KR101119834B1 - Model Adaptable Camera Module Test Socket and Model Adaptable Method - Google Patents

Abstract

The present invention relates to a test socket of a model adaptive camera module and an adaptation method according to a change of a camera module using a test socket of a model adaptive camera module. More specifically, a test socket including an upper body and a lower body for testing a camera module including a lens unit, an image sensor unit, a flexible printed circuit board unit (FPCB), and an electronic device unit, and a test socket for connecting the contact unit of the inspection equipment to test the camera module. An image sensor seating part manufactured according to a shape of an image sensor part to seat an image sensor part; A printed circuit board portion replaceable according to a change in position or shape of the electric component; A pogo pin block arranged according to the position of the electronic component and determined according to the shape of the electronic component and connected to the printed circuit board; And a pusher coupled to the lid or the lower body and determined to correspond to the printed circuit board portion determined according to the position and type of the electrical equipment.

Camera module, test socket, pogo pin block, printed circuit board, image sensor seat, inspection equipment

Description

Model adaptive camera module test socket and adaptation method according to camera module change using the test socket {Model Adaptable Camera Module Test Socket and Model Adaptable Method}

The present invention relates to a test socket of a model adaptive camera module and an adaptation method according to a change of a camera module using a test socket of a model adaptive camera module. More specifically, the test socket and the test of the model adaptive camera module that can test a variety of models of the camera module by replacing only a few parts in the same test socket rather than using a different test socket according to the change of the camera module model It is an adaptation method according to the change of camera module using socket.

After completing the assembly of each part, the mobile phone camera module for mobile phones undergoes an inspection process for any abnormality of the module such as open-short test, color test and pixel test. When evaluating the performance of the module, it is necessary to evaluate the characteristics of the signal received from the image sensor. Therefore, information such as the position of the connector, the number of pins of the camera module, and the length of the flexible printed circuit board (FPCB) is necessary. In addition, considering that the production cycle of the currently produced phone camera module is less than six months, it is possible to cope with the new model by using minimal equipment modification or JIG in consideration of the development of an automated robot, design and model change. Flexible design is needed.

The method of loading the module to inspect the phone camera module is to load the module directly because there is a jig in the inspection equipment, and to load the test socket into the inspection equipment after putting the module in the test socket. The lens portion of the loaded module receives an image of a test chart attached to the upper portion of the inspection equipment. In addition, each pin of the electronic parts of the module is connected to the inspection equipment to check the abnormality of the module by transferring the image from the power supply and the lens unit to the equipment.

Therefore, the central axis of the lens portion of the module should coincide with the central axis of the test chart during the inspection, and the electrical parts of the module and the inspection equipment should be electrically connected.

The existing method of loading a module on a jig fixed to the existing inspection equipment has a problem in that the position of the optical axis and the length of the electric field are changed according to the change of the model, so that the equipment must be replaced or reset according to the changed position. In addition, when the electronic parts are attached to the rear of the module (hereinafter referred to as the rear part), existing equipment cannot be used as it is, there is a problem that a new equipment must be manufactured for the rear type. In addition, the method of loading the inspection equipment using the existing test socket is applied to only one camera module model. Therefore, there is a problem that the test socket can no longer be used when the target model stops production.

Accordingly, even if the model of the camera module is changed, that is, the shape of the image sensor, the length of the flexible printed circuit board, the location of the electric part, and the shape of the electric part are changed, a test socket capable of applying various models without producing a new test socket is needed.

Accordingly, the present invention provides a test socket for coping with the model change of the phone camera module to solve the above problems. It provides a new concept of test socket and adaptation method according to model change of camera module using the test socket so that it can cope with the replacement of some parts of the test socket without using a new test socket when changing the model of the camera module.

In other words, according to the shape of the image sensor part, the location of the front part, the number of front part pins, the pitch size of the front part pins, and the classification type of the camera module (rear type / front type) in the camera module, the test socket itself is not replaced. Replace the image sensor seat that can seat the image sensor in the socket, select the fog pin block that matches the number and pitch of the pins on the electrical part, and adjust the PCB and the pusher according to the position or shape of the electrical part. The installation provides a camera module adaptable to the changed camera module.

In addition, the present invention provides a method in which the inspection can be performed in a fixed position without an additional transfer device to the optical axis of the inspection equipment and the electrical contact portion of the inspection equipment when the test socket is connected to the inspection equipment when the model of the camera module is changed. . It also provides a way for test sockets to be always in the same position during repeated loading or unloading of inspection equipment.

Other objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and preferred embodiments in conjunction with the accompanying drawings.

An object of the present invention as described above, including the upper body and the lower body for testing the camera module having a lens unit, an image sensor unit, a flexible printed circuit board unit and the electric field unit and connected to the contact portion of the inspection equipment to test the camera module A test socket comprising: an image sensor seating part manufactured according to a shape of an image sensor part to seat an image sensor part; A printed circuit board that is replaceable according to a change in position or shape of the electronic parts and coupled to an upper body or a lower body; A pogo pin block arranged according to the position of the electronic component and determined according to the type of the electronic component and connected to the printed circuit board; And a pusher coupled to the upper body or the lower body, and determined to correspond to the printed circuit board part determined according to the position and type of the electrical equipment. The model adaptable camera module test socket may include a pusher.

The upper body and the lower body, the printed circuit board portion, pogo pin block or pogo pin block having an internal space such that the coupling position of the printed circuit board portion can be changed according to the position of the electrical component or the shape change of the electrical component. It can be characterized.

The location of the electronic parts is classified into an I-type model and an L-type model according to the shape of the flexible printed circuit board, and the test socket is adapted to the model that is changed by changing the position where the pogo pin block is connected to the printed circuit board. You can do

The form of the electric part is classified into the front type where the pogo pin block to which the electric part is coupled is connected to the upper body and the rear type where the pogo pin block to which the electric part is coupled is connected to the lower body. In order to apply, the printed circuit board may be coupled to the upper body and the lower body having an inner space spaced at a predetermined interval, and to connect the pogo pin block to each of the upper body and the lower body.

Each of the upper body and the lower body may be provided with a predetermined space to be inserted into the printed circuit board portion connected to the pogo pin block.

The pogo pin block may be characterized in that the test socket is adapted to the camera module by replacing the determined pogo pin block according to the number of pins or the pitch size of the length pins.

Even if the model of the camera module changes, the optical axis of the inspection equipment is maintained, and the position of the printed circuit board connected to the pogo pin block is changed according to the model change of the camera module, so that the position of the inspection equipment contact portion is fixed so that the pogo pin block is The electrical connection to the contact portion of the printed circuit board portion and the inspection equipment can be maintained.

Further comprising a dynamic base on the lower surface of the lower body, when the test socket is repeatedly loaded or unloaded with the inspection equipment, the test socket may be characterized in that it maintains a relatively constant position.

The dynamic base portion may be characterized by having three positioning grooves each having a constant interval and spaced apart at intervals of 120 degrees with respect to the center point.

Another object of the present invention as an object of the present invention, in the adaptation method according to the change of the camera module using the test socket, if the shape of the image sensor unit is changed, providing an image sensor seating unit according to the shape of the image sensor of the camera module; Determining a pogo pin block that is electrically connected to the electric part when the pin of the electric part is changed; Determining a printed circuit board unit to which the determined pogo pin blocks can be connected; When the shape of the electric parts is changed, installing a printed circuit board part (PCB) determined according to the shape of the electric parts on the upper body or the lower body of the test socket; Connecting the pogo pin block to the printed circuit board in consideration of the position of the electric component of the camera module to be mounted later; Mounting an image sensor of the camera module to the image sensor unit and coupling the electric field pin to the pogo pin block to mount the camera module to the test socket; And inspecting the camera module by projecting an image of a test chart to the image sensor unit of the camera module by connecting the test socket to the inspection equipment. It can be achieved by the adaptation method accordingly.

In the installing step on the lower body, the pusher is installed on the body or the lower body according to the shape of the electric portion; may be characterized in that it further comprises.

In the pogo pin block determining step, the pogo pin blocks may be determined according to the number of full length pins or the pitch size of the full length pins.

The full length part may be characterized in that the pogo pin block to which the full length is coupled is classified into a front type connected to the upper body side and a pogo pin block to which the full length is coupled to the rear type connected to the lower body.

In the pogo pin block connecting step, the position of the electric component is classified into an I-type model and an L-type model according to the shape of the flexible printed circuit board, and the pogo pin block is changed according to the model changed by changing the position where the pogo pin block is connected to the PCB. The test socket may be characterized by adaptation.

The upper and lower bodies have internal spaces spaced at predetermined intervals, and each of the upper and lower bodies has a predetermined space for inserting a printed circuit board portion connected to the pogo pin block. All may be characterized as applicable.

In the camera module inspection step, even if the model of the camera module changes, the optical axis of the inspection equipment is maintained, and the position of the inspection equipment contact portion is fixed by changing the position of the printed circuit board connected to the pogo pin block according to the model change of the camera module. It may be characterized in that the electrical connection is maintained from the electrical parts to the pogo pin block, the printed circuit board part and the contact part of the inspection equipment.

When the test socket is repeatedly loaded or unloaded with the inspection equipment, the bottom of the lower body is tested by a dynamic base having three positioning grooves, each spaced at an interval of 120 degrees with respect to the center point. The socket may be characterized as maintaining a relatively constant position.

Therefore, according to one embodiment of the present invention as described above, the camera module test socket has an effect that can respond to the model change of the phone camera module. When changing the model of the camera module, it is possible to adapt the model change only by replacing some parts of the test socket without using a new test socket.

That is, without replacing the test socket itself, replace the image sensor seat that can seat the image sensor for the shape of the image sensor of the changed test socket, select the pogo pin block according to the number of pins and pitch size of the overall length , The lid and the lower body inner space to be applicable regardless of the position (I type or L type), the shape (rear or front type) of the overall length, and the printed circuit board portion and the pusher Installation on the body has an effect that can be adapted to the changed camera module.

In addition, the present invention, when the test socket is connected to the inspection equipment when changing the model of the camera module, the inspection can be carried out in a fixed position without an additional transport device on the optical axis of the inspection equipment and the electrical contact portion of the inspection equipment, the electrical equipment, pogo A series of electrical connections of the pin block, the printed circuit board unit, and the contact portion of the equipment can be maintained. In addition, there is no need for the transfer equipment, there is a fast, economic advantage.

In addition, the test socket uses a kinematic base during the repetitive loading or unloading of the inspection equipment, thereby ensuring the repeatability of the inspection equipment and the phone camera module test socket relative to the test socket.

Although the present invention has been described in connection with the above-mentioned preferred embodiments, it will be readily apparent to those skilled in the art that various other modifications and variations are possible without departing from the spirit and scope of the present invention. Are all within the scope of the appended claims.

(Configuration and Function of Model Adaptive Camera Module Test Socket)

Hereinafter, with reference to the accompanying drawings will be described the configuration and function of the present invention model adaptive camera module test socket. First, Figure 1 shows a perspective view of the camera module, Figure 2a shows a perspective view from above of a test socket equipped with a camera module. Figure 2b shows a perspective view from the side of the test socket equipped with a camera module. Figure 2c shows a perspective view of the upper body closed in a test socket equipped with a camera module. Figure 2d shows a perspective view of the upper body of the test socket.

As shown in FIG. 1, the camera module has various additional configurations, but is mainly composed of a lens unit 110, an image sensor unit 120, a flexible printed circuit board unit 130, and an electric component 140. Therefore, in the inspection process, the image of the test chart is projected on the image sensor unit 120 to form an electrical contact between the electrical unit 140 and the test socket inspection equipment. At this time, the center of the test chart, the center of the lens unit 110 and the image sensor unit 120 should match (optical axis coincidence).

As illustrated in FIGS. 2A to 2C, the test socket includes an image sensor seating part 200 in which the image sensor part 120 is seated when the camera module is mounted. In addition, it includes a pogo pin block 210 and a printed circuit board (PCB) unit 220 coupled to the pogo pin block 210 connected to the electrical component 140 pin 150 of the camera module 100. . The printed circuit board 220 is connected to the contact portion of the inspection equipment to perform the loading or unloading and inspection process. In addition, the test socket includes an upper body 240 and a lower body 250 and has an inner space between the upper body 240 and the lower body 250 when the upper body 240 is closed. The pusher 230 is installed on the inner surface of the upper body 240 or the lower body 250.

According to the model change of the camera module 100, the model is changed by relocating or replacing only the image sensor seat 200, the pogo pin block 210, the printed circuit board 220 or the pusher 230 without changing the test socket itself. Can adapt to That is, the model change of the camera module 100 may include the shape of the image sensor unit 120, the length of the flexible printed circuit board unit 130, the position (type I or L) of the electric component 140, and the electric component 140. ) Shape (rear or front), the number of full length pins 150 or the pitch size of the full length pins 150 will vary.

For the changed camera module 100 model, first, the image sensor seating unit 200 having a structure capable of mounting the image sensor unit 120 may be determined and installed in the test socket. In addition, the pogo pin block 210 connected to the electric component 140 is determined to match the number of the pins 150 and the pitch size of the pin 150. FIG. 3A illustrates a plan view of a test socket when the position shape of the electronic device 140 is type I, and FIG. 3B illustrates a plan view of the test socket when the location type of the electronic device 140 is L type.

As shown in FIGS. 3A and 3B, the arrangement of the pogo pin blocks 210 connected to the electrical component 140 to the printed circuit board 220 may vary depending on the position of the electrical component 140. In the case of type I, it can be seen that the pogo pin block 210 is connected to the middle portion of the printed circuit board 220, and in the case of the L type, the pogo pin block 210 is connected to the right side. Thus, the printed circuit board 220 is designed to be applicable to various electrical parts 140 in position.

4A is a side view of the pogo pin block 210, the printed circuit board unit 220, the upper body 240, and the lower body 250 that are coupled to the camera module 100 when the shape of the electrical component 140 is the front type. 4B is a pogo pin block 210, a printed circuit board 220, an upper body 240, and a lower body coupled to the camera module 100 when the shape of the electrical component 140 is a rear type. A side view is shown at 250. According to the shape of the electric component 140, it is determined whether the printed circuit board 220 to which the pogo pin block 210 is coupled is installed on the upper body 240 or the lower body 250.

As shown in Figure 4a, in the case of the front-type pogo pin block 210 is coupled to the printed circuit board 220 is installed on the upper body 240. Therefore, a predetermined space 246 for installing the printed circuit board 220 on the inner surface of the upper body 240 should be secured. In addition, as shown in Figure 4b, in the case of the back-type printed circuit board 220, the pogo pin block 210 is coupled to the lower body 250 is installed. Therefore, the inside of the lower body 250 is provided with a predetermined space 246 to install the printed circuit board 220.

The test socket of the present invention can be applied to both the rear type and the front type, as shown in FIGS. 4A and 4B. When the lid is closed, it has an inner space between the upper body 240 and the lower body 250 and this inner space has a size enough to be applied to both the front type and the rear type. Preferably, as the size of the test socket increases, the size of the equipment increases accordingly, so that the size of the upper body 240 and the lower body 250 is designed to be minimized to a size that can adapt to the model change.

In addition, since the front circuit board 220 is installed in the predetermined space 246 of the upper body 240, the pusher 230 is installed in the predetermined space 246 of the lower body 250, In this case, since the printed circuit board 220 is installed in the predetermined space 246 of the lower body 250, the pusher 230 is installed in the predetermined space 246 of the upper body 240. In this way, the test socket for the various models of the camera module 100 determines and installs the image sensor seating part 200, the pogo pin block 210, the printed circuit board part 220, and the pusher 230 corresponding to the model. Applicable to various models.

In addition, even when the model of the camera module 100 is changed when the test socket is coupled to the inspection equipment, the positions of the lens unit 110, the image sensor unit 120, and the image sensor seating unit 200 do not change. The optical axis of the equipment and the center of the lens unit 110 and the image sensor unit 120 will be matched. That is, optical axis agreement is maintained. As the model of the camera module 100 changes, the position of the pogo pin block 210 coupled to the printed circuit board 220 and the position of the printed circuit board 220 to which the pogo pin block 210 is coupled. By adapting to the change, a series of electrical connections are maintained from the electrical component 140 of the camera module 100 to the pogo pin block 210, the printed circuit board 220, and the contact portion of the equipment. Thus, there is no need for a separate transfer device to match the optical axis of the equipment or for a series of electrical connections.

In addition, the lower surface of the test socket lower body 250 further includes a dynamic base 260. 5 shows a perspective view from below of the test socket so that the dynamic base 260 is visible. As shown in FIG. 5, the dynamic base portion 260 is provided with positioning grooves 265 spaced at 120 ° with respect to the center point 261 and maintained at regular intervals. This positioning groove 265 is coupled to the positioning pin provided in the inspection equipment. Therefore, when the test socket is connected to the inspection equipment by the dynamic base 260 and repeatedly loaded or unloaded during the inspection process, the relative position between the test socket and the inspection equipment remains unchanged.

(Adaptation method of test socket according to model change of camera module)

Hereinafter, with reference to the accompanying drawings will be described a test socket adaptation method according to the model change of the present invention camera module. 6 shows a flowchart of a test socket adaptation method according to a model change of a camera module.

When the model of the camera module 100 is changed, first, it is determined whether the shape of the image sensor unit 120 is changed by changing the model (S10). When the shape is changed, the image sensor may be seated to seat the changed image sensor unit 120. It will be replaced with the unit 200 (S20). In addition, if the number of changed lengths of the pin 150 of the camera module 100 or the pitch size of the pin 150 is changed (S30), and if it is changed, the pogo is coupled to the pin 150 of such a length of the electric pore capable of electrical connection. The pin block 210 is determined (S40).

Determine whether the determined pogo pin block 210 is a printed circuit board unit 220 that can be connected (S50), and if not, determines the printed circuit board unit 220 that can electrically connect the pogo pin block 210 ( S60). In operation S70, it is determined whether the shape of the electric component 140 of the camera module 100 is changed. That is, it is determined whether the shape of the electric parts 140 is changed from the front type to the rear type or the rear type to the front type. When the shape is changed, in the case of the front type, the printed circuit board 220 is installed in the predetermined space 246 of the upper body 240 and the pusher 230 is installed in the predetermined space 246 of the lower body 250. . On the other hand, in the case of the back type, the printed circuit board 220 is installed on the lower body 250, and the pusher 230 is installed on the upper body 240 (S80).

Then, the pogo pin block 210 is connected to the printed circuit board unit 220 according to the position of the electric component 140 (S90). That is, depending on whether the electronic device 140 is I type or L type, when the camera module 100 is installed in the test socket, the electronic device 140 is poised at a position that can be coupled to the pogo pin block 210. The pin block 210 is connected to the printed circuit board 220.

This becomes a test socket to which the changed camera module 100 can be applied, and the image sensor unit 120 of the camera module 100 is seated on the image sensor seating unit 200 of the test socket, and the electrical unit 140 is mounted. The camera module 100 is installed in the test socket by connecting to the pogo pin block 210 (S100). Then, the test socket is connected to the inspection equipment to test, load and unload the test chart image onto the image sensor unit 120 to inspect the camera module 100 (S110).

As described above, even when the model of the camera module 100 is changed when the test socket is coupled to the inspection equipment, the positions of the lens unit 110, the image sensor, and the image sensor seating unit 200 do not change. The optical axis of the inspection equipment is coincident with the center of the lens unit 110 and the image sensor unit 120. As the model of the camera module 100 changes, the position of the pogo pin block 210 coupled to the printed circuit board 220 and the position of the printed circuit board 220 to which the pogo pin block 210 is coupled. By adapting to the change, a series of electrical connections are maintained from the electrical parts 140 of the camera module 100 to the pogo pin block 210, the printed circuit board part 220, and the contact parts of the equipment. Thus, there is no need for a separate transfer device to match the optical axis of the equipment or for a series of electrical connections.

In addition, the lower surface of the test socket lower body 250 further includes a dynamic base 260. The dynamic base 260 is provided with positioning grooves 265 spaced at 120 ° with respect to the center point 261 at regular intervals. These positioning grooves 265 are coupled to the positioning pins spaced 120 degrees each of the inspection equipment. Therefore, when the test socket is connected to the inspection equipment by the dynamic base 260 and repeatedly loaded or unloaded during the inspection process, the relative position between the test socket and the inspection equipment remains unchanged.

1 is a perspective view of a camera module,

Figure 2a is a perspective view from above of a test socket equipped with a camera module,

Figure 2b is a perspective view of the test socket equipped with a camera module from the side,

Figure 2c is a perspective view of the test socket with the upper body closed;

2d is a perspective view of the desk socket upper body,

3A is a plan view of a test socket equipped with a camera module having an I-type electric section;

3B is a plan view of a test socket equipped with a camera module having an L-shaped electric section;

Figure 4a is a side view of a test socket equipped with a camera module having a front electronic parts,

Figure 4b is a side view of the test socket equipped with a camera module having a back-type electric part,

5 is a perspective view from below of a test socket equipped with a camera module;

6 is a flowchart illustrating a test socket adaptation method according to a model change of a camera module.

<Description of the symbols for the main parts of the drawings>

100: camera module

110: lens unit

120: image sensor

130: flexible printed circuit board

140: overall length

150: overall length of the pin

200: image sensor seat

210: pogo pin block

220: printed circuit board

225: contact and connection of the inspection equipment

230: Pusher

240: upper body

245: Hall of the upper body

246: predetermined space of the upper body

250: lower body

260: Dynamic base

261: center point

265: positioning groove

Claims (17)

In the test socket for testing the camera module including an upper body and a lower body for testing the camera module having a lens unit, an image sensor unit, a flexible printed circuit board unit and the electrical component, and connected to the contact portion of the inspection equipment, An image sensor seating part manufactured according to the shape of the image sensor part to seat the image sensor part; A printed circuit board that is replaceable according to a change in position or shape of the electric component and coupled to the upper body or the lower body; A pogo pin block disposed according to the position of the electric component and determined according to the type of the electric component and connected to the printed circuit board; And And a pusher coupled to the upper body or the lower body and determined to correspond to the printed circuit board part determined according to the position and type of the electric component. The upper body and the lower body, In accordance with the position of the electronic part or the shape change of the electronic part, the printed circuit board unit, the pogo pin block or the pogo pin block is provided with an inner space so that the coupling position of the printed circuit board can be changed, The position of the electric part, According to the shape of the flexible printed circuit board portion is classified into I type model and L type model The test socket is adapted according to a model that is changed by changing the position where the pogo pin block is connected to the printed circuit board. The form of the electric part, The pogo pin block to which the full length is coupled is classified into a front type connected to the upper body side and the pogo pin block to which the full length is coupled to the rear type connected to the lower body, and the test socket is the front type and the rear side. In order to apply to all of the mold, the printed circuit board portion having the inner space spaced at a predetermined interval between the upper body and the lower body, and can connect the pogo pin block to each of the upper body and the lower body can be coupled Model adaptable camera module test socket, characterized in that. delete delete delete The method of claim 1, Modeled camera module test socket, characterized in that to form a predetermined space in each of the upper body and the lower body to be inserted into the printed circuit board portion connected to the pogo pin block. The method of claim 5, The pogo pin block, It is determined according to the number of the full length pins or the pitch size of the full length pins And a test socket can be adapted to the camera module by replacing the determined pogo pin block. The method of claim 6, Even if the model of the camera module changes, the optical axis of the inspection equipment is maintained, By changing the model of the camera module by changing the position of the printed circuit board connected to the pogo pin block, The position of the inspection equipment contact portion is fixed, the model adaptable camera module test socket, characterized in that the electrical connection from the electrical equipment to the pogo pin block, the printed circuit board portion and the contact portion of the inspection equipment is maintained. The method of claim 1, Further provided with a dynamic base on the lower surface of the lower body, When the test socket is repeatedly loaded or unloaded with the inspection equipment, The test socket is a model adaptable camera module test socket, characterized in that to maintain a relatively constant position. The method of claim 8, The dynamic base portion, A model-adaptive camera module test socket, characterized in that each of the three positioning grooves spaced at intervals of 120 degrees with respect to the center point at regular intervals. In the adaptation method according to the camera module change using the test socket of any one of claims 1, 5, 6, 7, 8, or 9. When the shape of the image sensor unit is changed, installing an image sensor seating unit according to the shape of the image sensor of the camera module; Determining a pogo pin block that is electrically connected to the electrical component when the pin of the electrical component is changed; Determining a printed circuit board unit to which the determined pogo pin blocks can be connected; Installing the printed circuit board part on the upper body or the lower body of the test socket when the shape of the electronic part is changed; Connecting a pogo pin block to the printed circuit board in consideration of a position of the electric component of a camera module to be mounted later; Mounting the image sensor of the camera module to the image sensor unit and coupling the electric component pin to the pogo pin block to mount the camera module to the test socket; And Connecting the test socket to an inspection apparatus and projecting an image of a test chart on the image sensor unit of the camera module to inspect the camera module; How to adapt to change. The method of claim 10, In the installation step on the lower body, The pusher is installed on the body or the lower body in accordance with the shape of the electric part; Adaptive method according to the camera module change using a model-adaptive camera module test socket, characterized in that it further comprises. The method of claim 11, In the pogo pin block determination step, The pogo pin block is an adaptation method according to the change of the camera module using a model-adaptive camera module test socket, characterized in that determined according to the number of the length of the electric field pin or the pitch size of the electric pole pin. The method of claim 10, The full length form is, The model adaptable camera module test socket, characterized in that the pogo pin block coupled to the full length is classified into a front type connected to the upper body side and a pogo pin block coupled to the full length is connected to the lower body. Adaptive method according to the change of camera module. The method of claim 10, In the pogo pin block connection step, The location of the electric component is classified into an I-type model and an L-type model according to the shape of the flexible printed circuit board. The method according to the camera module change using a model adaptable camera module test socket, characterized in that the test socket is adapted to the model that is changed by changing the position where the pogo pin block is connected to the printed circuit board. The method of claim 13, Has an inner space spaced at a predetermined interval between the upper body and the lower body, Each of the upper body and the lower body has a predetermined space to be inserted into the printed circuit board portion is connected to the pogo pin block model test camera, characterized in that the test socket is applicable to both the front type and the rear type Adaptive method according to the change of camera module using module test socket. The method of claim 15, In the camera module inspection step, Even if the model of the camera module changes, the optical axis of the inspection equipment is maintained, By changing the model of the camera module by changing the position of the printed circuit board connected to the pogo pin block, The position of the inspection equipment contact portion is fixed so that the electrical connection from the electrical equipment to the pogo pin block, the printed circuit board portion and the contact portion of the inspection equipment is maintained using a model adaptable camera module test socket Adaptation method according to camera module change. The method of claim 16, When the test socket is repeatedly loaded or unloaded with the inspection equipment, The test socket maintains a relatively constant position by a dynamic base having three positioning grooves each spaced at intervals of 120 ° from the lower surface of the lower body. Method according to the change of camera module using a standard camera module test socket.

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