CN210427645U

CN210427645U - Inspection unit and inspection system

Info

Publication number: CN210427645U
Application number: CN201920878815.8U
Authority: CN
Inventors: 库知文
Original assignee: Silead Inc
Current assignee: Silead Inc
Priority date: 2019-06-12
Filing date: 2019-06-12
Publication date: 2020-04-28
Anticipated expiration: 2029-06-12

Abstract

The utility model provides an inspection unit and inspection system, this inspection unit includes: the connecting body is provided with an opening; the connecting body is used for being connected with automatic test equipment, wherein the automatic test equipment is used for detecting the wafer; a light source disposed within the aperture; a probe card; the probe card is connected with the connecting body, and a transmission part for light to pass through is arranged on the probe card; the probe station is provided with a containing part for containing a wafer, and the containing part is positioned at the downstream of the transmission part in the propagation direction of the light; the wiring board is arranged opposite to the spring needle seat, and one side of the wiring board, back to the spring needle seat, is used for being connected with the automatic test equipment. The utility model provides a can carry out the inspection cell and the detecting system that test to the wafer that needs use the light source.

Description

Inspection unit and inspection system

Technical Field

The utility model relates to a wafer detects technical field, especially relates to an inspection unit and detecting system.

Background

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.

The existing inspection unit includes a probe station (Prober), a probe Card (Prober Card), a pogo pin ring (pogotor), and an automatic Test Equipment (Automated Test Equipment), and a wafer to be tested is placed on the probe station (Prober). The automatic test equipment is used for detecting the functional integrity of the wafer circuit so as to screen defective products.

During testing, the probe card is connected with the wafer. One end of the probe card, which is back to the wafer, is connected with the spring needle ring. One end of the spring needle ring back to the probe card is connected with automatic test equipment, so that the wafer can be tested through the automatic test equipment. However, since the conventional inspection unit does not include a light source, it is difficult to test a wafer requiring a light source.

It should be noted that the above background description is only for the sake of clarity and complete description of the technical solutions of the present invention, and is set forth for facilitating understanding of those skilled in the art. These solutions are not considered to be known to the person skilled in the art merely because they have been set forth in the background section of the present invention.

SUMMERY OF THE UTILITY MODEL

Based on the aforementioned prior art defect, the utility model provides an inspection unit and inspection system that can test the wafer that needs to use the light source.

In order to achieve the above object, the present invention provides the following technical solutions: an inspection unit comprising: the connecting body is provided with an opening; the connecting body is used for being connected with automatic test equipment, wherein the automatic test equipment is used for detecting the wafer; a light source disposed within the aperture; a probe card; the probe card is connected with the connecting body, and a transmission part for light to pass through is arranged on the probe card; the wafer transmission device comprises a probe station, wherein the probe station is provided with a containing part for containing a wafer, and the containing part is positioned at the downstream of a transmission part in the propagation direction of light rays.

As a preferred embodiment, it further comprises: the wiring board is arranged opposite to the spring needle seat, and one side of the wiring board, back to the spring needle seat, is used for being connected with the automatic test equipment.

In a preferred embodiment, the probe card is disposed on a side of the spring pin base facing away from the wiring board, and the probe station is disposed on a side of the probe card facing away from the spring pin base.

In a preferred embodiment, the transmission part is a through hole provided on the probe card.

In a preferred embodiment, the probe card is provided with a plurality of probing units located on one side of the transmissive portion, the probing units are arranged in parallel along a first direction in a horizontal plane, and the accommodating portion is movable in the horizontal plane relative to the probe card in a direction perpendicular to the first direction so as to be able to inspect the wafer.

As a preferred embodiment, each of the probing units includes a plurality of probes arranged along a circumferential direction, and each of the probes has a connection end for contacting the wafer.

In a preferred embodiment, each probe extends along a radial direction, and one end of each probe close to the transmission part is bent to form the connection end.

In a preferred embodiment, the light source is connected to a controller through a wire, and the controller is used for adjusting the illuminance of the light source.

As a preferred embodiment, the connector includes a pogo pin holder and a wiring board, a through hole is provided on the wiring board, and the lead is inserted into the through hole.

An inspection system, comprising: the inspection unit as described above; automatic test equipment; the automatic test equipment is used for detecting the wafer; the automatic test equipment is connected with the connecting body.

The utility model discloses inspection unit and inspection system make can install the light source in the spring needle ring through setting up connector, light source, probe card and probe platform, can make light shine on the wafer through the transmission portion again to when the connector links to each other with outside automatic test equipment, can be through contacting probe card and wafer, make automatic test equipment can test the wafer through the probe card. The light source used in the embodiment of the present application is used for providing light for the test of the wafer, so that the light source can be used for testing the wafer needing to use the light source. Therefore, the utility model provides a small and can carry out the inspection unit and the inspection system that test to the wafer that needs to use the light source.

Specific embodiments of the present invention are disclosed in detail with reference to the following description and accompanying drawings, which specify the manner in which the principles of the invention may be employed. It should be understood that the embodiments of the present invention are not so limited in scope. The embodiments of the invention include many variations, modifications and equivalents within the spirit and scope of the appended claims.

Features that are described and/or illustrated with respect to one embodiment may be used in the same way or in a similar way in one or more other embodiments, in combination with or instead of the features of the other embodiments.

It should be emphasized that the term "comprises/comprising" when used herein, is taken to specify the presence of stated features, integers, steps or components but does not preclude the presence or addition of one or more other features, integers, steps or components.

Drawings

The drawings described herein are for illustration purposes only and are not intended to limit the scope of the present disclosure in any way. In addition, the shapes, the proportional sizes, and the like of the respective members in the drawings are merely schematic for helping the understanding of the present invention, and do not specifically limit the shapes, the proportional sizes, and the like of the respective members of the present invention. The skilled person in the art can, under the teaching of the present invention, choose various possible shapes and proportional dimensions to implement the invention according to the specific situation. In the drawings:

fig. 1 is an exploded view of an inspection unit according to an embodiment of the present invention;

fig. 2 is a schematic structural view of a spring needle seat according to an embodiment of the present invention;

FIG. 3 is a front view of an inspection unit according to an embodiment of the present invention;

FIG. 4 is a side view of a probe card according to one embodiment of the present invention;

fig. 5 is a partial schematic bottom view of a probe card according to an embodiment of the invention.

Description of reference numerals:

11. a spring needle seat; 13. opening a hole; 15. a wiring board; 17. a probe card; 19. a probe station; 23. a transmissive portion; 27. A receptacle portion; 29. a detection unit; 31. a probe; 33. perforating; 35. a connecting end; 37. a light source.

Detailed Description

In order to make the technical solutions in the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts shall fall within the protection scope of the present invention.

It will be understood that when an element is referred to as being "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a single embodiment.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In this specification, a component of an embodiment of the present invention is defined as "up" in a direction toward or facing a user and "down" in a direction away from the user in a normal use state.

Specifically, the upward direction illustrated in fig. 1 to 5 is defined as "up", and the downward direction illustrated in fig. 1 to 5 is defined as "down".

It should be noted that the definitions of the directions in the present specification are only for convenience of describing the technical solution of the present invention, and do not limit the directions of the inspection unit in other scenarios, including but not limited to use, test, transportation, and manufacture, which may cause the orientation of the component to be reversed or the position to be changed.

The embodiment of the utility model provides an inspection unit can test the wafer that needs used light source 37. Specifically, as shown in fig. 1 and 3, the inspection unit may generally include a connector, a light source 37, a probe card 17, and a probe stage 19.

In the present embodiment, the connecting body is provided with an opening 13. So that the light source 37 can be mounted in the opening 13. Specifically, as shown in fig. 1 and 2, the "connecting body" typically refers to the spring needle holder 11. The term is not limited to meaning that line boards 15 may also be assigned.

Further, as shown in fig. 1, the pogo pin holder 11 is a member that electrically connects the probes 31 of the probe card 17 to respective electrodes (not shown) of the wiring board 15. The pogo pin holder 11 supports a plurality of pogo pins. As shown in fig. 2, the pogo pin holder 11 has a thick disc shape. And the spring needle holder 11 is annular as a whole. The annular spring needle holder 11 has a first central hole. The first central aperture forms the opening 13. The pogo pin holder 11 includes a plurality of insertion holes. The jack extends through the pogo pin holder 11 in a vertical direction. For example, as shown in fig. 1, the insertion hole extends in the up-down direction. Each pogo pin includes upper and lower end portions. When the pogo pins are inserted into the insertion holes, upper and lower end portions protrude up and down from the pogo pin holder 11 so as to be electrically connected to the electrodes of the wiring board 15 and the probes 31 of the probe card 17, respectively.

Further, the receptacles are arranged in multiple zones in the pogo pin holder 11. Sealing members are provided on the pogo pin holder 11 so as to surround the respective regions. The respective regions are arranged on the pogo pin holder 11 at regular intervals in the circumferential direction. The annular sealing member forms an opening 13 in the spring needle holder 11.

In this embodiment, the connector is used to connect to automatic test equipment. The automatic Test equipment is abbreviated as ate (automated Test equipment). The automatic test equipment is used for testing the wafer so as to detect the integrity of the circuit function of the wafer and further ensure the quality of wafer production. The automatic test equipment may be of conventional construction and is not specified in this application. Therefore, when the connecting body and the automatic test equipment are used, the wafer can be detected through the automatic test equipment.

In this embodiment, the embodiment of the present invention provides an inspection unit, further including: a wiring board 15. The wiring board 15 is disposed opposite to the pogo pin holder 11. As shown in fig. 1 and 3, for example, the wiring board 15 is located above the pogo pin holder 11. The side of the wiring board 15 facing away from the pogo pin holder 11 is used for connection with automatic test equipment. The upper side of the patch panel 15 is used for connection to automatic test equipment, as shown in fig. 1 and 3, for example. Specifically, the wiring board 15 has a first surface and a second surface that are opposed to each other. The first surface is located on the side of the wiring board 15 facing away from the pogo pin holder 11. For example, as shown in fig. 1 and 3, the first surface is located above the second surface. The wiring board 15 is provided with a first terminal on a first surface and a second terminal on a second surface. The first terminal is used for being connected with an interface of automatic test equipment. The second terminal is electrically connected to the upper end of the pogo pin holder 11.

In this embodiment, the light source 37 is disposed within the aperture 13. Specifically, the light source 37 is secured within the first central bore of the pogo pin holder 11. The fixing mode can be screw fixation, bolt fixation, welding fixation, integral forming and the like.

Further, the light source 37 is used to generate light so that the light can be irradiated on the wafer. And further ensure that the automatic test equipment can detect the wafer.

The light emitted by the light source 37 may be visible light or invisible light.

When the light emitted by the light source 37 is visible light, the visible light may be any suitable light having a wavelength in the range of 380 to 780nm, such as white light.

When the light emitted by the light source 37 is invisible light, the invisible light may be any suitable light with a wavelength less than 380nm or greater than 780nm, and may include, but is not limited to, infrared light, ultraviolet light, far infrared light, and the like.

Further, the light source 37 is connected to the controller through a wire. The controller is used to adjust the illumination of the light source 37 so that it can be varied in real time during wafer testing. Specifically, the controller may place the light source 37 at a low illumination, a normal illumination, and a saturated illumination. The controller may be, for example, a computer or a control chip, and is not limited in this application.

Depending on the actual exposure time parameter, the wafer is already saturated with the illumination of the light source 37 in the range of 1 Lux to 500 Lux. The light sources 37 can be arranged with an illuminance of 1 Lux to 500 Lux.

Further, the light irradiation area of the light source 37 needs to be set according to the probe unit 29 of the probe card 17. Specifically, when the probe unit 29 of the probe card 17 has 12 points, the light irradiation area of the light source 37 needs to be approximately 40 mm. When the probe unit 29 of the probe card 17 has 16 points, the light irradiation area of the light source 37 needs to be approximately 50 mm. When the probe unit 29 of the probe card 17 has 18 points, the light irradiation area of the light source 37 needs to be approximately 55 mm.

Further, as shown in fig. 1, the wiring board 15 is provided with a through hole 33. Specifically, the wiring board 15 is annular as a whole. The ring-shaped wiring board 15 has a second center hole. The second central aperture forms the through-hole 33. The wire is inserted into the through hole 33. So that the wire can be received through the through hole 33.

In the present embodiment, the probe card 17 is connected to a connector. For example, as shown in fig. 1 and 3, the probe card 17 is connected to the pogo pin holder 11.

Further, the probe card 17 is disposed on a side of the pogo pin holder 11 opposite to the wiring board 15. As shown in fig. 1 and 3, for example, the probe card 17 is disposed below the pogo pin holder 11.

Further, the probe card 17 has third and fourth surfaces opposite to each other. Which faces the pogo pin holder 11. The fourth surface is opposite the pogo pin holder 11. For example, as shown in fig. 1 and 3, the third surface is located above the fourth surface. A plurality of wiring terminals are disposed on the third surface. The plurality of terminals correspond to the pogo pins of the pogo pin holder 11. Each connecting terminal is contacted with the corresponding pogo pin, thereby achieving the electrical connection of the probe card 17 and the pogo pin holder 11. On which a plurality of probes 31 are arranged. Each probe 31 has a connection end 35 for contacting the wafer. Thereby electrically connecting the probe 31 with the wafer by contacting the connection terminal 35 with the wafer.

In the present embodiment, the probe card 17 is provided with a transmission portion 23 through which light passes. So that the light emitted from the light source 37 can pass through the probe card 17 and irradiate towards the side of the probe card 17 opposite to the pogo pin holder 11, for example, as shown in fig. 1 and 3, the light emitted from the light source 37 can pass through the projection part and irradiate towards the lower side of the probe card 17.

Specifically, as shown in fig. 1, the transmission part 23 is a through hole provided on the probe card 17. So that light can be irradiated toward the lower side of the probe card 17 through the through-hole. Of course, the transmissive portion 23 is not limited to a through hole provided in the probe card 17, and may include a transparent body covering the through hole of the probe card 17. The transparent body may be glass, for example, but the transparent body is not limited to glass and may be other materials, such as transparent resin.

Further, the transmission portion 23 faces the light source 37. Thereby ensuring that light from the light source 37 can be directed through the transmissive portion 23 toward the side of the probe card 17 opposite to the light source 37.

Further, each probe 31 extends along the radial direction, and one end of each probe 31 close to the transmission part 23 is bent to form a connection end 35. As shown in fig. 4, for example, the inner end of each probe 31 is bent to form a connecting end 35.

Further, the probe card 17 includes a plurality of electrical vias. A first end of the electrical channel is connected to each probe 31. The second end of the electrical channel is connected to each of the terminals.

In the present embodiment, the probe stage 19 is provided with a housing portion 27 for housing a wafer. Specifically, as shown in fig. 1 and 3, the probe stage 19 is plate-shaped as a whole. The accommodating portion 27 is a chuck provided on the probe stage 19. The chuck holds the wafer by vacuum pumping and carries the wafer to move to a required position.

Further, the accommodating portion 27 is located downstream of the transmitting portion 23 in the propagation direction of the light. Specifically, the probe station 19 is located on a side of the probe card 17 opposite to the pogo pin holder 11. As shown in fig. 1 and 3, for example, the probe station 19 is located below the probe card 17. The accommodating portion 27 is thus located below the transmissive portion 23, so that the accommodating portion 27 is located downstream of the transmissive portion 23 in the propagation direction of the light.

In one embodiment, the probe card 17 is provided with a plurality of probe units 29 on the side of the transmissive part 23. For example, as shown in fig. 5, the probe card 17 is provided with 8 probe units 29. The plurality of detection units 29 are arranged side by side in the first direction in the horizontal plane. That is, the plurality of detection units 29 are arranged in a line in the first direction in the horizontal plane on the side of the transmission part 23. The receiving portion 27 can move in a horizontal plane perpendicular to the first direction with respect to the probe card 17 to enable inspection of the wafer. That is, when the accommodating portion 27 moves in a horizontal plane perpendicular to the first direction with respect to the probe card 17, the plurality of probing units 29 of the probe card 17 can move simultaneously perpendicular to the first direction, and when the probe card 17 moves from one side of the wafer to the other side of the wafer, the probe card 17 can contact the entire surface of the wafer, thereby performing the inspection of the wafer.

Since the probes 31 of the probe card 17 extend radially in the horizontal plane and directly to the center of the probe card 17. And the light source 37 is located right above the probe card 17, and the light source 37 irradiates from top to bottom, so that the light emitted from the light source 37 can irradiate on the probe 31, and a "shadow" is left on the surface of the wafer on the side of the probe 31 opposite to the light source 37. Therefore, the plurality of probe units 29 are arranged in a row along the first direction in the horizontal plane, so that when the plurality of probe units 29 of the probe card 17 move in the horizontal plane perpendicular to the first direction, the probe card 17 is prevented from being affected by the shadow in the process of detecting the wafer, and the wafer cannot be detected.

Further, each detection unit 29 comprises a plurality of probes 31. A plurality of probes 31 are arranged in the circumferential direction, each probe 31 having a connection end 35 for contacting the wafer. For example, as shown in fig. 5, the probe card 17 is provided with 8 probe units 29. Each detection unit 29 is provided with a plurality of probes 31.

The embodiment of the utility model provides an inspection system can test the wafer that needs used light source 37. In particular, the inspection system may generally comprise an inspection unit, an automatic test equipment as described above. The automatic test equipment is connected with the connecting body.

The electronic device in the present application may further include other necessary modules or components in order to realize the basic functions of the electronic device. Taking a mobile smart phone as an example, it may further include a communication module, a battery, and the like. It should be noted that any other necessary modules or components included in the electronic device may be used in any suitable existing configuration. For clarity and brief description of the technical solutions provided by the present invention, the above parts will not be described herein again. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended.

It should be noted that, in the description of the present invention, the terms "first", "second", and the like are used for descriptive purposes only and for distinguishing similar objects, and no order is shown between the two, and no indication or suggestion of relative importance is understood. In addition, in the description of the present invention, "a plurality" means two or more unless otherwise specified.

It is to be understood that the above description is intended to be illustrative, and not restrictive. Many embodiments and many applications other than the examples provided would be apparent to those of skill in the art upon reading the above description. The scope of the present teachings should, therefore, be determined not with reference to the above description, but should instead be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled. The disclosures of all articles and references, including patent applications and publications, are hereby incorporated by reference for all purposes. The omission in the foregoing claims of any aspect of the subject matter that is disclosed herein is not intended to forego such subject matter, nor should the applicants be construed as having contemplated such subject matter as being part of the disclosed subject matter.

Claims

1. An inspection unit, comprising:

the connecting body is provided with an opening; the connecting body is used for being connected with automatic test equipment, wherein the automatic test equipment is used for detecting the wafer;

a light source disposed within the aperture;

a probe card; the probe card is connected with the connecting body, and a transmission part for light to pass through is arranged on the probe card;

the wafer transmission device comprises a probe station, wherein the probe station is provided with a containing part for containing a wafer, and the containing part is positioned at the downstream of a transmission part in the propagation direction of light rays.

2. The inspection unit of claim 1, further comprising: the wiring board, the connector is the spring needle file, the wiring board with the spring needle file sets up relatively, the wiring board back to one side of spring needle file be used for with automatic test equipment links to each other.

3. The inspection unit of claim 2, wherein: the probe card is arranged on one side, back to the wiring board, of the spring needle seat, and the probe table is arranged on one side, back to the spring needle seat, of the probe card.

4. The inspection unit of claim 1, wherein: the transmission part is a through hole provided on the probe card.

5. The inspection unit of claim 1, wherein: the probe card is provided with a plurality of detection units positioned on one side of the transmission part, the detection units are arranged in parallel along a first direction in a horizontal plane, and the accommodating part can move in the horizontal plane relative to the probe card in the first direction so as to detect the wafer.

6. The inspection unit of claim 5, wherein: each of the probe units includes a plurality of probes arranged in a circumferential direction, each of the probes having a connection end for contacting the wafer.

7. The inspection unit of claim 6, wherein: each probe extends along the radial direction, and one end, close to the transmission part, of each probe is bent to form the connecting end.

8. The inspection unit of claim 1, wherein: the light source is connected with the controller through a wire, and the controller is used for adjusting the illumination of the light source.

9. The inspection unit of claim 8, wherein: the connector includes spring needle file and patchboard, be provided with the perforation on the patchboard, the wire wears to locate in the perforation.

10. An inspection system, comprising:

the inspection unit of any one of claims 1 to 9;

automatic test equipment; the automatic test equipment is used for detecting the wafer; the automatic test equipment is connected with the connecting body.