at bottom plate top, the top fixedly connected with circuit board of pillar, just the top of circuit board is equipped with a plurality of electronic components, the inside joint of bottom plate has kelly and pothook, just the top fixed connection of pothook is in the bottom of kelly, the top fixedly connected with fin of kelly, just the top of fin is equipped with a plurality of heat conduction pieces, the bottom fixedly connected with heat conduction spring of heat conduction piece inner wall, just the inside of heat conduction piece is worn to locate by heat conduction spring's the other end, heat conduction spring's top fixedly connected with aluminium piece, just the top swing joint of aluminium piece is in the bottom of circuit board.

Further, one side that the fin was kept away from to the pillar is equipped with the heat dissipation strip, just the heat dissipation strip is located between bottom plate and the circuit board, the opposite side fixedly connected with aluminium package piece of heat dissipation strip, just the surface swing joint of aluminium package piece is on the surface of circuit board and bottom plate, one side fixedly connected with connecting block and a plurality of fixed block that the heat dissipation strip was kept away from to the aluminium package piece.

Furthermore, an auxiliary block is arranged on one side of the fixing block, clamping teeth are fixedly connected to one side, close to the fixing block, of the auxiliary block, fixed teeth are fixedly connected to one side, close to the clamping teeth, of the fixing block, and the fixed teeth are meshed with the surfaces of the clamping teeth.

Furthermore, the inside threaded connection of supplementary piece has the connecting rod, one side swing joint of supplementary piece inner wall has the spring, just the surface of connecting rod cup joints in the inside of spring, the one end fixedly connected with of connecting rod rotates the handle, just the inside of aluminium package piece, circuit board and bottom plate is worn to locate by the other end of connecting rod.

Furthermore, a plurality of radiating holes are formed in the bottom plate and the circuit board, and the radiating holes are arranged at equal intervals.

Furthermore, symmetrical ventilation holes are formed in the two sides of the bottom plate.

Furthermore, the inside aluminium strip that wears to be equipped with in both sides of circuit board, just the inside in bottom plate and ventilation hole is worn to locate by the bottom of aluminium strip.

The utility model discloses a technological effect and advantage:

1. compared with the prior art, through setting up the fin, aluminium piece and heat conduction piece etc, through self characteristic, thereby realize the heat dissipation by oneself, need not the manual work and open or close, time saving and labor saving, the radiating effect of circuit board has been strengthened, can cool down the heat dissipation that the circuit board produced at the during operation, the demand of the long-time work of circuit board has been satisfied, the damage to circuit board and other components and parts has been reduced, thereby life has been prolonged, work efficiency has been improved, the aluminium piece, heat conduction spring and heat conduction piece etc. transmit and the loss layer upon layer the heat, the radiating effect is improved.

2. Compared with the prior art, through setting up the heat dissipation strip, aluminium package piece etc., the heat dispersion of circuit board has further been strengthened, the temperature of circuit board has been reduced, with combined action such as fin, realize from inside to outside radiating process, the heat is through heat conduction transmission layer upon layer, greatly increased the heat loss and run off, the effect and the efficiency of heat dissipation cooling have been improved, the influence that causes the circuit board because of the temperature risees has been reduced, be convenient for circuit board long-time work, set up the connecting rod, turning handle and fixed block etc., not only when satisfying the heat dissipation, still convenient dismantlement and maintenance, flexibility and practicality are stronger, set up louvre and ventilation hole, the scope of device with air contact has been enlarged, circulation of air and heat exchange have been strengthened, can effectively discharge the heat dissipation with the heat, further improve the radiating effect.

Drawings

Fig. 1 is a schematic view of the overall structure of the present invention.

Fig. 2 is a schematic diagram of the local enlarged structure at a position of the present invention.

Fig. 3 is a schematic view of the sectional structure of the heat-conducting block of the present invention.

Fig. 4 is a schematic diagram of the local enlarged structure at the position B of the present invention.

Fig. 5 is a schematic diagram of the local enlarged structure at the position C of the present invention.

The reference signs are: 1. a base plate; 2. a pillar; 3. a circuit board; 4. an electronic component; 5. a clamping rod; 6. a hook; 7. a heat sink; 8. a heat conducting block; 9. a heat conductive spring; 10. an aluminum block; 11. a heat dissipating strip; 12. aluminum clad sheet; 13. connecting blocks; 14. a fixed block; 15. an auxiliary block; 16. clamping teeth; 17. fixing teeth; 18. a connecting rod; 19. a spring; 20. rotating the handle; 21. heat dissipation holes; 22. a vent hole; 23. and (3) aluminum strips.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

1-5 show a circuit board that possesses heat radiation structure, including bottom plate 1, the both sides fixedly connected with pillar 2 at bottom plate 1 top, the top fixedly connected with circuit board 3 of pillar 2, and the top of circuit board 3 is equipped with a plurality of electronic components 4, the inside joint of bottom plate 1 has kelly 5 and pothook 6, and the top fixed connection of pothook 6 is in the bottom of kelly 5, the top fixedly connected with fin 7 of kelly 5, and the top of fin 7 is equipped with a plurality of heat conduction piece 8, the bottom fixedly connected with heat conduction spring 9 of the 8 inner walls of heat conduction piece, and the other end of heat conduction spring 9 wears to locate the inside of heat conduction piece 8, the top fixedly connected with aluminium pig 10 of heat conduction spring 9, and the top swing joint of aluminium pig 10 is in the bottom of circuit board 3.

In a preferred embodiment, pillar 2 is equipped with heat dissipation strip 11 in the one side of keeping away from fin 7, and heat dissipation strip 11 is located between bottom plate 1 and circuit board 3, the opposite side fixedly connected with aluminium package piece 12 of heat dissipation strip 11, and the surface swing joint of aluminium package piece 12 is on the surface of circuit board 3 and bottom plate 1, aluminium package piece 12 keeps away from one side fixedly connected with connecting block 13 and a plurality of fixed block 14 of heat dissipation strip 11, so as to pass through self characteristic, thereby realize self-propelled heat dissipation, need not artifical the opening or closing, time saving and labor saving, the radiating effect of circuit board 3 has been strengthened, can cool down the heat dissipation that circuit board 3 produced at the during operation, the long-time demand of working of circuit board 3 has been satisfied, the damage to circuit board 3 and other components has been reduced, thereby service life is prolonged, and work efficiency is improved.

In a preferred embodiment, an auxiliary block 15 is disposed on one side of the fixed block 14, a latch 16 is fixedly connected to one side of the auxiliary block 15 close to the fixed block 14, a fixed tooth 17 is fixedly connected to one side of the fixed block 14 close to the latch 16, and the fixed tooth 17 is engaged with the surface of the latch 16, so that the stability of the device is enhanced, and the operation of the circuit board 3 and the electronic component 4 is facilitated.

In a preferred embodiment, the internal thread of the auxiliary block 15 is connected with a connecting rod 18, one side of the inner wall of the auxiliary block 15 is movably connected with a spring 19, the surface of the connecting rod 18 is sleeved inside the spring 19, one end of the connecting rod 18 is fixedly connected with a rotating handle 20, and the other end of the connecting rod 18 penetrates through the aluminum-clad sheet 12, the circuit board 3 and the bottom plate 1, so that the heat dissipation is satisfied, the disassembly and the maintenance are convenient, the flexibility and the practicability are strong, and the operation is simple.

In a preferred embodiment, a plurality of heat dissipation holes 21 are formed in the bottom plate 1 and the circuit board 3, and the heat dissipation holes 21 are equidistantly arranged, so that the contact range between the circuit board 3 and the bottom plate 1 and the air is enlarged, the air circulation and the heat exchange are enhanced, and the heat can be effectively discharged and dissipated.

In a preferred embodiment, the bottom plate 1 is provided with symmetrical ventilation holes 22 inside on both sides, so as to increase the contact area of the bottom plate 1 and air, and further improve the heat dissipation effect.

In a preferred embodiment, the inside aluminium strip 23 that wears to be equipped with in both sides of circuit board 3, and the bottom of aluminium strip 23 wears to locate bottom plate 1 and the inside of ventilation hole 22 to further strengthened the heat dispersion of circuit board 3, with combined action such as fin 7, the heat is through heat conduction transmission layer upon layer, greatly increased the heat loss and run off, improved the effect and the efficiency of heat dissipation cooling, reduced because of the influence that the temperature risees and cause circuit board 3, be convenient for circuit board 3 long-time work.

The utility model discloses the theory of operation: when the bottom plate 1, the circuit board 3 and the electronic components 4 on the circuit board work, part of the heat generated by the bottom plate 1 is ventilated, exchanged and radiated through air, the radiating holes 21 and the ventilating holes 22, and the other part of the heat is transmitted to the radiating fins 7 through the aluminum block 10, the heat conducting spring 9 and the heat conducting block 8 to be cooled and radiated, the heat is reduced and radiated through layer-by-layer transmission, the aluminum strips 23 transmit part of the heat on the circuit board 3 and the bottom plate 1 to the air from two ends and surfaces, the other part of the heat is transmitted to the radiating fins 7 to be radiated, meanwhile, the aluminum wrapping sheets 12 also conduct the heat to the air and the radiating strips 11, the heat is reduced through layer-by-layer transmission, the heat loss and the cooling are increased, thereby the effective heat radiation and the cooling are carried out on the circuit board 3 and the like, the normal work is ensured, the range of contact with the air is expanded through the pillars 2, the radiating holes 21 and the ventilating holes 22, and the air circulation and the heat exchange are enhanced, the driving connecting rod 18 and the aluminum clad sheet 12 can be separated from or connected with the circuit board 3 and the bottom plate 1 by applying a certain force to the rotating handle 20, so that the heat dissipation is realized, and the disassembly and the maintenance are convenient.

The points to be finally explained are: first, in the description of the present application, it should be noted that, unless otherwise specified and limited, the terms "mounted," "connected," and "connected" should be understood broadly, and may be a mechanical connection or an electrical connection, or a communication between two elements, and may be a direct connection, and "upper," "lower," "left," and "right" are only used to indicate a relative positional relationship, and when the absolute position of the object to be described is changed, the relative positional relationship may be changed;

secondly, the method comprises the following steps: in the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are referred to, and other structures can refer to the common design, and under the condition of no conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

and finally: the above description is only for the preferred embodiment of the present invention and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. The utility model provides a circuit board that possesses heat radiation structure, includes bottom plate (1), its characterized in that: the two sides of the top of the bottom plate (1) are fixedly connected with supporting columns (2), the top of each supporting column (2) is fixedly connected with a circuit board (3), a plurality of electronic components (4) are arranged at the top of the circuit board (3), a clamping rod (5) and a clamping hook (6) are clamped inside the bottom plate (1), the top of the clamping hook (6) is fixedly connected with the bottom of the clamping rod (5), the top of the clamping rod (5) is fixedly connected with a radiating fin (7), a plurality of heat conducting blocks (8) are arranged at the top of the radiating fin (7), heat conducting springs (9) are fixedly connected with the bottoms of the inner walls of the heat conducting blocks (8), the other end of the heat conduction spring (9) is arranged in the heat conduction block (8) in a penetrating way, the top of the heat conduction spring (9) is fixedly connected with an aluminum block (10), and the top of the aluminum block (10) is movably connected to the bottom of the circuit board (3).

2. The circuit board with a heat dissipation structure of claim 1, wherein: one side that fin (7) were kept away from in pillar (2) is equipped with heat dissipation strip (11), just heat dissipation strip (11) are located between bottom plate (1) and circuit board (3), the opposite side fixedly connected with aluminium package piece (12) of heat dissipation strip (11), just the surface swing joint of aluminium package piece (12) is on the surface of circuit board (3) and bottom plate (1), one side fixedly connected with connecting block (13) and a plurality of fixed block (14) of heat dissipation strip (11) are kept away from in aluminium package piece (12).

3. The circuit board with a heat dissipation structure of claim 2, wherein: an auxiliary block (15) is arranged on one side of the fixed block (14), clamping teeth (16) are fixedly connected to one side, close to the fixed block (14), of the auxiliary block (15), fixed teeth (17) are fixedly connected to one side, close to the clamping teeth (16), of the fixed block (14), and the fixed teeth (17) are meshed with the surfaces of the clamping teeth (16) and connected with each other.

4. The circuit board with a heat dissipation structure of claim 3, wherein: the inside threaded connection of supplementary piece (15) has connecting rod (18), one side swing joint of supplementary piece (15) inner wall has spring (19), just the inside at spring (19) is cup jointed on the surface of connecting rod (18), the one end fixedly connected with rotation handle (20) of connecting rod (18), just the inside of aluminium package piece (12), circuit board (3) and bottom plate (1) is worn to locate by the other end of connecting rod (18).

5. The circuit board with a heat dissipation structure of claim 4, wherein: a plurality of radiating holes (21) are formed in the bottom plate (1) and the circuit board (3), and the radiating holes (21) are arranged at equal intervals.

6. The circuit board with a heat dissipation structure of claim 5, wherein: symmetrical vent holes (22) are formed in the two sides of the bottom plate (1).

7. The circuit board with a heat dissipation structure of claim 6, wherein: the inside aluminium strip (23) of wearing to be equipped with in both sides of circuit board (3), just the inside of bottom plate (1) and ventilation hole (22) is worn to locate in the bottom of aluminium strip (23).